Semiconductor Assembly & Packaging Equipment Market
Semiconductor Assembly & Packaging Equipment
Market Scope: Industry Analysis, Market Size, Growth, Trends Till 2031
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Semiconductor Assembly & Packaging Equipment
Market Size and Growth
The Semiconductor Assembly & Packaging Equipment market is expected to grow at a CAGR of 7.3% during the forecast period (2021-2026). The market size is estimated to reach $5.6 billion by the end of 2026, driven by increasing demand for advanced packaging technologies and the growth of the semiconductor industry.
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Companies Covered (Covid 19 Impact Covered)
◍ ASM Pacific Technology
◍ Kulicke & Soffa Industries
◍ Besi
◍ Accrutech
◍ Shinkawa
◍ Palomar Technologies
◍ Hesse Mechatronics
◍ Toray Engineering
◍ West Bond
◍ HYBOND
◍ DIAS Automation
The semiconductor assembly & packaging equipment market is highly competitive with companies such as ASM Pacific Technology, Kulicke & Soffa Industries, Besi, Accrutech, Shinkawa, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, and DIAS Automation. These companies provide equipment for packaging, bonding, and testing of semiconductors, helping to grow the market by offering innovative solutions and advanced technology.
- ASM Pacific Technology: Sales revenue of $2.91 billion
- Kulicke & Soffa Industries: Sales revenue of $1.36 billion
- Besi: Sales revenue of $1.25 billion Request
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Sample
Market Segmentation
By Application
◍ IDMs
◍ OSAT
By Product
◍ Die Bonders
◍ Wire Bonders
◍ Packaging Equipment
◍ Others
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$ X Billion USD
Market Growth
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