Through Glass Vias(TGV) Substrate Market
Through Glass Vias(TGV) Substrate Market Scope: Industry Analysis, Market Size, Growth, Trends Till 2031
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Through Glass Vias(TGV) Substrate Market
Size and Growth
The Through Glass Vias (TGV) substrate market is experiencing significant growth, driven by increasing demand for advanced packaging solutions in electronics. As of 2023, the market size is estimated to reach approximately $1.2 billion, with projections highlighting sustained expansion due to innovations in miniaturization and integration of components in various applications.
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Companies Covered
(Covid 19 Impact Covered)
◍ Corning
◍ LPKF
◍ Samtec
◍ KISO WAVE Co., Ltd.
◍ Tecnisco
◍ Microplex
◍ Plan Optik
◍ NSG Group
◍ Allvia
The Through Glass Vias (TGV) substrate market features key players like Corning, LPKF, Samtec, KISO WAVE, Tecnisco, Microplex, Plan Optik, NSG Group, and Allvia. These companies innovate in glass substrates for highfrequency applications, advancing technology and increasing market demand, while also contributing to the growth of the electronics industry.
Sales revenue figures:
- Corning: $14 billion (2022)
- Samtec: $1.5 billion (2023 estimate)
- NSG Group: $3.4 billion (2022) Request Sample Report
Market Segmentation
By Application
By Product
◍ 300 mm Wafer
200 mm Wafer ◍ Below 150 mm Wafer ◍ Consumer Electronics
Automotive Industry ◍ Others
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Market Growth
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$ X Billion USD
