Ultra-thin Copper Foil Market
Ultra-thin Copper Foil Market Scope: Industry
Analysis, Market Size, Growth, Trends Till 2031
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Ultra-thin Copper Foil Market Size and Growth
The Ultra-thin Copper Foil market is experiencing significant growth, driven by increasing demand in electronics and renewable energy sectors. As of 2023, the market size is projected to reach USD 3 billion, with a CAGR of 15%. Competitive advancements and sustainability trends are shaping industry dynamics and future opportunities.
Companies Covered
(Covid 19 Impact Covered)
◍ SK Nexilis
◍ Mitsui Mining & Smelting
◍ ILJIN Materials
◍ Industrie De Nora
◍ Fukuda Metal Foil & Powder
◍ Nippon Denkai
◍ Carl Schlenk
◍ UACJ Foil Corporation
◍ Nan Ya Plastics
◍ Chaohua Technology
◍ Guangdong Jia Yuan Tech
◍ Nuode
◍ Shengda Electric
◍ Tongling Nonferrous Metals Group
◍ Shanghai Legion Compound Material
◍ Guangzhou Fangbang Electronics
The ultra-thin copper foil market features key players like SK Nexilis, Mitsui Mining & Smelting, and ILJIN Materials, enhancing product quality and supply. Companies drive growth through innovative applications in electronics and energy sectors. Notable revenue figures include SK Nexilis ($1.25 billion) and UACJ Foil ($900 million).
◍ Tongling Huachuang New Material
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Market Segmentation
By Application
IC Substrate
Coreless Substrate
Others
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By Product
Below 2μm
2-5μm
Market Growth
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$ X Billion USD
