Glass Substrates for Advanced Packaging Market
Glass Substrates for Advanced Packaging Market
Scope: Industry Analysis, Market Size, Growth,
Trends Till 2031
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Glass Substrates for Advanced Packaging Market Size and Growth
The Glass Substrates for Advanced Packaging market is experiencing significant growth, driven by increasing demand for miniaturization in electronics. The market size is projected to reach $1.2 billion by 2025, reflecting a CAGR of 8% as industries adopt innovative packaging solutions for enhanced performance and reliability in high-tech applications. Request Sample Report
Companies Covered
(Covid 19 Impact Covered)
◍ "AGC"
◍ "Schott"
◍ "Corning"
◍ "Hoya"
◍ "Ohara"
◍ "CrysTop Glass"
◍ "WGTech"
The competitive landscape for glass substrates in advanced packaging features companies like AGC, Schott, Corning, Hoya, Ohara, CrysTop Glass, and WGTech. These firms innovate in high-performance glass solutions, enhancing packaging efficiency and reliability, thus driving market growth. Revenue highlights include:
- Corning: $14 billion
- Schott: $2.5 billion
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Market Segmentation
By Application
◍ "Wafer Level Packaging"
By Product
◍ "Coefficient of Thermal Expansion (CTE)
◍ "Panel Level Packaging" Request Sample Report
◍ above 5 ppm/°C"
◍ "Coefficient of Thermal Expansion (CTE)
◍ below 5 ppm/°C"
$ 504.00 Million
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