

ABF (Ajinomoto Build-up Film) Substrate Market
Scope: Industry Analysis, Market Size, Growth, Trends Till 2031
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The ABF (Ajinomoto Build-up Film) Substrate market research report analyzes current market conditions and forecasts future trends. The market size for ABF Substrate is estimated to be $XX billion, driven by increasing demand for flexible and lightweight electronic devices. Key players include Ajinomoto Co., Inc., DuPont, and Mitsui Chemicals.
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◍ Unimicron
◍ Ibiden
◍ Nan Ya PCB
◍ Shinko Electric Industries
◍ Kinsus Interconnect Technology
◍ AT&S
◍ Semco
◍ Kyocera
◍ TOPPAN
◍ Zhen Ding Technology
◍ Daeduck Electronics
◍ ASE Material
◍ LG InnoTek
◍ Shennan Circuit
◍ Shenzhen Fastprint Circuit Tech
◍ ACCESS
The ABF substrate market is highly competitive with key players like Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, Daeduck Electronics, ASE Material, LG InnoTek, Shennan Circuit, Shenzhen Fastprint Circuit Tech, ACCESS, and NCAP China. These companies use ABF substrate for advanced packaging solutions, contributing to the growth of the market.
- Unimicron's sales revenue in 2020 was $4.1 billion
- Ibiden's sales revenue in 2020 was $3.6 billion
- Kyocera's sales revenue in 2020 was $14.7 billion
◍ National Center for Advanced Packaging (NCAP China)
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PCs
Server & Switch
Game Consoles
AI Chip ◍ Communication Base Station
By
◍ 4-8 Layers ABF Substrate
8-16 Layers ABF Substrate
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$ 6.50 Billion
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