UR TOTAL SOLUTIONS
PCB ASSEMBLY MATERIALS
Pg. 03
CIRCUIT BOARD PROTECTION
Pg. 05
THERMAL MANAGEMENT
Pg. 07
GENERAL ASSEMBLY
Pg. 10
LOW PRESSURE MOLDING
Pg. 12
PLASMA SURFACE TREATMENT
Pg. 15
INTELLIGENT INTRALOGISTICS SOLUTIONS
Pg. 17
CLEANING & DEGREASING
Pg 04
TEMPORARY MASKING
Pg 06
EMI SHIELDING
Pg 09
ELASTOMERIC MATERIAL SOLUTION
Pg. 11
DISPENSING SYSTEM
Pg. 13
CURING SYSTEM
Pg. 16
SHEAR
PCB ASSEMBLY MATERIALS
BAR
Anti-Oxidization
Anti Cu-leaching
SOLDER PASTES
NO chip floating
Solving incomplete BGA soldering
High speed printing (up to 150mm/s)
CORED WIRES
Supper wetting define anti
bridging performance
NO spattering
NO Cracking & Peeling Off of Flux Residue
ECOFRENDLY
CHIP BONDER (SMT RED GLUE)
Prevent component displacement Prevent the components from falling off
Economical, disposable
Thin blade profile for trimming in tight areas
Ergonomic handle design Spring-back action
Wide variety of shapes and sizes
Effective and efficient thermal conductor
Has iron plating to protect the soft, corrosive-prone copper
03
Cut up to 18 AWG copper wire (.04″/1mm)
cutter
CUTTER SOLDER TIPS
VAPOR DEGREASER
Vapor degreasing is the cleaning process which involves condensing solvents vapors on the object that is being cleaned. The process doesn’t require any water or scrubbing. Instead, the vapor-degreasing machine uses solvent vapors to clean and remove contaminants from parts. This process is used to clean various materials during the manufacturing process such as plastic, glass, metal, gold, and ceramic.
BENEFITS BENEFITS
01
Improve Board Appearance
Prevent False Quality Control Rejection
Prevent Failures from Dendrites
02 Allow Proper Conformal Coating Adhesive
Flux residues causing uplift
03
Prevent Corrosion of Leads and Joints
Corrosion on failed assembly in QFP area
CLEANING & DEGREASING
Dendrite-resistant
04
CIRCUIT BOARD PROTECTION
METHODS
CONFORMAL COATING
Protect PCBs from thermal shock, moisture, corrosion and environmental conditions.
most challenging environments
SEALING
Effective sealing of electronic components & modules protects complex, fine-pitch components from excessive thermal shock, high-temperature.
BENEFITS
PROTECT CIRCUIT BOARD from:
Harsh environments:
Chemical
Water
Temperature Extremes
Salt and dust
Mechanical:
Shock
Vibration
4
LOW PRESSURE MOLDING
Watertight encapsulation
High-temperature & solvent resistance
Suitable for sensitive e-components
ELECTRICAL INSULATION
FLAME RETARDANT UL 94 UL R
LONG- TERM RELIABILITY
HEAT DISSIPATION
1
3
05
TEMPORARY MASKING
HIGH TEMPERATURE MASKING TAPE
BENEFITS
WATER SOLUBLE
LATEX RUBBER
RESIDUE-FREE surface
RELIABLE PROTECTION for complex and intricate configuration
Superior protection with SINGLE COAT
Masked components are immediately READY FOR PRODUCTION
AVAILABLE in peelable, water -soluble, or burn-off types
UV MASKING
06
HOT MELT
THERMAL MANAGEMENT
THERMAL PAD 1
High thermal conductivity
High compressibility and compliance
Electrical insulation
Natural tack
Silicone base
Non-Silicone base
These materials are used when the presence of silicone oils could be detrimental to product performance in medical, high-end electronics and aerospace devices.
2
THERMAL GREASE
Silicone/ Non-silicone Based
Good leveling agent
No overflow
Effectively fill the gap of the interface
Improved reliability in harsh temperatures (200°C)
Easy processing
Silicone/ Non-silicone Based Thermal Grease
Thermal AdhesiveThermal Gap Filler
1.1
1.2
07
3 PHASE CHANGE MATERIALS (PCMs)
Phase Change Material (PCMs) are materials that are supplied as a solid pad and then soften and flow then a critical temperature is reached. When the material flows, it fills voids and interstices on the surface. As a result, PCMs could give a lower thermal resistance between the mating surfaces.
4 THERMAL GAP FILLER
Gap fillers are soft, thermally conductive silicone materials that are designed to dissipate heat from electronic devices. It can be used as liquid dispensed alternative to pre-fabricated thermal pads.
Ultra-Low Modulus: Minimal stress during assembly
Excellent Conformability to intricate geometries
Single solution for Multiple Applications
Efficient material usage
Customizable flow characteristics
5
Used when the key design criteria is both excellent thermal management and electrical conductivity.
3.2 3.1
Low mass decreases space
EMI reduction
HEAT SPREADER VAPOUR CHAMBER
Using the physical effect of phase change between liquid and gas, vapour chambers
Ultra thin
Available for unventilated design
No dusting issue
Excellent XYZ conduction (heat spreading)
Passive component with high stability (reliable)
Very low thermal resistance
Graphite Graphene
6 08
AND GROUNDING
Economical
Troubleshooting & prototyping
Static charge drainage
Fast and easy application
EMI Absorbers
EMI Shielding Absorbers
Flexible Absorbent Material
NFC, WPC & MAGNECTIC SHIELDING
Improve WPC efficiency and NFC or RFID read ranges
Be used for magnetic field shielding to help protect sensitive electronics
09
EMI SHIELDING
EMI ABSORPTION
EMI SHIELDING
01 02 03
GENERAL ASSEMBLY
Adhesives & Tapes
PERFORMANCE
ADHESIVE LOAD BEARING CAPABILITY
10
Type Overlap Shear (MPa) Structural Adhesives Curing Hot Melts Sealants Foam Tapes Hot Melts & Contact PSAs 7.0 - 40 2.8 - 7.0 2.0 - 5.5 0.3 - 3.0 0.3 - 1.0 0.01 - 0.1
Adhesive Sealants Curing Hot Melts PUR
ADHESIVE TECHNOLOGY
Tapes,
Tapes Contact Adhesives Solvent & Water based Hot Melts HM & Low melt
Adhesives Epoxy, Acrylic, Urẹthane Instant & Anaerobic Acrylic Foam VHB Tapes
Pressure-Sensitive Adhesive Double-Coated
Adhesive Transfer
Structural
ELASTOMERIC MATERIAL SOLUTIONS
BENEFITS
Engineered to retain comfort
Global design support and manufacturing provide samples to design more quickly
Environmentally friendly
Diverse comfort elements
Global certifications including ISO rated facilities & REACH/RoHS global standards
11
Battery Pads & Cushions Cushions 01 02 Display Protection 03 Shock Absorbtion 05
LOW PRESSURE MOLDING
Simplified process
“Sky Lining” allows use of less material, precise encapsulation and less weight
Complete watertight encapsulation
Safe, 1-component, UL 94-V0 approved
Zero waste
LPM MATERIALSMOLD DESIGN SOLUTIONS
12
LPM EQUIPMENTLPM CONTRACT MANUFACTURING
DISPENSING SYSTEM
1K Dispensing System
13
2. Precision Valve
3. Controller
4. Pressure Tank
5. Accessories
1. Dispensing Robot
2K Dispensing System
Flexible configuration & diverse possibilities for expansion
Highly effective through automation option
Quality control with options to monitor processes
Wide range of applications
Customizable
PLASMA SURFACE TREATMENT
The term “Plasma” designates matter with a high, unstable energy level. When plasma comes into contact with solid materials like plastics and metals, its energy acts on the surfaces and changes important properties, such as the surface energy. Today, many chemical surface treatment processes can be replaced by plasma treatment.
Clean Surface & Increase Surface Energy
Friendly with Environment
Can be intergrated inline
15
APPLICATIONS 01 PCB surface Activation 02 Oxide Removal 05 Pre-treat for Bonding 06 Pre-treat for Printing 03 Jig Cleaning 04 Metal Mask Cleaning
HIGHLIGHT
CURING SYSTEM
UV Curing
Heat Curing
One of this product line’s advantages is its flexibility in both temperature range and size. We can also customize dimension and volume capacity according to customers’ requirements for specific applications.
16
designed with corrosion-resistant
to
drying, heating, aging,
and
Solidly
materials
deliver invariable and uniform temperature for a wide range of applications such as
sterilizing, testing, curing
storing
VUV UVC UVB UVA UV Visible Light Gamma-Rays X-Rays Infra-Red Microwaves Radiowaves 1010101010101010101010101010 10101010101010101010101010 100 200 300400500600 700 OPERATING PRINCIPLE Flood light system 01 Conveyor System Spot UV System 02 03
INTELLIGENT INTRALOGISTICS SOLUTIONS
With efforts in robotic technologies, we provide global customers with leading mobile robot products and solutions. Our company is pleased to partner with Rozitek to develop the intelligent intralogistic robot system. Our solutions help you simplify flow, reduce costs and reform the intralogistics process
FLASH HARDWARE PRODUCTS
THOR
moves inventory shelves or pallets to the picking station by its lifting mechanism. It enhanced safety protection, delivering highly
BEAST
Carton Transfer Unit
Beast can transport or store single/multiple bins and realize precise inbound or outbound delivery. It supports picking height no less than 6 meters with high stability that is proven by passing 1 million times lifting tests. Being flexible in various shelves with multiple heights, it is suitable for typical applications such as high density warehouse storage and production line material distribution.
Surfer and Hulk move a wide range of materials by the conveyor and lifting mechanism.
The Surfer series supports docking with machines, transmission lines or tooling mechanisms to fulfill the automated production needs.
The Hulk series supports large material transportation, mainly used for heavy-duty applications in Automotive, Machinery, Aerospace and F&B manufacturing industries.
17
Conveyor Mobile Robot
Heavy-Duty Mobile Robot
KEY TECHNOLOGY PARTNERS
Mission
To be the partner to offer our customers the "total solution" of specialty materials and dispensing systems of all types to support their requirements at the lowest possible cost, with top quality, the best reliability and 100% support at all times.
Vision
To be the most elected and approved company in specialty materials and dispensing equipment, where the customers always want to come to find solutions for their assembly and manufacturing challenges and by keeping focus on our commitment for our customers’ satisfaction, providing support for their growth and success.
Core Values
Customer Focus
Discipline
Determination
PROSTECH ASIA PTE. LTD.
11 Woodlands Close #04-36, Woodlands 11 Singapore (737853)
T. (+84) 3430 88826
PROSTECH PHILIPPINES INC.
1709 Investment Dr, Alabang, Muntinlupa, 1780 Metro Manila
T. (+63) 960 881 8409
PROSTECH MALAYSIA SDN. BHD.
E. Lin.nguyen@prostech-asia.com
T. (+84) 343 088 826
VIETNAM PROS TECHNOLOGY CO., LTD.
E. info@prostech.vn
Head Office:
SL11-LK2, Vinhome Thang Long, An Khanh, Hoai Duc, Hanoi, Vietnam
T. (+84) 243 212 33 04
HCM Branch:
21 Nguyen Thi Nhung, Van Phuc Zone, Hiep Binh Phuoc, Thu Duc City, Ho Chi Minh City, Vietnam
T. (+84) 283 636 58 82
Danang Branch:
R910A, 9TH Floor, Muong Thanh Luxury, 115 Nguyen Van Linh, Nam Duong, Hai Chau, Danang City, Viet Nam
CONTACT US
Singapore Malaysia Manila Hanoi Danang Hochiminh