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Dry film technology

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Dry film technology

Currently being used in several brands of dry film, the different parameters of the brand in the film is slightly different when different batches of dry film is also slightly different parameters, the specific parameters required to communicate with manufacturers and according to their own devices conditions to be adjusted.

When dry film, start with dry polyethylene protective film on the take off, and then under the conditions of heat and pressure in the dry film resist paste to copper clad board. Dry film resist layer in the heated softened to increase PDFmyURL.com

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Equipment

pressure in the dry film resist paste to copper clad board. Dry film resist layer in the heated softened to increase mobility, by means of hot roll pressure and resist the role of the binder done in the film. Film is usually done in the film machine, film machine model range, but roughly the same basic structure, generally continuous film paste can also be a single post.

Continuous film to the attention of the upper and lower feed rollers coat dry dry when aligned, the general size of the membrane is slightly smaller than the board to prevent resist sticking to the hot roller. Continuous film production,

PTH pre-scrubbing machine

high efficiency, suitable for mass production. When a good film to master the three elements of pressure, temperature, transmission speed. Pressure: the newly installed film machine, first raised to the upper and lower axis parallel to the hot roller, and then to gradually increase the pressure with the pressure adjustment means, according to the thickness of PCB easily transferred to the dry paste, paste prison, no wrinkles. After the general pressure adjustment can be fixed to use, such as the production of circuit boards need to adjust the thickness difference is too large, the general line pressure of 0.5-0.6 kg / cm. Temperature: According to the type of dry, performance, environmental temperature and humidity vary slightly different than if the dry film coating and the ambient temperature low humidity hours, film temperature is higher, on the contrary can be lower, well within the darkroom stable environment and equipment in good condition is a guarantee of good film.

General If the film temperature is too high, then the image will become brittle dry, resulting in poor performanceresistant coating, film temperature is too low, dry film and copper surface adhesion is not strong, in the development or plating process, film Yi Qi Qiao even off. Usually control the film temperature is 100 ℃. Transmission Speed: with the film temperature, high temperature, transmission speed can be faster, low temperature will slow the transfer rate.

Transmission speed of 0.9 is usually a 1.8 m / min.

Usually when mass production in the required transmission speed, the hot roller is difficult to provide sufficient heat, the board can be preheated to film, that is dried in the oven can be cooled a little after the film, or to slow the film speed to be guaranteed.

To meet the production of fine line of PCB and the development of the wet film technology, this process is the use of special dry film laminator before the formation of a water film on the copper surface of the water film role is: to improve liquidity dry; get rid of scratches, blisters, pits, and depression, and other parts of the fabric, stranded on the bubble; film pressure in the heating process, water photoresist to light the role played by viscosity, which can greatly improve the dry film and substrate adhesion, thereby increasing the production of fine wire passing rate, PDFmyURL.com

according to reports, the use of this technology can improve the fine line 1-9% pass rate.

Intact surface film should be smooth, no wrinkles, no bubbles, no dust particles and other inclusions. Note that in order to maintain process stability, film should be subject to more than 15 minutes after the cooling and recovery further exposure.

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