Manufacturers of Flow Control Solutions for Semiconductor and Fab Equipment

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Manufacturers of Flow Control Solutions for Semiconductor and Fab Equipment Manufacturing is defined as the process which is used to convert raw materials into finished products. The operation of manufacturing can be viewed as a system with supplies and raw materials serving as its input and the finished products serving as outputs. In the manufacturing of semiconductor, the input materials include dopants, metals, semiconductor materials, and insulators. While, the output materials include ICs, printed circuit boards, IC packages and several other electronic systems and products such as digital cameras, computers and cellular phones. The types of processes that are used in semiconductor manufacturing includes oxidation, etching, crystal growth, planarization, deposition processes, and photolithography.

Proteus Industries focuses on the requirement, types of flow controllers, characteristics, and gases currently utilized in semiconductor industry. The importance of flow control in semiconductor equipment processes is vital to the repeatability, manufacturing, and capability of integrated circuits. Today, in semiconductor industries different kinds of flow control solutions are becoming dominant. Thermal bases flow control solution is the most common variety in the whole industry. There are two types of sensors which are used in different industries like MEMS-based sensors and Coriolis. These sensors are not fully developed but can be found in semiconductor application in the future. Continued technological advancements, improvements, and feature sizes in semiconductor chip manufacturing have seen the arrival of faster, smaller, and newer fluid handling component. In addition, the trend shifting in the industry from single wafers to batch process has effected the components of the traditional gas system. The requirements of the performance had not been developed for the mass flow control in the semiconductor industry, materials that are applied set forth a specification to test and define the requirements. The technique best duplicates the behavior of gas which is trying to enter into a wafer process chamber.


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