Low Pressure Molding Hot Melt Adhesive Market
Low Pressure Molding Hot Melt Adhesive Market
Scope: Industry Analysis, Market Size, Growth,
Trends Till 2031
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Low Pressure Molding Hot Melt Adhesive Market Size and Growth
The Low Pressure Molding Hot Melt Adhesive market is experiencing robust growth driven by increasing demand for lightweight, durable bonding solutions across industries. The market size is projected to reach approximately USD 1.5 billion by 2027, fueled by advancements in manufacturing processes and rising applications in electronics and automotive sectors.
Companies Covered
(Covid 19 Impact Covered)
◍ Henkel
◍ Bostik
◍ Huntsman
◍ Liancheng Rixin Fine Synthetic Material Co., Ltd.
◍ Fixatti
◍ SUNTIP
◍ MOLDMAN SYSTEMS LLC
◍ Austromelt
◍ Bühnen
◍ KY Chemical
The Low Pressure Molding Hot Melt Adhesive Market features key players like Henkel, Bostik, and Huntsman, enhancing applications across electronics, automotive, and medical sectors. These companies innovate packaging, increase production efficiency, and expand market reach, driving growth. Revenue highlights include Henkel’s reported €20 billion in total revenue and Bostik's robust market presence.
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Market Segmentation
By Application
Consumer Electronics
Automotive
Others
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By Product
Market Growth
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$ X Billion USD
