VPX & OpenVPX Systems and Backplanes Pixus Technologies provides VPX and OpenVPX packaging solutions for a range of military and aerospace applications. The Pixus VPX packaging solutions include subracks, enclosures, backplanes, chassis, and integrated system platforms. In addition, Pixus provides components and accessories such as fans, power supplies, card guides, guide rails, front panels, filler panels, and handles. VPX systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal technologies. VPX chassis and systems can be modified to meet customer requirements without NRE.
FEATURES VPX & OpenVPX ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VPX and OpenVPX backplanes ĄĄ Complies with VITA 46, VITA 48, VITA 65, VITA 1, VITA 1.1,
IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11
VME & VME64x ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VME and VME64x backplanes ĄĄ Complies with VITA 1, VITA 1.1, IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11 vita.opensystemsmedia.com/p372779
Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components
sales@pixustechnologies.com 519-885-5775
Pixus Technologies
www.pixustechnologies.com
VPX
Themis High-Density Servers Suited for computing environments where server Size, Weight, and Power (SWAP) is important, Themis RES High Density (HD) servers are designed for virtualization, ISR, Big Data Analytics, radar processing, image processing, large Hadoop clusters, and a multitude of applications that require high-compute density and low latency access to large-data storage. RES HD Servers double compute density, enable a 50% savings in rack space, and reduce system weight by nearly 50% with per server weights as low as seven pounds. Available in a 2RU (four bay) or 3RU (six bay) chassis, RES-HD servers provide maximum system configuration flexibility and functionality with processor, storage, high-speed switch, and system management module options. Combining leading-edge components that include Intel® Xeon® E5-2600 v3 Series processors and SuperMicro motherboards, RES servers feature expansion slots, extensive high-speed front or rear I/O, storage, and enhanced reliability options.
FEATURES ĄĄ SWAP-C Ready ĄĄ 2RU or 3RU Chassis Options ĄĄ Intel® Xeon® E5-2660 v3 Series processors, and Supermicro
X9DRT-IBFF motherboards
ĄĄ Supports up to three 56 Gb/sec Infiniband (IB) or 40 Gb Ethernet ports
to provide industry leading I/O bandwidth
ĄĄ Maximum system configuration and expansion flexibility with processor, ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ
storage, high-speed switch, and system management modules options Enhanced reliability for shock, vibration, and extended temperature 0° C to 55° C operating temperature range 8% to 90% operating humidity (non-condensing) Operating vibration: 4.76 Grms, 5Hz to 2000Hz (SSD) MIL-STD 810F, EN60000, CE Mark
vita.opensystemsmedia.com/p372688
Themis Computer
www.themis.com/hd www.vita-technologies.com
www.themis.com/headquartersandsales
linkedin.com/company/17952
510-252-0870
twitter.com/Themis_Computer
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