Ball Grid Array BGA Packages Market Size and Growth
The Ball Grid Array (BGA) Packages market research reports indicate a growing demand for smaller, more efficient electronic components. The BGA Packages market size is expected to reach $10.3 billion by 2025, driven by advancements in technology and the increasing adoption of electronic devices in various industries.
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Companies Covered (Covid 19 Impact Covered)
◍ Amkor Technology
◍ TriQuint Semiconductor Inc.
◍ Jiangsu Changjiang Electronics Technology Co.
◍ STATS ChipPAC Ltd.
◍ ASE Group
The Ball Grid Array (BGA) Packages Market is highly competitive with key players such as Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co., STATS ChipPAC Ltd., ASE Group, and others. These companies offer innovative BGA packages to cater to the increasing demand in various industry sectors, contributing to market growth.
- Amkor Technology reported sales revenue of $4.40 billion in 2020
◍ Advanced Semiconductor Engineering, Inc.
◍ PARPRO
◍ Intel
◍ Corintech Ltd
- ASE Group reported sales revenue of $13.17 billion in 2020
- Intel reported sales revenue of $77.87 billion in 2020
◍ Integrated Circuit Engineering Corporation
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