High Thermal Conductivity Copper Foil Market
High Thermal Conductivity Copper Foil Market
Scope: Industry Analysis, Market Size, Growth,
Trends Till 2031
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High Thermal Conductivity Copper Foil Market Size and Growth
The High Thermal Conductivity Copper Foil market is experiencing robust growth, driven by increasing demand in electronics and automotive sectors. As of 2023, the market size is projected to reach approximately $1.5 billion, with a compound annual growth rate (CAGR) of around 7% over the next five years, reflecting enhanced performance needs.
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Companies Covered
(Covid 19 Impact Covered)
◍ Fukuda
◍ NPC
◍ JX Nippon Mining & Metal
◍ Hitachi Cable
◍ CCP
◍ Furukawa Electric
◍ Tongling Nonferrous Metal Group
◍ LS Mtron
◍ Olin Brass
◍ Kingboard Chemical
The High Thermal Conductivity Copper Foil Market features companies like Fukuda, NPC, JX Nippon Mining & Metal, and Hitachi Cable, specializing in advanced electronics and thermal management solutions. They enhance product performance and innovation, driving market growth. Notable revenue figures include:
- JX Nippon Mining & Metal: \$10 billion
- Furukawa Electric: \$5.4 billion
- Hitachi Cable: \$4.8 billion
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Market Segmentation
By Application
◍ Printed Circuit Board
◍ Lithium-ion Batteries
◍ Electromagnetic Shielding
◍ Other
By Product
◍ Rolled Copper Foil
◍ Electrolytic Copper Foil
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Market Growth
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$ X Billion USD
