Electronic Potting & Encapsulating Epoxy Material
Market Scope: Industry Analysis, Market Size, Growth, Trends Till 2031
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Electronic Potting & Encapsulating Epoxy Material Market Size and Growth
The global Electronic Potting & Encapsulating Epoxy Material market is estimated to reach a value of $3.5 billion by 2025, growing at a CAGR of 7.2%. The increasing demand for electronic devices and components in various industries is driving the market growth. Key players include Henkel, HB Fuller, and Techsil Ltd.
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Companies Covered (Covid 19 Impact Covered)
◍ Henkel
◍ Dow Corning
◍ Hitachi Chemical
◍ LORD Corporation
◍ Huntsman Corporation
◍ ITW Engineered Polymers
◍ 3M
◍ H.B. Fuller
◍ John C. Dolph
◍ Master Bond
◍ ACC Silicones
◍ Epic Resins
◍ Plasma Ruggedized Solutions
The Electronic Potting & Encapsulating Epoxy Material Market is competitive with key players like Henkel, Dow Corning, Hitachi Chemical, LORD Corporation, and Huntsman Corporation. These companies offer a range of epoxy materials for electronic encapsulation and potting applications to enhance product performance and reliability. Sales revenue figures: Henkel - $20.5 billion, Dow Corning - $5.3 billion, LORD Corporation$1.1 billion.
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