Redistribution Layer Material Market Forecast to 2028
US$ 301.6 Million
COVID-19 Impact and Global Analysis
By Material Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] By Application [Fan-Out Wafer Level Packaging (FOWLP) and 2 5D/3D IC Packaging]
US$ 159.8 Million
2021
2028