Capillary Underfill Material Market
Capillary Underfill Material Market Scope: Industry
Analysis, Market Size, Growth, Trends Till 2031
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Capillary Underfill Material Market Size and Growth
The Capillary Underfill Material market is experiencing steady growth, driven by increasing demand in semiconductor packaging applications. Valued at approximately $300 million in 2023, the market is projected to expand at a CAGR of 5% through 2030, influenced by advancements in electronics and miniaturization trends across industries.
Companies Covered
(Covid 19 Impact Covered)
◍ Zymet
◍ H.B. Fuller
◍ Henkel
◍ Namics Corporation
◍ Yincae Advanced Material
◍ Master Bond
◍ Alpha Assembly Solutions
◍ LORD
◍ AIM Metals & Alloys
◍ Shin-Etsu Chemical
◍ Panasonic
The Capillary Underfill Material Market features key players like Zymet, H.B. Fuller, and Henkel, who enhance device performance through advanced materials. Companies like LORD and Shin-Etsu contribute by innovating solutions for precision electronics. Sales figures for some include H.B. Fuller: $3 billion; Henkel: $22 billion; and Panasonic: $70 billion.
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