Circuit Board Protection AND Underfills Henkel´s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, providing electrical insulation, and increasing vibration and shock resistance.
Conformal Coatings description
type
pot life
viscosity cps
cure cycle
secondary cure
delectric strenght (v/mil/kV/cm)
PC 18
- A one component solvent based Acrylic conformal coating specifically designed as a toluene free alternative. - Application by non-atomized selective spray coating equipment. - Components and joints may be repaired by heating the coating with a soldering iron for easy removal.
Urethane
60 min. tack free
350
Heat 2 hrs. at 125 °C
5-7 days at RT
1200/472
continuous up to 110 ºC
PC 28
- Solvent-based, oxygen curing, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray procedures
Urethane
60 min. tack free
35
Heat 5-7 days at 25 °C
Air Dry 30-60 min. followed by 2-4 hrs. at 60 °C
1500/591
continuous up to 110 ºC
PC 62
- Solvent-based, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray to meet MIL-I-46058C, Type PUR, requirements
Acrylic conformal
5 min. tack free
40-60
24 hours at 25°C
45 minutes at 75°C
N/A
–40 -125°C
5293
- UV Silicone for severe temperature cycling environments. - High reliability automotive - No solvents - Low VOC
Silicone
N/A
600
UV 20-40 sec. 75mW/cm2
Moisture Tack free:2-6 hrs. Full cure: 72 hrs
406/160
-40 -204 °C
product
temp. range
Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing required for lead free assembly. Our green materials are developed to meet demanding end use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion. Loctite CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life.
Semiconductor Liquid Encapsulants CSP and DCA Underfill Encapsulants product
18
description/Application
viscosity at 25°C
pot life
cure schedule
tg. °C
cte(1) (ppm/°C)
capillary flow
storage temp.
3513
Reworkable CSP
4,000 cps
2 days
30 min at 100 °C
69
70
N/A
2 °C - 8 °C
3593
Snap Cure Rapid Flow CSP
4,500 cps
7 days
5 min at 150 °C
110
50
100 sek.
2 °C - 8 °C
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl