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Volume 21 • Number 1

6

Columns

Features SPECIFICATIONS UPDATE: Version 2.0: The evolution of SMARC module specification

6

PC/104 Consortium

PC/104: A fresh look in its 25th year

5

By Stephen St. Amant, PC/104 Consortium President

By Martin Unverdorben, Kontron

Resource Guide PROFILE INDEX

PROCESSOR ARCHITECTURE: 10

The “fishal” recognition revolution in fish counting

10

By Rory Dear, Technical Contributor

PC/104 CONSORTIUM: PC/104 Consortium information

12

15

COMs and SoMs Hardware and Peripherals IoT SBCs and Boards Systems

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Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


www.pc104.org

PC/104

Consortium

By Stephen St. Amant, PC/104 Consortium President

PC/104: A fresh look in its 25th year Let’s take a moment to recall the significance of 1987 – thirty years ago. You may immediately think, “Yes. 1987. A fantastic year for the birth of tennis stars: Andy Murray, Novak Djokovic, Maria Sharapova, Ana Ivanovic, and Sara Errani were all born in ’87.” But I imagine your second thought is about PC/104, right? Well, it could be if you know your PC/104 history: 1987 marks the year that Ampro introduced the Little Board/PC singleboard computer – one of the earliest seeds of the PC/104 ecosystem. Early collaborators such as Real Time Devices (now RTD Embedded Technologies) and Diamond Systems began developing compatible products as interest grew in the modular building block concept. By 1989, an innovative plugin mezzanine concept was introduced; it was perhaps the first look at a stackable bus structure that could eliminate the need for a backplane. As the form and function of the 3.775-inch by 3.550-inch stackable PC architecture began to take shape, Ampro made the industry-changing decision to spin its proprietary form factor into an open standard. In 1992, twelve ­trailblazing companies would join together to establish the PC/104 specification and the consortium that bears its name. Stackable expansion buses, corner mounting holes, and a compact footprint proved to be a winning combination which quickly found popularity among embedded system designers. (Note: Many thanks to Rick Lehrbaum for his previous publications chronicling the early history of PC/104.) In the 25 years since the Consortium’s founding, the PC/104 stackable architecture has successfully evolved to support advances in signal technologies and growth in silicon availability. Today, PC/104 is a thriving ecosystem supporting some of the most exciting embedded military, aerospace, industrial, medical, transportation, communications, and security applications. With specifications based on stackable ISA, PCI, and PCI Express buses, there is very little on the front lines of embedded computing that PC/104 does not address. Our member companies manufacture products which enable leading-edge technologies around the globe, while also supporting decades-old infrastructure.

www.smallformfactors.com

With specifications based on stackable ISA, PCI, and PCI Express buses, there is very little on the front lines of embedded computing that PC/104 does not address. While the capabilities of the PC/104 architecture have expanded and adapted over time, the Consortium’s branding has not always kept pace. That is, until now: This year, the PC/104 Consortium is launching a newly redesigned logo. It’s a fresh message to correspond with the continued evolution of the PC/104 specifications and the steady expansion of the PC/104 ecosystem. As stewards of the PC/104 specifications, and developers of future stackable standards, the Consortium leadership felt that the organization’s visual identity needed to better reflect the innovative spirit and forward-thinking technologies of its member companies and the PC/104 specifications it promotes. PC/104 systems support a vast network of embedded applications across the globe, and the Consortium’s well-crafted ­standards have positioned our members for continued, sustainable growth. Visit the Consortium exhibit and many of our member companies this March at embedded world in Nuremberg, Germany. Look for a wide variety of embedded products and innovative solutions based on the latest PCIe/104, PCIe/104 OneBank, and PCI/104-Express specifications, as well as those in PC/104, PC/104-Plus, PCI-104, EPIC, EPIC Express, EBX, and EBX Express. As always, keep up with the latest PC/104 products, news, and specification updates at www.pc104.org.

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SPECIFICATIONS UPDATE SPECIFICATIONS UPDATE

Version 2.0: The evolution of SMARC module specification By Martin Unverdorben

Earlier this year, the Standardization Group for Embedded Technologies (SGET) updated its Smart Mobility Architecture (SMARC) embedded computing format to the 2.0 specification. Since its inception three years ago, the SMARC small-form-factor module has given developers an innovation boost for the ultra-low-power embedded market. Due to its widespread adoption and successful application, SGET members determined that Version 2.0 was needed to support next-generation design requirements. The primary reason to implement a new SMARC 2.0 specification is to provide an enhanced pinout that would better meet broader application requirements and processor interfaces. Essential to the standard’s ongoing viability, an updated spec also needed to offer backward compatibility with the original standard set in 2013 for low-profile form factor modules.

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SMARC development history The SMARC format was originally created out of the necessity for a computer-onmodules (COMs) standard that would support and accommodate energy-saving ARM system-on- chip (SoC) processors. Since the inception of the format, Intel has subsequently improved the power efficiency of its processors with Atom-based SoCs, making the SMARC format also very well suited for x86 architecture-based products. SMARC answers the needs of systems integrators who want to be able to leverage available user-interface options to the fullest to support access to the smaller, low-cost display modules employed in many of today’s advanced mobile devices.

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SMARC modules are targeted to embedded systems developers that want the design flexibility of using COMs and carrier boards, and also to system developers requiring SoC-based, ultralow power COMs in miniature format. Actually, the application areas that can use SMARC modules is continually expanding, from solutions in the automation market to graphics and imagecentric devices which also require extremely low energy consumption and must withstand extreme environmental conditions. The modules also serve as building blocks for very small portable handheld devices as well as for larger devices where consumption must not exceed a few watts and the computingpower requirement is particularly high.

Different from the PCI Express focus of COM Express, SMARC gives developers additional flexibility in handling different types of video and graphics output, serial buses, general-purpose SPI, client and host forms of USB, plus serial and parallel camera interfaces. It also provides support for standard flash-memory card formats such as SD and eMMC.

Per the SGET specification, two module sizes are defined: a full-size module that measures 82 mm by 80 mm, and a short module for more compact systems measuring 82 mm by 50 mm. Both use the proven Mobile PCI Express modules (MXMs) edge connector that features 314 edge fingers that mate with a low-profile 314-pin/0.5 mm pitch rightangle connector. Different from the PCI Express focus of COM Express, SMARC gives developers additional flexibility in handling different types of video and graphics output, serial buses, generalpurpose SPI, client and host forms of USB, plus serial and parallel camera interfaces. It also provides support for standard flash-memory card formats such as SD and eMMC. SMARC’s modular approach offers builtin scalability and upgradability, enabling OEMs to get to market quickly with low-cost, low-power, and small-footprint solutions. Once the SMARC standard was in place, companies in this space addressed market demand by offering modules with ARM SoC processors including the Freescale i.MX 6, Texas Instruments Sitara 3874, and NVIDIA Tegra 3. Developers now had the building blocks to more easily engineer ultra-low-power devices. What changed with Version 2.0? SGET recognized the need for the SMARC connector’s 314 electrical contacts to www.smallformfactors.com

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SPECIFICATIONS UPDATE support and provide compatibility with two distinct SoC architectures – not only ARM, but also x86. With ARM, for example, the connector must guarantee a high degree of signal integrity as required by the high-frequency serial interfaces, as well as support a parallel TFT display, MIPI display interface, camera interfaces, multiple SPI links, and SDIO interfaces. At the same time, it must offer full compatibility with x86 requirements such as support for multiple USB and PCI Express lanes, and support for the LPC bus. Based on three years of valuable market feedback from a broad range of developers and users, SGET successfully updated the original specification. (See Table 1 below.) As part of its policy of continuous improvement, members recommended a variety of modifications and enhancements. Specifically, they identified interfaces which were rarely used or considered nearly outdated; these have now been removed from the specification. These little-used interfaces include the parallel camera interface, parallel display interface, PCI Express presence and clock request signals, alternate function block, SPDIF, one I2S (out of three), and the eMMC interface to the carrier. The new pinout version maintains compatibility with the V1.1 pinout as much as possible. Accordingly, previously under-utilized V1.1 pins have been repurposed for new interfaces: In particular, the parallel LCD interface offers almost 50 pins that have been repurposed to DP++, the second Ethernet port, and the upgraded dualchannel LVDS. The overall guiding principal was that there should be no damage if a V1.1-compliant module is placed into a V2.0-compliant carrier, or vice-versa if a V2.0-compliant module is placed into a V1.1-compliant carrier. Developers can still

SMARC 2.0 – WHAT’S NEW Added Interfaces

2nd channel LVDS 2nd Ethernet IEEE1588 trigger signals (software definable pins) 4th PCI Express lane Extra USB ports (6x USB 2.0 + 2x USB SS signals now) x86 power management signals eSPI DP++ Video Interface Total

2x 24 Bit LVDS / eDP 4 channel / MIPI DSI 4 channel HDMI / DP++ DP++ Other Changes

Added RF connector option Changed Module EEPROM from I2C_PM to I2C_GP Added power sequencing details Removed Interfaces

Parallel camera interface Parallel Display interface PCI Express presence and clock request signals Alternate function block SPDIF

count on SMARC 2.0 support for 1x SATA, 2x CAN, 1x SDIO, 12x GPIO, 1x HDMI, 4x UART, 4x I2C, and 1x SPI. ❚❚ The new version V2.0 will repurpose selected V1.1 pins that are underused for new interfaces in order to keep the compatibility with the V1.1 pins. ❚❚ New interfaces include a second channel LVDS, a second Ethernet port, IEEE1588 trigger signals, a fourth PCI Express Lane, extra USB ports (now up to 6x USB 2.0 + 2x USB SS signals), x86 power management signals, eSPI, and DP++. ❚❚ Three digital displays: As primary display, 2 x 24-bit LVDS or eDP (four channels) or MIPI DSI (four channels) can be used; the secondary display can either be HDMI or DP++, and the third display can be DP++. Meeting broader application needs SMARC 2.0 enables manufacturers to make more sophisticated products for its customers, and offers the features necessary to create the Internet of Things (IoT) applications of the future. For example, the second gigabit Ethernet (GbE) port allows designers to more easily develop simple gateway solutions. In addition, wireless connectivity can be enabled with the Version 2.0 optional RF connector. Ultra-low-power applications now get the benefit of full HD display support from the second LVDS channel. Furthermore, with the DP++ (dual-mode DisplayPort) interface that supports resolutions up to Ultra HD with 3,840 by 2,160 pixels makes state-of-the-art multimedia-based systems possible in mobile devices. Utilizing the DP++ interface allows systems integrators to connect DisplayPort, HDMI, and DVI displays. The dual-channel LVDS capabilities in Version 2.0 provide the ability to drive either two low-resolution displays or a single high-resolution display supporting up to 1,920  by 1,200 pixels at 60  Hz depending upon the processor used.

eMMC 1 of 3 I2S Table 1

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There is also support for additional PCI Express (PCIe) and USB ports to streamline the process of connecting

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


necessary computing peripherals for developers. SMARC 2.0 supports up to six USB 2.0 ports and two USB 3.0 interfaces. Available are now four PCIe lanes for platform-specific extensions delivering the flexibility to add new application functionality.

Figure 1 The SMARC-sXAL provides extensive real-time computing power in an energy-efficient and flexible platform. Users benefit from improved computing performance and long-term availability.

The bottom line is that the interfaces now supported are optimized for both ARM and x86-based SoCs. SMARC provides a COMs standard for interfacing different SoCs. By unifying these interfaces through standardization, OEMs can achieve greater flexibility with exchangeability between carrier boards and modules, allowing them to innovate applications that are able to migrate between very-low-power ARM platforms all the way up to 15W TDP x86 platforms. Defined for the future SGET has upgraded the SMARC 2.0 specification, making these modules ideal building blocks for future innovative and sophisticated applications. It maintains backward compatibility while offering next-generation interface ­support, aligning perfectly with SoC technology evolution. As a founding member of SGET, Kontron is committed to remaining at the forefront of SMARC standard definition. The company recently announced new SMARC 2.0 modules based on the latest generation Intel Atom, Pentium, and Celeron processors. (See Figure 1.) For more information about SGET and SMARC visit www.sget.org/standards/ smarc.html. Martin Unverdorben is the product manager for SMARC at Kontron and is an active member of the Standardization Group for Embedded Technologies (SGET) committee. Using his prior experience as a field application engineer, Martin regularly trains customers in the design and implementation of computers-onmodule (CoMs) in their applications. Martin holds a degree in electrical engineering.  Kontron www.kontron.com www.smallformfactors.com

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PROCESSOR ARCHITECTURE

PCIe/104 – The “fishal” recognition revolution in fish counting By Rory Dear, Technical Contributor The National Oceanic and Atmospheric Administration (NOAA) used the flexibility of PCIe/104 architecture to update its monitoring of fish stocks.

Fish-count surveys are vital in ensuring the conservation and management of fish stocks in our increasingly overfished seas. The accuracy of those surveys is critical in providing evidence of overfishing to drive restorative and preventative legislation. Traditional fish-counting is inherently manual, relying on fishing trawlers casting enormous nets into the ocean, pulling aboard as many fish as possible to manually count and develop the trawl survey. Environmentally, the primary shortcoming of this approach is the number of fish killed during the course of this out of water survey. Naturally areas demanding the closest monitoring are those that are most threatened, thus such surveys can quickly become counter-productive to the aim of protecting their stocks. Trawling nets do not discriminate, so it’s not just fish that can get caught in the net. Additionally, often small species of fish are too small to be caught by the wide net mesh required to provide the strength to lift the catch out of the ocean. Inaccuracies of the traditional methodologies also fail to support protection legislation. There are substantial error margins involved in extrapolating from a small surveyed area to the larger area likely seeking protection. The length of time taken to undertake the survey and natural free movement of fish stocks again must again be addressed via extrapolation. Finally, the relatively high cost of the equipment and resource often dictates that the ideal level of monitoring required is prohibited.

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Seeking to revolutionize this historic practice, covering an area of ocean with particular commercial and scientific interest, the National Oceanic and Atmospheric Administration (NOAA) sought the answer in the power of embedded computing and specifically, in the flexibility of PCIe/104. In the latest iteration of this concept, PC/104 consortium members ADL Embedded Solutions, Inc. and RTD Inc. recently partnered to help bring this idea from an R&D exercise to reality. NOAA’s National Marine Fisheries service (NMFS) manages nearly 3 million square miles of coastal waters off Alaska and the west coast of the United States. This region supports some of the most significant commercial fisheries on the planet, yet are also home to some of the largest marine mammal populations. NMFS have been working tirelessly in the research and development phase of a camera based trawl technology (codenamed CAM-Trawl) for a number of years. The industry advances in underwater image capturing and facial recognition sought to

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


Real-time fish count data analysis is now instantly available for NOAA marine researchers to aid in their conservation efforts.

address the many shortfalls of the traditional approach – loosely cleverly termed “Fishal Recognition.” Early generations of the CAM-Trawl system worked in isolation, effectively just capturing myriad images to local storage, which necessitated analysis at some later date back at the laboratory. While addressing many of the environmental and accuracy shortfalls, the process remained laborious and relatively expensive. CAM-Trawl (Figure 1) enables undersea fish-count surveys with little disturb­ance to physical fish stocks. NMFS sought the assistance of ADL Embedded Solutions Inc via their Fish Management Acquisition (FMA) program to improve their proof-of-concept to the point it truly revolutionized the process. Employing a PCIe/104 stack with Quad-Core Intel Core-i7 the CAM-Trawl system gained the local performance necessary to facilitate real-time processing of image data, all whilst reducing the overall size to improve mounting flexibility and ease of storage and transportation. Typically residing in the wheelhouse, the Control Computer steadily monitors a wide range of external sensors monitoring geographical data, time, pressure, RFID tag readings and control of Vision Boxes derived from sensor input. Acting as a control sensor, it autonomously manages remote power on/off, start/stop image acquisition and clock syncing in a one-to-many relationship. The systems are housed in a stainless steel IP67 enclosure with waterproof I/O connectors to guarantee longevity in harsh marine environments. Why PCIe/104? No other configuration offers flexible support for today’s PCIe functions of quad GbE and quad USB 3.0, while facilitating likely future expansion needs of a PCIe x16 GPU or 10GbE LAN. The mechanical methodology of the famed PC/104 stack is sufficiently rugged for the shock and vibration stress of a top-side environment on a fishing trawler while enabling a smallform-factor design for an IP67 marine environment.

Figure 1 | CAM-Trawl enables undersea fish-count surveys with little disturbance to physical fish stocks.

Figure 2 | Left: ADL Control Computer, Right: ADL image acquisition computer.

Is the revolution complete? Not yet. The CAM-Trawl concept has indeed addressed the issues of traditional fish-surveying, then localized image processing has slashed the cost and processing time of data obtained via this means. So what’s next?

The Image Acquisition Computer naturally drives image capture. The GeniCam-compliant vision platform uses the latest vision technology and supports up to 6x GbE ports for camera interfacing, critically adding real-time image processing of those incoming video streams and storing crucial metadata for date/ time, fish identify, etc.

The next step will evolve how that image capture data is ­processed, likely employing the power of FPGAs in parallel to traditional computing where FPGAs are deployed in datacenters and undertaking pre-processing to achieve data-set reductions in majority of image applications “on land”. FPGAs are particularly performance and power efficient using runlength-encodes to get rid of “nothing” – in layman’s terms we mean handling any mathematics, at lightning speed. Such FPGA pre-processing would both increase data processing speed and slash the CPU performance requirements of the host computer.

The combination has revolutionized fish surveying and achieved all the stated goals for the project. Real-time fish count data analysis is now instantly available for NOAA marine researchers to aid in their conservation efforts. Still new technology, the results from experimental trawl surveys in 2016 has been very positive and work is underway to standardize on the key components utilised to facilitate mass adoption of “Fishal Recognition” technology.

While fish-counting may appear to be a somewhat niche need, the possibilities to revolutionize other applications throughout numerous industry sectors is unprecedented. The PC/104 consortium is collectively working tirelessly to realize the hardware necessary to facilitate these, with companies including Sundance, Euresys, EPIX, Sensoray, and AMP Ltd all heavily involved in image capture, processing, and pre-­ processing under PCIe/104.

www.smallformfactors.com

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PC/104 CONSORTIUM

History of the PC/104 Consortium The PC/104 Consortium was established in February 1992 by 12 companies with a common vision of adapting desktop computer technology for embedded applications. This consortium has had a tremendous, positive effect on the embedded computer marketplace. The initial release of the PC/104 specification in March of 1992 was an open design offering the power and flexibility of an IBM compatible personal computer in a size ideally suited for embedding. Simple and elegant in design, while small but rugged in performance, PC/104 technology bridged the successes of the past with the promises of future innovations. The ISA bus of the original IBM PC –– as established by the IEEE P996 specification – is still fully supported today by PC/104 technology over two decades after it was created. When demand for a faster, higher-bandwidth bus emerged, the PC/104 Consortium once again followed the desktop PC by adding a PCI bus to the ISA bus. Following on, PC/104-Plus was introduced in February of 1997. By keeping the ISA bus and adding the PCI bus, this specification became an addition to the technology rather than a replacement of any existing technology.

When desktop PCs stopped using the ISA bus, the PC/104 Consortium was ready with PCI-104 technology. The concept of PCI with no ISA was introduced in the original PC/104-Plus specification and was subsequently formally recognized with its own specification in November 2003. Once again, the PC/104 Consortium followed the desktop PC while keeping the legacy specifications intact. This growth pattern underscores the PC/104 Consortium’s desire to support the legacy technology while developing new solutions for the future. Longevity is a requirement for embedded systems and remains one of the hallmarks of PC/104 technology. This aspect is proven time and again by the number of PC/104, PC/104-Plus, and PCI-104 products on the market today, as well as by the number of PC/104 sites on other form-factor boards. To learn more about PC/104 Consortium organization and membership, please visit www.pc104.0g or email the organization at info@pc104.org.

PC/104 Consortium Founding Members

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Ampro

DMS Systems

Real Time Devices

Automation Instruments

Enclosure Technologies

Reflection Technology

BG Technologies

IOTech Inc.

Voice Connection

Diamond Systems

Quantum Software Systems

Xecom

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


Types of PC/104 Specifications ❚❚ PC/104: Like the original PC bus itself, PC/104 is thus the

❚❚ EPIC: The EPIC specification defines a physical platform

expression of an existing de facto standard, rather than

for midsized embedded single-board computer (SBC) with

being the invention and design of a committee. In 1992,

multiple I/O expansion options. Its size is midway between

the IEEE began a project to standardize a reduced form-

the industry standard PC/104 stackable format and EBX

factor implementation of the IEEE P996 (draft) specification

SBC format. This size board will support larger processors

for the PC and PC/AT buses, for embedded applications.

requiring large heat sinks. The added space also allows for

The PC/104 specification has been adopted as the “base

combining features on an SBC which would normally be

document” for this new IEEE draft standard, called the

found on multiple PC/104 modules.

P996.1 Standard for Compact Embedded-PC Modules. ❚❚ EPIC Express: Its size is midway between the ❚❚ The key differences between PC/104 and the regular

industry-standard PC/104 stackable format and the EBX

PC bus (IEEE P996) are compact form factor, with size

SBC format. This board emphasizes I/O connector area.

reduced to 3.6 by 3.8 inches; unique self-stacking bus,

The added space also allows for combining features

which eliminates the cost and bulk of backplanes and card

on an SBC which would normally be found on multiple

cages; pin-and-socket connectors, in which rugged and

PC/104 modules.

reliable 64- and 40-contact male/female headers replace the standard PC’s edge card connectors; and relaxed bus

❚❚ EBX: The EBX form factor, combining a

drive (6 mA), which lowers power consumption to one or

standard footprint with open interfaces, is small

two watts per module and minimizes component count.

enough for deeply embedded applications, yet large enough to contain the functions of a full embedded

❚❚ PC/104-Plus: This specification establishes a standard for

computer system: CPU, memory, mass storage

the use of a high-speed PCI bus in embedded applications.

interfaces, display controller, serial/parallel ports, and

Incorporating the PCI bus within the industry-proven

other system functions.

PC/104 form factor brings many advantages, including fast data transfer over a PCI bus, low cost due to PC/104’s

❚❚ EBX Express: Allows easy and modular addition of

unique self-stacking bus, and high reliability due to

functions not contained in standard product offerings.

PC/104’s inherent ruggedness.

This EBX system expansion is based on popular existing industry standards — PC/104, PCI, PC/104-Plus,

❚❚ PCI-104: To accommodate the gradual replacement of ISA

PCI-104, and PCMCIA.

bus devices with PCI devices, the PCI-104 was approved by the PC/104 Consortium. PCI-104 is a PCI-only architecture

❚❚ “Adopt-a-spec”: Any group or individual(s) having

that accommodates the advances of PCI devices in a small,

a specification for an embedded technology that

rugged form factor.

implements and/or supports PC/104 technology may present the specification to the Consortium for

❚❚ PCI/104-Express: Incorporating the PCI Express bus

consideration as a standard.

within the industry-proven PC/104 architecture brings many advantages for embedded applications, including

Please see website (http://pc104.org/hardware-

fast data transfer, low cost due to PC/104’s unique self-

specifications/adopt-a-spec) for additional information.

stacking bus, high reliability due to PC/104’s inherent ruggedness, and long term sustainability. www.smallformfactors.com

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 CONSORTIUM

PC/104 Consortium Members at Embedded World March 14-16, 2017

|

Nuremberg, Germany

|

www.embedded-world.de/en

PC/104 CONSORTIUM MEMBER

BOOTH NUMBER

AAEON. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-310

ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-554

ADLINK Technology Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-540

AMD – Advanced Micro Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-360

Advantech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 2 / 2-138

Arbor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 2 / 2-451

Axiomtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-456

b-plus GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-438

Connect Tech Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 2 / 2-318

Diamond Systems Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 3 / 3-354

ept GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 3A / 3A-141

Eurotech S.p.A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 3 / 3-618

Fastwel Group Co. Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-309

iBase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 2 / 2-241

OpenSystems Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 2 / 2-630

PC/104 Consortium . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall TBD

PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-483

Perfectron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 1 / 1-430

RTD Embedded Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 2 / 2-351

Samtec Europe GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 4A / 4A-240

VersaLogic Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 3 / 3-259

WinSystems Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hall 3 / 3-501

PC/104 Consortium 2017 Member Directory ACCES I/O www.accesio.com

General Standards Corporation www.generalstandards.com

RTD Embedded Technologies www.rtd.com

Advanced Micro Devices (AMD) www.amd.com/en-us

ICOP Technology www.icop.com.tw

Samtec www.samtec.com

ARBOR Technology www.arbor-technology.com/gl/Home

MicroMax Computer Intelligence www.micromax.com

SBS Science Technology www.sbs.cn/en

Axiomtek www.axiomtek.com

MPL www.mpl.ch

Sealevel Systems www.sealevel.com

bplus GmbH https://www.b-plus.com/en/home.html

PEAK System Technik www.peaksystem.com/ Home.59.0.html?L1

Sundance Multiprocessor Technology www.sundance.com

Abaco Systems www.abaco.com Curtiss-Wright Defense Solutions www.curtisswrightds.com Euresys www.euresys.com Fastwel Co. www.fastwel.com

14 y

Perfectron Co. www.perfectron.com PC/104 and Small Form Factors www.smallformfactors.mil-embedded.com RedWave Labs www.redwavelabs.com

TriM Technologies www.trim-technology.com Umezawa Musen Denki Co. www.umezawa.co.jp WinSystems Inc. www.winsystems.com

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


Company Category

Page

ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Silicon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADL Embedded Solutions Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADL Embedded Solutions Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Advanced Micro Peripherals, Ltd. . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . congatec inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Curtiss-Wright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DFI Technology, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Euresys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Orion Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Orion Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Orion Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . IoT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sundance Multiprocessor Technology Ltd. . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Themis Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VersaLogic Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VersaLogic Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VersaLogic Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

www.smallformfactors.com ew17_177_799x123_825_Embedded_Computing_Design_2ew17P.indd

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PC/104 and Small Form Factors Resource Guide  Spring 2017 15:26 y 15 04.10.16

PC/104 and Small Form Factors Resource Guide

RESOURCE GUIDE INDEX


PC/104 and Small Form Factors Resource Guide

COMs <<Category>> and SOMs

FEATURES ĄĄ Latest Intel® Atom™, Celeron® and Pentium® processors based

on the highly optimized new 14nm micro-architecture.

<<Title>>

ĄĄ All form factors host the high-performance Intel® Gen9 graphics

New industrial family

which provides up to 18 execution units and supports up to 4k decode and encode capabilities for HEVC4, H.264, VP8, SVC and MVC.

<<Description>>

Introducing low-power Intel® Atom™, Celeron® and Pentium® processors (Codename Apollo Lake) on six different form factors: Mini-ITX motherboards and Pico-ITX single board computers as well as COM Express Compact, COM Express Mini, Qseven and SMARC 2.0 Computer-onModules. What makes this processor so attractive for design-in on so many different form factors?

ĄĄ Support up to three 4K displays with resolutions up to

4096 x 2160 @ 60 Hz.

ĄĄ The 14 nm BGA (Ball Grid Array) package now has 1296 pins,

or 10% more as compared to the 1170 pins of its predecessors. As a result, the new processors’ BGA options have a 10% larger footprint, measuring 31x24 mm or 744 mm² compared to earlier processors measuring 25 x 27 mm or 675 mm².

A quick overview The new low-power processors from Intel® offer significantly higher performance at lower power consumption with massively improved graphics capabilities. Designers across the broad spectrum of embedded markets will find essential value in the improved performance-per-watt at a power envelope of only 6 to 12 watt. Additionally, new graphics capabilities are fueled by the powerful Intel® Gen 9 graphics engine, which was previously only available at the high-end level of Intel® Core™ processors. Extended temperature support, accommodating ambient temperatures ranging from -40° C to +85° C, as well as comprehensive real-time capabilities rounds out the feature set. All this makes the new low-power processor generation very attractive, blending performance, price and embedded longevity.

ĄĄ The battery life is expected to last approximately 15% longer over

earlier processor generations.

ĄĄ Industrial-grade temperature variants available. ĄĄ According to the demands in the embedded markets, these

processor families also offer long-term availability of 7 years. FEATURES ĄĄ

<<Feature 1>>

ĄĄ

<<Feature 2>>

ĄĄ

<<Feature 3>>

ĄĄ

<<Feature 4>>

ĄĄ

<<Feature 5>>

Which form factor fits best?

ĄĄ

<<Feature 6>>

The broad spectrum of possible applications calls for a corresponding array of dedicated OEM system designs. This is congatec’s strongest value proposition, offering OEMs every advantage in simplifying the use of new Intel® Atom™, Celeron® and Pentium® processor technology – from six different standard form factors on boards and modules, to original design and manufacturing (ODM) services for PCBs and OEM system designs.

ĄĄ

<<Feature 7>>

ĄĄ

<<Feature 8>>

ĄĄ

<<Feature 9>>

ĄĄ

<<Feature 10>>

Mini ITX and Pico ITX With Mini ITX and Pico ITX boards, engineers have a range of attractive options – including long-term available, industrial-grade motherboards and single board computers that fit perfectly into any standard system design that doesn’t require a dedicated PCB for a customized feature set. These boards are application-ready for immediate use, however if you are facing any BSP or driver challenges, congatec’s personal support is there to help. IoT engineers can also capitalize on the support of SIM cards offered by congatec’s Mini ITX motherboards. The Pico-ITX option offers excellent flexibility with a wide range of interfaces in a very small footprint.

Computer-on-Modules For applications that require a dedicated carrier board for customized interfaces, engineers can choose a preferred module from congatec’s broad portfolio of COM Express, Qseven and SMARC 2.0 Computer-on-Modules. Optionally, congatec also provides dedicated carrier board designs for these modules. congatec is open to any type of design cooperation, and engineers are completely free to decide whether carrier board design is the OEM’s core competence or whether resources are better used by outsourcing.

smallformfactors.mil-embedded.com/p374035

congatec name Company

<<website_url>> www.congatec.us 16 y

 <<contact email>> sales-us@congatec.com www.linkedin.com/company/congatec-ag <<linkedin>>

<<magazine_url>>/<<product_id_number>>

 858-457-2600  <<phone>> twitter.com/congatecAG @<<twitter_name>>

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


ETH-DIO-48 Ethernet 48-Channel Industrial Strength Digital I/O Designed for compact control and monitoring applications, this product features 48 or 24 industrial strength TTL digital I/O lines. This Ethernet device is an ideal solution for adding portable, easyto-install, digital I/O to any Ethernet network, even wirelessly. The ETH-DIO-48 is excellent for use in applications sensing inputs such as switch closures, TTL, LVTTL, CMOS logic, and is ideal for controlling external relays, driving indicator lights, and more. Applications include home, portable, tablet, laboratory, industrial automation, and embedded OEM. Available accessories include a broad range of ribbon cables, screw terminal boards, optically isolated adapters, electromechanical relay boards, and industry standard solid state module racks. Special order items such as conformal coating, custom software, right angle headers, and more, are also available.

FEATURES ĄĄ Ethernet 10/100 RJ45 connector for interfacing to CPU or network ĄĄ 48 or 24 channel high-current TTL digital I/O lines ĄĄ Compatible with industry standard I/O racks such as Grayhill, Opto 22,

Western Reserve Controls, etc.

ĄĄ Eight-bit ports software selectable for inputs or outputs ĄĄ All 48 digital I/O lines buffered with 32 mA source/64mA sink current

capabilities

ĄĄ Jumper selectable I/O pulled up to 5V (via 10KΩ) for contact monitoring, ĄĄ ĄĄ ĄĄ ĄĄ

pulled down to ground or floating Resettable 0.5A fused +5VDC output per I/O connector OEM version (board only), features PC/104 size and mounting compatibility Small, (4"x4"x1.7") rugged, steel industrial enclosure LVTTL (3.3V) and -40°C to +85°C industrial operating temperature available as factory options smallformfactors.mil-embedded.com/p372692

ACCES I/O Products, Inc.

www.accesio.com/eth-dio-48

contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

Hardware and Peripherals

mPCIe-COM Family PCI Express Mini Cards ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource. Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits. The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.

ACCES I/O Products, Inc. www.accesio.com

www.smallformfactors.com

FEATURES ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O

connectors

ĄĄ 4 or 2-port serial communication cards with optional DB9M connectivity ĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port

stored in EEPROM

ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX

and RX

ĄĄ Port-by-port field selectable termination for RS-422/485 applications ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232 ĄĄ ĄĄ ĄĄ ĄĄ

up to 921.6 kbps) Custom baud rates easily configured ±15kV ESD protection on all signal pins CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supported RS-232 only and RS-422/485 versions available

contactus@accesio.com

smallformfactors.mil-embedded.com/p372691

 linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals


PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

mPCIe-ICM Family PCI Express Mini Cards The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communications. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming. The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly damage to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out. The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

ACCES I/O Products, Inc. www.accesio.com

FEATURES ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port mPCIe RS232 serial communication cards ĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signals

ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RX

ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication speeds up to 1 Mbps simultaneously ĄĄ Custom baud rates easily configured ĄĄ ±15kV ESD protection on all signal pins ĄĄ 9-bit data mode fully supported ĄĄ Supports CTS and RTS handshaking smallformfactors.mil-embedded.com/p372557

contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

Hardware and Peripherals

USB-104-HUB – Rugged, Industrial Grade, 4-Port USB Hub This small industrial/military grade hub features extended temperature operation (-40°C to +85°C), high-retention USB connectors, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104 sized and can easily be installed in new or existing PC/104-based systems as well. The USB-104-HUB now makes it easy to add additional USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Embedded OEM, Laboratory, Kiosk, Transportation/Automotive, and Military/Government. This versatile four-port hub can be bus powered or self powered. You may choose from three power input connectors: DC power input jack, screw terminals, or 3.5" drive power connector (Berg). Mounting provisions include DIN rail, 3.5" front panel drive bay mounting, and various panel mounting plates.

ACCES I/O Products, Inc. www.accesio.com 18 y

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Rugged, industrialized, four-port USB hub High-speed USB 2.0 device, USB 3.0, and 1.1 compatible Extended temperature operation (-40°C to +85°C) Data transfer rates up to 480 Mbps Supports bus-powered and self-powered modes Three power input connectors (power jack, screw terminals, or 3.5" drive Berg power connector) LED status indicators for power and overcurrent fault conditions for each downstream port USB/104 form factor for OEM embedded applications OEM version (board only) features PC/104 module size and mounting Includes micro-fit embedded USB header connectors in parallel with all standard USB connectors Industrial grade USB connectors feature high-retention design Small (4" x 4" x 1"), low profile, steel enclosure 3.5" front panel drive bay mounting provision

contactus@accesio.com

smallformfactors.mil-embedded.com/p369571

 linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


XDG201 The Xtreme/10G Managed Ethernet Switch/Router from Connect Tech targets managed Layer 2 and Layer 3 equipment in SMB, SME, and industrial applications where high port count 1G switching with 10G aggregation/uplinks are required. This Managed 10G Ethernet Switch/Router is designed to act as a module allowing it to be mated to a Connect Tech off-theshelf breakout board or with a custom designed breakout board to meet your exact application requirements. With a total of 36 switchable ports, including 4x 10G, 8x 1G (SGMII), and 25x 1G (Copper 10/100/1000Mbps), the XDG201 gets a lot done in an extremely small form factor of 85mm x 85mm.

FEATURES 36 switchable ports (4x 10G; 8x 1G [SGMI]; 24x 1G) ĄĄ High-density board-to-board connector ĄĄ +4V to 14V input range ĄĄ 85mm x 85mm module ĄĄ -40°C to +85°C ĄĄ

smallformfactors.mil-embedded.com/p374037

Connect Tech Inc.

http://bit.ly/2jBBhF0

sales@connecttech.com

 www.linkedin.com/company/connect-tech-inc

 519-836-1291 @ConnectTechInc

Hardware and Peripherals

Coaxlink Duo PCIe/104

The Coaxlink Duo PCIe/104 from Euresys is a ruggedized CoaXPress frame grabber compliant with the PCIe/104 form factor. It features an extended operating temperature range, optional conformal coating and is able to withstand high levels of shock and vibration. It provides two CoaXPress CXP-6 (6 Gbit/s) camera connections and a PCIe 2.0 (Gen 2) x4 bus. CoaXPress carries high-speed digital video over standard coaxial cables and is suitable for embedded video applications. The Coaxlink Duo PCIe/104 can be customized to fit your requirements.

FEATURES ĄĄ Ruggedized COTS board for industrial and military embedded ĄĄ ĄĄ

ĄĄ ĄĄ ĄĄ ĄĄ

applications Small stackable PCIe/104 form factor Extended temperature range: -40 to +85°C / -40 to +185°F with conduction cooling (ambient temperature measured inside the enclosure) Sustained shock: 20 g/11ms (all axes – half-sine and saw tooth) Optional conformal coating Two CoaXPress CXP-6 connections: 1,250 MB/s camera bandwidth PCIe 2.0 (Gen 2) x4 bus: 1,700 MB/s delivery bandwidth smallformfactors.mil-embedded.com/p373667

Euresys

www.euresys.com www.smallformfactors.com

marcom@euresys.com

 linkedin.com/company/euresys

 +32 4 367 72 88 @Euresys

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals


PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PCAN-PC/104 CAN Interface for PC/104 The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing. The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

smallformfactors.mil-embedded.com/p341735

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-1

FEATURES Multiple PC/104 cards can be operated in parallel (interrupt sharing) ĄĄ 1 or 2 High-speed CAN channels (ISO 11898-2) ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter ĄĄ Optionally available with galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel ĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) ĄĄ

info@peak-system.com

 @PEAK_System

 +49 (0) 6151-8173-20

Hardware and Peripherals

PCAN-PC/104-Plus CAN Interface for PC/104-Plus The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied. The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic. smallformfactors.mil-embedded.com/p345620

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-2 20 y

FEATURES Up to four cards can be used in one system 1 or 2 High-speed CAN channels (ISO 11898-2) ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter ĄĄ Optionally available with galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel ĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) ĄĄ ĄĄ

info@peak-system.com

 @PEAK_System

 +49 (0) 6151-8173-20

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


PCAN-PC/104-Plus Quad The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

FEATURES ĄĄ

Up to four cards can be used in one system

ĄĄ

4 High-speed CAN channels (ISO 11898-2)

ĄĄ

Bit rates from 5 kbit/s up to 1 Mbit/s

ĄĄ ĄĄ ĄĄ ĄĄ

smallformfactors.mil-embedded.com/p367584

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-3

Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) info@peak-system.com

 @PEAK_System

 +49 (0) 6151-8173-20

Hardware and Peripherals

PCAN-PCI/104-Express The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN busses to a PCI/104-Express FEATURES system. Up to four cards can be stacked together. The ĄĄ Up to four cards can be used in one system CAN bus is connected using a 9-pin D-Sub plug on the slot ĄĄ 1, 2, or 4 High-speed CAN channels (ISO 11898-2) brackets supplied. There is galvanic isolation of up to 500 ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s Volts between the computer and CAN sides. The card is ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B available as a single, dual, or four-channel version. (29-bit ID) The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

ĄĄ ĄĄ ĄĄ

smallformfactors.mil-embedded.com/p372678

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-4 www.smallformfactors.com

5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) info@peak-system.com

 @PEAK_System

 +49 (0) 6151-8173-20

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals


PC/104 and Small Form Factors Resource Guide

IoT

Managed Scalable GigE Switch The LAN35MH08HR is an 8-port 10/100/1000 Managed Ethernet switch. This switch module has a total of 10 ports: eight ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expansion port allowing full compatibility with RTD’s managed and unmanaged StackNET™ Ethernet switch family. Additionally, this allows the CPU to use the switch without the need for external cables. The LAN35MH08HR can also be used as an expandable, standalone 8-port Ethernet switch. The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. All of the industry-standard Managed Ethernet Switch features found in an enterprise rackmount switch are provided, such as VLANs, Spanning Tree, QoS, and SNMP. Additionally, the CEServices software provides features for carrier and timing-critical networks such as OAM, Synchronous Ethernet, and IEEE 1588. The switch may be configured via a web GUI interface, or a command-line console via USB, Telnet, or SSH.

FEATURES ĄĄ -40 to +85°C operation, passively cooled ĄĄ PCIe/104 stackable bus structure ĄĄ Eight 1000/100/10 Mbps Ethernet ports plus one host port and one

stacking switch expansion port

ĄĄ Onboard tri-color LED for each Ethernet Port ĄĄ RJ-45 jacks or 10-pin right-angle headers ĄĄ Fully-managed Layer 2 Ethernet Switch with Layer 3-aware packet

processing • Support for all major Enterprise switching features such as VLANs, Spanning Tree, QoS, and SNMP • Manageable via web GUI interface, SSH, Telnet, and Serial Console • Industry-standard CLI interface ĄĄ Onboard PCI Express Ethernet Controller for interface to host cpuModule ĄĄ USB Device Port for Serial Console command-line interface ĄĄ Passive heat sink included • Available in stackable, rugged enclosures smallformfactors.mil-embedded.com/p373422

sales@rtd.com  814-234-8087

RTD Embedded Technologies, Inc.

www.rtd.com/switch

SBCs and Boards

FireBird Quad USB 3.0 Host Controller Active Silicon’s FireBird Quad USB 3.0 Host Controller supports four USB 3.0 ports arranged as two ports per host controller with each controller having its own PCI Express x1 Gen2 interface to give a combined total data throughput of 10 Gbps. This architecture allows two USB 3.0 devices operating simultaneously at full bandwidth, or four devices operating simultaneously sharing the combined bandwidth of two full speed links. The board incorporates a dedicated USB power supply to ensure reliable device operation independent of the main system power supply. This feature allows the USB power output for each port to be set to 5.1V to compensate for the voltage drop on long reach USB3 cables. The USB 3.0 Host Controllers used are the proven Renesas μPD720202. Software support is based on the Renesas driver stack, which provides the high throughput required by USB Vision cameras.

Active Silicon, Ltd.

www.activesilicon.com 22 y

FEATURES 4 x USB 3.0 compliant downstream ports ĄĄ Dual full USB 3.0 bandwidth, each channel split into 2 x USB 3.0 ports ĄĄ Based on proven Renesas™ USB 3.0 Host Controller ĄĄ Dedicated USB power supply allows for long cables ĄĄ Support for USB3 Vision cameras ĄĄ Windows and Linux support ĄĄ

sales@activesilicon.com

smallformfactors.mil-embedded.com/p373349

 www.linkedin.com/company/active-silicon

 +44 (0) 1753 650 600

 @ActiveSilicon

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


ADLE3800SEC Intel® E3800 Series Edge-Connect SBC Measuring just 75mm x 75mm, the ADLE3800SEC is an embedded SBC specially optimized for Size, Weight, and Power (SWAP) applications. Based on the E3800 series Intel Atom™ SoC, this tiny board delivers maximum performance in the smallest possible size. It features a quad-core processor with up to 2MB onboard cache, and an integrated Intel HD Graphics engine with support for DirectX 11, Open GL 4.0, and full HD video playback.

About EdgE-ConnECt ArChitECturE: Via the backside board-edge FEATURES connector, additional I/O are easily accessible using standard and customerspecific breakout boards. Easy expansion helps reduce cabling, integration time and system size while increasing quality and overall MTBF. Easily connect to sensors, cameras and storage with a full range of onboard I/O: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie, and SATA. The Intel HD Graphics engine supports video output in either HDMI or Display Port format. An onboard M.2 socket allows users to install the fastest Solid State storage solutions on the market. Extended Temperature Ratings and hard-mounted Edge-Connect design make the ADLE3800SEC ideal for rugged embedded applications.

AppliCAtions: UUAV, UUV Unmanned Systems, Industrial Control

ĄĄ

Small Size (75mm x 75mm)

ĄĄ

4GB soldered DRAM (DDR3-1333 MHz)

ĄĄ

Low power Atom® processor (8W TDP)

ĄĄ

Quad-Core/Dual Core Versions Available

ĄĄ

M.2 Storage Socket Onboard

ĄĄ

Expansion Connector

ĄĄ

Extended Temperature Available

Systems, Government and Defense, Video Surveillance, Small Scale Robotics, Remote Datalogging, Man-Wearable Computing.

smallformfactors.mil-embedded.com/p374010

ADL Embedded Solutions Inc.

sales@adl-usa.com

 855-727-4200

 www.linkedin.com/company/adl-embedded-solutions

www.adl-usa.com

SBCs and Boards

XStream-SD4 – Low Latency Standalone H.264 Video Streamer The XStream-SD4 is an intelligent, stand-alone, ultra low latency H.264 Streaming solution that accepts 4x NTSC/PAL/RS-170 composite video sources and records and streams them over 100/1000MBit Ethernet. This SWaP optimized solution is ideal for rapid deployment in demanding applications in Military, Communications, Transportation, Mining and Energy industries. The XStream-SD4 features a dedicated hardware compression engine capable of encoding all 4 video channels at full size and full frame-rate with Ultra Low Latency (under 40ms). The flexible streaming engine can stream each channel direct from the on-board Ethernet port as well as save direct to locally attached storage for later retrieval. The XStream-SD4 also supports 4 channels of audio that can be captured and streamed with the video data.

FEATURES

The XStream-SD4 is an intelligent stand-alone device with its own onboard CPU and does not require a host CPU or any driver or OS software. For mechanical convenience the module can be mounted on a PC/104 stack without consuming host CPU resources.

Advanced Micro Peripherals

www.amp-usa.com/stand-alone/h264/xstream-sd4.php www.smallformfactors.com

ĄĄ

Ultra Low Latency w/video latency below 40ms

ĄĄ

4x PAL/NTSC/RS-170 video inputs

ĄĄ

4 channels of audio encoding

ĄĄ

Intelligent stand-alone device – no CPU or drivers

ĄĄ

Extended Temperature available -40°C to +85°C

ĄĄ

SWaP Optimized smallformfactors.mil-embedded.com/p373749

sales@amp-usa.com  212-951-7205  @adv_micro_Perip  www.linkedin.com/company/advanced-micro-peripherals 

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 and Small Form Factors Resource Guide

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PC/104 and Small Form Factors Resource Guide

SBCs and Boards

NTX7642 – Extended Temp. Atom™ based Processor The Orion NTX7642 single board computer (SBC) is a rugged, compact, high-performance, low power, multi-core COM Express mini module ideally suited for a variety of applications. The NTX7642 features the powerful Intel® E3800 series processor along with up to 4GB DDR3 memory, on-board NAND Flash, and Gigabit Ethernet to provide streamlined high-performance, low power processing in a small form factor (55mm x 84mm). With an unparalleled complement of I/O including Gigabit Ethernet, two SATA ports, two USB 3.0 ports, USB OTG port, four USB 2.0 ports, two serial ports, audio and graphics in a small form factor, this SBC can be adapted to a variety of Military, Industrial, or Commercial applications where low power and high performance are required. The NTX7642 and Orion’s optional mini form factor type 10 and VPX carrier cards are available in multiple levels of ruggedization, from commercial temperature air cooled to extended temperature. Multiple Board Support Packages (BSPs) are available including Linux, Wind River VxWorks & Windows.

Orion Technologies

www.oriontechnologies.com

FEATURES ĄĄ

Intel® Atom™ E3800 Series (Bay Trail) Processor

ĄĄ

Configurations from single core (3W) to quad core (10W) TDP

ĄĄ

Ruggedized ultra-small form factor (55mm x 84mm)

ĄĄ

Type 1 and Type 10 Com Express signaling

ĄĄ

Up to 4GB DDR3 SDRAM

ĄĄ

2x SATA ports, 2x Serial ports, 4x USB 2.0, 2x USB 3.0

ĄĄ

HDMI/DP Video Connection smallformfactors.mil-embedded.com/p374023

sales@oriontechnologies.com

 407-476-2120

 www.linkedin.com/company/orion-technologies-llc

 @OrionEmbedded SBCs and Boards

PCI7620 – PCIe/104 4th Gen. Intel® Core™ i7 SBC The Orion PCI7620 single board computer (SBC) is a rugged, compact, high-performance, low power, multi-core PCIe/104 module ideally suited for a variety of applications. The PCI7620 features the powerful Intel® Fourth Generation Dual Core™ i7 along with up to 8GB of DDR3 memory and an unparalleled complement of I/O, including Gigabit Ethernet ports, two serial ports, two USB 3.0 ports and six USB 2.0 ports. This SBC can be adapted to a variety of Military, Industrial, or Commercial applications where low power and high performance are required. The PCI7620 is available in multiple levels of ruggedization, from commercial temperature air cooled to extended temperature. Multiple Board Support Packages (BSPs) are available including Linux, Wind River VxWorks & Windows.

Orion Technologies

www.oriontechnologies.com 24 y

FEATURES Intel® 4th Gen. Core™ i7 dual core processor ĄĄ Stack down type 2 PCIe/104 connector ĄĄ Up to 4GB DDR3L-1600 memory on-board ĄĄ Up to 64GB SATA NAND Flash on-board ĄĄ Four 10/100/1000 Ethernet (Base-T) ĄĄ 2x SATA 6Gb/s ports, 2x RS-232/RS-422 Serial ports, 6x USB 2.0, 2x USB 3.0 ĄĄ Three independent video display ports ĄĄ

sales@oriontechnologies.com

smallformfactors.mil-embedded.com/p374024

 407-476-2120

 www.linkedin.com/company/orion-technologies-llc

 @OrionEmbedded

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


Intel Atom E3800-based SBC

The CMX34BT is an advanced PC/104 single board computer and controller with a PCIe/104 stackable bus structure. This Intel Atom E3800-based CPU is exceptionally suited for intelligent systems requiring low power consumption in harsh thermal conditions. The CMX34BTseries CPUs are available in quad-core, dual-core, and single -core configurations. Surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. All models include 4GB surface-mount single-channel ECC DDR3 SDRAM and a 32GB industrial-grade surface-mount SATA flash drive. smallformfactors.mil-embedded.com/p373421

FEATURES ĄĄ PCIe/104 stackable bus structure ĄĄ Available in modular, rugged enclosures and eBuild systems ĄĄ Intel Atom E3800 Series Processor

ĄĄ ĄĄ ĄĄ

ĄĄ ĄĄ

• Clock Speed: 1.33 GHz, 1.46 GHz, and 1.91 GHz options • Max. Core Temperature: 110°C 4GB Single-Channel DDR3 SDRAM (Surface-Mounted) • Robust Error Code Correction (ECC) 32GB Surface-mounted industrial-grade SATA flash drive 4 PCIe x1 Links, One SATA Port, 4 Serial Ports, 9 USB ports, Dual Gigabit Ethernet, Analog VGA, Embedded DisplayPort (eDP) 1.3 with Audio, on-board advanced Digital I/O -40 to +85°C standard operating temperature Thermal-optimized passive heat sink included

sales@rtd.com  814-234-8087

RTD Embedded Technologies, Inc.

www.rtd.com/atom

SBCs and Boards

PC/104 OneBank I/O Board with Artix-7 FPGA

EMC2-7A100

FEATURES

The EMC2-7A100 can use commercial, industrial or automotive graded Artix-7 FPGAs and is complimented with 1Gbyte of DDR3 local storage, 32Mbytes of Flash memory for storage/configurations and has 68x free differential I/O pins which are routed to a VITA57.1 FMC-LPC high-speed connector for bespoke interfaces.

ĄĄ PCIe/104 OneBank FPGA I/O Board

The four-lane Multi Gigabit serial Transceivers (MGT) are coupled to a PCI switch for infinite scalability, the FMC-LPC and a SATA connector on the PC/104 stack to connect to local storage or for direct high-speed connection to stacked EMC2 boards.

Sundance Multiprocessor Technology Ltd. www.sundance.com www.smallformfactors.com

ĄĄ XC7A100, Speed Grade -2 FPGA on a SoM Module ĄĄ 1Gbyte DDR3 and 32Mbytes of Flash Memory ĄĄ PCI Express Gen 2 compatible and integrate PCI Express ĄĄ Infinite number of EMC²-7A100’s can be stacked ĄĄ Expandable with any VITA57.1 FMC-LPC I/O Module ĄĄ 96mm x 90 mm PC/104 Form-Factor with Cable-less

Break-Out PCB Connector

smallformfactors.mil-embedded.com/p373991

Sales@Sundance.com

 @SundanceDotCom

 +44 (0) 1494 793 167

PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 and Small Form Factors Resource Guide

SBCs and Boards


PC/104 and Small Form Factors Resource Guide

SBCs and Boards

Viper (VL-EBX-38) EBX “Bay Trail” Embedded Computer SBC The Viper is a low power/high-performance single board computer (SBC) which combines Intel’s advanced Bay Trail processor, with a traditional PC/104-Plus™ expansion interface. This combination makes it easy to upgrade existing systems to a powerful 4th generation Atom processor, while preserving plug-in expansion to existing specialty I/O boards. In addition, it also contains a full complement of on-board I/O interfaces, including USB 3.0, mini PCIe expansion sockets, TPM chip, A/D, D/A, and 32-bits of digital I/O. Driven by a low power E3800 (Bay Trail) processor, with clock rates up to 1.9 GHz, the Viper features quad-, dual-, and single-core processor options. Viper is built on the industry-standard EBX form factor. It includes legacy ISA and PCI connectors to interface directly with PC/104-Plus expansion boards. As with all VersaLogic products, the Viper is designed to support OEM applications where high reliability and long-term availability are required. Viper is backed by a 5-year warranty, 5-year minimum off-the-shelf availability guarantee, and expert US-based technical support. From application design-in support, to its 10+ year extended life programs, the Viper provides a durable embedded computer solution with an excellent cost of ownership.

VersaLogic Corporation

www.versalogic.com/products/DS.asp?ProductID=281

FEATURES -40° to +85°C Operating Temperature TPM (Trusted Platform Module) security chip ĄĄ EBX™ form factor – PC/104-Plus expansion ĄĄ 4th Generation Intel® Atom™ processor (“Bay Trail”) – Quad-, dual-, and single-core models ĄĄ Up to 16 GB RAM (ECC memory to 8 GB) ĄĄ Dual Gigabit Ethernet ĄĄ On board power conditioning – 9 to 15 volt input ĄĄ ĄĄ

smallformfactors.mil-embedded.com/p374034

sales@VersaLogic.com linkedin.com/company/versalogic-corporation

 503-747-2261

 @versalogic

SBCs and Boards

Lion (VL-EPMe-42) PC/104 with Kaby Lake! The Lion is a high-performance single board computer (SBC) which combines Intel’s 7th generation Core “Kaby Lake” processor, with a newer PCIe/104 OneBank expansion interface. Compatible with the PCIe/104-Express format, it includes a legacy PCI connector, and a high-speed PCIe connector. This provides flexible system expansion, while leaving more on-board space available for product features. The single bank connector is mechanically and electrically compatible with PCI/104-Express Type 1 and Type 2 modules. In addition, the Lion also contains a full complement of on-board I/O interfaces, including USB 3.0, USB 2.0, mini PCIe expansion socket, TPM chip, multiple serial interfaces, and 8-bits of digital I/O. The Lion is available with an embedded i7-7600U, i5-7300U, or i3-7100U type Kaby Lake processor, providing standard clock rates up to 2.8 GHz and Turbo Boost rates to 3.9 GHz. The Kaby Lake processors feature dual-core CPUs and Hyper-Threading logic allowing up to 4 simultaneous threads to be executed. As with all VersaLogic products, the Lion is designed to support OEM applications where high reliability and long-term availability are required. Lion is backed by a five-year warranty, 5+ year off-the-shelf availability guarantee, and expert US-based technical support.

VersaLogic Corporation

www.versalogic.com/products/DS.asp?ProductID=282 26 y

FEATURES 7th Generation Intel® Core™ processor (“Kaby Lake”) Dual-core ĄĄ PCIe/104 OneBank™ form factor ĄĄ TPM (Trusted Platform Module) security chip ĄĄ Intel Active Management Technology ĄĄ -40° to +85°C Operating Temperature ĄĄ Up to 16 GB RAM ĄĄ I/O: Dual Gigabit Ethernet, USB 3.0, Mini PCIe socket ĄĄ

smallformfactors.mil-embedded.com/p374027

sales@VersaLogic.com linkedin.com/company/versalogic-corporation

 503-747-2261

 @versalogic

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


Blackbird (VL-EPU-4562) Compact Sky Lake Embedded Computer The Blackbird is a compact, rugged x86 type board-level embedded computer. It has been engineered and tested to meet the military and medical industries’ evolving requirements to develop smaller, lighter, and lower power embedded systems while adhering to stringent regulatory standards. The Blackbird is a member of the VersaLogic family of ultrarugged embedded x86 computers. This embedded computer, equipped with a 6th Generation Intel Core “Skylake” processor, is designed to withstand extreme temperature, impact, and vibration. The Sky Lake processors feature quad- and dual-core CPUs along with HyperThreading logic allowing up to 8 simultaneous threads to be executed. The Blackbird provides great performance and I/O features, moderate power consumption (15 to 26 W typical depending on model), and a compact package. The Blackbird provides compatibility with a broad range of standard x86 application development tools for reduced development time. The on-board Power Management Unit greatly simplifies system power supply requirements. It features a wide input voltage range of 8 to 30 volts so it is fully compatible with 12 or 24V vehicle applications. It also includes reverse voltage protection, over voltage protection, RF noise filtering, and transient voltage protection, to provide enhanced durability and reliability in the field.

VersaLogic Corporation

www.versalogic.com/products/DS.asp?ProductID=285

FEATURES ĄĄ -40° to +85°C operating temperature models ĄĄ Trusted Platform Module (TPM) security chip ĄĄ 6th Generation Intel® Core™ “Skylake” processor ĄĄ On-board Power Management - 8 to 30 volt DC input (12 and

24 volt system compatible) ĄĄ Compact size (95 x 125 x 37 mm) supporting up to 32 GB DDR4 RAM ĄĄ Dual USB 3.0 port, Dual mini DisplayPort and LVDS video outputs ĄĄ Dual Gigabit Ethernet and three Mini PCIe Sockets smallformfactors.mil-embedded.com/p374028

sales@VersaLogic.com linkedin.com/company/versalogic-corporation

 503-747-2261

 @versalogic

SBCs and Boards

EPIC Industrial Intel® E3800 Single Board Computer

WinSystems’ EPX-C414 is an EPIC form factor single board computer (SBC) with PC/104-Plus expansion featuring the Intel® Atom™ E3800 SOC processor. Its FEATURES small size, rugged design and extended operational ĄĄ Intel® Bay Trail E3845/E3825 Processor temperature make it a great fit for industrial IoT appli- ĄĄ -40°C to +85°C Operational Temperature cations and embedded systems in the industrial control, ĄĄ 8 USB 2.0 and 4 Serial (RS-232/422/485) Ports ĄĄ Two 10/100/1000 Mbps Ethernet Ports transportation, Mil/COTS, and energy markets. ĄĄ

48 Bidirectional GPIO

ĄĄ

2 MiniPCIe Sockets, PC/104-Plus Expansion

ĄĄ

MSATA and CFast Sockets for onboard SSD smallformfactors.mil-embedded.com/p373989

WinSystems

www.winsystems.com www.smallformfactors.com

info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc PC/104 and Small Form Factors Resource Guide  Spring 2017

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PC/104 and Small Form Factors Resource Guide

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PC/104 OneBank Intel® E3900 SBC with Dual Ethernet

WinSystems’ PX1-C415 single board computer (SBC) is a PC/104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel® Apollo FEATURES Lake-I SOC processor. Its small size, rugged design and ĄĄ Intel Apollo Lake-I E3900 Processor (Dual or Quad core) extended operational temperature make it a great fit for ĄĄ Up to 8 GB DDR3-LV System RAM industrial IoT applications and embedded systems in the ĄĄ -40°C to +85°C Operating Temperature Range industrial control, transportation, Mil/COTS, and energy ĄĄ PC/104 Small Form Factor with PCIe/104™ OneBank™ ĄĄ USB Type C 3.0 and 8x USB 2.0 markets. ĄĄ

24 GPIO with event sense

ĄĄ

Four Serial Ports smallformfactors.mil-embedded.com/p373987

WinSystems

www.winsystems.com

info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc Systems

ADLEPC-1500 Mini Embedded PC Based on the ADLE3800SEC E3800-series Edge-Connect SBC, this compact embedded PC delivers maximum performance in a very small 3.4″ x 3.2″ footprint. It features an Intel E3800-series Atom processor with onboard 4GB DDR3 RAM and integrated Intel HD Graphics engine with support for DirectX 11, Open GL 4.0 and full HD video playback. The ADLEPC-1500 comes packaged in an industrial-grade chassis with mounting options for a variety of environments. Via its SBC edge-connect architecture, it can easily be extended to larger custom systems with added I/O and functionality. This makes possible a fixed processor/software combination across similar products with varying I/O needs.

FEATURES ĄĄ

HWD Dimensions: 1.3" x 3.4" x 3.2" (33mm x 86mm x 81mm)

ĄĄ

Intel Atom E3800-3845 Quad, Intel Atom E3800-3827 Dual

ĄĄ

4GB DDR3 1333MHz (soldered onboard)

ĄĄ

Display Port (2560x1600): BIOS option for HDMI (1920x1200) using DisplayPort cable

ĄĄ

1x M.2 Socket Key, B, 2242

Systems, Robotics, Datalogging, Wearable Computing, Traffic engineering, License plate recognition (LPR), Digital signage, Kiosk and ATM applications, IoT Gateways, Industrial camera systems for toll roads, border security and other applications.

ĄĄ

2x100/1000 LAN, 1x USB2.0, 1x USB3.0, 1x Display Port

ĄĄ

Voltage Input = 20-30 VDC; 24V Nominal; Optional 7-36V

ADL Embedded Solutions Inc.

ApplicAtions: UAV and UUV Unmanned Systems, Industrial Control

www.adl-usa.com 28 y

smallformfactors.mil-embedded.com/p374009

sales@adl-usa.com

 855-727-4200

 www.linkedin.com/company/adl-embedded-solutions

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


DTS1: 1-slot Rugged Network Attached File Server The industry’s first COTS data-at-rest Network Attached File Server that supports Commercial Solutions for Classified (CSfC) 2-Layer Encryption, with 2TB of storage. The Data Transport System 1-Slot (DTS1) addresses today’s rapidly increasing demand for high-capacity secure storage on deployed unmanned vehicles and ISR platforms. The single slot Network Attached Storage (NAS) device weighs only 4.0 lb. and measures only 1.5 x 5.0 x 6.5" (38.1 x 127 x 165.1 mm). It provides up to 2 TB of storage and supports advanced encryption to protect critical data-at-rest. Because the DTS1 functions as a NAS file server it helps system designers reduce SWaP by eliminating the need for independent storage in each of the platform’s computer, display, or management devices. It enables any network-enabled device to communicate with any other similar device, to retrieve stored data or save new captured data. The DTS1 is ideal for rugged applications that require the storage, removal, and transport of critical data such as cockpit data, ISR, mobile applications, heavy industrial , and video/audio data collection.

Curtiss-Wright Defense Solutions www.curtisswrightds.com

FEATURES ĄĄ

2-Layer encryption

ĄĄ

Network Attached Storage

ĄĄ

iSCSI Block Storage

ĄĄ

Ethernet recording and packet capture

ĄĄ

PXE boot of network clients

ĄĄ

SWaP optimized smallformfactors.mil-embedded.com/p373640

ds@curtisswright.com  703-779-7800  @curtisswrightds  www.linkedin.com/company/curtiss-wright-defense-solutions 

Systems

Small Form Factor Embedded Computing Solutions DFI Tech provides a wide range of Small Form Factor (SFF) embedded computers for Industrial, Medical, Mil/Aero, Energy, Infotainment/Gaming, Transportation, and other applications. Our rugged, fanless computers feature various configurations of Intel® Atom™ and ARM™ Processors. For advanced requirements, the air-cooled compact computers feature Intel Core i3/i5/i7 with PCIe expansion, graphics/ video, networking, optical and HDD drive options, and a wealth of I/O options.

Call DFI Tech to discuss your application today!

800-909-4334

FEATURES ĄĄ

Standard and modified-standard SFF computing designs

ĄĄ

Wide selection of Atom, ARM, and Core i processor options

ĄĄ

Fanless, conduction-cooled configurations available

ĄĄ

Ruggedized versions for shock/vibration

ĄĄ

Wide range of expansion, I/O, and drive options

ĄĄ

Multiple temperature ranges available smallformfactors.mil-embedded.com/p374026

DFI Tech • Sacramento, CA www.dfitech.com

www.smallformfactors.com

sales.inquiry@dfitech.com

 @dfitech

 800-909-4334

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High Speed Image Frame Grabber Elma’s OptiSys-5101 is a PCIe/104 based high performance embedded vision system featuring a high definition image frame grabber ideal for a wide array of applications across multiple industries. The system has four Camera Link ports configurable as four base ports, two full ports or two base ports and one full port. Powered by an Intel Quad Corei7 processor, the small light weight system includes high capacity removable storage to maximize image data collection and streamline offload operations. A miniPCIe site allows additional application I/O customization. Packaged in a sturdy and attractive chassis, the OptiSys-5101 is US designed and manufactured and shipped fully tested and integrated including ready to run image analysis software. Inquire about a range of CPU, storage capacity and additional I/O options.

Elma Electronic

FEATURES ĄĄ Four speed configurable Camera Link ports ĄĄ Multi-terabyte front removable storage bay with a SATA III

interface

ĄĄ miniPCIe expansion site for I/O add ons ĄĄ Ready to run image analysis software package options ĄĄ Supports up to 2 Medium, Full, or 10-tap Camera Link Cameras ĄĄ Haswell class CPU for high performance capture rate ĄĄ Stores thousands of HD images smallformfactors.mil-embedded.com/p373986

www.elma.com

sales@elma.com

 216-760-9909

Systems

PC/104 Rugged Computer Orion Technologies’ rugged Small Form Factor Computer (SFFC) is designed around the PC/104 architecture and features either the efficient Intel Atom processor or a high-performance Intel i7. It offers multiple expansion options including Synchro/ Resolver, Multi-port Serial, Analog, Digital, MIL-STD-1553, and Multi-port Ethernet. The SFFC is designed to meet MIL-STD-810 shock and vibration standards, 461 EMI standards, and is conduction cooled to withstand high temperature rugged environments.

FEATURES Rugged PC/104 solution ĄĄ Bay Trail Atom™ processor or Intel® Core™ i7 dual core processor ĄĄ Up to Four 10/100/1000 Ethernet ports ĄĄ Multiple OS support ĄĄ Expandable I/O (Serial, Synchro/Resolver, AD/DA, Layer 2/3 Ethernet Switch, etc.) ĄĄ Environmentally Qualified per MIL-STD-810 ĄĄ Custom Solutions Available ĄĄ

smallformfactors.mil-embedded.com/p374025

Orion Technologies

www.oriontechnologies.com 30 y

sales@oriontechnologies.com

 407-476-2120

 www.linkedin.com/company/orion-technologies-llc

 @OrionEmbedded

Spring 2017  PC/104 and Small Form Factors Resource Guide www.smallformfactors.com


RTD Off-the-Shelf Mission Computer RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid uptime for mission-critical applications. The system includes a rugged single board computer, power supply, mSATA card carrier, and room for an additional peripheral module. Without increasing the enclosure size, functional upgrades can include high-performance data acquisition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking delivers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a watertight solution with excellent environmental isolation. Keyed cylindrical connectors offer easy cable connections while maintaining the integrity of the environmental seal.

FEATURES ĄĄ -40 to +85°C standard operating temperature ĄĄ Designed for high ingress protection in harsh environments ĄĄ Milled aluminum enclosure with integrated heat sinks and

heat fins

ĄĄ Rugged Intel and AMD-based Single Board Computers ĄĄ High-performance, synchronized power supply ĄĄ mSATA card carrier and optional 2.5" removable drive ĄĄ Designed to include an additional PCIe/104, PCI/104-Express

or PCI-104 peripheral module without increasing overall enclosure size

smallformfactors.mil-embedded.com/p373424

sales@rtd.com  814-234-8087

RTD Embedded Technologies, Inc.

www.rtd.com/systems

Systems

Nanopak i7 The Themis Nanopak i7 computer packs an Intel Core i7 processor, 1TB FLASH storage, Gigabit ethernet, and multiple I/O interfaces in a small, light-weight form factor. Powered by a 9-30V battery, the Nanopak i7 is designed for man-wearable, unmanned vehicle, shipboard, and mission-critical field applications where size, weight, power and cooling (SWAP-C) are critical. The Nanopak i7 supports real time control, data recorders, small storage/communication systems, and mobile robotics, making it an ideal solution for military computing on the go.

FEATURES ĄĄ

Intel Core i7

ĄĄ

Linux, Microsoft Windows

ĄĄ

Local or Network PXE boot

ĄĄ

8GB System Memory, FLASH storage

ĄĄ

USB, Serial, VGA

ĄĄ

Rugged aluminum chassis

ĄĄ

MIL-STD-810G smallformfactors.mil-embedded.com/p372129

Themis Computer www.themis.com

www.smallformfactors.com

shaza.khan@themis.com

 www.linkedin.com/company/themis-computer

 510-252-0870 @Themis_Computer

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NEW IDEAS

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PC/104 and Small Form Factors with Resource Guide Spring 2017  

2017 Resource Guide, evolution of SMARC, revolution in fish counting, and more in the Resource Guide edition of PC104/ Small Form Factors.