

Epoxy Molding Compounds Market Scope: Industry
Analysis, Market Size, Growth, Trends Till 2031
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The Epoxy Molding Compounds market is experiencing robust growth, driven by increasing demand across electronics and automotive sectors. Current market size is estimated at approximately $1.2 billion, with a projected CAGR of 5.3% over the next five years. Key drivers include advancements in technology and rising adoption of lightweight materials.
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◍ Sumitomo Bakelite
◍ Hitachi Chemical
◍ Chang Chun Group
◍ Hysol Huawei Electronics
◍ Panasonic
◍ Kyocera
◍ KCC
◍ Samsung SDI
◍ Eternal Materials
◍ Jiangsu Zhongpeng New Material
◍ Shin-Etsu Chemical
◍ Hexion
◍ Nepes
◍ Tianjin Kaihua Insulating Material
◍ HHCK
◍ Scienchem
◍ Beijing Sino-tech Electronic Material
The Epoxy Molding Compounds market features key players like Sumitomo Bakelite and Hitachi Chemical, focusing on high-performance materials for electronics. Companies innovate and expand applications, enhancing market growth. Notable revenue contributions include:
- Sumitomo Bakelite: Approximately $1.5 billion
- Hitachi Chemical: Approximately $1.3 billion
- Samsung SDI: Approximately $28 billion
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◍ Normal Epoxy Molding Compound ◍ Green Epoxy Molding Compound ◍ Semiconductor Encapsulation ◍ Electronic Components
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$ 3.30 Billion