Ceramic to Metal Package & Shell Market Size and Growth
The Ceramic to Metal Package & Shell market is projected to experience significant growth due to increasing demand for high-performance and reliable electronic components. The market size is estimated to reach $1.4 billion by 2025, driven by advancements in technology and growth in industries such as telecommunications, aerospace, and healthcare.
Request Sample Report
Companies Covered (Covid 19 Impact Covered)
◍ Kyocera
◍ NGK/NTK
◍ Egide
◍ NEO Tech
◍ AdTech Ceramics
◍ Ametek
◍ Electronic Products, Inc. (EPI)
◍ CETC 43 (Shengda Electronics)
◍ Jiangsu Yixing Electronics
◍ Chaozhou Three-Circle (Group)
The Ceramic to Metal Package & Shell Market is highly competitive with companies like Kyocera, NGK/NTK, Egide, NEO Tech, AdTech Ceramics, Ametek, EPI, CETC 43, Jiangsu Yixing Electronics, and others. These companies use ceramic to metal packages for various applications such as aerospace, defense, and medical. Kyocera - $4.4 billion, NGK/NTK - $4.2 billion, Ametek$4.7 billion.
◍ Hebei Sinopack Electronic Tech & CETC 13
◍ Beijing BDStar Navigation (Glead)
◍ Fujian Minhang Electronics
◍ RF Materials (METALLIFE)
◍ CETC 55
◍ Qingdao Kerry Electronics
◍ Hebei Dingci Electronic
◍ Shanghai Xintao Weixing Materials
