Quad-Flat-NoLead Packaging (QFN) Market
Quad-Flat-No-Lead Packaging (QFN) Market Scope: Industry Analysis, Market Size, Growth, Trends Till 2031
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Quad-Flat-No-Lead Packaging (QFN) Market Size and Growth
The Quad-Flat-No-Lead Packaging (QFN) market is experiencing steady growth due to increasing demand for smaller and more efficient electronic devices. The market size is projected to reach USD 8.6 billion by 2025, driven by advancements in semiconductor technology and growing adoption of QFN packaging in various industries.
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Companies Covered (Covid 19 Impact Covered)
◍ ASE(SPIL)
◍ Amkor Technology
◍ JCET Group
◍ Powertech Technology Inc.
◍ Tongfu Microelectronics
◍ Tianshui Huatian Technology
◍ UTAC
◍ Orient Semiconductor
◍ ChipMOS
◍ King Yuan Electronics
◍ SFA Semicon
The Quad-Flat-No-Lead Packaging (QFN) Market is highly competitive with major players like ASE (SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, ChipMOS, King Yuan Electronics, and SFA Semicon. These companies use QFN packaging technology to provide high-performance, costeffective solutions for various applications, thereby contributing to the growth of the QFN market.
- ASE (SPIL) reported sales revenue of $10.14 billion
- Amkor Technology had sales revenue of $4.53 billion
- JCET Group's sales revenue stood at $3.5 billion.
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