

Camera Module & Touch Sensor Assembly
Adhesives Market Scope: Industry Analysis, Market
Size, Growth, Trends Till 2031
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The Camera Module & Touch Sensor Assembly Adhesives market research reports indicate a growing demand for adhesives in the electronics industry due to the increasing popularity of smartphones and tablets. The global market size for these adhesives is projected to reach $2.5 billion by 2025, driven by technological advancements and the need for more efficient assembly processes.
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Companies Covered (Covid 19 Impact Covered)
◍ Dymax
◍ DELO
◍ Henkel
◍ H.B. Fuller
◍ NAMICS
◍ Addison Clear Wave
◍ ThreeBond
◍ Ajinomoto Fine-Techno
◍ Tex Year Industries
◍ AVENTK
◍ KY Chemical
◍ Sekisui
◍ Longain New Materials
The Camera Module & Touch Sensor Assembly Adhesives Market is highly competitive with key players such as Dymax, DELO, Henkel, H.B. Fuller, NAMICS, Addison Clear Wave, ThreeBond, Ajinomoto Fine-Techno, Tex Year Industries, AVENTK, KY Chemical, Sekisui, and Longain New Materials. These companies provide adhesive solutions for assembling camera modules and touch sensors, contributing to the growth of the market.
- Dymax: $400 million
- DELO: $180 million
- Henkel: $21 billion
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◍ Camera Module Assembly
◍ Touch Sensor Assembly
◍ UV Curable Type
◍ Non-UV Curable Type
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