Through Glass Vias Substrate Market
Through Glass Vias Substrate Market Scope:
Industry Analysis, Market Size, Growth, Trends Till 2031
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Through Glass Vias Substrate Market Size and Growth
The Through Glass Vias Substrate market is witnessing significant growth driven by rising demand in advanced electronics and telecommunications. As of 2023, the market size is projected to reach approximately $400 million, with a robust CAGR forecast due to increasing adoption in OLED displays and miniaturization trends in circuit designs.
Companies Covered
(Covid 19 Impact Covered)
◍ Corning
◍ NSG Group
◍ Kiso Micro Co.LTD
◍ LPKF
◍ Plan Optik
◍ Samtec
◍ Microplex
◍ Tecnisco
◍ Allvia
The Through Glass Vias (TGV) substrate market features companies like Corning, NSG Group, and Kiso Micro Co. utilizing TGV technology for advanced electronics packaging. These firms innovate in miniaturization and integration, driving market growth. Notable sales revenues include:
- Corning: $12.5 billion
- NSG Group: $5.2 billion
- Samtec: $900 million
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Market Segmentation
By Application
◍ Biotechnology/Medical
◍ Consumer Electronics
◍ Automotive
◍ Others
By Product
◍ 300 mm Wafer ◍ 200 mm Wafer ◍ Below 150 mm Wafer
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Market Growth
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$ X Billion USD
