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The Journal of Military Electronics & Computing

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GPGPU Solutions Gear Up for Signal Processing Duties

CONTENTS March 2012

Volume 14

Number 3

SPECIAL FEATURE GPGPUs vs. FPGAs for Military Signal Processing

10 GPGPU Solutions Gear Up for Signal Processing Duties Jeff Child

16 Case Study: Adapting GPGPU Tech for Mil DSP Use

Ian Stalker and Ivan Straznicky, Curtiss-Wright Controls Defense Solutions

20 Exclusive Roundtable: Experts Discuss Future Airborne Capability Environment (FACE)

TECH RECON DoD Budget Report: Major Programs

26 Leaner Major Programs Budget Keeps Technology in Forefront Jeff Child

SYSTEM DEVELOPMENT Annual EOL and Component Obsolescence Directory

40 Many Roads to Keeping Obsolescence Issues in Check Jeff Child

42 Annual EOL and Component Obsolescence Directory 46 Die Extraction Strategy Solves DMSMS Challenges Brian Shumaker, Global Circuit Innovations

TECHNOLOGY FOCUS Small Form Factor Boards

50 Small Form Factor Boards Up Their Compute Density Game Jeff Child


Small Form Factor Boards Roundup Digital subscriptions available:

COTS (kots), n. 1. Commercial off-the-shelf. Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customerpaid minor modification to standard COTS products to meet the customer’s unique requirements. —Ant. When applied to the procurement of electronics for the U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

Departments 6 Publisher’s Notebook And We’re Off! 2012 Defense Budget 8

The Inside Track


COTS Products

66 Editorial The Army and Agile Acquisition

Coming in April See Page 64 On The Cover: A number of upgrades are planned for the F-22 Raptor. Among these are capabilities for emitterbased geo-location of threat systems, ground-looking synthetic aperture radar (SAR) modes and electronic attack functionality. Shown here, a three-ship formation of F-22 Raptors flies to the Nevada Test and Training Range during a combat training exercise involving the air forces of the United States and its allies.

(U.S Air Force photo/ Staff Sgt. Taylor Worley)


The Journal of Military Electronics & Computing



B B - 2 5 9 0 B AT T E RY C H A R G E R

PRESIDENT John Reardon,

The Lind BB-2590 Battery Charger is designed to charge a single BB-2590 military battery, with or without the SMBUS (BB-2590 battery not included). ‡ Compatible with BB-2590 military battery and BB-2590 military battery with SMBUS ‡ 9HOFUR VWUDS VHFXUHV WKH FRQQHFWRU WR WKH EDWWHU\ WR HQVXUH D VROLG connection with the battery contacts ‡ *UHHQ/('RQFKDUJHULQGLFDWHVFKDUJLQJVWDWH ‡ 2WKHU LQSXW FDEOH RSWLRQV DYDLODEOH XSRQ UHTXHVW VRPH RSWLRQV LQFOXGH 1$726ODYHFRQQHFWRUEDUHZLUHOHDGRUVRODUSDQHOFRQQHFWLRQV

PUBLISHER Pete Yeatman,

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COTS Journal | March 2012

Jeff Child, Editor-in-Chief 20A Northwest Blvd., PMB#137, Nashua, NH 03063 Phone: (603) 429-8301 Fax: (603) 424-8122 Published by THEâ&#x20AC;&#x2C6;RTCâ&#x20AC;&#x2C6;GROUP Copyright 2011, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.


NOTEBOOK And We’re Off! 2013 Defense Budget


he White House’s 2013 Defense Budget is finally out, which is like the beginning of another horse race for pundits to attempt to analyze and speculate on what it means to our industry. The one thing we still need to realize is that this is only the opening gate to the budget process. Compounding the normal budget game between the Brass, Congress and the White House, this is an election year. Many pages of print and electrons regarding this subject will be put in play between now and the end of the year while the players shift items and priorities in the Budget before it gets passed. And passed this year if we’re lucky. Many years we just get extensions. Ignoring all the rhetoric from the doves and hawks—as well as the two political parties—regarding the merit of the budget, let’s take a look at some of the basics and dovetail them into the White House Defense Plan issued in January. The Defense Budget for 2012 is $531 billion. For 2013 it will be $525 billion—a small decrease. And for 2014 it’s projected to increase to $534 billion— and by 2017 to $567 billion. We’re essentially saying Iraq is behind us, yet we still have to ask for $8 billion in 2013 to get our equipment out of the country. We’re committed to increasing our support for, and to train, the Afghan military—yet we’re cutting our funds for those efforts in this budget. We are increasing our cyber spending as well as special ops by about 5 percent per year in support of our Defense Plan regarding our concern over China. The proposed budget is said to be in line with the strategy of doing less with less. We need to clearly determine the priority of our military interests and establish the resources to achieve those interests. By 2014 we should significantly reduce the personnel in uniform along with civilian support staff. The Army will take the largest hit—cutting 72,000, bringing the force to 490,000. The Marines will lose 20,000, bringing its force size to 182,000. The Navy and Air Force will have the smallest percentage force reduction—the Navy with a cut of 6,200 to 319,500 and the Air Force with 4,200 to 328,000. The clear winner in this long range plan and future budgets is the Navy. The Navy’s ability to essentially move tactical operations bases to anywhere in the world, within weeks, fits in line with the concept of the Defense Plan. In contrast, the Air Force and the Army have to establish land bases of operation, requiring seizure of land. Supporting the plan to increase cyber spending is at least $80 billion of secret defense funds spent on intelligence gathering, mostly handled by organizations like the National Intelligence Program and the Military Intelligence Program. These organizations are responsible for most of the super secret satellites and segments of other information gathering sources like subma6

COTS Journal | March 2012

rines. Less clandestine areas of space information are taking a 22 percent hit in 2013, taking their funding down to $8 billion. All this money and priorities juggling is making many stock holders of military contractors nervous. How will the prime contractors react to declining orders and cancelled programs? In the ’90s the industry went through a major bloodletting with primes trading off divisions to focus on one specific market area eliminating competing with one another. The ’90s also saw the major primes merging. Today the office of Assistant Secretary of Defense for Acquisition is not in support of losing any prime contractors to mergers or acquisitions in this downturn. Yet the primes need to show growth and profitability. In the past—although not often successful—primes shifted to the non-military markets for opportunities. With the commercial markets being far from robust, this does not seem like a venture too many will consider. The DoD has made it clear that it is looking for the military establishment to utilize more commercially available technologies and resources. It has also made it clear that it will invest and protect niche technologies and suppliers that are critical to the military. Good news for our industry. Will primes start to acquire smaller organizations in our industry like in the ’90s? The reality of the world we live in has all the politicians in a firm grasp and limits how far they can risk the country with drastic cuts in the defense budget. The proposed budget is based on a great deal of hope that the world moves in a direction as predicted by the Defense Plan. These two documents rely heavily on technology and readily available commercial technology. Moreover, the DoD is looking for and counting on the conversion of technology used in industry to meet the unique needs of the military. Although not a “bowl you over” statement, the 2013 RDT&E budget has gone from $1.27 billion this year to $1.52 billion. That shows the DoD has some interest in staying ahead with new technology. Couple the increased RDT&E funds with a push to increase all aspects of cyber spending, and it’s clear our industry will see an increase in opportunities in all grades of product from office to extreme environments. It’s time we got a little good news.

Pete Yeatman, Publisher COTS Journal


INSIDE TRACK Lockheed Martin Selects Presagis Software for MC-130J Lockheed Martin Aeronautics has selected Presagis’ VAPS XT-178 tool for use in developing embedded graphics displays for the Special Mission Processor (SMP) on the MC-130J Increment 3 program for the U.S. Air Force Special Operations Command (AFSOC). Presagis VAPS XT-178 will run on the MC-130J Variant and offers a path to compliance with the new DO-178C guidance. As the first COTS DO178B, object-oriented, avionics HMI development tool, VAPS XT-178 can be used for both ARINC 661 and non-ARINC 661 programs. Moreover, with its runtime architecture, VAPS XT-178 can produce displays that will run on a variety of software and hardware environments, making it the ideal solution for the efficient development of HMIs. The object-oriented, DO-178B Level A HMI tool, VAPS XT-178 is a software package for creating embedded display graphics for safetycritical avionics projects intended for RTCA DO-178B certification. VAPS XT-178 has been created by the same engineering team that developed the widely successful VAPS Qualifiable Code Generator (QCG) DO-178B qualifiable product that has been used across many programs worldwide.

The MC-130J Combat Shadow II, Air Force Special Operations Command’s newest aircraft, sits on the tarmac after its unveiling last March.

Lockheed Martin Bethesda, MD. (301) 897-6000. [].

SSAI Taps I/O and Processor Technology from North Atlantic Industries Engineers from SSAI selected 3U CompactPCI technology from North Atlantic Industries (NAI) in Bohemia, NY to be used in the replacement Loader Weapon Control Panel (LWCP) and Electronic Control Unit (ECU) for the AC-130U Gunship (Figure 2). The LWCP provides the user interface for gunner control of the 40 mm and 105 mm weapons on the Gunship. The ECU takes the Mission Computer commanded position and senses feedback on actual gun position to control the dynamic aiming of the AC-130U Trainable Gun Mounts. The Government requirements were to deliver form, fit and functional replacement ECU and LWCP designs that main-


COTS Journal | March 2012

Figure 1

Synchro/ LVDT Measurement, MIL-STD-1553 and RS-422 functions; highly programmable discrete I/O; U2 processors; and power supplies (55LQ2) in both boxes.

Figure 2

AC-130U primary missions are close air support, air interdiction and armed reconnaissance. Close air support missions include troops in contact, convoy escort and point air defense. tained or exceeded the performance of the obsolete legacy equipment. NAI worked closely with SSAI engineers to select the exact hardware and firmware solution to meet all system needs. The system uses a full complement of NAI’s rugged, 3U CompactPCI I/O boards (75DP3, 75C3) including A/D, D/A,

North Atlantic Industries Bohemia, NY. (631) 567-1100. [].

General Dynamics Demos First MUOSBased Comms on JTRS HMS Radio Using the Joint Tactical Radio System (JTRS) Handheld, Manpack, Small Form Fit (HMS) two-channel networking radio (AN/PRC-155), General Dynamics C4 Systems recently completed the first demonstration of secure voice and data communications via the Mobile

User Objective System (MUOS) satellite-communications waveform. The demonstration used an AN/PRC-155 manpack radio (Figure 3)—running the MUOS waveform software—to transmit encrypted voice through a MUOS-satellite simulator to the MUOS ground station equipment that will soon be deployed in Sicily. MUOS is a military satellite communications system that will enable secure, mobile networked communications worldwide, in even the most austere environments. Development of the MUOS waveform remains on track for completion in the third quarter of 2012. By yearend, the MUOS capability will be available on the AN/PRC-155 manpack radio, the first MUOS terminal that will be available to soldiers. General Dynamics developed the MUOS waveform using the PRC-155 manpack radio.

Inside Track

The demonstration used an AN/ PRC-155 manpack radio running the MUOS waveform software. With two channels in one radio, a soldier can use one channel for line-of-sight SINCGARS and SRW waveforms, and bridge to the second channel using the MUOS satellite system for unprecedented, dedicated global communications reach. General Dynamics C4 Systems Scottsdale, AZ. (480) 441-3033. [].

Analytic Systems Provides Power for U.S. Army Tactical Comms Analytic Systems has received their first contract for their high-performance customized DC/AC Inverters (model IPS300-24-110UE) that will power equipment within the U.S. Army’s AN/TRC-190 tactical communication shelters. Ultra Electronics TCS contracted Analytic Systems to provide Analytic Systems’ inverters due to their high reliability and rugged designs. Ultra Electronics TCS, a world leader in tactical communications, has had an IDIQ contract for several years with the U.S. Army’s Warfighter Information Network-Tactical, and the Analytic Systems’ inverter is currently used for specific tasks against that contract. The IPS Series of “Pure Sine Wave” Inverters are designed specifically for running computers and other electronics

with an added two-year extension available. Analytic Systems Delta, British Columbia, Canada (604) 946-9981. [].

Military Market Watch Unmanned Maritime Systems Market Offers Big Opportunities The Unmanned Maritime Systems (UMS) market, which includes Unmanned Surface Vehicles (USV) and Unmanned Underwater Vehicles (UUV), is coming of age, rapidly evolving under the combined impact of changing economies, operational and technological advances, and maritime threats. The UMS defense market is forecasted to exceed a cumulative $7 billion between 2012 and 2020, whereas the UMS security market is expected to surpass a cumulative $600 million between 2012 and 2020. Although the UMS security market remains considerably smaller than the defense market, the growth rate of the security market is forecasted to be much more robust than that of the defense market. Many factors are leading the surge of interest in UMS. There’s an inGlobal UMS Market Forecast by Market Sectors creased demand for maritime security, 1,600 1,442 the continuing threats of mines and Defense 1,400 submarines, military budget pressures, Security 1,276 and the fact that UUV have proven 1,162 1,200 their worth. Trends look promising: 973.9 navies starting USV programs, frig1,000 869.4 ates being equipped with unmanned 800 systems for air and sea, lower costs for 707.4 613.8 sensors and navigation systems, an 600 494.6 increasing need for covertness in blue 437.9 and brown waters, synergies coming 400 and going to the oil and gas industry, 200 a healthy UUV industry, new designs of UUV and USV, and a technology 0 transfer of unmanned ground and 2012 2013 2014 2015 2016 2017 2018 2019 2020 unmanned air vehicles to UMS. Figure 4 A host of business opportunities are shaping up, many including subsystems and sophisticated electronics The UMS defense market is forecasted to exceed a cumulative $7 billion between 2012 and 2020. and software. Today the industry is with UMSs where UAVs were in 2000. It’s no wonder unmanned maritime systems show the best procurement and R&D forecast by looking at the 2011-2036 Unmanned Systems Roadmap funding table. A new UMS report from Market Info Group provides details on the markets, forecasts, business opportunities and where you might be able to get a piece of that niche industry. For further information about this research contact Market Info Group. $ Millions

Figure 3

in rugged mobile and other off-grid locations. One standard AC receptacle or a variety of customized MIL-SPEC Connectors provide for easy connection. Versions are available to operate from 12V, 24V, 28V, or 32V battery systems. The IPS300 series of inverters carry a standard three-year warranty

Market Info Group (703) 348-2747. Chantilly, VA. [].

March 2012 | COTS Journal


SPECIAL FEATURE GPGPUs vs. FPGAs for Military Signal Processing


COTS Journal | March 2012

GPGPU Solutions Gear Up for Signal Processing Duties Offering a straightforward alternative to FPGAs for many military signal processing requirements, GPGPUs continue to gain mindshare. A host of board, system and toolkit style solutions are smoothing the road to adoption. Jeff Child Editor-in-Chief


he idea of graphics processors used as general purpose processors is the latest disruptive technology to invade military embedded computing. GPGPUs offer powerful and dense processing combined with easy programming to give them a decided edge over traditional signal processing approaches. This concept of putting high-performance graphics processors to work on general purpose processing tasks is beginning to gain traction. But they’re not expected to supplant FPGAs overnight. GPUs have potential in application areas including target tracking, image stabilization and SAR (synthetic aperture radar) simulation. Sensor processing and software defined radio are also well suited for this kind of processing. Board-level products have emerged specifically for GPGPU computing in a number of form factors including OpenVPX. And to smooth the task of developing GPU-based military systems, a number of complete development kits are also available. The sheer complexity of today’s military embedded systems is overwhelming. The challenge gets particularly acute when systems run on a variety of processor engines. FPGA-based systems are an example. In contrast to general purpose processors, FPGAs don’t have a defined internal architecture, instruction set, data paths or peripheral set. While FPGAs remain a mainstay of military signal processing, GPGPUs are a simpler way to do complex multiprocessing.

Leveraging Silicon Trends As imaging subsystem performance requirements inevitably increase and sensor payloads grow, a reliable way to increase performance will be required. Feeding those needs, GPGPU manufacturers such as NVIDIA and AMD release new and higherperforming GPGPUs roughly twice per year. However, a method for rapidly and seamlessly upgrading components to the latest GPGPUs should be available. One way to achieve this is to implement GPGPUs via a Mobile PCI Express Module (MXM), March 2012 | COTS Journal



Figure 1

For UAV payload applications such as SAR (synthetic aperture radar), the increases in the compute capability that are offered by the use of GPGPUs have a direct relationship to more capable detection systems, increased UAV autonomy and increased survivability. an industry standard form factor. Both AMD/ATI and NVIDIA ship their GPGPUs on these surface-mount boards with defined connecter specifications. Upgrading a carrier card with MXMs featuring the latest GPGPU technology is a much quicker way to disseminate the latest technology than a complete re-spin of a GPGPU board containing soldereddown components. This idea of GPUs as general purpose processing engines also falls nicely into the theme of doing more while keeping the complexity at bayâ&#x20AC;&#x201D;in this case, complexity to the system developer. Graphics chip vendor NVIDIA developed a parallel computing architecture called CUDA. CUDA lets programmers use conventional computing languages to access the massively parallel processing capabilities of the GPU. Aside from serving applications 12

COTS Journal | March 2012

in radar, signals intelligence and video surveillance and interpretation, GPUs based on the CUDA architecture have potential in other application areas, including target tracking, image stabilization and SAR (synthetic aperture radar) simulation. This dense level of radar processing is particularly welcome on UAV radar payloads (Figure 1).

GPUs for Modeling and Simulation Meanwhile, modeling and simulation applications, with their large data sets and reliance on mathematical functions, can take full advantage of GPGPU computingâ&#x20AC;&#x2122;s massively parallel computational model. As a result, more complex problems can be addressed and additional scenarios analyzed. This shift in processing capability is significant, as real-world testing

of multiple scenarios significantly increases project cost, and in many cases is virtually impossible as conditions that require testing occur at unpredictable times. Just that kind of situation comes up when trying to analyze aircraft carrier operations at sea. Setting a jet fighter down on a moving carrier deck is never an easy task, and the degree of difficulty increases during adverse weather. As a result, the Navy conducts aircraft missions when conditions are within predetermined operational envelopes, but testing the limits of such operational envelopes using aircraft and pilots is not a practical option due to safety concerns. This is why computer models are used on a range of scenarios to more accurately predict how aircraft and the carrier react under different sets of environmental conditions.



Figure 2

Board-level products have emerged specifically for GPGPU computing in a number of form factors, including OpenVPX. Curtiss-Wright Controls Defense Solutions (CWCDS) recently rolled out its 3U OpenVPX general purpose graphics processing unit (GPGPU) multicore engine, the VPX3491 GPU Application Accelerator. The

small form factor VPX3-491 features an NVIDIA GPU based on the NVIDIA Fermi architecture with 240 CUDA cores. Integrated into a subsystem, the VPX3-491 functions as a coprocessor attached to a host Intel processor board and takes advantage of the new PCIe Expansion Plane definitions in the VITA 65 OpenVPX standard to provide offthe-shelf backplane support for high-

The Ensemble 6000 Series 6U OpenVPX Intel Core i7 LDS6520 Module combines Intel’s Core i7 processor family with the POET fabric interconnect. It provides high-speed communication links to GPGPU modules, offering a typical 10x gain in system performance for many ISR applications.

An added benefit to creating computer models is that f light scenarios can be saved and subsequently used with f light simulators to train pilots, giving them the valuable experience of landing in a variety of less than optimal conditions without risking lives or aircraft. Such simulation models not only apply to piloted aircraft, but are also relevant for operating unmanned aerial vehicles off a carrier flight deck. To address this complex issue, EM Photonics developed a hardware-accelerated computational fluid dynamics (CFD) tool based on NVIDIA GPGPU technology that will rapidly and accurately model aircraft interaction with naval vessels, especially with regard to the vessel’s airwake. Once developed, these CFD solvers can also be used to model a range of other scenarios where small moving objects interact with larger moving structures, from helicopters landing on ships to deploying payloads from aircraft. During Phase I of the program, compute time of a solver for the Euler equations was reduced from 18 hours to 20 minutes, resulting in a 54x improvement. While this level of performance gain is quite impressive, the challenge for the project’s next phase is to deal with computations that can take up to 150,000 CPU hours to run. Untitled-5 1

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Figure 4 Figure 3

NVIDIA Tesla C-class GPU computing processor support is provided in its NextStream dense streaming blade server, including the recently announced Tesla C2075. The 2U format is optimized for high-performance computing tasks that require a mix of traditional multicore CPU processing with GPU co-processing in a dense form factor.

BPG7087 and BPG8032 (shown) industrial backplanes are available for use with military general purpose GPU and video display wall systems.

Toolkit GPGPU Solutions speed interconnection between pairs of SBC/GPU. The combination of 2nd Generation Intel processors, gen2 PCI Express interconnect and 240 NVIDIA CUDA cores raises the performance bar for compact systems for demanding military digital signal processing (DSP) applications such as C4ISR, EO/ IR and SatCom. The VPX3-491 takes full advantage of GPUs based on the NVIDIA Fermi architecture. Designed for high-performance computing, the newest generation of NVIDIA processors features larger internal shared memories, a completely new L2 cache, unified memory addressing, and many other enhancements to improve CUDA-based applications performance and improve programmer productivity. The VPX3-491 supports its high-performance GPU processor with a 2 Gbyte, 256-bit wide, 80 Gbyte/s GDDR5 memory subsystem designed to eliminate data bottlenecks and support large signal processing datasets into the onboard memory. The VPX3-491 supports a full 16-lane Gen2 PCIe interface to the backplane, supporting the maximum possible bandwidth between host and GPU. The VPX3-491 also supports 8-lane and 4-lane PCIe interfaces. Another board-level GPGPU solution is Mercury Computer Systems’ En14

COTS Journal | March 2012

semble 6000 Series 6U OpenVPX Intel Core i7 LDS6520 Module (Figure 2), the first embedded computing product combining Intel’s Core i7 processor family with the POET fabric interconnect. The board was one of the first OpenVPX Intel products to provide high-speed communication links to general purpose GPU modules (GPGPU), providing a typical 10x gain in system performance for many ISR applications compared to previous generation designs. The linkage to the GPGPUs is enabled by the PCI Express expansion plane, a component of the 6U OpenVPX multiplane architecture. The LDS6520 supports the XMCs and a dual-core Intel Core i7 Processor. It is available in air-cooled and conductioncooled rugged versions. The initial configurations of the LDS6520 support both serial RapidIO 1.3 and serial RapidIO 2.1 to the backplane. The POET (Protocol Off load Engine Technology) enables a serial RapidIO or low-latency 10 Gigabit Ethernet data plane to connect a number of Intel Core i7 processors and FPGAs. This embedded POET capability on the LDS6520 module facilitates very high-speed data connections and system scaling for Intel devices in defense applications, thereby delivering best-of-breed levels of ISR subsystem performance.

Mercury also offers a full Imaging Toolkit, designed to aid crafting capabilities for electro-optical, infrared (EO/IR), hyperspectral and radar imaging application development for the defense and commercial markets. It provides a layer of abstraction between the application and the GPGPU code, insulating developers from the GPGPU implementation details. The algorithms used in the Imaging Toolkit include imaging functions specifically designed to support high-bandwidth data streams from multiple sensors. These are optimized to take full advantage of parallel multicore processing while minimizing data latency, lowering risk, and allowing developers to focus on their application development. Also providing a kit-based solution is GE Intelligent Platforms with its 6U OpenVPX CUDA Starter Kit. It provides system integrators with a complete application development platform supporting multiple GPGPU configurations. It lets users start development and testing on GE’s latest IPN250 single board computer with onboard Intel Core2 Duo processor and NVIDIA GT240 GPU. Also included is GE’s NPN240 dual NVIDIA GT240 GPU card; a 4-slot chassis; and ancillary hardware including disk drives, rear transition modules, power supply and cables to support multi-GPU configurations along with


a pre-installed CentOS Linux start-up image. The IPN250, Intel Penryn Core2 Duo plus NVIDIA GT240 96 core COTS processor, paired with the NPN240, dual NVIDIA GT240 expansion card, are the first in a new family of 6U OpenVPX GPGPU cluster solutions targeting extended temperature, harsh environment mission pay loads for airborne, ground vehicle and naval platforms.

Rackmount GPGPU Computing System-level computing platforms based on GPUs are also starting to emerge. An example is the NextStream system (Figure 3) from NextComputing. Support for the NVIDIA Tesla Cclass GPU computing processor is provided in its NextStream dense streaming blade server, including the recently announced Tesla C2075. The NextStream is optimized for high-performance computing tasks that require a mix of traditional multicore CPU processing with GPU co-processing in a dense form factor. Traditional blade servers, while optimized for density in large-scale installations, require a significant investment in rack real estate. In a GPUoptimized setup, the NextStream can be configured with two blades, each with dual 6-core Intel Xeon processors, 96 Gbyte RAM, and a dedicated NVIDIA Tesla GPU computing processor on a full PCI Express 2.0 x16 slot. Additional expansion space is available for a third Tesla processor on one of the two blades, or for other expansion cards and storage. GPUs are also being used for more direct graphics applications such as video walls. The Trenton BPG7087 and BPG8032 industrial backplanes are now available for use with military general purpose GPU and video display wall systems. These backplanes are the backbone of rackmount computer systems that support high-performance option cards with PCI Express x16 electrical interfaces. The design of each PCI Express backplane delivers high system bandwidth while ensuring fast data transfers with minimum latencies at full PCIe x16 link speeds. The backplanes support a

wide array of PICMG 1.3 single board computers including Trenton’s single processor TSB7053 and dual processor JXT6966. A system designed with a BPG7087 or BPG8032 backplane, COTS PCI Express option cards and Trenton single board computers provides the speed, flexibility and faster Mean Time To Repair (MTTR) critical in applications such as military surveillance and video display walls. Curtiss-Wright Controls Defense Solutions Ashland, VA. (703) 779-7800. [].

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NextComputing Nashua, NH. (603) 886-3874. []. Trenton Technology Gainesville, GA. (770) 287-3100. [].

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LEMT: Condition Monitoring for embedded PCs. View current and historical data, as well as device information. LiPPERT Embedded Computers Inc. 2220 Northmont Parkway Suite 250 Duluth, GA 30096 Phone +1 (770) 295 0031 Fax +1 (678) 417 6273

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March 2012 | COTS Journal


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SPECIAL FEATURE GPGPUs vs. FPGAs for Military Signal Processing

Case Study: Adapting GPGPU Tech for Mil DSP Use General purpose GPU processing is well suited to demanding military DSP requirements. But the question of testing versus redesign must be part of the decision process. Ian Stalker, Product Marketing Manager Ivan Straznicky, Technical Fellow, Strategic Planning Office Curtiss-Wright Controls Defense Solutions


hanks to their unmatched speed, hundreds of cores and dedicated f loating point math libraries, General Purpose Graphics Processor Units (GPGPUs) are gaining ground in the military market. GPGPUs are being used to meet the intense processing needs of C4ISR military applications that require large amounts of DSP algorithm computation. That said, GPGPU technology is a perfect example of where the application of consumer driven technology requires some adaptation on the military technology supplier side to provide it in a format suited to military requirements. It also provides an example of choosing between a testing approach versus a redesign approach. Case in point is one of today’s most advanced GPGPUs for embedded applications: NVIDIA’s 240-core Fermi architecture device (Figure 1). While the architecture offers a leap forward in performance compared to the previous generation GT240, NVIDIA provides the Fermi architecture only in the MXM mezzanine module format. The device is not available in a BGA package. That means that soldered down board designs—such as those targeted for military systems—were forced to compromise for lower performance. 16

COTS Journal | March 2012


NVIDIA’s Fermi architecture general purpose GPU device with 240 cores is among today’s most advanced GPGPUs for embedded applications.


Figure 2

Tests performed on the NVIDA Fermi MXM module’s electrical connectors showed that they are able to satisfy VITA 47.

Testing for Harsh Environments In an effort to ensure that the MXM module can meet the stringent ruggedness requirements demanded by the defense and aerospace market, Curtiss-Wright engineers submitted the MXM module to a full complement of tests. These tests were designed to characterize and verify the MXM’s ability to operate optimally in the severe shock, vibration and thermal requirements of embedded military system deployment. Leveraging in-house resources for ruggedization, testing and thermal analysis, the engineers built a test vehicle with which to extensively investigate the MXM module and its connector. As a next step, the engineers developed, implemented and then tested additional risk mitigation techniques to ensure that the open standard COTS boards, based on OpenVPX (VITA 46/VITA 48/ VITA 65) GPGPU board products, were able to take full advantage of the incredible levels of performance delivered by these new devices while meeting or exceeding the ruggedness and reliability requirements of the most demanding military applications. The result is that MXM modules, implemented on the 490 and 491, easily satisfy L200 (85C card edge) ruggedization levels and meet or exceed the highest levels 18

COTS Journal | March 2012

of the VITA 47 standard that defines the Environmental, Design and Construction, Safety, and Quality for Plug-In Units. To test the NVIDIA MXM module electrical connectors, the engineers subjected the module to a battery of tests to ensure its ability to withstand the harsh conditions that rugged military equipment must endure. The MXM packaging testing and CWCDS product enhancements included three areas. The first was electrical testing of the MXM connector—including humidity (500 hrs.), mixed flowing gas (20 days) and durability. Next was mechanical shock and random vibration. And the third area was full qualification over temperature.

Connectors Satisfy VITA 47 Specs A thorough examination of the MXM electrical connectors (Figure 2) showed that they were able to satisfy VITA 47. The connectors were tested to the highest typical level of 100AC, which typically induces the highest displacements under vibration. Tests included visual and SEM/ EDX inspection afterward to measure any fretting or wear. While a soldered-down BGA package will provide the highest possible levels of resistance to shock and vibration, the testing of the MXM module connectors shows that, like the ubiquitous

and well-proven PMC and XMC mezzanine modules, a mezzanine architecture approach is more than sufficient for the applications in which it will be deployed. According to the tests, MXM mezzanine modules go beyond delivering required levels of shock and vibration performance to provide several additional advantages that can’t be met by soldered down devices. Most significantly, MXM mezzanines provide the fastest access to NVIDIA’s newest, most advanced GPU technology. Adding risk and complexity to the BGA approach is the fact that the responsibility for designing the electrical interface circuitry sits with the board designer. The problem is that the BGA approach ignores the routing, testing and non-trivial memory interface design work that NVIDIA has already undertaken. GPU memory interfaces are significantly faster and wider than those associated with general purpose processors such as those from Intel and Freescale. In this case it made sense to leverage the large investment and proven expertise that NVIDIA provides, having already developed the memory interface circuitry for the MXM module. With MXMs the customer is assured that the GPU experts have addressed and solved the electrical interface problem for them, mitigating the design risk curve.

Marrying MXM with VPX An example VPX solution supporting the MXM Fermi GPU is Curtiss-Wright’s VPX6-490. It lets system designers optimize their signal processing capabilities by providing them with NVIDIA’s newest Fermi architecture-based GPU silicon. In fact, the Fermi architecture is not being made available in a BGA version, so the only way for designers to take advantage of the performance leaps delivered by Fermi is through use of the MXM mezzanine version. As NVIDIA upgrades its chip families, the MXM module approach enables board designers, and their customers seeking technology upgrades, to take advantage of the latest GPU designs without having to undertake a major redesign of their board. With the BGA approach, you are locked into a particular generation of GPU device until you undertake the costly, time-consuming and risk loaded process


of spinning an entire new board design. Using MXM simplifies the ability to track NVIDIA’s technology roadmap, which pays huge dividends in terms of getting the latest/greatest commercial GPU performance in deployed DSP systems to the field to support the warfighter sooner. There is another potentially surprising result from the extensive analysis and testing of the MXM module. It turns out that it is actually easier to efficiently cool the MXM mezzanine module than it is to cool a BGA soldered down on a host board. The MXM module packaging enhanced the ability to cool the high-power GPU/ MXM, leading to a new high-water mark (50W chip at L200). This is because the MXM mezzanine’s form factor makes it far easier to bolt a heat spreader, heat shunt, or in the case of air-cooling, a heat sink to the MXM. Compared to a soldered down chip approach, the MXM makes it much easier to get the necessary metalwork, delivering optimal cooling, much closer to the GPU die. The result is significant. Engineers were able to cool a 50W GPU on a 75W MXM to Level 200 ruggedization levels. That achievement is more difficult with the soldered down design approach.

Integration Density Another big plus that MXM modules provide for system designers is the greater level of integration densities they make possible on the host card. Placing the GPU and its support devices on the mezzanine frees up valuable real estate that gives designers the flexibility to add additional functionality to their boards. CurtissWright takes advantage of this additional

Figure 3

The 3U VPX3-491 is designed to enhance the ruggedization of several aspects of the MXM module, such the ability to handle high levels of shock, vibration, humidity and thermal cycling. board real estate freed by use of the MXM to add higher levels of performance, adding an industry-unique signal conditioning circuit on board the VPX6-490. This circuit cleans up the sensitive 5 Gbit/s PCI Express signals between backplane and MXM module, reducing the risk that a less than perfect backplane implementation will affect the operation of the system. To take advantage of the full performance potential of NVIDIA’s gamechanging Fermi architecture, the mechan-

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SPECIAL FEATURE GPGPUs vs. FPGAs for Military Signal Processing

EXCLUSIVE ROUNDTABLE: Experts Discuss Future Airborne Capability Environment (FACE) Recently, COTS Journalâ&#x20AC;&#x2122;s Jeff Child had the unique opportunity to sit down with representatives from three companies involved in the Future Airborne Capability Environment (FACE): Kirk Avery from Lockheed Martin, Joe Dusio from Rockwell Collins, and Chip Downing from Wind River (Figure 1). The FACE Standard defines the software computing environment and interfaces designed to support the development of portable components across the general-purpose, safety and security profiles. FACE uses industry standards for distributed communications, programming languages, graphics, operating systems and other areas. Its goal is to establish a common computing software infrastructure supporting portable, capability-specific software components across Department of Defense (DoD) avionics systems. Jeff Child, COTS Journal: Letâ&#x20AC;&#x2122;s start out with the consortium itself. What is the Future Airborne Capability Environment (FACE) Consortium and what is its purpose? Joe Dusio, Rockwell Collins: The FACE Consortium was formed in 2010 as a collaborative approach to develop a common operating environment supporting portability and reuse of software components across Department of Defense (DoD) aviation systems. The FACE Consortium has developed a supplier-independent, standardized environment for DoD aviation 20

COTS Journal | March 2012

Figure 1

From left to right, Joe Dusio from Rockwell Collins, Kirk Avery from Lockheed Martin, and Chip Downing from Wind River. systems allowing software components to be rapidly migrated across systems conforming to the FACE Standard. The FACE Consortium provides a vendor-neutral forum for industry and the U.S. government to work together to develop and consolidate the open standards, best practices, guidance docu-

ments and business models necessary to achieve these results. CJ: Attempts at establishing open systems standards have been tried in the military before with mixed success. Why is FACE so critical now? Kirk Avery, Lockheed Martin: There


are a couple of reasons why FACE is so timely. First, current aviation systems are typically developed for a unique set of requirements by a single vendor, causing longer lead times for urgent needs, platform-unique designs, limited portability of software components, increased costs, and creating barriers to competition within and across platforms. Second, the military aviation community has not created standardized architectural and software interface


standards to sufficiently enable portability of software components across DoD aviation systems. Furthermore, contracts typically do not require conformance to a common set of open standards, and program managers are not funded to assume cost or schedule risks of multi-platform requirements. Chip Downing, Wind River: Commercial aerospace suppliers have standardized on open common core platforms based upon ARINC 653, which is a stan-


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Untitled-3 1 COTS Journal | March 2012 22

3/1/12 9:41:55 AM

dard API for integrated modular avionics (IMA), but this has simply not occurred in military avionics systems. Wind River alone has over 140 customers using our ARINC 653 solution on over 50 aircraft; so it is clear that the concept of using an open, common compute platform environment makes good business sense. We just need to proliferate this concept into military aviation system designs. CJ: I would imagine thereâ&#x20AC;&#x2122;s a lot of cost savings and reuse benefits with this type of architecture. Can you review some of those benefits of FACE? Avery: FACE creates an open, modular software environment enabling portability and reuse of software components across multiple programs and platforms. This architecture expands the selection options for military software components, reduces up-front procurement costs, reduces system integration cost and risk, reduces upgrade and technical refresh costs, and therefore reduces total life cycle costs. CJ: Many of our readers are familiar with initiatives such as IMA and Modular Open Systems Approach (MOSA). How does the FACE Consortium relate to those? Downing: The FACE Consortium builds upon the tenets of Open Architecture (OA), IMA and Modular Open Systems Approach (MOSA) by defining a standardized method of interface between software components and architectural segments. The consortium is currently comprised of 39 members including DoD and industry member organizations, their representatives and advisors. The Consortium was formed and is currently managed under the auspices of The Open Group. Avery: There are four key teams managing the development and proliferation of the FACE standard and other Consortium documents: 1. Steering Committee: Provides oversight, governance and direction to the consortium. 2. Technical Working Group (TWG): Responsible for creating the Technical Standard and accompanying information.


3. Business Working Group (BWG): Responsible for defining business models to communicate FACE goals to DoD and Industry leaders. 4. Advisory Board: Provides guidance and advice to the consortium. CJ: Oftentimes a standard can be called “open” yet in practice interoperability isn’t always a certainty. Are the standards produced by the FACE Consortium truly open standards? Dusio: Yes, the standards are truly open. Anyone can download and use FACE Consortium work products after agreeing to The Open Group’s terms and conditions for use. The FACE Business Guide and FACE Technical Standard for FACE Reference Architecture are available now. The Consortium teams are now actively working on a FACE Contracts Guide, FACE Library Guide, FACE Conformance Business Plan, and the FACE Conformance Certification Guide. It’s important to note that all members of the consortium realize that to make this standard a success we need to create a powerful balance between both technical and business requirements. Just defining an open API for DoD aviation systems won’t work. CJ: You mentioned the business side. How soon do you expect there will be government procurements requiring FACE conformance? Downing: There are now at least five released Requests for Information (RFI) and Requests for Proposal (RFP) having references and requirements for FACE. These RFIs/RFPs include US Navy C-130T, US Navy ADDS, US Navy Full Motion Video, Army Joint Multi-Role Technology Demonstrator, and the US Navy BAA for the Autonomous Aerial Cargo Utility System (AACUS) research program. CJ: Let’s get down to the specifics now. Would you outline for me what the key components are of the FACE computing environment? Dusio: The FACE Consortium has defined the key vertical and horizontal software interfaces and will provide implementation guidance for using these interfaces. The Technical Standard for FACE Reference Architecture document

contains a high-level architectural overview and a detailed description of the architectural segments interconnected by three key interfaces. These segments and their interconnections comprise the FACE computing environment. Avery: The five segments (Figure 2) of the FACE computing environment are: 1. T  he Operating System (O/S) Segment 2. T  he Input/Output (I/O) Services Segment

3. Platform-Specific Services Segment 4. T  ransport Services Segment 5. Portable Component Segment FACE is not a platform-specific design, however, it provides design guidelines to both aviation platform and mission equipment package Program Managers. This computing environment enables portable, modular, software capabilities to be used across multiple platforms.

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CJ: What’s the process by which the FACE Technical Standard is being validated? Downing: The FACE Consortium membership, in conjunction with academia, has worked to prototype, evaluate, examine and demonstrate the FACE computing environment. The FACE Consortium is also developing a FACE Conformance Verification and Certification Program Plan covering three major topics: the FACE Conformance Verification Process, the FACE Conformance Certification Process, and the underlying FACE Conformance Business Structure. For more information readers can go to the FACE public website at: This site contains general information about the Consortium. There is also a private, members-only collaborative website supporting the work of the Consortium. Anyone who works for a FACE Consortium member organization and

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TECH RECON DoD Budget Report: Major Programs

Leaner Major Programs Budget Keeps Technology in Forefront The 2013 Defense Budget Request includes a blend of modernizations and restructurings, with an emphasis on cost-efficiency. Numerous technology upgrades to existing platforms along with an overall network-centric strategy mean opportunities for embedded computing. Jeff Child Editor-in-Chief


arlier this month the President’s 2013 Budget Request for the DoD was released, kicking off the process toward the long budget cycle—one sure to be complicated by much disagreement and the turbulence of an election year. The FY 2013 Budget Request for the DoD totals $613.9 billion. Within that the acquisition funding request totals $178.8 billion, of which $109.1 billion is for Procurement and $69.7 billion is for Research, Development, Test and Evaluation (RDT&E) programs. The request includes both Base ($169.7 billion) and Overseas Contingency Operations (OCO) ($9.1 billion) funding. Of this amount, $72.3 billion is for programs that have been designated as Major Defense Acquisition Programs (MDAP). Figure 1 shows a breakdown of how major program funding is being allocated. The major categories within the MDAP umbrella include: Aircraft, C4 Systems, Ground Programs, Mis-


COTS Journal | March 2012

FY 2013 Modernization — Base and OCO: $178.8 Billion

Shipbuilding & Maritime Systems $22.6

Space Based Systems $8.0

($ billions)

Aircraft $47.6

RDT&E S&T $11.9

C41 Systems $8.2

Mission Support $50.4

Figure 1

DoD FY 2013 Major Program categories.

Ground Systems $10.9

Missiles & Munitions $10.2

Missile Defense $9.0

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FY 2013 Aircraft â&#x20AC;&#x201D; Base and OCO: $47.6 Billion ($ billions)

Aircraft Modifications $6.7

Unmanned Aerial Vehicle $3.8 Technology Development $2.9

Aircraft Support $4.9

Support Aircraft $1.9

Cargo Aircraft $7.9 Combat Aircraft $19.5

Figure 2

DoD FY 2013 Major Aircraft Program funding. FY 2013 Ground Programs â&#x20AC;&#x201D; Base and OCO: $10.9 Billion ($ billions)

Weapons $1.0 Combat Vehicles $1.7

Heavy Tactical Vehicles $1.0 Support Equipment $6.3

Figure 3

Light Tactical Vehicles $0.5 Medium Tactical Vehicles $0.4

DoD FY 2013 Major Ground Systems funding. sile Defense, Munitions and Missiles, Shipbuilding/Maritime Systems, and Space Based and Related Systems. Mission Support and Science and Technology also fall under the MDAP net. 28

COTS Journal | March 2012

Aircraft Major Programs The budget for the Air Force like other branches includes a mix of modernization plans, program terminations and program restructurings. As Figure 2 shows, some investment continues in

UAV development, but even more investment is being made in upgrading existing manned aircraft. A next-generation bomber is a new acquisition program that began in FY 2012. The new bomber will be expected to incorporate many subsystems (engines, radars and other avionics) and technologies that are already proven. By relying on proven technologies and by planning to evolve the aircraft over time as threats evolve, similar to the B-52 legacy fleet, the upfront acquisition costs will be reduced. The average procurement unit cost is anticipated to be about $550 million in FY 2010 dollars for a fleet of 80-100 aircraft. Funding in FY 2013 is $0.3 billion and totals $6.3 billion from FY 2013 FY 2017. The FY 2013 budget requests funding for three NATO Alliance Ground Surveillance (AGS) systems. Based on the Block 40 version of the RQ-4B Global Hawk UAV, the systems will enable the Alliance to perform persistent surveillance over wide areas. Using advanced radar sensors, the NATO AGS will continuously detect and track moving objects throughout observed areas, and provide radar imagery of areas and stationary objects. Funding is $0.2 billion in FY 2013 and totals $0.9 billion from FY 2013 - FY 2017. On the list of terminated programs is the RQ-4 Global Hawk Block 30 (GH30). The GH30 is a high-altitude, long-endurance unmanned aircraft with integrated imagery, radar and signals intelligence sensors. The GH30 was scheduled to replace the U-2 aircraft in FY 2015, and was expected to provide significant cost savings over U-2. The Department has determined that the GH30 would require a much more substantial investment than originally planned in order to reach its maximum potential. The Department has determined that the termination of the GH30 is a manageable risk and proposes to extend U-2 operations until FY 2025. Also terminated are the C-130 Avionics Modernization Program (AMP) and C-27J Joint Cargo Aircraft. The FY 2013 Budget Request proposes the termination of C-130 AMP program and includes funding for the more cost-effective


adverse weather precision targeting incorporate the latest technology available. Due to changing Department priorities, funding constraints, and the need to reduce concurrency, the Department determined that it is a manageable risk to reduce procurement by a combined total of 13 aircraft in FY 2013 and 179 aircraft from FY 2013 - FY 2017. On the UAV side, a restructuring sustains 65 MQ-1/9 combat air

patrols with a surge capability to 85; retains the Predator longer than previously planned; protects funding for the Army’s Gray Eagle; and continues the development of new capabilities. The DoD has determined that 24 MQ-9 Reaper aircraft adequately support 65 combat air patrols and has reduced the procurement of the MQ-9 Reaper by 24 aircraft and reinvested the funds in ground stations.

Figure 4

A repaired turret to its upgraded hull in the first M1A2 Abrams System Enhancement Package Version 2, the latest M1 variant to be inducted into the depot production line. Optimize Legacy C-130 Communication, Navigation Surveillance Air Traffic Management (CNS/ATM) program. Meanwhile, the C-27J’s termination was deemed a manageable risk because many of its missions can be accomplished by the legacy C-130 fleet. One of the DoD’s most expensive programs, the Joint Strike Fighter (JSF) is targeted for a restructuring. As long planned, the JSF will meet Air Force Conventional Take-off & Landing (CTOL) requirements with the F-35A variant, the Marine Corps Short Take-Off and Vertical Landing (STOVL) requirements with the F-35B variant, and Navy Carrier Variant (CV) requirements with the F-35C variant. Commonality among the variants is expected to hold down life cycle costs. This is a joint program with no single executive service. Service Acquisition Executive (SAE) authority alternates between the Navy and the Air Force, and currently resides with the Air Force. The F-35’s advanced avionics, data links and Untitled-4 1

AM March 2012 | COTS2/16/11 Journal9:51:5029


FY 2013 Shipbuilding and Maritime Systems â&#x20AC;&#x201D; Base: $22.6 Billion

Technology Development $2.8

Outfitting & Post Delivery $0.3

($ billions) Submarine Combatant $5.2

Support $2.8

Support Ships $1.3

Surface Combatant $10.2

Figure 5

DoD FY 2011 Major Shipbuilding and Maritime funding.

Major Ground Programs The DoD continues to modernize its ground force capabilities. That modernization and upgrade of selected core systems is a continuous process. Some of the existing programs targeted for upgrades include howitzers, Stryker vehicles, M1 Abrams, Bradley Fighting Vehicle and the Light Armored Vehicle (LAV). The Army is focused on developing a Ground Com-

bat Vehicle (GCV) to provide a new infantry fighting vehicle to the warfighter. The GCV has the design growth to adapt to capabilities as the operational environment changes and technology matures to position soldiers for long-term success. The Marine Corps is developing the Marine Personnel Carrier (MPC), an advanced generation armored personnel carrier that would provide general sup-

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port lift to the marine infantry in the ground combat element-based maneuver task force. Figure 3 shows a breakdown of Ground Vehicle funding. The Stryker Vehicle under the FY 2013 Budget Request is well supported. The plan calls for the procurement of 58 Nuclear, Biological, Chemical Reconnaissance Vehicles (NBCRV) as well as engineering and development efforts, including survivability and integration of targeting under armor (TUA) on the Stryker Fire Support Vehicle (FSV). The Budget Request also includes funding for the purchase of hardware modifications and the installation of Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR) obsolescence/safety items. Funding in FY 2013 is $0.3 billion and totals $0.5 billion from FY 2013 - FY 2017. Meanwhile, the Army and Marine Corps have proposed the termination of the HMMWV Recapitalization program. The combined savings in FY 2013 is $0.2 billion and totals $0.9 billion from FY 2013 - FY 2017. The termination of the HMMWV Recapitalization program maintains the non-deployed HMMWV fleet in its current condition. The services will continue to sustain their legacy HMMWV fleet until the Joint Light Tactical Vehicle enters the inventory.


ÂŽ Untitled-5 1 COTS Journal | March 2012 30

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FY 2013 Command, Control, Communications, and Computers (C4) Systems — Base and OCO: $8.2 Billion ($ billions)

Automation $0.4 Base Communication $0.1 Theater Combat C3 & Services $6.2

Information Security & Assurance $0.7 Technology Development $0.7

Figure 6

DoD FY 2011 Major Command, Control, Communications and Computer Systems (C4) program funding.

Among the most closely watched ground programs is the Ground Combat Vehicle (GCV). In FY 2009, the Army initiated the new GCV to provide Soldiers essential protected mobility that is required to operate across the full spectrum of activities. Significant delays have hampered the progress of this key program. The Army entered the Technology Development Phase in August 2011, but the program was delayed due to a contract award protest. The Department proposes the GCV restructuring in order to accommodate the fact-of-life adjustments to the program. The proposed savings is $1.3 billion in FY 2013 and totals $1.3 billion from FY 2013 - FY 2017. The current M1 Abrams tank modernization effort supports two variants. The M1A1 Situational Awareness (SA) and the M1A2 System Enhancement Program (SEP). The M1A1 SA modernization includes steel encased depleted uranium for increased frontal and turret side armor protection, suspension improvements, an advanced computer system with embedded diagnostics, a second generation thermal sensor, and a laser rangefinder to designate targets from increased distances. The M1A2 SEP tank (Figure 4) 32

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COTS Journal | March 2012

2/3/12 1:59:48 PM

modernization includes a commander’s independent thermal weapons station, position navigation equipment, improved fire control system, and an improved AGT1500 turbine engine. The FY 2013 Budget Request provides system technical support to complete the final M1A2 Abrams System Enhancement Package (SEP) production, fielding and training.

Shipbuilding and Maritime Systems The Navy’s major program acquistion strategy focuses on a central principle of forward presence. The idea is that forward presence promotes conflict deterrence by ensuring forces are in a position to expeditiously respond to conflict. In accordance with that mission need, the Navy’s Shipbuilding Portfolio for FY 2013 includes the funding for 10 new ships (two Virginia Class nuclear attack submarines; two DDG-51 Flight IIA destroyers; four Littoral Combat Ships (LCS); one Joint High Speed Vessel (JHSV); along with the construction funding for one carrier, the USS John F. Kennedy, the second FORD class nuclear powered aircraft carrier). These procurements will allow the U.S. Navy to maintain maritime superiority



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well into the 21st century. Figure 5 highlights the FY 2013 Shipbuilding Portfolio budget request. Today’s U.S. Navy currently has 11 active carriers. The CVN 21 Carrier Replacement ships will include new technologies such as an integrated topside island with a new multi-function radar, a new propulsion plant, monitoring improvements, manpower reduction technologies, flight deck enhancements, Electromagnetic Aircraft Launching System (EMALS), and advanced arresting gear. The CVN 21 ships provide credible, sustainable, independent forward presence during peacetime without access to land bases; operate as the cornerstone of a joint and/or allied maritime expeditionary force in response to crisis; and carry the war to the enemy through joint multi-mission offensive operations. The FY 2013 request funds first year of construction for USS John F. Kennedy (CVN 79). A critical part of the Navy’s strategy involves the Littoral Combat Ship

(LCS). It will be the first Navy ship to separate capability from hull form. LCS will be capable of employing interchangeable mission modules for Mine Warfare, Anti-Submarine Warfare and Anti-Surface Warfare to counter anti-access threats close to shore such as mines, quiet diesel submarines and swarming small boats. The LCS seaframe and mission modules are two separate and distinct acquisition programs that are synchronized to ensure combined capability. The FY 2013 Budget funds four LCS seaframes at $1.8 billion and procurement of three mission modules (one Mine Countermeasures and two Surface Warfare).

Command, Control, Communications and Computer Systems (C4) Making the most significant use of embedded computing and electronics is the C4 (Command, Control, Communications and Computer) Systems part of the DoD’s Budget. The DoD is

Aries Correct-A-Chip™ adapters solve military IC obsolescence problems easily and cost-effectively by letting you use what’s available and what’s qualified… without costly board redesign or rework. You can convert from any device footprint or package style to any other, from surface mount to thru-hole, from one pinout to another…all without respinning your boards. You can even add new componentry or circuitry in the same board space for added performance and capability. Solve your military IC obsolescence problems at:

Untitled-1 1 COTS Journal | March 2012 36

Bristol, PA 19007-6810 (215) 781-9956 Fax: (215) 781-9845 e-mail:

3/2/12 10:07:41 AM

transforming and developing new concepts for the conduct of future joint military operations. At the heart of these efforts is an interconnected network of sensors, shooters, command, control and intelligence. This networkbased interconnectivity increases the operational effectiveness by assuring access to the best possible information by decision-makers at all levels, thus allowing dispersed forces to communicate, maneuver, share a common userdefined operating picture, and successfully complete assigned missions more efficiently. Net-centricity transforms the way that information is managed to accelerate decision making, improve joint warfighting and create intelligence advantages. The end result is that all information is visible, available, usable and trusted—when needed and where needed—to accelerate the decision cycles. Net-centricity is a service-based architecture pattern for information sharing. It is being implemented by the Command, Control, Communications, Computer and Intelligence (C4I) community via building joint architectures and roadmaps for integrating joint airborne networking capabilities with the evolving ground, maritime and space networks. It encompasses the development of technologies like gateways, waveforms, network management and information assurance. Figure 6 shows the funding breakout of the C4 Systems category. The major programs here include JTRS and WIN-T. The Joint Tactical Radio System (JTRS) program encompasses ground, airborne, vehicular, maritime and small form fit variants of the radio hardware; 17 Increment 1 waveforms for porting into the JTRS hardware; and network management applications. All JTRS products are being developed in a joint environment to ensure interoperability and the enhancement of hardware and software commonality and reusability. The JTRS Ground Mobile Radio (GMR) program has been canceled, as the Army has revised its requirements and is seeking a more affordable solution. The FY 2013 Budget funds the de-


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velopment, testing and manufacture of JTRS engineering development models (EDMs), low rate initial production (LRIP) and full rate production (FRP), to include hardware and software, as well as sustainment of fielded radios and certified waveforms. The Warfighter Information Network–Tactical (WIN-T) is the Army’s on-the-move, high-speed, high-capability backbone communications network, linking warfighters in the battlefield with the Global Information Grid (GIG). This network is intended to provide command, control, communications, computers, intelligence, surveillance and reconnaissance (C4ISR) support capabilities. The system is being developed as a network for reliable, secure and seamless video, data, imagery and voice services for the warfighters in the theater to enable decisive combat actions. The WIN-T program consists of four increments. Increment 1 (Inc 1) provides “networking at the halt” by upgrading the Joint Network Node (JNN) satellite capability to access the Ka-band defense Wideband Global Satellite (WGS). Increment 2 (Inc 2) provides initial networking on-the-move to the battlefield. Increment 3 (Inc 3) provides full networking on-the-move via air tier. Increment 4 (Inc 4) provides protected satellite communications on-the-move. The FY 2013 Budget procures and continues to field WIN-T Inc 1 to the Army, with a Ka satellite upgrade. Fielding of Inc 1 will be completed by the end of 2QFY12, and Inc 1b Material Work Order (MWO) fielding will start in 4QFY12. WIN-T Inc 2 is currently in Limited Rate Initial Production (LRIP) in anticipation of its Initial Operational Test in FY 2012 followed by Full Rate Production in FY 2013. WIN-T Inc 3 continues in its Engineering, Manufacturing and Development (EMD) phase to deliver full networking on-the-move, including the airborne tier.

Space-Based and Related Systems (508)-678-0550 38

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COTS Journal | March 2012

1/12/10 10:03:31 AM

Space assets support deployed United States forces by providing communications services, navigation capa-

bilities, and information collected by remote sensors such as weather satellites and intelligence collection systems. Procurement of satellites and launch services are typically funded two years prior to launch. Generally speaking, the first two satellites of a new system are purchased with Research, Development, Test & Evaluation funding and the remainder of the satellites are purchased with procurement funding. The Air Force is implementing approaches to maximize efficient satellite acquisitions. These approaches include buying blocks of satellites, using fixedprice contracting to stabilize requirements, promoting a stable research and development investment for evolutionary growth, and modifying the annual funding approach for industrial base efficiency. The FY 2013 overall space program request at $8.0 billion is lower than FY 2012 (-22%), due to fewer satellites and launch vehicles being procured, and various research & development programs being rescoped or terminated, including the Defense Weather Satellite System.

SYSTEM DEVELOPMENT Annual EOL and Component Obsolescence Directory

Many Roads to Keeping Obsolescence Issues in Check The problem of obsolescence just keeps getting tougher. But to help alleviate some of those woes, a set of government groups, distributors and specialty engineering firms provide services to ease component obsolescence challenges. Jeff Child Editor-in-Chief


s commercial and consumer system lifecycles shrink, the components used in those broader markets are facing ever shorter life spans. As result, the problem of obsolescence—also known as Diminishing Manufacturing Sources and Material Shortages (DMSMS) in military parlance—is only getting harder. The good news is that there’s a solid infrastructure of companies and organizations armed to battle this problem. COTS Journal’s 13th Annual End-of-Life Supplier Directory, displayed on the following three pages, lists those players and what they do. The ways to deal with the problem of a chip that has gone end-of-life are many. There are also packaging firms who do custom assembly of obsolete integrated circuits using existing wafer and die. Taking the next step beyond that, there are even some firms that will remanufacture the obsolete die—often at a more modern process size. And there are also numerous aftermarket chip suppliers who stock inventories of devices that have gone obsolete. Among them is a mix of small firms specializing in aftermarket business, and large distributors 40

COTS Journal | March 2012

who include aftermarket products in their portfolio. The directory lists the key DoD initiated organizations whose responsibilities include component obsolescence management and support. Among these, the Defense Microelectronics Activity (DMEA) plays a key role by developing and coordinating solutions to DoD obsolescence problems. The group has specific responsibility for issues relating to semiconductors. When any large military program gets underway, a Diminishing Manufacturing Sources (DMS) team is set up. That team comprises members from the program office itself as well as from the various depots, acquisition logistic centers (ALCs) and OEMS involved. The DMEA then acts as a resource to the team by offering technical advice.

B-2 Bomber Example Exemplifying the problem of component obsolescence is the B-2 Bomber (Figure 1). After numerous electronics upgrades, the B-2 is expected to be around for a long time. No plans are in place to replace it, according to reports, for at least two more decades.

During one of its upgrade cycles, according to the DMEA, the B-2 Bomber faced a challenge where more than 140 obsolete microelectronic components and sub-modules could not be acquired for support of the B-2 Radar Warning Receiver (RWR). Not only was the system designed decades ago, there were also significant amounts of design and performance support documentation for critical parts that could not be located. That lack of parts and documentation was significantly impacting the supportability of the RWR and threatened to impact the mission of the B-2. To solve the problem, the DMEA effort was two-fold: First, the engineering staff within DMEA reverseengineered several microelectronic integrated circuits, a process involving testing and characterization of the original part, and redevelopment of design and performance documentation. New replacement parts with performance characteristics virtually identical to the original part were designed, tested and qualified. Production parts are currently available and are being used for support of the RWR. Secondly, DMEA contracted for and


Figure 1

With decades of upgrades ahead of it, the B-2 Bomber exemplifies the challenges of component obsolescence for military electronics and embedded computing. program-managed the efforts of several private-sector contractors to provide the reverse engineering, redesign, test, qualification and manufacture of obsolete subassemblies within the RWR. This effort required constant monitoring and coordination of tasks between multiple contractors and government agencies due to the specialized nature of the work.

Testing Is Critical Whether a replacement part or an archived version of an obsolete part is used, the testing phase is all important. That’s where the requirements are either met or not. With that in mind, Rochester Electronics, a specialist in mature and end-of-life semiconductors, has adopted what it calls its Original Engineering-Driven Test

Protocol, whereby Rochester engineers use the manufacturer’s factoryapproved test programs or, when appropriate, upgrade those programs or even develop new test programs. When the original test programs and/ or test systems are unavailable from the original manufacturer, Rochester’s test engineers develop new test programs based on the latest revisions of the data sheets. Because the test process is relied upon to prevent defective components from being shipping to customers as “good” devices, it is critical to correctly match the proper test techniques with the overall component/system requirements. Rochester’s test engineers apply extensive experience with fault conditions and fault classes that can exist exclusively to certain technologies

(for example, IDDQ testing of CMOS devices) and product classifications (for example, blown fuse faults in PLDs). This knowledge facilitates the implementation of the appropriate test techniques and methodologies that produce accurate results. If necessary, Rochester engineers convert test programs to existing test platforms using proven in-house custom conversion software tools.

March 2012 | COTS Journal


SYSTEM DEVELOPMENT Annual EOL and Component Obsolescence Directory

Company/Organization Contact




Annapolis, MD. (866) 321-6060. [].

B, DB, L, R

ARINC works with companies to develop a cost-effective obsolescence management program. This includes developing and implementing a DMSMS program, determining future component availability, and evaluating alternative strategies for component replacement. They can determine status of mechanical parts with ARINC Logistics Assessment and Risk Management System (ALARM).

Arrow/Zeus Electronics

Melville, NY. (631) 847-2000. [].

O, S

Offers up-screening and testing through third-party test labs, selected and approved by customers. Offers a range of DMS services. Listed on the GIDEP notification system and an active member of JEDEC. Services range from "frontend" Bill of Materials (BOM) management to "back-end" sourcing solutions.

Artisan Scientific

Champaign, IL. (888) 887-6872. [].

B, L, O

Inventories over 50,000 pieces of equipment, including 10,000 exclusively for the VXI platform, allowing them to supply and support systems throughout extended life cycles. Emphasis on VXI, VME, VXI/cPCI and other industrial platforms. Helps customers manage their DMSMS supply and COTS obsolescence requirements for their in-service and extended-life equipment platforms.


Phoenix, AZ. (480) 643-2000 [].

DB, E, L, O, P, R, S

Global electronics distributor with numerous value-add services from testing and screening to assembly. Offers supply-chain and design-chain services, logistics solutions, product assembly and more. Avnet’s logistics centers that house military product are ITAR certified and meet or exceed homeland security requirements.

Center for Advanced Life Cycle Engineering (CALCE)

College Park, MD. (301) 405-5323. [].

B, DB, R, S

The Center for Advanced Life Cycle Engineering (CALCE) is recognized as a driving force behind the development and implementation of physics-of-failure (PoF) approaches to reliability, as well as a world leader in accelerated testing, electronic parts selection and management, and supply-chain management.

CPU Technology

Pleasanton, CA. (925) 224-9920. [].

B, E

CPU Tech produces secure processors that protect software and systems from reverse engineering. Acalis enables the development of secure and compatible electronics modernization technology solving obsolescence problems while reducing size, weight and power (SWAP).


McClellan Park, CA. (916) 231-1555. [].

B, E, F, G, P

DMEA provides long-term, strategic support for the entire range of DoD systems that utilize microelectronics. DMEA presents the system manager with appropriate solution options to not only keep the system operational but also transform it to the next level of sophistication. These solution options range from component upgrades to board or system upgrades with advanced technology.

DPA Components International

Simi Valley, CA. (805) 581-9200. [].

D, P, S

Offers custom packaging, qualification, screening, counterfeit analysis and its own DPEM (De-capsulate Plastic Encapsulated Module) process for obsolete parts. Perform review of obsolete part specification, recommend closest available part substitution. Generate test plan or assembly drawing to custom package and/or upgrade part to required quality and reliability level.

DLA Land and Maritime

Columbus, OH. (614) 692-0663. [].

DB, G, R

Defense Supply Center, Columbus (DSCC) is a Supply/Demand Chain that manages more than 2 million different items. An end-to-end supply chain manager, DLA Land and Maritime's state-of-the-art systems connect business processes from the supplier to the customer through the Land and Maritime Supply and Demand Chains.

e2v aerospace and defense

Santa Clara, CA. (408) 737-0992. [].

DB, D, E, F, R

(Formerly QP Semiconductor). e2v supports the supply of hi-rel semiconductors for specialist aerospace and defense programs over the full system lifecycle. Offers design, development and re-engineering services combined with the capability to store, test and package devices.

Electronic Expediters

Camarillo, CA. (805) 987-7171. [].


Buys, sells and stocks military and commercial electronic components. Specializes in military, industrial and commercial-type component parts, and carries a large selection of obsolete and hard-to-find spare parts.

Falcon Electronics

Commack, NY. (800) 444-4744. [].

L, O, S

Distributor to the avionics, military and space industry. Falcon’s line card showcases superior, high-reliability product lines from the industry’s top manufacturers, all with long-term Mil-Aero strategies, reducing the possibility of obsolescence.

GD California

Livermore, CA. (925) 456-9900. [].

B, E, O

Manufacturer specializing exclusively in legacy boards, system-level products and obsolescence management. These products include: VME bus, STD & STD32 bus, CompactPCI, MBI, MBII, SBUS, QBUS, UNIBUS, telecommunications systems, SCSI bus boards; graphic boards; data storage units; chassis and canisters; and small computer systems. Once the manufacturer transfers these products to us, their form, fit and functionality are maintained at the level of revision, at the time of transfer.


COTS Journal | March 2012


• Systems tailored to your requirements • Built tough for extended system deployments • Designed-to-meet and certified MIL-STD-810 systems • 5-year factory warranty for Trenton SBCs, motherboards and backplanes • Standard and custom boards with BIOS revision control • COTS hardware maximizes system flexibility • Key industry partnerships enable advanced turnkey solutions


The Global Leader in Customer-Driven Computing Solutions™


Company/Organization Contact




Corona, CA. (951) 898-3207 [].

DB, G, R

GIDEP works closely with different government activities on several DMSMS projects that will eventually be migrated to a GIDEP system. Among these projects are the DMS Shared Data Warehouse, the DMSMS Prediction Tool, and the Army DMS Info System. Future migration of these systems in GIDEP would facilitate GIDEP's role as the central repository of data for DMS management.


Geneva, Switzerland. + 41 22 919 02 15. [].


IEC generates international standards for the practice of uprating components and using them in systems. IECQ conducts the IEC’s certification program for electronic components, processes and related materials, including aerospace.


Englewood, CO. (303) 790-0600. [].


Offers tools for obsolescence, counterfeit and environmental compliance management that provide up to date information that manufacturers can rely on to identify end-of-life components, quickly find lead-free alternates and avoid at-risk parts and suppliers.

Innovasic Semiconductor

Albuquerque, NM. (505) 883-5263. [].


A fabless semiconductor that offers devices that are pin-compatible, drop-in replacements that are software compatible with devices originally manufactured by the suppliers. Offers these extended life ICs as drop-in replacements for use in existing products as well as for new designs.

Inventory Locator Service (ILS)

Memphis, TN. (901) 794-5000. [].


Inventory Locator Service enables subscribers in the aerospace, defense and marine industries to buy and sell parts, equipment and services. Over 5 billion parts listed, 60,000 customer accesses each day and 20,000 subscribers.


San Diego, CA. (714) 758-4158. [].

B, E, P

Facilities for electronic and mechanical design, rapid prototype development, ISO-compliant flexible manufacturing systems, and complete functional lifecycle support.

Lansdale Semiconductor

Tempe, AZ. (602) 438-0123. [].

D, E, O, P

Aftermarket support of obsolete ICs from major semiconductor suppliers. Certified and approved by the Defense Supply Center Columbus (DSCC) as a Qualified Manufacturer (QM) of electronic military components under the MIL-PRF-38535 Qualified Manufacturing List (QML), as well as being an ISO 9001-2008-qualified supplier.

Maxwell Technologies

San Diego, CA. (858) 503-3300. [].

E, P

Uses MCM package as form, fit and functional replacement. Maxwell Technologies is qualified to MIL-PRF-38535, Class Q and Class V. Many of our products are manufactured using MIL-PRF-38534 as a guideline and screened to Maxwell’s self-defined Class H and Class K flows.

Micross Components

Los Angeles, CA. (215) 997-3200. [].

B, DB, D, L,P, R Capability covers obsolescence solutions including stock management, component / bare die storage and fit, form and function component emulation.

Minco Technology Labs

Austin, TX. (512) 834-2022. [].

D, O, P

Offers custom packaging division with additional emphasis in standard part packaging, known-good die processing, and other high-reliability applications. QML 19500 Certified by DSCC. Minco’s inventory and obsolescence management can maintain specified die and packaged products in desired quantities at bonded inventory locations.


Hopkins, MN. (952) 931-2400. [].

B, DB, D, O, P, S

A material manager, procurement, distribution and light manufacturing supplier of military spare and repair parts for a wide range of military vehicles and electronic equipment to the U.S. Department of Defense, OEMs and over 60 Defense Forces around the world.

Now Electronics

Huntington, NY. (631) 351-8300. [].

L, O, P

Distributor specializing in military and aerospace level components. Approved supplier to Lockheed-Martin, Northrop-Grumman, Raytheon, Boeing Sanmina-SCI Systems, the U.S. Defense Dept., NATO and many others.

Phoenix Logistics

Tempe, AZ. (602) 231-8616 [].

E, O

Provides complete system development and life cycle management of integrated data transmission and avionics interconnect solutions including MIL-STD-1553, RF/Microwave, and High Speed data to the military and aerospace market.

Pikes Peak Test Labs

Colorado Springs, CO. (719) 596-0802. [].

B, D, E, L, O, P, S

Lab experienced in SEM (Scanning Electron Microscopy) with Elemental Analysis (EDX) capabilities, electronic component upgrade screening to MIL-STD-883, Class B, lid torque, radiation hardness testing and evaluation. Offers in-house services to assist in determining whether your components are genuine or potentially counterfeit.


Gaithersburg, MD. (240) 883-9170. [].


Precience develops and markets enterprise level EH&S, environmental compliance management, obsolescence management, content management, procurement decision support and design chain management products.


COTS Journal | March 2012


Company/Organization Contact



Richardson Electronics

LaFox, IL. (630) 208-2200. [].

DB, O, P

Engineering services to aid product manufacturing, systems integration, prototype design and parts logistics from design-in through after-market stages.

Rochester Electronics

Newburyport, MA. (978) 462-9332. [].

D, F, O, P, R

Authorized/franchised supplier of aftermarket parts. Manufactures more than 20,000 devices from a wafer bank of over 10 billion manufacturer-supplied die and Rochester-fabricated die using the original manufacturer's tooling and process information. Manufacturing flows include commercial, industrial, military temp, MIL-STD-883, SMD, QML, Space and customer SCD.


Princeton, NJ. (609) 734-2168. [].

B, E, F, R, P

Through the GEM and AME programs, DLA, DSCC and Sarnoff offer a flexible technology that can be used during any phase of a weapon system life cycle, offering a permanent solution to obsolescence at the component or board level while reducing total ownership cost and maintaining readiness levels.

Sensitron Semiconductor

Deer Park, NY. (631) 586-7600. [].

B, D, E, F, P, R, S

Specialties include design, process materials, electrical, packaging and testing. Facility has AS9100 3rd Party Registration Certificate Process to the MIL-PRF-19500, Flow Qualified to MIL-PRF-38534 Hybrids Class H Level.

Tektronix Service Solutions

Beaverton, OR (800) 438-8165. [].


Offers test and calibration services to space and defense prime contractors, government agencies and commercial manufacturers, including automotive, avionics, telecom and medical. Services include semiconductor and passive component test, wafer probe, product test and evaluation, and repair and calibration of general electrical and mechanical test equipment. Fixed locations, on-site locations and mobile calibration facilities nationwide. ISO9001:2000 registered, DSCC-approved, A2LA (ISO/IEC-17025) accredited and ISTA-certified.

T.S.I. Microelectronics

Danvers, MA. (978) 774-8722. [].

D, E, O, P

Specializes in Hybrid Microcircuits and assembly of semiconductors in hermetic packages, such as: Flat Packs, DIPS, TO-46, TO-18, TO-87, TO-39, TO-99, TO-3, TO-254, TO-257 and TO-258 to name a few. T.S.I.'s product line includes replacement devices for products that have been discontinued by sources.

Total Parts Plus

Fort Walton Beach, FL. (850) 244-7293. [].

D, B

Specializes in environmental compliance and obsolescence management solutions in the form of data content, web-based solutions and hosted services. Provides a real-time PCN/PDN Alert Service, alternate component sourcing and life-cycle forecasting.


Ann Arbor, MI. (877) 944-1942. [].

B, L

Specializes in using their Intel-based CPU design experience to create replacement VME and CompactPCI legacy solutions, which are pin for pin and BIOS compatible with the original design. This allows customers to procure processor boards in lower volumes and maintain ongoing programs for several more years, without cost-prohibitive last-time buys or expensive and extensive upgrades.





Board level

Solves board-level DMS problems (as opposed to component-level problems).



Provides a database covering topics such as alternate sources, devices that are obsolete, cross-references or uprating results.


Die processor

Refers to processing OEM die, not an emulated solution.


Emulation/reverse engineering

Vendor may emulate a DMS device in a gate array or full-custom device, or provide a pseudo-form, fit and functional equivalent.



Has foundry capability to fabricate wafers.


Government agency




The vendor provides a service to locate DMS components and boards/systems.


Obsolete inventory

Maintains OEM inventory in die or packaged form.


Specialty packaging

Packages components as monolithic or multi-chip modules.


Industry reference

Denotes an organization or company with widely recognized knowledge or information concerning the DMS industry.



Performs uprating or upscreening.

March 2012 | COTS Journal


SYSTEM DEVELOPMENT Annual EOL and Component Obsolescence Directory

Die Extraction Strategy Solves DMSMS Challenges Component obsolescence challenges continue to plague military system designs. By extracting die and reassembling into another package, designers can get the fit, form and function they require. Brian Shumaker, Marketing Manager Global Circuit Innovations


t’s completely common these days for commercial ICs to be used in long lifetime military systems—with 20to 30-year life cycles. That coupled with the steady decrease of commercial IC life cycles—typically 2 to 3 years—means that component obsolescence is becoming an increasingly difficult aspect of managing production logistics and procurement. In many cases that component obsolescence means that the device package configuration used in the original build of materials cannot be located. A part in DIP, SOIC, LCC, PQFP format or possibly even bare die might be impossible to find even though it could be readily available in an alternate package footprint. Fortunately services are available to provide reliable, cost-effective, highvolume extraction technology to remove silicon die from any plastic or ceramic package. This can be done while keeping it fully functional. They can then be reassembled into any other plastic and/ or hermetically sealed ceramic package footprint. Even ceramic upgrades are also possible, with all of the benefits associated with ceramic packaging. This technology provides many potential solutions targeting the need for part reclamation and microcircuit refabrication, both current topics pertinent to resolving DMSMS issues. 46

COTS Journal | March 2012

Figure 1

Shown here is a die removed and cleaned with gold wires removed—ready for installing in a new package.


Gaussian Distribution Comparisons for Bond Pull Data 0.6

Figure 2

Extracted die are shown here in gel packets available for creating obsolete semiconductor package forms or developing advanced or obsolete hybrids.

Relative Frequency


Mil-STD-883H Lower Spec Limit =3.0 grams


OEM-Gold1 GCI-Gold1 GCI-Gold2

GCI-Gold1 OEM-Gold1 GCI-Gold2




0 0

Extraction in the Commercial Industry The technology associated with die extraction and reassembly has been in use for many years within the commercial industry. The die extraction process relies on a chemical and mechanical process tailored to each package type that is no more aggressive than those that the original die was exposed to when the device was originally manufactured. The process is performed in a clean room using high volume vacuum hoods to remove fumes that may be created during the chemical extraction process to protect the personnel. The spent chemicals are naturalized after the extraction process according to standards specified by the Environmental Protection Agency (EPA). Once the die has been successfully extracted from either a plastic or ceramic package, the original gold wires are mechanically removed just above the original gold ball bond, leaving the original ball bond in place, providing a clean, uncontaminated gold surface for high-adhesion re-bonding (Figure 1). This process also provides an added benefit of screening for weak original bonds. The only subsequent non-standard assembly process is that a new gold ball bond is made to the existing gold ball bond surface, rather than to the original aluminum pad interface. Not removing the complete ball bond maintains the full functional integrity of the die, so the die is as reliable as if it was removed from the original wafer. 48

COTS Journal | March 2012









Bond Pull Strength (grams)

Figure 3

Bond pull tests show reassembled die meets or exceeds Mil-STD-883H specifications.

Reusing Semiconductor Die Under proper process optimization, the new gold bond on the existing gold ball bond adheres extremely well and is referred to as a “compound bond.” This bonding method is reliable for repackaging a die in a blank or open package to reclamate the identical obsolete package “form.” Using the original die allows it to be compatible across all military electronic systems for which the die was originally approved. Using an extracted die for creating custom hybrid circuits creates the opportunity for using the latest die available on the market (Figure 2) without the cost of buying a whole or partial wafer. The reliability of a compound bond to an extracted die pad is supported with pre- and post-die extraction/reassembly bond pull data, which is not only indistinguishable in both cases, but also generally limited to the tensile strength of the bond wire used. Additional test data shown in Figure 3 referencing bond pull strength is statistically identical for pre- and postextraction/re-assembly processing.

Avoiding Counterfeit Issues The die extraction and reassembly process also has the added benefit of pro-

viding inspected, genuine silicon for subsequent reassembly, while significantly reducing the possibility of inadvertent use of “counterfeit devices” in military systems. When the die is reassembled in a new package form to reclamate an obsolete component, Global Circuit Innovations’ standard policy is to apply a custom part number to the device and never label it with its original part number. GCI also partners with companies that are accredited by the Defense Microelectronics Activity (DMEA) as a DoD Category 1A Trusted Integrated Circuit Supplier for Test Services if the repackaged component needs additional up screening to meet specific Mil-STD883H series of tests. Global Circuit Innovations can provide raw extracted die in less than a week or as little as two days with a yield of greater than 90 percent. To take advantage of these services, the customer sends any quantity of prescreened semiconductor devices to GCI. The die will be safely removed from the package; kept fully functional, and they are packed in vacuum gel packets to be quickly shipped back to the customer. The die is then available to be installed


Figure 4

GCI die reclamation service provides a cost-effective alternative to other highercost solutions such as redesign or refabrication of the microcircuit chip to resolve Diminishing Manufacturing Sources and Material Shortage (DMSMS) issues. Instead of performing a costly PCB re-spin to accommodate an obsolete component, or use expensive reverse engineering techniques to replicate the die and package, consider using a die extraction and

reclamation service the next time there’s a need for a low-cost solution to an obsolete die, or a need for an obsolete semiconductor device that meets its original form, fit and function. Global Circuits Innovations San Carlos, CA. (650) 593-7083. [].

This shows an example of extracted die reassembled in a different package form. in Hybrid, Multi-Chip-Modules or in a custom package. Figure 4 shows an example of an extracted die reassembled in a different package form. GCI also can repackage the die in a hermetically sealed ceramic package to operate at 125°C, or a high temperature reassembly process can upgrade the device to operate at greater than 185°C. One hundred percent wire bond verification is performed and the parts are labeled with a custom part number.

Leveraging Other Available Package Options Most die are available in different package forms when originally manufactured, so if a COTS component package form is obsolete (such as CERDIP) but is readably available in a PLCC or other type of package, Global Circuit Innovations can safely remove die from the available package. It is then installed in a new blank package to reclamate a device that meets the exact form, fit and function of the obsolete component. Using the original die eliminates compatibility performance issues if used across military electronic platforms where the same die has been qualified. GCI can provide extracted die in small or high volume from plastic packages, ceramic packages, metal cans or hybrids with a greater than 90 percent yield. The extracted die can be made available in a vacuum gel package to create hybrid or MCM devices if it is too expensive to buy a full wafer or the die is obsolete. The Untitled-1 1

PM March 2012 | COTS9/17/09 Journal3:09:1049

TECHNOLOGY FOCUS Small Form Factor Boards

Small Form Factor Boards Up Their Compute Density Game Offering mission-critical solutions for a variety of mobile, space-constrained military systems, small form factor boards continue to offer faster processing in compact, lower power packages. Jeff Child Editor-in-Chief


olving the needs of systems including small UAVs, robotics, missionspecific handheld systems, intelligent munitions and many others, small form factor boards are now at the center of many key defense applications. As the “Small Form Factor Boards Roundup” on the following pages shows, today’s crop of choices includes ESMini, EBX, SUMITISM and COM Express along with a variety of small non-standard boards. Because COTS Journal will cover PC/104 and PC/104-family boards as a dedicated Roundup topic in the June issue this year, this Roundup is restricted to small form factors other than PC/104-family boards. An example of the kind of military platform suited for small form factor computing is the Modular Advanced Armed Robotic System (MAARS) (Figure 1) from QinetiQ North America. This unmanned ground vehicle (UGV) can be positioned in remote areas where personnel are currently unable to monitor their security, and can also carry either a direct or indirect fire weapon system. It is remotely controlled by an operator 50

COTS Journal | March 2012

Figure 1

The Modular Advanced Armed Robotic System (MAARS) can also carry either a direct or indirect fire weapon system. It is remotely controlled by an operator equipped with a lightweight, wearable control unit (shown). equipped with a lightweight, wearable control unit. MAARS features multiple onboard day and night cameras, motion detectors, an acoustic microphone, a hostile fire detection system, and a speaker system with a siren to provide optimum situational awareness and alarm. In the past 12 months, COM Express has emerged as the most common format among new small form factor product rollouts. The Computer-on-Module (COM) concept has found a solid and growing foothold in military embedded systems. COM Express adds high-speed fabric interconnects to the mix. COM boards provide a complete computing core that can be upgraded when needed, leaving the application-specific I/O on the baseboard.

A single COM Express module can provide the same processing and graphics performance as alternative solutions, like a multiple PC/104 board stack. Designers have three COM Express module sizes to choose from to suit their individual application requirements. All signals are maintained on the carrier card, where additional connectors can be added as required per specific applications. As a macro-component, COM Express enables technology insertions without a large time or monetary investment, and supports easy upgrades through multiple product lifetimes. With recent improvements in video support and chipset graphics, integrated video support has become a mandatory requirement for UAVs and other military systems. COM Express planned for the expansion of video and display capabilities, and provides standard connector access for a variety of high-speed interfaces. The COM Express connector supports multiple video interfaces including DisplayPort, VGA, SDVO, HDMI or DVI. This allows designers to take advantage of the latest graphics capabilities without having to worry about affecting performance. COM Express was specifically designed to ease the transition from legacy connectors and offers native interface support for modern-day I/O interfaces. On top of offering more PCI Express and USB ports than PC/104-Express modules, additional connecters can be added for LAN, SATA, video, audio, USB and PCI Express, delivering maximum I/O flexibility to meet specific application requirements. And since signals do not have to pass through multiple connectors, the signal integrity remains intact.

Rugged Stand-Alone Box & PCI Express Products Gallery Mission Computers Safety-critical and certifiable COTS building blocks Rugged multiprocessing architecture FPGA custom processing Variety of avionic interfaces Multiple gigabit Ethernet interfaces Video input, output, compression Flash-based mass storage Sealed ATR military enclosures (40/40)

Featuring the latest in Rugged Stand-Alone Box & PCI Express Products technologies

CES - Creative Electronic Systems SA Phone: +41 22 884 51 00 Fax: +41 22 794 74 30


SIU6 - Embedded I/O System – Sensor Interface Unit

Curtiss-Wright’s Hybricon brand RME13XC extreme cooling rackmount OpenVPX chassis meets stringent ANSI/ VITA 65 power/cooling requirements for 6U 150W OpenVPX™ modules. Available with 6U 16-slot 1” pitch VITA 68 signal integrity compliant 6.25 Gbaud OpenVPX backplane and 3300W power supply. Conduction cooled version also available.

Curtiss-Wright Controls Defense Solutions Phone: (978) 952-2017 Fax: (978) 952-8717

E-mail: Web:

High Density Multi-function I/O subsystem for data acquisition, distribution and processing applications Features compact, conduction-cooled enclosure, 6U VME high density multi-function I/O boards, integrated power supply and Ethernet/Networkcentric communications Modular architecture allows mixand-match I/O, communications and processing functions Low profile, rugged, base-plate cooled chassis

North Atlantic Industries, Inc. Phone: (631) 567-1100 Fax: (631) 567-1823

RMB-C2 Rugged Mobile Computer

Phone: (303) 412-2013 Fax: (303) 426-8126

Pentek, Inc. E-mail: Web:

E-mail: Web:

Onyx Model 78760: PCI Express Board with Four 200 MHz, 16-bit A/Ds and Virtex-7 FPGA

Modular design ensures rapid customization Designed, manufactured and certified in the US Wide temperature range -40°C to 75°C MIL-810F shock and vibration Best-in-class shock mount Meets ISO-7637 & MIL-1275B

Computers in Motion

E-mail: Web:

Phone: (201) 818-5900 Fax: (201) 818-5904

PCI Express (Gen. 1, 2 & 3) interface x4 or x8 Four 200 MHz 16-bit A/Ds 4 GB DDR3 SDRAM Xilinx Virtex-7 VXT FPGA Clock/sync bus for multiboard synchronization Advanced reconfigurability features Optional user-configurable gigabit serial interface Also available in XMC, OpenVPX, and cPCI formats E-mail: Web:

TECHNOLOGY FOCUS: Small Form Factor Boards Roundup COM Express Type 6 Module Is Extreme Rugged Solution

Module Adds Multi Monitor Support and Storage Options

COM Express Compact Module Boasts Low Power Performance

A COM Express Type 6 module based on the quad/dual-core second generation Intel Core i7 processor and Mobile Intel QM67 Express Chipset is targeted at mobile applications running in harsh environments. The ExpressHRR from Adlink Technology follows Adlink’s “Rugged by Design” methodology for use in environments prone to severe shock, vibration, humidity and extended temperature ranges. The Ampro by Adlink Express-HRR is a modular, power-efficient solution for mobile applications running in space-constrained,

Advanced Digital Logic has announced the release of its ADLGS45-DHSP. The ADLGS45DHSP can be added to the company’s ADLGS45PC to expand its video and data storage capabilities. The ADLGS45-DHSP takes SDVO signaling from the ADLGS45PC PCIe bus. The SDVO is then level shifted by a pair of Chrontel CH3781C to provide signaling for DVI-D and HDMI outputs at a maximum

A low-power COM Express compact module is powered by the Intel Atom processors 400 and 500 Series. The new SOM 6763 B1 from Advantech B1 with Intel Atom processor N455 (512K Cache, 1.66 GHz) and Intel Atom processor D525 (1M Cache, 1.80 GHz) migrates its memory from DDR2 to DDR3 along with both 18-bit and 24-bit LVDS. The SOM-6763 B1 is suitable for portable devices, medical equipment and rugged applications.

extreme rugged environments. The ExpressHRR is compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout, which is based on the popular Type 2 pinout, but with legacy functions replaced by digital display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 6 pinout also supports the SPI Interface, which was unavailable in COM.0 Rev. 1.0. The Ampro by Adlink Express-HRR offers up to 16 Gbyte ECC 1333 MHz DDR3 memory in two SODIMM sockets; three DDIs for DisplayPort/HDMI/DVI/SDVO; eight PCIe x1 and one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1); as well as two SATA 6 Gbit/s, two SATA 3 Gbit/s, Gigabit Ethernet and eight USB 2.0 interfaces. The Express-HRR is validated for reliable performance in extended temperatures ranging from -40° to 85°C and features a 50 percent thicker printed circuit board (PCB) for high vibration tolerance.

resolution of 2048 x 1536. The onboard DVI and HDMI video ports can be optionally removed and replaced with 2 mm locking pin headers when custom cabling or when deep embedding prevents their use. By way of the Intel GMA 4500 video driver, dual independent display is possible in various combinations of LVDS, HDMI, VGA and DVI-D. The ADLGS45-DHSP also offers additional functionality with SATA and PATA ports. The SATA interface provides two SATA 3 Gbit/s ports in addition to the four ports located on the ADLGS45PC. The PATA interface will provide Primary Master /Slave IDE drive functionality. Primary Master can also be populated with an onboard 2, 4 or 8 Gbyte SSD that can be optionally write protected via jumper.

The SOM-6763 B1 complies with COM R2.0 type 2 specification for customers targeting lower power consumption and higher performance applications. The compact design (95 x 95 mm) is suitable for applications such as portable POS, transportation, entry-level gaming machines, patient monitoring and factory automation. SOM-6763 B1 allows customers to choose from 18-bit or 24-bit LVDS, which makes available a greater variety of displays to choose from. Advantech iManager provides a valuable suite of programmable APIs such as Multi-level Watchdog, Hardware Monitor, Smart Fan and more; all with user friendly interfaces following the EAPI 1.0 standard. Since this is a built-in solution on chip, iManager ensures functions operate even if the OS fails.

Advanced Digital Logic San Diego, CA. (858) 490-0597. [].

Advantech Irvine, CA. (949) 789-7178. [].

ADLINK San Jose, CA. (408) 360-0200. [].


COTS Journal | March 2012

Small Form Factor Boards

COM Express Module with the Latest Atom Processor-Based Platform A Type VI compact size COM Express Basic module measuring 95 mm x 95 mm (3.74˝ x 3.74˝), the PCOM-B218VG from American Portwell includes the Intel Atom processor N2000 and D2000 series and the Intel NM10 Express chipset. This platform includes an integrated Intel Graphics Media Accelerator (GMA) 3600/3650 engine to enhance 3D performance for media applications such as

high-definition 1080p imaging; two Display Ports that support multiple DP/HDMI/DVI functions; one SO-DIMM socket to support DDR3 SDRAM up to 4 Gbyte; two SATA; one Fast Ethernet; expansion (via the COM Express carrier board) of four PCI-E x1, which can be configured to one PCI Express x4, LPC interface and high-definition audio interface; and a PCOM-C211 developer COM Express Type VI carrier board. The PCOM-B218VG is targeted for applications such as medical devices, test equipment, industrial control, gaming machines, portable devices and COTS military. In each of these market segments, COM Express safeguards development investments and lowers total cost of ownership by enabling designers to partition commodity host-processor COM Express modules from proprietary, value-added platform building blocks, including FPGAs and specialty I/Os on custom baseboards. COM Express modules can help minimize current and future design risks because they help save development time and costs during initial phase of development, while achieving faster timeto-market, simplifying the future upgrade path and scalability, and increasing the application lifecycle.

American Portwell Fremont, CA. (510) 403-3399. [].

Qseven Mini Carrier Baseboard for Accelerated Design-In

Module Family Provides Analog and Digital I/O Options

A new mini carrier baseboard for spacecritical applications is based on the Qseven standard. The Conga-QMCB baseboard from Congatec is suitable for fast prototype design and compact, mobile applications. Measuring 145 x 95 mm, the easy-to-integrate mini carrier board is packed with a wide range of state-ofthe-art interfaces and is designed to accelerate the evaluation process in the design-in phase, thereby facilitating faster time-to-market. DisplayPort, HDMI and LVDS 18/24 Bit graphics interfaces have been implemented,

A family of I/O expansion modules for systems is based on single-board computers (SBCs) that expand using either PCI/104Express, PC/104-Plus, or SUMIT-ISM. The modules implement identical analog and digital I/O feature sets on all three formats, letting companies choose their favorite expansion format now, while reserving the option of migrating to an alternate format in the future without major rework to the application’s I/O software or interfaces. The E104-DAQ1616, P104-DAQ1616 and SMT-DAQ1616 (shown) modules are implemented on the PCI/104-

together with six USB interfaces and an Ethernet connection. The board also offers additional standard interfaces such as high definition audio and a mini PCI express socket, which can be used for WLAN. SD-Card, 2x SATA and CFast have also been integrated on the baseboard to enable the connection of mass storage devices. The Conga-QMCB is powered by a single 5V DC supply. Battery management signaling is fully incorporated, enabling the use of the Congatec Smart Battery Manager (CongaSBM2) and making the baseboard a simple solution for mobile systems. The Conga-QMCB is designed for use with the new Conga-QAF computer module, which is based on AMD Fusion technology; and the Conga-QA6, which is based on the current Intel Atom E600 series.

Express, PC/104-Plus and SUMIT-ISM Type1 expansion formats, respectively. Each includes sixteen 16-bit A/D inputs and sixteen 16-bit D/A output channels, with programmable range and polarity. The modules’ highperformance A/D converter operates at a 2 MHz sample rate. Each module also includes seven 8-bit digital I/O ports (with a mix of bit-wide and byte-wide direction control), two 32-bit up/ down counter/timers with programmable input source and gate, four 24-bit pulse-width modulation circuits with 0-100% duty cycle, and a watchdog timer. Each module’s set of I/O ports is organized into a combination of byte-wide, nibble-wide and bit-wide direction control, for maximum flexibility and application compatibility. Outputs implement 3.3V logic levels with 5.0V compatibility, and inputs are buffered to protect the FPGA. Although the standard, default configuration supports 96 programmable digital I/O lines, the modules can be reconfigured to enable an array of additional features, including eight 32-bit up/ down counter/timers with programmable input source and gate, four 24-bit PWM circuits with 0-100% duty cycle capability, and interrupt/ latched mode operation. Pricing for the Analog I/O SUMIT Type 1 module SMT-DAQ1616 (shown) starts at $750.

Congatec San Diego, CA. (858) 457-2600. [].

Diamond Systems Mountain View, CA (800) 367-2104. []. March 2012 | COTS Journal


Small Form Factor Boards

Atom-Based Rugged SBC Is iPhone-Sized For many of today’s military applications, it’s all about compute density. Feeding that need, General Micro Systems (GMS) has developed an Intel Atom-based rugged SBC that offers unbelievably low power consumption. Combined with its exceptionally small footprint and high performance, the Atom XPC40x (extended temperature, conduction-cooled) and Atom XP40x (standard temperature) satisfy the intense demand for an ultra-small computer with full-size processing power.

Easily accommodating 64 Gbytes of storage via onboard solid-state disk in its miniature 3.5 x 2.5 x 0.5-inch package, Atom is the world’s smallest full-featured rugged computer. It boasts 533 MHz DDR-2 SDRAM and is powered by a 1.6 GHz Intel Atom processor that provides 512 Kbytes of cache. With full laptop functionality, Atom offers high-performance graphics with 3D acceleration, and includes five USB-2.0 ports and support for two Express Mini Cards for Wi-Fi, CanBus or other user I/O. The Atom XPC40x is designed to operate at -40° to +85°C with a maximum thermal gain of only 5°C above ambient. Because of its heat tolerance, it is ideal for applications where ambient temperature is high, such as a controller located in an engine compartment or for small robots and UAVs working in extreme temperatures. The Atom, with its exceptionally low power consumption/dissipation (3W average, 10W peak), imposes little to no impact on the user, eliminating many inherent problems with wearable computers. Pricing starts at $1,295 for the conduction-cooled XPC40x and $695 for the standard-temperature XP40X in single quantities.

General Micro System Rancho Cucamonga, CA. (909) 980-4863. [].


COTS Journal | March 2012

COM Express Reference Carrier Designed for Extended Temperature A reference and evaluation board validated for use in the extended temperature range of -40° to +85°C makes a suitable platform either for direct deployment in, or for carrying out development of, rugged applications in extreme environments. The COM Express Reference Carrier-i Type 10 from Kontron can host all COM Express mini COMs with pin-out Type 10. In addition to COM Express Type 1 pin-outbased designs, the Kontron Reference Carrier-i Type10 features new digital video interfaces

such as DisplayPort and DVI, CAN Bus and COM ports. Developers and OEMs will now have more I/O flexibility for developing scalable and ultra-compact applications on a 120 x 120 mm Nano-ITX footprint. The Kontron COM Express Reference Carrier-i Type 10 is suitable for all COM Express Type 10-compliant mini COMs and carries all of the interfaces defined for the COM Express pin-out Type 10. In addition to the availability of LVDS, developers will also enjoy the benefits of the DisplayPort and DVI interfaces that are directly accessible on the carrier board. This reference carrier board design offers remarkable flexibility when selecting the type of panel to be deployed. For application-specific expansion, the carrier board offers two Mini PCI Express extension slots with USB and SIM card support. This makes developing applications that are connected via GSM, UMTS or future LTE, a simple task. A total of seven USB ports are available, including port 7 as a USB client. The power supply can also fall within a wide range of 5.5 to 20 VDC.

Kontron Poway, CA. (888) 294-4558. [].

Low Power, High Processing Combine in ESMini Module An ESMini module uses a PowerPC MPC5121e or a MPC5123 processor, each based on an e300 processor core incorporating a memory management unit (MMU) and a floating point unit (FPU) as well as a powerful 760 Mips using clock frequencies of up to 400 MHz. The rugged, ultra-small form factor MM550 ESMini module from Men Micro is suitable for use in mobile applications. The processor’s e300 core pairs a display interface unit, with or without a 3D graphics engine, and integrated I/O features with exceptionally

low power of up to 3 watts maximum and performance to make the MM50 an attractive solution for mission-critical applications as well. The MM50’s soldered 512 Mbytes of DDR2 SDRAM withstands severe shock of 15g, 11 ms, bump of 10g, 16 ms and vibration of 1g from 10 Hz to 150 Hz (sinusoidal). The MM50 also provides up to 128 Kbyte of non-volatile FRAM and mass storage expansion through SDHC on the carrier board. In addition to serial I/O interfaces, such as USB, the MM50 also features legacy interfaces including CAN bus, COM, Fast Ethernet, I2C and GPIO. The MM50’s graphics controller and audio function combined with its low power dissipation make it a suitable platform to build up compact control systems with the need for visualization. Six individually programmable controllers give further flexibility to implement serial I/O. As with all ESMini modules, the MM50 operating temperature is from -40° to +85°C. An optional version with a conduction-cooling frame gives each ESMini module full EMC protection. The module can be used without an enclosure as well. Pricing for the MM50 is $384.

MEN Micro Ambler, PA. (215) 542-9575. [].

Small Form Factor Boards

Sub 1-Watt Pico-ITX SBC Targets Military Embedded Systems

Core i7-Based Module Boasts -25° to 70°C Temp Operation

EBX Atom SBC Blends High Performance and Legacy Support

Micro/sys has released a 2.5-inch Pico-ITX ARM single board computer offering PowerThrough-USB and an impressive mix of video, audio, USB, memory and power features for today’s handheld applications. Featuring the cost-efficient, power-conscience Freescale Semiconductor i.MX515 ARM Cortex-A8 processor tailored for multimedia, the SBC5651

While the first generation of COM Express boards wasn’t generally rugged, a new set of products has emerged specifically crafted for harsh environments. With that in mind, the ruggedized Procelerant CEQM57XT COM Express from RadiSys combines the Intel Core i7 and i5 processors and the Mobile Intel QM57 Express chipset with extended temperature range from -25° to 70°C and ruggedized vibration specifications that are required for many mil/aero and industrial applications such

WinSystems announced their EBC-C384, an EBX-compatible, Intel Atom-based single board computer (SBC). The EBC-C384 comes with either the Intel Atom single core 1.66 GHz N455 or dual core 1.80 GHz D525 processor combined with the ICH8M I/O hub controller and a variety of onboard serial and parallel I/O

Ad Index Get Connected with technology and companies providing solutions now Get Connected is a new resource for further exploration

into products, technologies and companies. Whether your goal interfaces. This SBC’s I/O includes two SATA as ruggedized computers/tablets, unmanned is ideally suited for use in small, low-power is to research the latest datasheet from a company, speak The directly channels, two Gigabit Ethernet ports, eight vehicles/robots and in-vehicle computers. handheld and portable devices. with an Application Engineer, or jump to a company's technical page, the CEQM57XT features the Intel Core i7 2.53 The SBC5651 is engineered to satisfy the USB 2.0 ports, four serial COM channels that goal of Get Connected is to put you in touch with the right resource. GHz, 2.0 GHz and 1.06 GHz processors and the power management, space conservation and support RS-232/422/485, 48 digital I/O lines Whichever level of service you require for whatever type of technology, Intel Core i5 2.4 GHz processor for increased multimedia I/O demands of handheld and and HD audio. Legacy I/O includes a PS/2 Get Connected will help you connect with the companies and products processing performance and a seven-year portable applications. Consuming less you thanare searching keyboard and mouse controller, LPT port and for. lifecycle, a key requirement for mil/aero and 1W with user-programmable speeds up to PATA interface. Also PC/104, PC/104-Plus industrial applications. 800 MHz, the SBC5651 offers performance and MiniPCI connectors provide additional The board’s COM Express 1.0 Type 2 pin-out while respecting low power operation. To expansion options with industry standard ensures smooth upgrades. Six PCI Express x1 enable mounting in cramped spaces, USB, off-the-shelf or user-designed specialty I/O ports, one PCI Express x8 port and optional PCI Ethernet, power and SD/MMC standard ports modules. Express x16 expansion port are provided for are available on board eliminating the need Up to 4 Gbytes of DDR3 MHz SODIMM increased peripheral performance. The board for breakout boards or unnecessary cabling. system memory can be supported on the dual also provides Gbit Trusted Platform providing Additionally, the SBC5651 boasts LCD touch Get Connected coresolutions D525 andnow 2 Gbytes on the single core N455 with Ethernet, technology and companies Management (TPM), optional conformal screen support (both LVDS and TFT), LED version of the EBC-C384. There is also a socket Get Connected is a new resource for further exploration into products, technologies and companies. Whether your goal is to research th and optional extended and industrial back light control, keypad interface, SD card datasheetcoating for a CompactFlash (CF) device as well. The from a company, speak directly with an Application Engineer, or jump to a company's technical page, the goal of Get Connect temperature stand-alone SODIMM memory. slot, and 4 Gbyte NAND flash enabling OEMs fanless, single N455, 1.66 GHz board is in touch with the right resource. Whichever level of service you require for whatever typecore of technology, RadiSys designs ruggedness the and productspriced to provide the user-friendliest handheld Get Connected $529. The will help you connect with theinto companies you areatsearching for.dual core D525, 1.80 GHz CEQM57XT by utilizing its proprietary designs. In addition, since all components are board is priced at $595. implementation of the Highly Accelerated validated for the extended temperature range WinSystems Life Test (HALT) during the design process to from -40° to +85°C, the SBC5651 is industrial Arlington, TX. identify and correct product weaknesses prior temperature capable by design. The SBC5651 (817) 274-7553. to production; Highly Accelerated Sample starts at $395 in single quantity and mid $200s Screen (HASS) is then used during production in 100-piece quantities. []. to continually monitor supplier quality and Micro/sys component robustness. Through rigorous Montrose, CA. HALT/HASS testing, RadiSys ensures that the (818) 244-4600. product is designed to its extended temperature range limits required by its target markets. [].


RadiSys Hillsboro, OR. Get Connected with (503) companies and 615-1100. products featured in this section. [].

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March 2012 | COTS Journal




Get Connected with companies and products featured in this section.

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PRODUCTS Get Connected

with companies mentioned in this article.

Module Pair Delivers High-Speed System Synchronization and Distribution

Get Connected with companies mentioned in this article. Synchronization is important in multichannel applications like phased array radar, diversity receivers, and direction finding and beamforming These applications Pentek Get Connected with companies andantennas. products featured in this section.abound in military systems. has introduced two high-speed system synchronization and distribution products: the Model 7192 PMC/ XMC module and the Model 9192 rack-mount unit. These high speed synchronizers are designed to support multiple Pentek Virtex-6 Cobalt and Pentek Virtex-7 Onyx modules at clock rates up to 1.8 GHz and sample rates to 3.6 GHz. The Model 7192 is a PMC/XMC board that can synchronize up to four Cobalt modules, each receiving a common clock along with timing signals that can be used for synchronizing, triggering and gating functions. The Model 9192 is packaged in a 19” 1U rack-mount unit supporting up to twelve modules. The Model 7192 and 9192 enable synchronous sampling and timing for a wide range of multichannel high-speed data acquisition, DSP and software radio applications. Both products are compatible with any combination of Pentek’s Model 71670 Quad 1.25 GHz D/A boards, Model 71630 1 GHz A/D and D/A boards, and Model 71640 3.6 GHz A/D boards. The modules are available in PMC/XMC, PCI, VPX, cPCI and rugged form factors supporting a range of environments from the lab to deployment. The Model 7192 High-Speed System Synchronization and Distribution PMC/XMC starts at $2,995. This product is also available in PCIe, 3U or 6U cPCI, VPX and rugged form factors. The Model 9192 High-Speed System Synchronization and Distribution Unit starts at $5,995. Pentek, Upper Saddle River, NJ. (201) 818-5900. [].

IFF Mode 5 Test Set Has DoD AIMS Certification for KIV-77 and KIV-78

Dual GPU Multimedia Workstation Sports AMD Radeon HD 6990M CrossFireX

Aeroflex has announced that the Aeroflex APM-424(V)5 IFF MK XIIA Mode 5 portable test set has received full certification from the U.S. Department of Defense (DoD) AIMS International Program Office to support both AIMS 04-900A Option A (KIV-78) and Option B (KIV-77) crypto appliqués. With the latest AIMS certification, Aeroflex’s Mode 5 test set has resolved all previous exceptions, including support for burst mode interrogators, and is in full compliance with DoD AIMS 03-1000A performance standards for Mark XIIA performance and ICAO Annex 10 international standards for Mode S ELS/EHS performance for ramp testing of IFF transponders and interrogators. Support for Option A (KIV-78) and Option B (KIV-77) reduces cost and maintenance. The APM-424(V)5 COMSEC interface easily accommodates both Option A (KIV-78) and Option B (KIV-77) crypto appliqués in a single test set. This will allow operators to use a crypto that is common to their platform and avoid the logistics and costs associated with acquiring additional test sets and difficult-to-obtain cryptographic devices.

Eurocom is now offering the EUROCOM Leopard 2.0, a high-performance 18.4-inch notebook with support for dual GPU operation. The EUROCOM Leopard 2.0 supports dual GPU technology from NVIDIA, as well as AMD. NVIDIA GeForce GTX 560M and AMD Radeon HD 6990M and HD 6970M GPUs power the Leopard 2.0. With the 18.4-inch display and THX TruStudio Pro, the Leopard is a leader in mobile audio and video reproduction. Being fully configurable and customizable allows users to build their system to their exact specifications, operational and/or application requirements. EUROCOM Leopard 2.0 supports up to 24 Gbyte of RAM and Second Generation Intel Sandy Bridge i7 and i7 extreme processors, with the Intel HM 67 chipset. The system supports four storage drives, for up to 4 Terabytes in RAID 0/1/5/10.

Aeroflex, Wichita, KS. (316) 522-4981. [].

Eurocom, Nepean, Ontario, Canada, (613) 224-6122. [].

Industrial Managed Gigabit PoE Switch Has 12 Ports Aaxeon Technologies has released its new LNP-1204GN 12-port Industrial Managed Gigabit PoE (Power over Ethernet) Switch. The LNP-1204GN features 8 x 10/100/1000Base-T(X) PoE ports and 4 x 1000Base-X SFP ports and can transmit power up to 30W to remote devices per PoE port. Along with the standard model, the LNP-1204GN is also available in an extended operating temperature model (LNP-1204GN-T) that can withstand temperatures of -40° to 75°C. The LNP-1204GN boasts many security features such as MAC-based port security, port-based network access control (802.1x), VLANs, radius centralized password management, and SNMPv3 encrypted authentication and access security in order to provide you with a safe and secure network.

Aaxeon Technologies, Brea, CA. (714) 671-9000. []. 56

COTS Journal | March 2012

COTS Products Get Connected with companies and products featured in this section.

VITA 62 3U DC/DC VPX Power Supply IsthisConduction-Cooled Get Connected with companies and products featured in section.

North Atlantic Industries (NAI) has announced the availability of its

latest 3U rugged VPX power product—the VPX55-3, ideally suited for harsh land, air and sea applications. The VPX55-3 provides up to 300 watts of power with six outputs and is compliant with MIL-STD-704F. Other features include an option for MIL-STD-1275B transients for operation during +6 VDC cranking conditions and reverse polarity protection, and a built-in EMI Filter compliant with MIL-STD-461, CE102— all within a single slot 0.8 deg pitch, 3U package. The VPX55-3 is designed to meet standard 3U VPX mechanical requirements and has VITA 62-compatible outputs and signaling. Basic pricing configuration starts at $3,998 each.

North Atlantic Industries, Bohemia, NY. (631) 567-1100. [].

PC/104 DC/DC Power Supply Provides a 10-50V Input Range WinSystems has announced two new PC/104 wide input range, DC/DC power supplies. The input voltage range for the units is from 10 to 50V DC, which allows them to work with 12, 24, or 48 volt battery operated or distributed DC power systems. The standard output voltage for the PCM-DC-AT500 is +5V at 20A. For the triple output PCM-DC-AT512, the voltages are +5V at 20A, +12V at 3A, and -12V at 0.5A. Both versions will operate from -40° to +85°C with no fans or heat sinks and are well suited for applications including pipelines, transportation, communications, solar power and military. The PCM-DC-AT power supplies have no minimum load requirement to bring the units into regulation. All the outputs have overvoltage and short circuit protection plus overcurrent protection as well. The PCM-DC-AT has individual LED indicators that display a visual status of each regulated output. Power is input through a standard 2-pin plug and connector system for easy connection and removal. The output voltage is wired directly to the PC/104 connector. On the PCM-DC-AT512 there are also two, four-pin connectors at the edge of the board to provide +5V and +12V to disk drives and other accessories. Both the PCM-DC-AT500 and PCM-DC-AT512 are PC/104 and RoHS compliant. They measure 3.6” x 3.8” (90 mm x 96 mm). The single output PCM-DC-AT500 is priced at $149 (qty. 1). The triple output PCM-DC-AT512 is priced at $199 (qty. 1).

Small, Fanless System with Extended Temp Range and MILSTD810F Rating Logic Supply has introduced the LGX Extended Temperature AU115 Atom System. It features an Intel Atom N270 processor housed in a small footprint, low-profile chassis less than 1.5” thick. The AU115 system offers reliable computing in an operating temperature environment of -20° to 60°C. With no fans or vent openings, the AU115 is protected from exposure to the dust, dirt and grime that are typically found on the factory floor or in a mobile environment. It is MIL-STD 810F rated to withstand vibration and shock, and can be configured with a solid state device for storage to extend the lifetime of the system and ensure data integrity. For I/O connectivity, the AU115 provides two RS-232 COM ports (one of which can be used as GPIO), an RS-232/422/485 port, four USB 2.0 ports, DVI-I, dual Intel Gbit LAN ports, two audio jacks, and a 12-volt DC power jack. It supports a 2.5-inch notebook SATA HDD or SSD, up to two Gbyte RAM, and Wi-Fi via a PCIe Mini Card slot. It also has an integrated watchdog timer and comes standard with L-shaped mounting brackets. Weighing less than two pounds, this system offers plenty of versatility without adding any bulk.

Logic Supply, South Burlington, VT. (802) 861-2600. [].

WinSystems, Arlington, TX. (817) 274-7553. [].

½ ATR System Boasts Increased Cooling Capability Extreme Engineering Solutions is shipping the XPand4201, a sub-½ ATR, forced air-cooled enclosure for conduction-cooled modules. The XPand4201 is designed to reduce the Size, Weight and Power (SWaP) of deployed military systems. A fully populated XPand4201 weighs less than 19 pounds. The XPand4201 conducts heat from conduction-cooled modules to heat exchangers, where the heat is dissipated to the ambient environment by forced-air cooling. Its sidewall heat exchangers are 1/2” wider than those of the XPand4200 to provide increased cooling, while a heat exchanger integrated on the top of the XPand4201 allows for significantly higher cooling capability over similar systems. Because the design supports conduction-cooled boards in an air tight enclosure, the XPand4201 provides enhanced shock and vibration protection and isolation of the boards from the outside environment.

Extreme Engineering Solutions, Middleton, WI. (608) 833-1155. []. March 2012 | COTS Journal


COTS Products Get Connected with companies and products featured in this section.

Rugged Four-Port USB Hub Features Extended Temperature Get Connected with companies and products featured in this section.

A rugged, industrial-strength four-port industry/military grade USB hub features extended temperature operation (-40° to 85°C), high retention USB connectors, and an industrial steel enclosure for shock and vibration mitigation. The USB-104-HUB from AccesI/O also includes an OEM version (board only), which is PC/104 sized and can easily be installed in new or existing PC/104-based systems. This now makes it easy to add additional USB-based I/O to an embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless and more. Real-world markets include Industrial Automation, Embedded OEM, Laboratory, Kiosk, Transportation/Automotive and Military/Government. This four-port hub can be bus-powered or self-powered. You may choose from three power input connectors: DC power input jack, screw terminals, or 3.5-inch drive power connector (Berg). Mounting provisions include DIN rail, 3.5-inch front panel drive bay mounting, and various panel mounting plates. The 3.5-inch front panel drive bay mounting provision allows for easy installation in rack-mount industrial and military grade style chassis, as well as home or office PCs.

ACCES I/O Products, San Diego, CA. (858) 550-9559. [].

300 Watt Power Supply Supports -40° to +85°C Temps

Transient Recorders Add PCI Express for Increased Data Precision

Advanced Power Solutions (APS) announces the release of their APS303Mx series of 300 watt U-Frame Switchers safety approved to the 3rd Edition of UL60601 and single outputs ranging from 5 to 54V. The APS303Mx series consists of 10 standard output models. Standard features include 600 watt peak load operation for up to 5 seconds; Universal AC Input with Active Power Factor Correction; Dual-fused input protection; low leakage of only 120uA at 264 VAC; Power-Good, Fan Fail, Inhibit and 12V Fan control. Options include a perforated top-mount cover; top-mount fan cover, end-mount fan cover; Industrial operating temperature range of -40° to +85°C; and Molex or terminal block connections. Products are now in full production with evaluation quantities available from stock and production deliveries of less than 8 weeks. Pricing is $85 each for 100 piece quantities.

Elsys Instruments has expanded its family of LAN-controlled transient recorders to include high-speed PCI Express (PCIe) data transfer on its data acquisition modules. The new TPCE data acquisition modules are highprecision and highresolution digitizers with sophisticated features such as advanced trigger modes, continuous data acquisition mode, single ended and differential inputs, digital input lines and ICP coupling for piezo sensors. The new PCIe modules can be housed in Elsys’ TraNET FE transient recorders that hold 4 to 32 single-ended channels, or 2 to 16 differential channels, in the TraNET EPC industrial computer frame with 16 slots for a total of 64 channels, or in the TraNET PPC ruggedized portable computer system with six slots for a total of 24 channels. Pricing for a LAN transient recorder system equipped with TPCE modules is dependent upon recorder selected. Prices for individual TPCE modules start at $5,900.

Advanced Power Solutions, Livermore, CA. (925) 456-9890. [].

Elsys Instruments, Niederrohrdorf, Switzerland.+ 41(0)56 496 01 55. [].

ATCA Open Modular Platform for 4G LTE and Carrier Cloud Network Infrastructure Military networking needs have a lot of overlap with telecommunications. A new 10 Gigabit Ethernet ATCA open modular platform is a starting point for telecom equipment manufacturers (TEMs) to build on a common platform a multitude of new equipment configurations using CPU, NPU, DSP, storage and specialized third-party ATCA-based line cards that meet the requirements for 3G, 4G LTE, WiMAX, GPON, IPTV and carrier cloud network elements. Each Kontron 10G ATCA open modular OM9141-10G platform from Kontron includes redundant power entry modules, cooling infrastructure with hot swappable redundant fans, and second generation 10GbE switching capabilities. Shelf Management is built in with redundancy and interoperability tested Shelf Manager Cross Connects as per the PICMG specification, and an optional COM Express dual-core module is available for centralized system management with a standards-based HPI implementation. A telco alarm panel provides telecom grade external system alarm notification. The mature and stable Kontron switch management software suite supports a comprehensive list of core features and protocols including QoS, IPv4 and IPv6 routing, IPv4/IPv6 multicast routing and selected protocols.

Kontron, Poway, CA. (888) 294-4558. []. 58

COTS Journal | March 2012

COTS Products Get Connected with companies and products featured in this section.

Min-ITX Supports Get Connected with companies and products featuredBoard in this section. Options

Extensive I/O

A new mini-ITX SBC features a second generation Intel Core i7/i5/i3 or Celeron processor with up to 16 Gbyte DDR3 memory and runs off a single 12V-only 4-pin power connector. The X9SCV-QV4 from Supermicro uses the Intel QM67 chipset. Measuring 6.7 inch x 6.7 inch, the module offers 11 USB 2.0 ports, 2 HDMI ports and a VGA d-sub connector to connect the graphics integrated on the CPU. In addition, it provides 2 COM ports and dual Gigabit Ethernet LAN ports. One PCIe slot is also provided. The X9SCV-QV4 provides extensive monitoring and health features with temperature monitoring for the CPU and chassis environment including CPU trip support and FC temperature sensing logic. It also supports three 4-pin fan headers for the ability to support fans with speed control and can also support 3-pin fans without speed control.

Upgraded Video Compression XMC Enhances Military Decisions

Curtiss-Wright Controls Defense Solutions (CWCDS) has introduced a breakthrough new approach for deployed platform video management. The new VRD1-CC integrates switching, recording and network distribution of High Definition (HD) video for aerospace and defense platforms in a single compact rugged unit. The VRD1-CC is the industry’s first video management system (VMS) to deliver comprehensive functionality that previously required multiple or expensive customized systems, in a single unit optimized for SWaP-C constrained platforms. The VRD1-CC speeds and simplifies the integration of HD VMS for military applications deployed in harsh environments, such as vetronics and avionics. The conduction-cooled VRD1-CC (an air-cooled variant is also planned) is a lightweight, compact subsystem. A single VRD1-CC unit combines six channels of full resolution HD 30fps MPEG4 H.264 compression, video and audio recording with metadata/ event markers, and Ethernet video distribution or storage to disk. A simple, intuitive man-machine interface provides an onboard or remote operator with complete access to the VRD1-CC’s wide range of VMS options and functionality. This powerful VMS supports up to 18 video inputs in a mix of different standards, including HD-SDI, RGB and DVI. These video inputs can then be easily routed to any of the VRD1-CC’s 12 video outputs for real-time viewing or routed to the system’s real-time HD video compression subsystem for recording or distribution over a standard Ethernet network.

GE Intelligent Platforms has announced an enhanced version of the ICS-8580 rugged high definition video compression XMC module. Designed in response to the growing use of video in a broad range of defense applications, it allows very high quality moving images to be captured, transmitted and stored at very high speed with very low latency and with minimal consumption of precious bandwidth or disk space. As such, it can make a significant contribution to superior decision making and improved troop safety. The ICS-8580 can capture video inputs and archive or stream them over Ethernet, managing multiple streams and performing capture, manipulation, conversion, compression, storage, decompression and video display. Its rugged XMC form factor means that it is compact, lightweight and consumes little power, enabling it to be easily deployed in systems destined for deployment in harsh environments that are constrained by size, weight and power (SWaP). The ICS-8580 features H.264 video compression/ decompression (codec) technology, which is widely regarded as being the optimum solution: it is considered to be up to 3x as efficient as other codec solutions, allowing vital image detail to be retained while occupying the minimum possible bandwidth or storage.

Curtiss-Wright Controls Defense Solutions, Ashland, VA. (703) 779-7800. [].

GE Intelligent Platforms, Charlottesville, VA. (800) 368-2738. [].

Supermicro, San Jose, CA. (408) 503-8000. [].

HD Video Switching, Recording and Network Distribution System Routes up to 18 Inputs

Series of Configurable Power Supplies up to 2500 Watts Two series of multiple output configurable AC-DC power supplies suit high-power medical and IT/industrial applications. The X15 series from XP Power complies with the international EN/UL 60950 safety specification for IT and industrial applications. Capable of delivering 1500W output at low line input, and 2500W output at high line (greater than 180 VAC input), these compact fan-cooled units measuring 11 x 5 x 5 inches (279.4 x 127 x 127 mm) have a power density of up to 9.09W per cubic inch. An auxiliary 5V / 1A always-on output is available to power logic or control circuits in the end system without the need for any additional voltage source or step down converters. An optional fan speed control is available. The fleXPower series is available in six power levels from 400W to 2500W. Pricing is from $1,158 for a fully loaded chassis in 100-unit quantities.

XP Power, Sunnyvale, CA. (408) 732-7777. []. March 2012 | COTS Journal


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Intelligent Motor Control Solution Is Micro-Sized Get Connected with companies and products featured in this section.

A new, micro-sized pluggable servo drive has been particularly developed for motion control applications where space is critical. The iPOS3602 MX drive from Technosoft can be integrated—within seconds—to the user’s motherboard or PCB machine. All basic motor control functions, as well as motion control and PLC features, are embedded onto this small drive (55 mm x 26 mm x 13 mm, 10g). Equipped with CAN / CANopen and optionally with EtherCAT interfaces, iPOS3602 MX provides a flexible, compact solution adapted to the decentralized control of any rotary or linear brushless, DC brush or step motor up to 75W (36V, 2A). The drive’s setup, tuning and motion programming are fast with EasyMotion Studio and Technosoft Motion Language (TML). Thanks to its embedded intelligence, iPOS3602 MX is able to run complex motion commands directly at drive level. Using the TML language, multiple operations can be executed with iPOS3602 MX: setting of various motion modes, change of motion modes and/or parameters, execution of homing sequences or program flow control. At the same time, iPOS3602 MX can handle digital I/O and analog input signals, execution of arithmetic and logic operations, and transfer of data between axes.

Technosoft, Bevaix, Switzerland. +41 (0)32 732 55 01. [].

PCI Express Acquisition Card Targets Radar

XMC4000 Evaluation Board Boasts WLAN

A new PCI Express-based primary radar acquisition card indicates the continued response to the growing adoption of the PCI Express bus as the primary motherboard-level interconnect on modern PCs. The HPx-200e card from Cambridge Pixel extends the product family, which already includes radar input cards in PCI and PMC form factors, to provide a x1 lane PCI Express option. The new card supports multiple analog and digital radar inputs, in addition to trigger and azimuth (ACP/ARP and parallel data) signals. The card also provides a capability to detect missing signals to provide software alarms for loss of triggers or azimuth data. The HPx-200e card supports a wide range of signal types and voltages, allowing connection to a diverse range of commercial and military radar types including those from Furono, Kelvin Hughes, Terma, JRC, Koden, Sperry, Raytheon, as well as specialist military radars.

Hitex Development Tools offers a compact “all-in-one” evaluation board right in time with the newly introduced XMC4000 architecture from Infineon based on the Cortex-M4 core from ARM. The board named XMC-HiLight comes with a bunch of functions such as communication (WLAN, LAN, USB), slide control, LED matrix control, RGB and A/D on just one board. XMCHiLight is designed to be compatible withthe Infineon Hexagon Evaluation Kit, which makes it also compatible with software applications designed with DAVE 3. It provides interfaces to the Hexagon satellite boards HMI and ACT, which can be plugged in directly. Customized hardware extensions are easy to implement with an optional prototyping board that can be switched to the XMC-HiLight.

Cambridge Pixel, Cambridge, UK. +44 (0) 1223 882174. [].

Hitex Development Tools, Irvine, CA. (949) 863-0320. [].

3U OpenVPX SBC Runs Gen2 Core i7 with EFI BIOS Replacement A new 3U OpenVPX Single Board Computer is based on the Intel second-generation Core i7 processor (Sandy Bridge) and is coupled with the Intel QM67 chipset and up to 8 Gbytes DDR3-1333 with ECC. The IC-INT-VPX3a from Interface Concept uses this fully integrated Dual Core processor operating at 2.2 GHz to offer greater performance than its predecessors in the same envelope together with an unmatched level of I/O bandwidth like PCI Express, GigaEthernet, serial UARTs, GPIOs...for both onboard and off-board functions. In addition, the onboard Spartan-6 Open FPGA is dedicated to customer-specific functionalities, to make the ICINT-VPX3a a suitable response for demanding applications such as radar processing, requiring performance, flexibility and reliability. The IC-INT-VPX3a uses the new UEFI 2.1 firmware interface. EFI is intended as a significantly improved replacement of the old legacy BIOS firmware interface historically used by all PC. The EFI specification was originally developed by Intel and is now managed by the Unified EFI Forum, officially known as Unified EFI (UEFI). This board, OpenVPX compliant, is available in standard, rugged and conduction-cooled grades, and operating systems supported include Windows, Linux and VxWorks.

Interface Concept, Quimper, France. +33 (0)2 98 57 71 76. []. 60

COTS Journal | March 2012

COTS Products

Solid as a Rock... and twice as Cool!

Dual Core Mini-ITX Board Features Rich I/O Set A dual core Mini-ITX board features one of the richest I/O sets available for a wide range of embedded applications including ATM, kiosks, POS, digital signage, healthcare and digital media applications. The Via EPIA-M910 from Via Technologies is available in both active and passive cooling configurations with the choice of either a performance-oriented 1.6 GHz Via Nano X2 dual core processor or a fanless 1.0 GHz Via Eden X2 dual core processor, and is paired with the Via VX900 media system processor. The rich I/O set features HDMI and VGA display connectivity ports with pin headers for two 24-bit LVDS (one single channel and one dual channel), eight USB 2.0 ports, dual Gigabit LAN networking, eight COM ports (which can be expanded to twelve with the VIA LPC-01/02 add-on card) and is available in SKUs with either DC-in or ATX power supply support, providing the utmost flexibility to match a wide range of embedded computing needs.

Ruggedized 3U Multi Protocol R AID Systems No matter how you shake it, bake it, or configure it, everyone knows the reputation, value and endurance of Phoenix solid state and rotating disk products. Leading the way in rugged COTS data storage technology for decades, Phoenix keeps you on the leading edge with very cool products!

We Put the State of Art to Work

XXXQIFOYJOUDPNt 714ď&#x161;ş283ď&#x161;ş4800 PHOENIX INTERNATIONAL IS AS 9100/ISO 9001: 2008 CERTIFIED

VIA Technologies, Fremont, CA. (510) 683-3300. [].

Low-Power COM Express Type 6 Module Pushes Graphics Performance

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A new, low-power COM Express module for advanced designs supports Pin-out Type 6 and provides improved display options along with increased bandwidth thanks to digital display interfaces and additional PCI Express lanes. With new, low-power Intel processors soldered on in a BGA package, the conga-TS67 module from congatec is suitable for vibration-resistant applications. The module is available in four second-generation, low-power Intel Core processor versions, from the Intel Celeron 807UE processor (1M Cache, 1.0 GHz) with just 10 watt TDP to the Core i7 2610UE dual core processor (4M Cache, 1.50 GHz) with 17 watt TDP and up to 8 Gbyte dual-channel DDR3 memory (1333 MHz). Pin-out Type 6 is implemented for the Intel QM67 Express chipset series and future generations. In addition to VGA and LVDS, it provides three digital display interfaces, which can each be configured for DisplayPort, HDMI or DVI and whichâ&#x20AC;&#x201D;in contrast to Type 2 modulesâ&#x20AC;&#x201D;are no longer multiplexed. Type 6 also features a PCI Express Graphics (PEG) port enabling the connection of additional graphics components for maximum display support, for instance in gaming and medical applications. Seven PCI Express Lanes, PCI Express Graphics (PEG) x16 Lanes for high-performance external graphics cards, eight USB 2.0 ports, four SATA interfaces with RAID support, one EIDE and a 1 Gbyte Ethernet interface, enable fast and flexible system updating. Fan control, an LPC bus for the easy connection of Legacy I/O interfaces, and Intel High Definition Audio complete the feature set. All conga-TS67 modules are fitted with the new UEFI embedded firmware solution. A suitable evaluation carrier board for COM Express Type 6 is also available. Pricing starts at $500.

9/9/11 6:35:00 PM

3.5â&#x20AC;? SCSI SSD

i i i i i

SE/LVD/HVD & extended temp options. Replacement for obsolete SCSI drives. SCSI legacy support now and into the future. Uses COTS 2.5â&#x20AC;? SSDs. Options for discrete controlled secure erase.

RedRockTechnologies,Inc. 480Ͳ483Ͳ3777

Congatec, San Diego, CA. (858) 457-2600. [].

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11/22/11 9:59:56 AM

COTS Products

Atom-Based COM Express Compact Module Targets Low Power A new COM Express compact CPU module is powered by the low-power Intel Atom N2600 and D2700 processors based on COM.0 R2.0 type 2 pin-out. Type 2 pin-out and legacy I/O support make for easy migration, and type 2 connectors are resistant to shock and

vibration while offering high bandwidth and high-speed data transmission. The new SOM-6765 offers ample performance with a focus on low power consumption—6W on a 95 x 95 mm module—and is suitable for a variety of handheld and portable devices. SOM-6765 is based on the latest Intel Atom dual-core

N2600 and D2700 processors, based on 32nm technology, which includes hardware HD decode and support for faster DDR3 1066 memory. SOM-6765 offers dual display output and various graphic interfaces such as LVDS, VGA and even Blu-ray via HDMI.

Advantech, Irvine, CA. (949) 7987178. [].

A surprising blend of personalities

That’s the nature of the AB2000 Avionics BusBox® With so many built-in capabilities, the highlyflexible AB2000 family from Ballard Technology is the ideal fit for a wide range of applications. These rugged, conduction-cooled, COTS devices combine a powerful computer processor, multi-protocol databus interfaces, Ethernet, USB, other I/O, and PMC expansion in a small, lightweight package. Discover what the AB2000 can do for you. Call 425.339.0281 or email

AB2000 Personalities... · Embedded Computer · Aircraft Interface Device · Data Recorder · Protocol Converter · Ethernet Switch · Power Management Unit · Radio/Satcom Interface · and many more


AS9100 / ISO 9001 Registered

Untitled-10 1 COTS Journal | March 2012 62

3/7/12 11:09:58 AM

Fanless Rugged Computer Offers IP65 Certification Eurotech has announced the launch of the EN50155-rated DynaCOR 10-00, a new family of rugged mobile computers that targets demanding machine-to-machine (M2M) applications. Based on the Intel Atom processor, the DynaCOR 10-00 is a purpose-built, lowpower, mobile computer platform with a wide

range power supply and IP65 protection. The DynaCOR 10-00 is a dependable platform featuring CPU speeds of 1.1 GHz, 512 Mbyte RAM and a 2 Gbyte flash disk. The DynaCOR 10-00 rail-rated platform is purpose built for the transportation and heavy industrial markets leveraging Eurotech’s Everyware Software Framework (ESF) to speed up M2M application software development. The design also benefits from connectivity to the Everyware Cloud, Eurotech’s M2M cloud platform, dramatically cutting time-to-market when building scalable, robust applications that integrate devices with business applications.

Eurotech, Columbia, MD. (301) 490-4007. [].







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Acces I/O Products, Inc.........................

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Avionics Interface Technologies............ 21.....................................

RTECC.................................................... 65..........................................

Ballard Technology, Inc.......................... 62................................

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Critical I/O.............................................. 33....................................

Rugged Stand-Alone Box & PCI Express Products Gallery..................................... 51

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SIE Computing Solutions, Inc................ 22........................................

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Trenton Technology, ....................... 43......................... with companiesInc.. mentioned in this article.

End ofTechnologies, Article Chassis Plans, LLC................................ 24........................... RTD Embedded Inc.... 2, Products Get Connected with companies and

Get Connected GE Intelligent Platforms, Inc.................. Triple E Corporation............................... 19..................................

General Standards Corporation............. 23......................

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Innovative Integration............................ Kontron................................................... Lauterbach............................................. 30.................................

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Logic Devices, Inc.................................. Mercury Computer Systems, Inc........... 37............................................. Nallatech, Inc......................................... Ocean Server Technology, Inc............... One Stop Systems, Inc........................... Pentek, Inc............................................. 68....................................... Phoenix International............................. 61....................................

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COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 250, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices. POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 250, San Clemente, CA 92673.

Coming Next Month Special Feature: Picking the Winners: Four Embedded Form Factors with the Most Secure Future There are many aspects that lead to acceptance by the military for a particular embedded computing board form factor. It’s not simply technical merit but a host of vendor, standard and product ecosystem issues that mean success. VME achieved more success than others, but CompactPCI eventually got there as well. This section evaluates the various embedded form factors and picks the four that seem most likely to have a secure future in the defense realm. VME/VXS, VPX, cPCI, PC/104, COM Express, ATCA, MicroTCA and others are considered. Tech Recon: Bots on the Ground: Advances in Military Robotics There’s no doubt that military robots—or unmanned ground vehicles (UGVs) as they’re more often called—have proven to be an incredibly valuable life-saving resource in combat operations in Iraq and Afghanistan. And while UGV technology has nowhere near matched the level of maturity that UAVs have, they’ve come a long way over the past several years. This section explores the technologies that support military robotics and looks at the DoD’s plan for their future. System Development: Harsh Environment Testing for Boards and Enclosures As systems get denser and more complex, the problem of engineering boards and enclosures isn’t getting any easier. There’s just no avoiding the trend toward processors and other key components ramping up in wattage. And more power means more challenges dissipating heat. Airborne systems, ground systems and shipborne systems all have unique tradeoffs facing them. Exotic techniques such as spray-cooling and liquid-cooling are all on the table as possible ways to attack the cooling challenge. Meanwhile, meeting the stringent levels of shock and vibration ratings required by most defense and aerospace programs is no slam dunk. Articles in this section delve into those areas and compare the solutions available. Tech Focus: Rugged Ethernet Switch Boards Ethernet is becoming entrenched as a favorite interconnect fabric in compute-intensive applications like sonar, radar, or any application that networks sensor arrays together. This section updates readers on the product and technology trends driving boardlevel Ethernet switch products, and will include a product album of representative Ethernet switch board products in form factors such as VPX, VME, cPCI, MicroTCA and more. 64

COTS Journal | March 2012





EDITORIAL Jeff Child, Editor-in-Chief

The Army and Agile Acquistion


very February I look forward to trekking down to Fort Lauderdale for the annual Association of the U.S. Army (AUSA) show—this was my ninth year attending the event. Escaping New England winter for a couple days is always welcome, but really for me the attraction is the chance to get an early-in-the-year taste of what’s happening in technology and defense programs under the Army’s purview. The timing is always nice because it’s the time of year when the DoD puts forth its budget proposals, so there’s an atmosphere of debate and discussion on where the industry is headed. This year there was of course a sense that the U.S. Army is grappling with ways to be cost-efficient while still pushing for needed technology innovations. A highlight for me this year was attending the keynote by Heidi Shyu, acting assistant secretary of the Army for Acquisition, Logistics and Technology. She spoke on several topics including the Army’s efforts to deal with constrained budgets, a more focused acquisition process, and the role of technologically mature solutions. Shyu talked about the need to “seize the moment” by implementing improvements in the Army’s acquisitions process. This includes taking a so-called Agile Process approach of blending programs of record with promising emerging technologies and, in some cases, commercial off-the-shelf products. She also talked about taking a “cost-conscious” approach and cited the need to manage programs according to cost-saving “should cost” goals. Shyu went on to name some examples of programs that have benefited from the Army’s new procurement approaches, such as the Ground Combat Vehicle, or GCV, and the Joint Light Tactical Vehicle, known as JLTV. “[For the GCV program] On the requirements side, we took a critical look at the planned vehicle capabilities to prioritize them with an eye on performance and affordability” said Shyu. “The goal was to meet cost and schedule targets by giving industry the necessary trade space to meet Army needs.” Meanwhile with the JLTV, the Army took steps to ensure that the program was executable and affordable by synchronizing requirements with the Marine Corps and shortening the Engineering Manufacturing and Design, or EMD phase, resulting in improved capability and substantial cost savings for the program, according to Shyu. Shyu explained that the Agile Process is grounded in a series of semi-annual exercises at Fort Bliss, Texas and White Sands Missile Range, N.M., called Network Integration Evaluations, or NIE, which are helping to streamline the integration, development and procurement of promising new systems and improvements to the Nett Warrior program. The program adjustments as a result of the NIE events resulted in a $800 million in savings, and the weight was 66

COTS Journal | March 2012

reduced from more than seven pounds to just over three pounds. Many of the program adjustments made after NIE results prompted the Army to reexamine planned purchases or revise requirements. An example is the cancellation of the Early Infantry Brigade Combat Team effort (including the Network Integration Kit) and the Mounted Soldier System program, and the restructure of the Nett Warrior efforts. Another major programmatic change related to the NIE is the termination of the Joint Tactical JTRS Ground Mobile Radio, or GMR. Soldiers at NIE 11.2 desired the GMR’s communications potential but criticized its size, power consumption and startup time. This month a number of procurement actions resulted directly from the Network Integration Evaluations, including the Army issuing a “sources sought” notice for a single-channel, vehicle-mounted radio. The JTRS Soldier Radio Waveform, known as SRW, enables radios to transmit information between the squadand team-level JTRS Rifleman Radio and the Army’s larger tactical communications network. The Army plans to buy approximately 5,000 of the vehicle-mounted radios, also known as SRW Appliqué. The vehicle-mounted SRW Appliqué radio procured under the Agile Process is intended as an interim solution until the two-channel, vehicle-mounted component of the JTRS Handheld, Manpack, Small Form Fit, or HMS, family of radios is approved for fielding. The Rifleman Radio is also part of the HMS program. Elsewhere at AUSA, there were presentations on how the Army is synchronizing the production, fielding and training for Capability Set 13, which is composed of vehicles, network components, and associated equipment and software. This is an integrated effort that will for the first time deliver voice and data capability throughout the brigade combat team formation down to the tactical edge. At the heart of Capability Set 13 is the Warfighter Information Network– Tactical, known as WIN-T, Increment 2, a major upgrade that enables mission command on-the-move and extends satellite communications to the company level. A theme in the presentations about Capability Set 13 was the need to leverage industry innovation to keep pace with technological advances. With that in mind, the Army is taking several steps to ensure small businesses are able to participate in the NIEs, including ways to evaluate prototype technologies in small quantities and to minimize field support cost. All of this reaffirms what we’ve often said: The computing, communications and electronics portions of defense programs continue to be ripe with activity, even as DoD Budgets overall take dramatic hits. This bodes positive for our industry as the Army looks for designs and technology solutions that provide the most capabilities for the cost.



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COTS Journal  

March 2012

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