Materiaalit

Process materials & production accessories

Table of Contents

Material

Page

Solder Paste

6

Solder Wire

7

Fluxes

8

Surface Mount Adhesives

9

Conductive Adhesives

10

Thermal Management Materials

11

Thermal Management Adhesives

12

Silicones

13-15

Die Attach Adhesives

16

Encapsulants

17

Circuit Board Protection

18

Cleaners and other Products

19

Soldering Stations

Page

Soldering Stations

22-28

Cleaning of Tips

29

Tools and Stands

30-31

Soldering Cartridges

32

Work Environment

Page

Filter System

34-35

Working Table

36

Fume Cupboards

37

Chemical Cabinets

37

Inspection & Other Equipment Inspection & Other Equipment

Our Business Areas Our Business Areas

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Page 38

Page 39

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3

4

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Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

MATERIAL

Solder Paste The Multicore® line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes. Whether your process requires long abandon times, wide process windows, or high-speed printing, Henkel offers a paste that suits your requirements.

Leaded Solder Paste PRODUCT

description/APPLICATION

% METAL LOAD

ALLOY

MP218

- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues - Extended open time and tack-life - Suitable for fine pich, high speed printing

WS200

- High performance water washable solder paste.

- Residues are readily removed with DI water, without the need for a saponifier - Good open time with excellent print definition and soldering activity

SN62/SN63 63S4

TACK (g./mm ²)

print speed mm/sec.

ipc/j-std classification

1.1

25-200

ROL0

(Anti-Tombstoning)

89.5 90.5 (Proflow)

SN62/SN63

90.5

0.8

25-100

OHR1

POWDER TYPE

%METAL LOAD

Lead Free Solder Paste Product

description/APPLICATION

ALLOY

LF318

- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues - Extended open time and tack-life

96SC

LF700

- No-clean - Low voiding - Excellent humidity resistance - Long abandon time - High printing speed

96SC 97SC

(38-20 µm)

WS300

- Lead-free water washable solder paste

96SC 97SC

(45-20 µm)

AGS (45-20 µm)

TACK (G./MM²)

PRINT SPEED MM/SEC.

ipc/j-std classification

88.5

2.0

25-150

ROL0

1.8 2.4

1.8 2.4

20-150

ROL0

0.9

0.9

25-100

OHR1

DAP

AGS

Solder Paste

No Clean Lead free

No Clean Tin Lead

Water Wash Lead Free

Water Wash Tin Lead

LF318™

MP218™

WS300™

WS200™

LF700™ Tin Lead

6

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Lead Free

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Solder Wire The line of cored wires features the renowned multiple flux cores technology to ensure even and consistent distribution of flux throughout the solder wire. This reliability makes Multicore solder wires the first choice for wire soldering processes.

product

halide content

description

ipc class

alloy options (SN/PB)

alloy options (PB-free)

content (BYweight)

CRYSTAL 400

Halide free, no-clean, clear residue, in­creased flux content for improved wetting

ZERO

ROL0

60/40, SN62

96SC, 99C, 97SC

2.2%

CRYSTAL 502

No-clean, clear residue, minimal activation for increased wetting speed

0.2%

ROM1

60/40, SN62

96SC, 99C, 97SC

3%

CRYSTAL 511

No clean, clear residues, heat stable

1.1%

ROM1

60/40

96SC, 97SC

2.7%

General purpose high activity for fast wetting

0.5%

ROL1

60/40, SN62

96SC, 99C, 97SC

3%

3%

ORH1

60/40, SN62

96SC, 99C, 97SC

2%

362 HYDRO-X

High activity water washable

Bolded text is normal warehouse products.

96SC = Sn 95,5, AG 3,8%, Cu 0,7% melting point 217 °C 99C = Sn 99,3%, Cu 0,7% melting point 227 °C 97SC = Sn 96,5% Ag 3,0%, Cu 0,5% melting point 217-218 °C

Cored Wire

Water Wash

No Clean

Hydro-X™

C400™ C502™ C511™ 362™

Use fume absorbers when soldering. More info on page 33-35

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7

Fluxes The range of VOC-free (Volatile Organic Compound) fluxes offer reliable, high yield, no clean wave soldering whilst providing significant environmental and safety benefits due to the non flammable VOC-free (water based) flux carrier systems.

Alcohol Based Fluxes product

description/application

% solids

% Halids

acid value

ipc class

application

X32-10

- Clear residue - Wide process window - A general purpose halide-free low solids flux - Suitable for foam and spray flux application systems

2.2

ZERO

15.3

REM0

SPRAY/FOAM

MF 388

- Low residue - Halide free - Ideal for Pb-free wave soldering

3.5

ZERO

20

ROL0

SPRAY

5372

- High temperature - Dipping flux - Suitable for all Multicore alloys

75

0.12

38

-

DIPPING

VOC-Free Fluxes product

MF300

description/application

% solids

- General purpose VOC-free (water based) - No-clean, halide-free and resin-free flux - Compatible with Pb-free processes

% Halids

4.6

acid value

ZERO

ipc class

37

ORM0

application

SPRAY/FOAM

Water Washable Fluxes product

HYDROX/20

description/application

% solids

- IPA based - A high activity water washable flux - Unique activator package - Residues are readily and completely removed by water wash after soldering - Suitable for lead-free wave soldering

20

% Halids

acid value

IPC CLASS

24

ORH1

1.0

application

SPRAY/FOAM

Cleaners page 19

Liquid Fluxes

No Clean

Voc Free

Water Wash

5372

MF300™

Hydro-X20™ SC01™

Rework Small Areas

MF388™ ROML

X32-10i™ REMO

Syntehetic Resin

8

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Surface Mount Adhesives Henkel is the world leader in developing cutting edge technology for high-speed syringe dispense and stencil print Chipbonders®. Innovative new surface mount adhesives are developed to meet the challenges of high speed assembly processes and high reliability end user requirements.

Syringe Dispense Adhesive product

description/application

color***

cure

storage (protect from heat)

process methid

shelf life**

3609

- For high-speed dispensing - Red for best vision pickup on light surfaces

RED

90 sec. at 150 °C or 3-4 min at 125 °C

High Speed Dispensing 40,000+ DPH capable.

5 °C ± 3 °C

6 months DOM

3621

- Superior humidity resistance and electrical properties - Can be used in lead free solder applications - Room temperature storage capable

RED

90 sec. at 150 °C or 3-4 min at 125 °C

Very High Speed Dispensing 47,000 DPH capable.

Jettable.

5 °C ± 3 °C or 8 °C -21 °C for 30 days

10 months DOM

3627

- Specially formulated for excellent high-speed dispensing - Room temperature storage capable

RED

90 sec. at 150 °C 3-4 min at 125 °C

High Speed Dispensing

5 °C ± 3 °C

6 months DOM

3629

- High reliability - Low temperature cure - Lead-Free capable - Flourescence under UV light

RED PINK

60 sec. at 150 °C 110 sec. at 120 °C 3 min. at 110 °C

Dispensing Printing

5 °C ± 3 °C

6 months DOM

Stencil Print/Pin Transfer Adhesives product

description/application

color***

cure

storage (protect from heat)

process methid

shelf life**

3616

- Specifically formulated for metal stencil print applications - Especially well-suited for large components

RED

60 sec. at 150 °C or 2-8 min at 125 °C

Stencil Print (0.5-2"/sec.)

5 °C ± 3 °C

9 months DOM

3627

- Excellent high-speed printing for finepitch components - Room temperature storage capable

RED

90 sec. at 150 °C 3-4 min at 125 °C

Dispense and Stencil Print

5 °C ± 3 °C

6 months DOM

3629

- High reliability - Low temperature cure - Lead-Free capable - Flourescence under UV light

RED PINK

60 sec. at 150 °C 110 sec. at 120 °C 3 min. at 110 °C

Dispensing Printing

5 °C ± 3 °C

6 months DOM

Clean Up Solvent product

7360

description/application

solvent type

- Nozzle and dispense machine component cleaner - Excellent for removal of uncured adhesive from the board without causing the adhesive to gel

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flashpoint

Aliphatic Ester Blend

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100 °C

corrosive properties

None

ozone depletion potential

None

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9

Conductive Adhesives Loctite® Electrically Conductive Adhesives provide both a mechanical bond and an electrical interconnection between a device and a circuit board. Loctite® electrically conductive adhesives meet the industry’s need for lead-free alternatives to solder.

Electrically Conductive Epoxy Adhesives Product

3880

3888

description/application

shelf life*

lapshear adhesion (AL/AL)

cure schedules

tg °C

cte ppm/ °C

volume resistivity (ohm-cm)

work life at room temp.

Heat Cure 1-component

- Syringe or stencil dispense - Silver conductive adhesive for solder replacement - Long work life

6 months at 0-(-10 °C)

>1,000 psi 6.9 N/mm²

10 min at 125 °C 6 min at 150 °C 3 min at 175 °C

40

45

<.0.0005

7 days

Room temperature 2-component

Room-temperature cure adhesive for applications requiring a com­bination of good mechanical and electrical properties

6 months at 21-25 °C

>1,000 psi 6.9 N/mm²

24 hrs at 23 °C 1 hr at 120 °C 30 min at 155 °C

50

>50

<.0.0001

90 min.

description/ cure

*Shelf life- 2-component materials have a one year shelf life at room temperature (21 °C-25 °C)

2-Component Packages

1-Component Packages

Typically used for sample evaluation and rework applications.

These packages do not require special storage equipment.

They can be stored up to 12 months at room temperature.

All 1-component products are packaged in convenient syringes.

These packages must be stored FROZEN at -40 °C. (The exception is product 3880 which is stored at 0 °C.)

Electrically Conductive Adhesives

Chipbonder ™

Screen Print/ Pin Transfers

Dispense Adhesives

3616™

3609™

3627™

3621™

3629™

3627™

Cleaner

7360™

Isotropical Conductive 3880™

Adhesive Clean-Up Solvent 7360™

3888™

3629™

10

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Thermal Management Materials The PCTIMs are silicone-free and do not migrate or dry out like thermal greases. These innovative products are manufactured as a highly thixo-tropic phase change compound coated in a strictly controlled manner upon the surfaces of special grades of thin AL or CU foils, or to dielectric substrate films.

Phase Change Thermal Interface Material thermal impedance (°C-in. ²/W) at 80 PSI

thermal impedance (°C-in. ²/W) at 550 kpaI

Thermal conductivity (W/mk)

Phase change temperature (ºC)

substrates thickness (mm)

total thickness (mm)

substrates material

Unsupported film with very low thermal impedance even at low pressure. Fills gaps up to 0.2 mm (0.008") or collapses to form a thin interface. Direct attach to heat sink without heating. Suitable for semiconductor and power electronics applications

0.003

0.022

3.3

45

N/A

0.008 0.2

None

Powerstrate® 51r™

Low thermal impedance, reworkable grade. Most suited to applications on lidded processors where the heat sink may have to be removed for rework.

0.008

0.052

3

51

0.051

0.074 to 0.083

AL 1145-0

Powerstrate® 51,60™

Low thermal impedance, robust grade. Suited to a wide range of applications on bare die processors and other electronics devices.

0.008

0.052

3

51 or 61

0.051

0.064 to 0.16

AL 1145-0

PSX-D

Thermal paste for stencil print or manual application

0.008

0.052

3.4

N/A

N/A

0.254

All

Silverstrate®

Excellent thermal performace, particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required, (Silverfilled).

0.003

0.022

3.14

51

0.051

0.102 to 0.127

AL 1145-0

Thermstrate® TC™

Phase change compound in applicator bar. Ideal for prototyping, rework and small scale production.

0.021

0.137

0.47

60

N/A

N/A

None

Thermstrate® 2000™

Good thermal performance most suited to applications on power IGBTs, semiconductors, DC-DC converters and other isolated packages.

0.022

0.143

3

60

0.051 & 0.128

0.076 to 0.191

AL 1145-0

product

description/application

Powerstrate® Xtreme™

Phase Change Thermal Interface Material - Electrically Isolating Products product

description/application

thermal impedance (°C-in. ²/W) at 80 PSI

thermal impedance (°C-in. ²/W) at 550 kpaI

Thermal conductIVITY (W/mk)

Phase change temp. (ºC)

Thickness substrates (mm)

total thickness (mm)

substrates material

DIELECTRIC RATING VAC/MIL SUBSTRATE

UL YELLOW CARD

UL FLAMMABILTY

Isostrate® 2000™

Electrically isolating phase change material for use with a wide range of non-isolated components.

0.12

0.78

0.45

60

0.025 to 0.076

0.051 to 0.153

Polyimide

>5000

None

None

Isostrate® J-Series™

Electrically isolating phase change material. Ideal for nonisolated devices in high volume applications where high thermal performance is not required.

0.48

3.12

0.155

60

0.0051

0.076

Polyethylene

>5000

See data sheet

See data sheet

MCMstrate®

Adhesive backed version of Isostrate. Allows pad to be postioned to facilitate assembly.

0.25

1.325

0.4

60

0.025 to 0.076

0.064 to 0.114

Polyimide

>5000

E1049 35

94V-0

EMIstrate®

Unique combination of thermal and EMI management. Excellent choise for radiated EMI control.

0.4

2.6

0.69

60

See data sheet

See data sheet

Polyimide

N/A

N/A

N/A

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11

Thermal Management Adhesives Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips while providing an efficient method of thermal transfer between heat generating electronics devices and their heat sinks.

Thermal Adhesives product

description/application

cure/ chemistry

specific gravity

viscosity

shelf life

cure schedules

modulus

tg °C

Cte ppm/ ºC

thermal conductivity

315

Self-shimming for electrical isolation; room-temperaturecuring adhesive.

1-component Activator* Acrylic

1.7

Paste

9 months at 5 °C

5 min. at 20 °C 4-24 hr. at 20 °C

390,000 psi 2700 N/ mm2

50

69

0.80 W/mK

384

epairable, room-temperatureR curing adhesive utilized for parts subject to disassembly.

1-component Activator* Acrylic

1.6

Paste

9 months at 5 °C

5 min. at 20 °C 4-24 hr. at 20 °C

400,000 psi 2800 N/ mm2

50

110

0.76 W/mK

5404

S elf-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.

1-component Heat Cure Silicone

2.4

280** g/min.

5 months at 4 °C

10 min. at 150 °C

587 psi**** 4 N/mm2

-40

104

1.0 W/mK

7386

7 387 DEPEND is one component of a two part no mix adhesive system. It is solvent based and has a very low viscosity. 1.75 oz bottle

Heptane and Isopropanol

0.8

Very low

on part life 2 months

N/A

N/A

N/A

N/A

N/A

* Use with activator 7386.

** Extrusion measured @ 50 psi/0.125" orifice. *** Made to order. Initial order may require longer lead time.

**** Youngs Modulus

Thermal Management Mtl.

Adhesives

Shimming

NonShimming

315™

384™

Thermal Pads

Activator

NonInsulating

Electrically Insulating

Electrically Conductive

7386™

Powerstrate® Xtreme™

Isostrate®

Silverstrate®

5404™

Thermal Paste

Specialty Mtl.

PSX-D®

EMI-Strate®

Powerstrate® Thermstrate®

12

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Silicones Silicones offer highly diverse product properties for virtually unlimited applications. With their great versatility, silicone products are ideal for intelligent, customized solutions. They offer thermal stability, weatherability, hydrophobic and hydrophilic surface properties, and excellent release, lubricating and dielectric characteristics.

Potting and Encapsulation Silicone gel addition-curing dencity g/cm³

colour

1K

Transp.

pot life 23° C

0.96

150

6H

100˚/240 min 130˚/40 min 150˚/10 min

0.98

35 000 2 500

3 month 15˚C/ 6 month

100˚/240 min 130˚/40 min 150˚/10 min

1 000

1 000

features

Semicosil® 926

- Low viscosity - Ready-to-use, one-component - Rapid heat cure - Low content of uncured polymer - Low ion content

Semicosil® 924

- Thixotropic flow - Low ion content - Low content of volatiles - Low content of uncured polymer - Forms a soft gel on vulcanization

Wacker Silgel® 612

- Very low viscosity - Very low hardness (silicone gel) - Crystal clear vulcanizate - Pronounced tackiness - Excellent mechanical damping properites

1:1

Transp.

0.96

- Very low viscosity - Low ion content

1K

Transp.

0.97

Elastosil® RT745S

mix

Viscosity mPa s

product

1K

Transp.

cure time °C/ime for 1 cm

hardness cone mm/10

applications

60

Encapsulation of electronic components.

50

Recommended for local encapsulation of delicate electronic components,e.g.bonded chips on hybrid components which are exposed to extreme external influences.

2H

23˚/8 hrs 70˚/15 min 120˚/5 min

300

Encapsulation of electronic components and solar cells.

Embedding of optical fibres.

Production of shock absorbers.

Sealing of clean-room filters.

>4 H

80˚/30 min 120˚/5 min 150˚/2 min

5 37 Shore 00

Encapsulation of electronic components

Silicone Rubber Addition-Curing RTV-2 product

Elastosil® RT 601

hardness cone mm/10

mix

colour

dencity g/cm³

Viscosity mPa s

pot life 23° C

- Low viscosity - Medium cured hardness - Excellent tensile strength - Crystal clear vulcanizate

9:1

Transp

1,02

3 500

90 min

23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min

45

All-round potting compound.

Manufacture of moulded articles by casting.

9:1

Light Grey

1,17

3 500

80 min

23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min

30

All-round potting compound.

9:1

Transp

1,02

800

90 min

23˚/24 hrs 70˚/30 min 100˚/8 min 150˚/5 min

25

Encapsulation of electrical and electronic components.

9:1

Reddish brown

1,43

10 000

80 min

23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min

55

All-round potting compound.

9:1

Reddish brown

1,3

12 000

60 min

23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min

27

All-round potting compound.

Technical mouldings.

Encapsulation of electrical components.

9:1

Reddish brown

2,3

35 000

150 min

23˚/24 H 70˚/60 min 100˚/30 min 150˚/10 min

80

Encapsulation of electrical components.

9:1

Grey

1,50

1 100

8h

100˚/60 min 150˚/15 min

20

Encapsulation of electrical components.

Elastosil® RT 602

- Low viscosity - Medium hardness - Excellent heat stability

Elastosil® RT 604

- Very low viscosity - Low hardness - Crystal clear vulcanizates

Elastosil® RT607

- High hardness - Excellent heat stability - Flame retardant

Elastosil® RT 622

cure time °C/ime for 1 cm

features

- Good processing due to low viscosity - Very good mechanical properties - Soft vulcanizates

Elastosil® RT 675

- Low viscosity - Low hardness - Fast curing at higher temperatures

Elastosil® RT 743 LV

- Extreme hardness - Excellent heat stability - Extremely high thermal conductivity

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applications

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13

Silicones

Encapsulation and Coating Silicone Rubber product

features

mix

colour

dencity g/cm³

Viscosity mPa s

pot life 23° C

cure time °C/ime for 1 cm

hardness cone mm/10

Elastosil® 935

- Low viscosity - Very long pot life - Fast curing at elevated temperatures - Low hardness - High flexibility - Low risk of inhibition by soldering or flux residues

1:1

Transp

0.97

3 500

7 days 10˚C/14 d

80˚/30 min 120˚/10 min 150˚C/5 min

15

applications

Coating of printed circuit boards.

Encapsulation of electronic components.

Bonding, Fixing and Sealing/Gasketing Room temperature Curing RTV-1 features

mix

color

dencity g/cm³

Viscosity mPa s

pot life 23° C

cure time °C/ime for 1 cm

hardness cone mm/10

Elastosil® A 07

- Ready to use, one-component system - Low viscosity - High flexibility - Primerless adhesion to many substrates

1K

Transp.

1.08

10 000 -

3-5 min

5

20

Multipurpose sealant and coating material.

Elastosil® A 234

- Amine-curing system - Flowable - Excellent heat stability - Excellent primerless adhesion to many substrates

1K

White

1.21

35 000

10-20 min

2

36

Gluing and sealing of steam chambers and sole plates of steam iron

Elastosil® A 33

- Ready to use, one-component system - Good mechanical properties - Primerless adhesion to many substrates

1K

Ivory

1.16

2

10-20 min

2

25

Adhesive for the coating and sealing at high temperatures.

Elastosil® A 43

- Amine-curing system - Flowable - Excellent heat stability - Excellent primerless adhesion to many substrates

1K

Transp.

Black

1.09

350 000

10-25 min

1-2

30

General-purpose adhesive and coating for technical and medical applications

Elastosil® N 2010

- Neutral curing system (alkoxy) - Sprayable - Flowable - Primerless adhesion to many substrates - Good heat stability

1K

Transp.

1.01

20 000 -

10-25 min

2-4

25

General-purpose adhesive and coating for technical applications

- Neutral curing system (alkoxy) - Short skin forming time - Fast curing - Flowable - Primerless adhesion to many substrates - Good heat stability

1K

Black

1.14

45 000 -

20 min

2-4

36

General-purpose adhesive and for technical applications.

CIPG- and FIPG-applications e.g. for headlamps.

Elastosil® N 2197

- Neutral curing system - Solvent free - Non-slump - Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces

1K

Grey

1.24

N/A

25 min

2-4

35

General-purpose adhesive and for technical applications.

Elastosil® N 2199

- Neutral curing system - Solvent free - Non-slump - Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces

1K

Transp.

1.05

N/A

25 min

2-4

40

General-purpose adhesive and for technical applications.

1.30

N/A

5-20 min

2-4

33

The fully cured rubber can withstand expansion-compression cycles for many years. Especially well suited for joining materials with different coefficients of thermal expansion.

1.0

10

10-25 min

1-2

60

product

Elastosil® N 2034

Elastosil® N 9132 N 9132 S Elastosil® N 189

14

- One-part, ready-to-use - Neutral curing system - Non-slump - Excellent unprimed adhesion to most plastic, metal, glass and ceramic substrates - Flame retardant:meets UL 94V-O

1K

- Neutral curing system (oxime) - Non-slump - Good resistance against mineral oil and coolant fluids - Excellent heat stability - Excellent adhesion to many substrates

1K

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Grey

White

Black

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

applications

General-purpose adhesive fortechnical applications.

FIPG- and CIPG-application

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Silicones

Heat Cure SiliconeAdhesive Silicone Rubber Addition-Curing product

features

mix

colour

dencity g/cm³

Viscosity mPa s

Shear rate. g/10s

cure time 23 °C

26 min

140˚/20 min 200˚/3 min

45

Allround glue for houseware and metal industry.

Useable for silk screen printing.

hardness shore a

applications

- Ready-to-use, one-component - Flowable - Thixotropic - High extrusion rate - Fast curing at high temperatures - Good heat stability - Excellent primerless adhesion to many substrates

1K

Black

1.23

100 000 13 000

Semicosil® 986/1K

- Ready-to-use, one-part system - Thixotropic - Translucent, medium hardness - High flexibility

1K

Transp.

1.07

300 000

-

100 °/6 h 130 °/30 min 150 °/10min

51

General purpose adhesive for the electronics industry.

Semicosil® 987/1K

- Ready-to-use, one-component system - Low viscosity during dispensing nonslump after dispensing - Medium hardness - High flexibility - Primerless adhesion to many substrates

1K

Transp. + Grey.

1.1

300 000 30 000

-

100˚/6 h 130˚/1 h 150˚/10 min

50

General purpose adhesive for the electronic industry. FIPG-and CIPGapplications.

Elastosil® RT 705

Silicone Paste features

colour

dencity g/cm³

operating temp.

hardness cone mm/10

- Good electrical properties - Good adhesion to metal and ceramic materials - Excellent water repellency

Transp.

1.0

-40 - +220

350

Lubricants for shut-off valves.

Release agents for compression moulding, extruder die rings.

Silicone Paste P 12

- Soft, heat sink paste with marked thermal conductivity - Electrically insulating

White

2.25

-30 - +200

300

Especially used in semiconductor technology as a heat sink paste.

Geniosil N 550

- Silane modified polymere adhesive, free of isocyanates, tin catalysts and silicones - Neutral curing - Temperature range -50° C to 120 °C - Solvent free - Excellent adhesioin

Grey.

1.3

-50 - +120

Shore A 55

product

Silicone Paste P 4

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

applications

Sealant/elastic adhesive for technical applications.

Can be varnished with suitable paints in cured and uncured state.

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

15

Die Attach Adhesives Based on ultra-hydrophobic chemistry, Hysol® die attach adhesives offer very high adhesive strength, elongation at break, and cohesive energy at high reflow temperatures. These properties help electronic packages retain adhesive strength and structural integrity during moisture soak and absorb stresses during the deformations associated with lead free reflow processing.

Die Attach Adhesives for Non-Hermetic Packages For organic substrates including laminates, array, BGA and CSP packagers product

QMI 536 QMI 550SI QMI 550 EC

Thermal conductivity

tg (°C)

9000 CPS

0.3 W/mk

-31

15 min at1 50 ˚C oven 10 sec at 150 ˚C SC

17000 CPS

0.6 W/mk

15 min at 150 ˚C oven 10 sec at 150 ˚C SC

17000 CPS

3.8 W/mk

resin

filler

oven cure/ skip cure

Industry Standard Industry standard for die-to-die bonding; dielectric, high adhesive strength material for organic substrates.

BMI

PTFE

15 min at 150 ˚C oven 10 sec at 150 ˚C SC

Low CTE CVersion of QMI 550 Silica-filled for low shrinkage and low warpage on laminate and flex substrates.

BMI

Silica

Electrically Conductive Silver-filled version of QMI 550; very high adhesive and cohesive strength.

BMI

Silver

description/application

viscosity 5rpm at 25 °C

cte 1/2

modulus at 25°C

storage temp.

93 174

0.30 GPa

-40 °C

33

43 91

1.50 GPa

-40 °C

2

46 148

2.8 GPa

-40 °C

For inorganic substrates incl. CU, Pd, Ag & Au plating, ceramic and black oxide product

16

description/application

resin

filler

Recommende cure

BMI

Silver

15 min at 180 ˚C oven 10 sec at 200 ˚C SC

QMI 518

Electrically Conductive, Large die Similar properties to QMI 519, but formulated to have a low modulus to reduce stress on die larger than 500+500 mil./13-13µm.

QMI 519

JEDEC L1 260C for SOIC, QFN Industry standard for QFN packages. Good for all preplated leadframes, and bare copper.

Higher adhesion, excellent electrical and thermal performance.

BMI

Silver

15 min at 185 ˚C oven 10 sec at 200 ˚C SC

QMI 519HT02l

High Thermal Conductivity Very high electrical and thermal conductivity while maintaining excellent adhesion. Suitable for high heat dissipating devises.

BMI

Silver

15 min at 180 ˚C oven 10 sec at 200 ˚C SC

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

viscosity 5rpm at 25 °C

Thermal conductivity

tg (°C)

8500 CPS

1.4 W/mk

-64

9000 CPS

3.8 W/mk

18800 CPS

7.3 W/mk

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

cte 1/2

modulus at 25°C

storage temp.

69 152

0.10 GPa

-40 °C

75

40 140

5.3 GPa

-40 °C

49

42 104

6.70 GPa

-40 °C

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Encapsulants Semiconductor Liquid Encapsulants.

Henkel´s co-cure dam and fill encapsulants cure in one easy step, requiring no pre-cure of the dam material. High purity liquid epoxy encapsulants are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage and corrosion.

Chip on Board Liquid Encapsulants.

These products cure to form void-free globs when exposed to heat, with formulations for low CTE, minimizing stress on wire bonds during thermal cycling. These encapsulants are easy-to-dispense, minimize induced stresses, provide improved temperature cycling performance, and offer excellent chemical resistance.

Semiconductor Liquid Encapsulants Flow Control / Dam Materials product

FP4451

description/application

Flow Control Barrier

pot life at 25 ºC

recommended cure

flow properties

24 hrs.

30 min. at 125 °C + 90 min. at 165 °C

None

viscosity at 25ºC

tg. ºC

cte (1) (ppm/ºC)

% filler

860,000 cps

145

24

72

viscosity at 25ºC

tg. ºC

cte (1) (ppm/ºC)

% filler

storage temp.

-40 °C

Fill Encapsulants product

description/application

pot life at 25 ºC

FP4450

ICs, COB, BGA, PGA

3 days

FP4470

Lead-free Packages

5 days

recommended cure

flow properties

storage temp.

30 min. at 125 °C + 90 min. at 165 °C

High

50,000 cps

155

22

73

-40 °C

30 min. at 125 °C + 90 min. at 165 °C

High

48,000 cps

148

18

75

-40 °C

recommended cure

flow properties

viscosity at 25ºC

tg. ºC

cte (1) (ppm/ºC)

% filler

Clip on Board Liquid Encapsulants product

description/application

pot life at 25 ºC

storage temp.

EO1016

COB, Watch ICs

3 months

15 min. at 150 °C

Medium

70,000 cps

115

40

40

4 °C

EO1060

Chip on Board

25 days

4-6 hrs. at 125 °C

High

15,000 cps

125

40

61

4 °C

FP4401

Chip on Board

24 hrs.

3 hrs. at 170 °C or 6 hrs. at 150 °C

Low

375,000 cps

160

22

75

-40 °C

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

17

Circuit Board Protection AND Underfills Henkel´s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, providing electrical insulation, and increasing vibration and shock resistance.

Conformal Coatings description

type

pot life

viscosity cps

cure cycle

secondary cure

delectric strenght (v/mil/kV/cm)

PC 18

- A one component solvent based Acrylic conformal coating specifically designed as a toluene free alternative.

- Application by non-atomized selective spray coating equipment.

- Components and joints may be repaired by heating the coating with a soldering iron for easy removal.

Urethane

60 min. tack free

350

Heat 2 hrs. at 125 °C

5-7 days at RT

1200/472

continuous up to 110 ºC

PC 28

- Solvent-based, oxygen curing, coating exhibiting superior toughness with abrasion and solvent resistance.

- Apply by brush, dip or spray procedures

Urethane

60 min. tack free

35

Heat 5-7 days at 25 °C

Air Dry 30-60 min. followed by 2-4 hrs. at 60 °C

1500/591

continuous up to 110 ºC

PC 62

- Solvent-based, coating exhibiting superior toughness with abrasion and solvent resistance.

- Apply by brush, dip or spray to meet MIL-I-46058C, Type PUR, requirements

Acrylic conformal

5 min. tack free

40-60

24 hours at 25°C

45 minutes at 75°C

N/A

–40 -125°C

5293

- UV Silicone for severe temperature cycling environments.

- High reliability automotive - No solvents - Low VOC

Silicone

N/A

600

UV 20-40 sec.

75mW/cm2

Moisture Tack free:2-6 hrs.

Full cure: 72 hrs

406/160

-40 -204 °C

product

temp. range

Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing required for lead free assembly. Our green materials are developed to meet demanding end use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion. Loctite CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life.

Semiconductor Liquid Encapsulants CSP and DCA Underfill Encapsulants product

18

description/Application

viscosity at 25°C

pot life

cure schedule

tg. °C

cte(1) (ppm/°C)

capillary flow

storage temp.

3513

Reworkable CSP

4,000 cps

2 days

30 min at 100 °C

69

70

N/A

2 °C - 8 °C

3593

Snap Cure Rapid Flow CSP

4,500 cps

7 days

5 min at 150 °C

110

50

100 sek.

2 °C - 8 °C

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Cleaners and other products

product

description/application

SC01 MCF800 SPOT ON SOLDER MASK

TTC-LF

STW 001

product

NO-CLEAN DESOLDERING WICKS

product

MINI FLUXERS & CLEANERS

PACKING SIZE

- SC01 is designed for the stencil cleaning and hand cleaning of solder process residues.

- A highly effective cleaner that dries rapidly (fast evaporation).

5L

- MCF800 is designed for post soldering cleaning using cleaning process equipment.

- Highly effective cleaner, requires rinse using either water or solvent.

8 ML

- Temporary solder resists used with circuit boards prior to soldering.

- Ideal for prevention of PTH hole filling and for the protection of contact surfaces e.g. edge connections.

- Suitable for use with hand, robotic, pneumatic or template screening applications and brush.

- Peelable for easy removal.

250 ML 5L

- Handy, non-abrasive solder iron tip-tinner.

- Easily wets hot solder irons leaving a brightly tinned tip.

- Improves hand soldering efficiency and extends tip life.

- Adhesive pad allows easy mounting on or near the solder iron holder.

15 G

100 wipes/can

- Stencil Wipes

description/application

type

AVAILABLE WIDTHS

NC-00 NC-AA NC-AB NC-BB

- Fast, easy means of removing solder.

- No-clean, High activity flux means minimal cleaning is required.

- Comprehensive range available

description/application

0.8 MM 1.5 MM 2.2 MM 2.7 MM

RANGE AVAILABLE

- Controlled release flux and cleaner pen applicators.

- Ideal for controlled application of flux when carrying out SMT re-work.

- Cleaner pen easily removes residues.

No clean flux x335-07i pen Cleaner MCF-800 pen

SOLDER ACCESSORIES

Solder Masks Multicore

Spot-On™

Mini Cleaners Multicore

MCF800™ Multicore

SC01™

Mini Fluxers (Flux Pen) No Clean Multicore

x33S-07i

Tip Tinners Multicore

TTC-LF™

Wicks Multicore

NC-00™ Multicore

NC-AA™ Multicore

NC-AB™ Multicore

NC-BB™

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

19

Soldering Stations

22

23

Soldering and desoldering stations

Entry line Soldering Stations system/ PART NO

description

nominal power

total peak power

temp. selection between

BD-2BA BD-2SA

Digital soldering station with 2-lines readout display and menu for modification of values from original setting

75W

60/140 W

90-450 °C

CD-2BA

Soldering station 230V For general electronics jobs.

Includes control unit BD, handpiece T245-A, cartridges C245-003 and C245-007

75W

140 W

90-450 °C

CD-2SA

Soldering station 230V For high precision solder joints.

Incudes control unit BD, handpiece T210-A, cartridge C210-001 and 210-008

75W

60 W 140 W

90-450 °C

nominal power

total peak power

temp. selection between

75W

140 W

90-450 °C

2 x 20W

2 x 40 W

90-450 °C

Single line Soldering Stations system/ PART NO

description

CF-2A

Solder feed station 230V Designed for repetitive soldering or when you need a free hand. Equiped with solder feed iron of 1mm diameter.

Includes AP control unit, AP-A solder feed iron, C130-403 cartridge.

CP-2A

Micro tweezers station 230V For soldering and desoldering SMD components with micro-tweezer. Includes control unit PA, PA-A micro hot tweezers and 2 x C120-002 cartridge.

Single line Desoldering Stations system/ PART NO

24

description

nominal power

total peak power

temp. selection between

CS-2A

Electric system 230V Electric suction system powered by control unit DSV or electric vacuum pump MS-A. Includes control unit DSV, DS-A micro desoldering iron with tip C360-004, MS-A electric vacuum pump.

20W

30 W

300-450 °C

CV-2A

Pneumatic system 230V Pneumatic suction system with dial for temperature selection.

Includes control unit DSV, DS-A micro desoldering iron with tip C36-004, pneumatic suction system feeded by compresed air max 6 bar.

20W

30 W

300-450 °C

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Soldering and desoldering stations

DIT and DIR Soldering Stations, one channel system/ PART NO

nominal power

description

total peak power

temp. selection between

weight

DIT-2A

Soldering station 230V For general electronic applications.

Includes control unit DI-2A, stand AD-SA, soldering iron T245-A and cartridge C245-003

75 W

140 W

300-450 ºC

2 kg

DIR-2A

Soldering station 230V For high and medium precision solder-joints.

Includes control unit DI-2A, soldering iron T210-A, cartridge C210-001 ad stand AD-SA

75 W

140 W 60 W

300-450 ºC

2 kg

DIS Desoldering Station system/ PART NO

nominal power

description

total peak power

temp. selection between

weight

DIS-2A

Desoldering station 230V. For desoldering insertion componenets and cleaning circuits with SMD components.

Includes control unit DI-2A, desoldering iron with tip C560-003, stand DR-SA, MS-A suction module electric system and accessories set.

75 W

140 W

300-450 ºC

2 kg

DSS-2A

Micro desoldering station 230V. For desoldering small and medium-sized insertion components; high-precision station with small measurements.

Includes control unit DI-2A, desoldering iron DS-A with tip C360-004, stand DS-SA, MS-A suction module electric system and accessories set.

75 W

140 W

300-450 ºC

2 kg

DIN Nitrogen Soldering Station 230V system/ PART NO

DIN-2A

nominal power

description The DIN-2A nitrogen soldering station combines 2 ways of transferring heat: - By direct contact between the solder tip and the solder joint, just like a normal soldering iron. - By nitrogen which is heated when flowing through the soldering tip.

Includes DI-SA control unit, stand DN-SA, nitrogen handpiece T245-NA with C245-003.

MN-A nitrogen flow regulator. N2 flow regulation:: 0,5-3,5 LPM at 5 Bar.Max pressure:6 Bar.

75 W

total peak power

140 W

temp. selection between

90-450 ºC

weight

1,2 kg

An externa nitrogen circuit is needed or the nitrogen generator from JBC GN-A

GN-A Nitrogen module generator SYSTEM/PART.NO

GN-A

Description • • • •

Compressed air pressure: 4 to 6 Bar Gas N2 concentration: up to 99,9% Concentraded N2 gas flow: 1 to 2 NL/min.

Weight: 2 kg

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

25

Soldering and desoldering stations

DDST Rework Station system/PART NO

DDST-2A

description

nominal power

total peak power

Sleep mode power

Soldering and desoldering station 230 V The station offers a complete solution for fast and safe repair of insertion component circuits by suction of hte solder. The station can also be used for cleaning pads in SMD circuits.

2 x 75W

2 x 140W

Hibernation mode power

2 x 10W

temp. selection between

weight

2 x 4W

4.5 kg

air flow regulation

protected against antistatic discharge

90-450 °C

includes Control unit DD-2A Handspiece T245-A Cartridge C245003 Desoldering DR-A Tip C560-003 Stand AD-SA and DR-SA Suction electrical system MS-A Set of tools and accessories

JT High Power Hot Air Station 230 V system/PART NO

JT-2A

description

maximum power

A high power hot air station used for desoldering all types of SMD's.

Its powerful heater desolders even the biggest QFPs and PLCCs quickly and safely. Desoldering small and mediumsized BGAs is done in a very short time.

1000 W

includes JT-2A

includes JT-2QA

Control unit JTE-2A Heater 1000 W Extractor stand with 5 extractors, 5 protectors and 2 tripods Heater stand Set of accessories

Control unit Stand Heater handle 1000 W No accessories

Temp. selection

°C

temp. room

room 450°C and "cool"

6-45 l/min

Yes

Total weight

8,7 kg

TE Hot Air Station 230V system/PART NO

TE-2A

26

description A precision hot air station ideal for soldering and desoldering small and medium-sized SMD components.

Autonomus hot air station, digital, thermo regulated with air flox control.

includes TE-2A

includes TE-2Qa

Control unit JTE-2A Heater 300 W Heater stand JT-SA Accessories Extractor stand with 2 tripods, 3 extractros and 5 protectors

Control unit Stand Heater handle 300 W No accessories

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Power max out

Temp. selection

variable air flow settings

total weight

300 W

room 450°C and "cool"

between 4 and 11 l/ min

6,7 kg

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

90-450 °C

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Soldering and desoldering stations

HD Heavy Duty Station 230 V system/PART NO

description

nominal power

total peak power

sleep mode

hibernations mode

145 W

270 W

20 W

9W

90-500ºC

4,5 kg

temp. range

weight

Ideal solution for high thermal demand and prolonged heavy duty soldering applications. Specifically designed for extensive soldering of multi-layerd circuits and parts which require high remperatures.

HD-2A

temp. range

weight

includes Control unit HD-2A Handspiece T245-A Cartridge C470003 Stand AD-SA

AL Automatic Solder Feed Station 230 V system/PART NO

description

Ideal solution for extensive soldering application, and any soldering application that requires one or two free hands.

AL-2A

nominal power

total peak power

sleep mode

hibernations mode

Solder wire diamters

75 W

140 W

10 W

4W

0,5 - 1,5 mm

90-500ºC

3,2 kg

includes Control unit AL-2A Complete handle AL-A Cartridge C250403 Stand AL-SA Tubes set and guides for: wires ø 0,9 - 1 mm: 00024101

AL-IA Hands-free soldering arm for soldering iron AL product

Description

AL-IA

Part no

Indispensable for using the AL system while having both hands free.

For this purpose it is also necessary to use the pedal set

0964551

AM Rework Station 230 V system/PART NO

AM-2A

description

nominal power

peak power

Designed for rework and repair of through-hole and SMT boards.

The station´s 4 modules offer the following rework/repair operations: - Desoldering of SMD components of any size by hot air.

- Desoldering SMT and through-hole components.

- Pick & Place tip for placing components.

- Soldering of any kind of components.

2 x 75 W

2 x 140 W

includes Control unit AM-2A T245 handpiece with cartridge C245003 DR-A desoldering iron with the C560-003 tip heater 1000W. MP 2260 Pick & Place Extractor stand with.5 extractors, 5 prtectors and 2 tripods.

Stands for soldering iron, desoldering iron and heater.

Set of accessories.

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Air flow regulation

6-45 l/min

Vacuum pump for holding ICs

x

weight

8,1 kg

Power hot air unit

soldering iron temp range

desoldering iron temp range

hot air temp. range

900 W

90-450ºC

300-450ºC

150-450ºC

sleep mode

2 x 10 W

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

hibernations mode

2x6W

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

27

Soldering and desoldering stations

NAST Nano Station 230 V system/PART NO

NAST-2A

nominal power

description A complete station designed for micro soldering and desoldering of small-size components like chips 0201, 0402 etc.

peak power

15W

temp regulation

weight

30W

90-450 °C

2.6 kg

hibernation power

temp. selection

weight

includes Control unit NA-2A Nano soldering iron NT205-A Nano tweezers NP105-A Cartridge set (10 pcs)

DI-2A 1 Tool Control Unit system/PART NO

DI-2A

Nominal power

description 1-tool digital control unit features a digital read-out display for accurate temperature and tool control.

75 W

peak power

sleep power

140 W

10 W

4W

sleep power

90-450 °C

2 kg

temp. selection

weight

for a complete station following is needed Control unit One tool with corresponding stand & cartridge

DD and DM 2- & 4- Tools digital Control Units description

nominal power

total peak power

DD-2A

2 tools control unit 230 V Offers connectivity for working with 2 tools simultaneously..

Designed for production and rework applications with high thermal requirements.

2 x 75W

2 x 140W

2 x 10W

2 x 4W

90-450 °C

3,5 kg

DM-2A

4 tools control unit 230 V Offers connectivity for working with 4 tools simultaneously..

Designed for production and rework applications with high thermal requirements.

4 x 75W

4 x 140W

4 x 10W

4 x 4W

90-450 °C

4,5 kg

system/PART NO

hibernations power

for a complete station following is needed Control unit From 1 to 4 tools with its corresponding stand & cartridge

28

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Soldering and desoldering stations

MS-A and MV-A Desoldering Suction Modules system/PART NO

description

power

supply

typical surface resistance

recommended air pressure

weight

MS-A

MS-A electric suction module Electric suction module with overdrive startup funtion that offers quick collection of solder before it cools down. This suction system is regulated by the control unit.

12 W

24 V

1015-1011

-

1,7 kg

MV-A

MV-A pneumatic suction module This pneumatic suction module uses compressed air and a Venturi valve. This system offers outstanding desoldering results because of its immediate suction responsiveness.

This suction system is powered by compressed unit.

3W

24 V

1015-1011

5 Bar (max 6)

1,4 Kg

Cleaning of Tips Cleaning sand CL6780 Tip tinner TT-A For chemical cleaning and tinning the tip at the same time. Very efficient.

Stand

The most "aggressive" method to clean even the most oxidated tips.

Metal wool CL6205 Dry cleaning method, indispensable for lead-free soldering. Removes oxidation and facilitates tinning.

Metal brush CL6217 Cleans tips, tweezers and desoldering irons the same way as metal wood.

Stand accesory + sponge S7080

Dry cleaning system + Metal wool CL6760 Dry cleaning + sand CL6780

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

29

Stands and Tools

30

system/PART NO

for handpiece

includes

AD-SA

• T210-A • T245-A

• • • •

PA-SA

• For PA-A micro hot tweezers

• Sponge stand • Sleep mode

DR-SA

• For DR-A desoldering iron

• Brush and sponge stand • Sleep mode

AP-SA

• For AP-A solder feed iron

• Sponge stand • Sleep mode

HT-SA

• For HT-A hot tweezers

• Sponge stand • Sleep mode

AD-SA

• For AP-A solder feed iron

• Sponge stand • Sleep mode

HT-SA

• For HT-A hot tweezers

• Sponge stand • Sleep mode

DS-SA

• For DS-A micro desoldering iron

• Brush and sponge stand • Sleep mode

Dry cleaning module with metal wool 3 cartridges extractor magazine for C210 or C245 Quick cartridges change Sleep mode

tools

system/PART NO

descriptiion

NANO The smallest soldering tools available in the market

• NP-A

• Uses cartridges C105 • Perfect for soldering and desoldering very smal-sized chip components.

• NT-A

• Uses cartridges C105 • For high-precision soldering jobs

Handpiece

• T-210-A

• For precision applications • Used with C210 cartridges • Offers quick cartridge change

T245 Handpiece For general soldering jobs in electronics

• T-245

• Offers quick cartridge change

• T245-FA

• A screw in this handpiece allows fixation of cartridges, ideal for high-intensity jobs that do NOT require frequent change of cartriges.

T245 Comfort handpieces Same characteristics as T245.

Neoprene grip, thermally isolating and giving more comfort to the user.

Ideal for intensive soldering.

• T245-CA

• Quick cartridge change

• T245-TA

• Handpiece incorporates a screw that allows to fix the cartridges • Ideal for high intensity jobs where NO cartridge change is needed

• T245-SA

• A screw in this handpiece helps to securely fix the cartridge, ideal for extensive soldering jobs that do NOT require frequent cartridge changes. Supplied with a cable of 3 m lenght.

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Tools and Cartridges

tools

system/PART NO

description

• PA-A

• • • • •

• HT-A

• Specially for soldering and desoldering small and medium-sized SMD components. A cable strip cartridge is also available.

• Each cartrdge is individually controlled by the control unit, guaranteeing fast heating-up, accuracy and recovery of temperature.

• Conntcted to JBC station DI, DD, DM AM and single line AP

• DS-A

• • • •

Adapts to the ever-decreasing size of new components.

Very easy cleaning and maintenance. Tips are easily inserted by gentle pushing Contacted to JBC stations DS-2A, DV-2A, DI, DD, DM, AM and single line AP Supplied with tip C360-004

• DR

• • • •

Very easy cleaning and maintenance Two different types of solder residue chambers are available: metal and glass Tips are easily palced by thread Supplied with tip C560-003

• AP-A

• Offers a "third hand" by feeding soldering wire from diamters 0.8 to 1 mm. Specifically helpful for high-volume soldering jobs, and whenever an extra hand is needed.

• Connected to JBC stations DI, DD, DM, AM and single line AP • Supplied wiht cartrigde C130-403

• SN5450

• Solder reels for AP-A • The soldering irons are fitted with lead free solder reel - 99% Sn/0.3% Ag/0.7 Cu - with 50g solder.

Microtweezers

Tweezers

Microdesoldering irons

Desoldering iron

Soldering wire feeding iron

Solder reels

Designed for soldering and desoldering SMD micro components Each cartridge is individually controlled by the control unit, guaranteeing fast heating-up, accuracy and recovery of temperature The available range of cartridge is made for desoldering a wide range of components.

Connected to JBc stations, DI, DD, DM, AM and single line AP. Supplied without cartridges.

Cartridges

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

31

Cartridges

32

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Work Environment

Filter System The world technical leader in air pollution systems Filtronic's business concept is to develop and manufacture mobile filter systems by creating a better workbench environment and protect individuals and products from hazardous gases and particles.

High Airflow Systems

Extract Arm Concept

34

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

CBC-Clean Bench Concept

High Vacuum Systems

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Filter System

system

MG 75

MG 95

MG 100

MG 200

MG 400

max suction capacity m3/h

description

High efficiency fume extraction with a wide range of filters depending on applications. It meets the demands for work in cleanroom. The MG75 is a filter unit with connection for one extraction arm. Remote control for variable speed, filter lifetime indication and alarm functions.

75

Microfiler separation degree DOP%

Gas filter-chemisorbtionseparation degree %

remote control

power size (WHD)

weight

Voltage

100

38-49

>99.97

>95 100/250V

100

Fume extraction system with high efficiency filter. Connection for one or two arms. The system can be set in variable speed and has an alarm function for filter lifetime indication.

100

High efficiency fume extraction system with integrated pre filter and a combined particle and gas filter.

Wide range of filters depending on application. Meets the demands for work in cleanroom. Remote control for filter lifetime indication, variable speed and alarm functions.

sound level dB(A), at 1 m.

Yes 465mm 640mm 220mm

38-50

>99.97

Accessory

Yes 465mm 640mm 220mm

>95

100W <52

>99.97

>95

100/250V

Accessory

460mm 640mm 210mm

No 15 kg Accessory

300W 200

310

<55

>99.95

>95 115/230V

450

>55

99.97

>95 115/230V

100-1000-ESD 100-1032-ESD 100-1055-ESD

Yes 400mm 1016mm 402mm

43 kg

200-1000-ESD Yes

300W 400

950-1000-ESD 950-1010-ESD

18 kg

100/250V

140

750-1000-ESD 750-1010-ESD

15 kg

100 140

part no Pre filter

100

High efficiency fume extraction with a wide range of filters depending on applications. It meets the demands for work in cleanroom. The MG95 is a filter unit with connection for one or two extraction arms. Remote control for variable speed, filter lifetime indication and alarm functions.

High efficiency fume extraction system with integrated pre filter and a combined particle and gas filter.

Wide range of filters depending on application. Meets the demands for work in cleanroom. Remote control for filter lifetime indication, variable speed and alarm functions.

Blower capasity m3/h

Yes 796mm 1016mm 402mm

68 kg

450-1000-ESD Yes

Accessories System

description

technical data

Pre-filter

• A pre-filter for the high airflow systems MG 75, 95 and 100.

• The pre filter is mounted on the filter system.

• The filter media is of a “bag” type model with a high separation degree.

Pre filter bag active area 25 dm² Pre filter bag Class F8

PF-1200

Trolley

• Trolley for MG75 and MG95. An easy solution to get the filter system even more mobile.

Arm brackets for the extraction arm is included

450 x 450 x 750 mm (WxDxH))

950-3202-EDS

Bench mounting set

• Bench mounting set for MG100. To be mounted on the edge of the workbench.

Remote control

• Remote control to MG units .

Connection hose

• Connection hose with quick-connection, aluminium covered Available from 1-5 meter length.

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Part no

780-3001-ESD 700-3057

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

ø 65 mm (diameter)

On request

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

35

Working Table Abraflex produces equipment for the production environment. They primarily market the electronic business and are fully familiar with the complete esd concept. Keywords for Abraflex are stability, flexibility and ergonomics.

Product nO

Product nO

35SC136ESD

description

35SC135ESD

Electric Table stand 1050x685mm max last 200kg

35SC137ESD

Electric Table stand 1850x685mm 200kg

35SF135ESD

Reinforced electric table stand 1050X685mm 300KG

35SF136ESD

35SF137ESD

Reinforced electric Table stand 1850x685mm 300kg

35999

Wheel undercarriage for above (pair)

35 203

Table top 1100x800x21mm, beige laminate

35 204

Table top 1500x800x21mm, beige laminate

35 205

Table top 2000x800x21mm, beige laminate

35 239

Table top 1100x800x21mm, grey ESD-laminate

35 240

Table top 1500x800x21mm, grey ESD-laminate

35 242

Table top 2000x800x21mm, grey ESD-laminate

35 229

Table top 1100x800x21mm, beige ESD-Norastat

35 230

Table top 1500x800x21mm, beige ESD-Norastat

35 232

Table top 2000x800x21mm, beige ESD-Norastat

UUA101-6

UUA101-2

35998

35862-8601

Reinforced gantry aluminium 1900mm

35 300

Shelf 1000x320x21mm grey ESD-laminate with fittings

35 310

35 320

Shelf 1800x320x21mm grey ESD-laminate with fittings

UUA 111

UUA 102-ESD UUA 106 UUA112-2 UUA108

36

description

Electric Table stand 1350x685mm 200kg Wheel undercarriage for above (Pair) Reinforced electric Table stand 1350x685mm 300kg

Gantry steel ESD 1900mm grey Angelable shelf sheetmetal ESD 875x300mm with fittings Shelf 1400x320x21mm grey ESD-laminate with fittings Power outlet, 7-way, breaker and fittings

Adjustable illumination ESD 24W High frequency

UUA 105-2

Railgirder for the UUA 101-2

Illuminated magnifying glass with railfittings

UUA 107-1

Linear railfittings for microscope

Solder smoke evacuation hose for mounting with microscope ESD

UUA112

Solder smoke evacuation hose with swiveling arm ESD

Linear mounting for solderstation ESD

UUA115

Drawer unit for tools ESD

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

Cabinets

Fume cupboards Customized fume cupboards. Manufacturing according to your specification.

The fume cupboard opening are equipted with electrically-operated sliding hatches designed for machines and other applications. All models are adapted to requirements according to the customers wishes. Available in a choice of colors according to the NCS or RAL color atlas.

Chemical cabinets Fire-resistant cabinets for inflammable gases and chemicals. The cabinets are equipped for ventilation installation and are available in differens sizes.

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

37

Inspection & Other Equipment

Optilia Instruments AB is manufacturer of high quality flexible video and digital microscopes for visual inspection, quality control, software analysis & measurements and digital image recording & documentation.

W10x • Inspection camera with built-in laser pointer • 10x optical zoom and auto focus function • Analog video signal (PAL) Flexia Visual Inspection & Documentation kit • ESD Protected and Approved • Digital Image Recording & Documentation • High Image Quality

The Dino-Lite Digital Microscopes by AnMo have created a whole new category of products in the electronics industry. The Dino-Lite can be connected to a computer and allows you to record moving and still images as well as time lapse recording.

• Magnification ranges from ~10 to 200 to 500x.

• LED lights are built in in white, polarized, ultraviolet, infrared or a

switchable combination.

ESD safe magazine rack All the models are compatible with standard specs. of SMT equipment.

The unique ”smart rack” keeps cardguides absolutely parallel while providing excellent rigidity. All the quick-width adjustment magazines are equipped with the AJ-slope system. A large selection of magazines for special applications can be offered for ceramic, substrate and instance heat-resistant type.

38

Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi

Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl

our business areas

By organising our activities into business areas we are able to offer a high level of specialised expertise and service to our customers. Each area has its dedicated marketing organisation complemented by interactive support functions. This gives us the considerable flexibility coupled with guaranteed access to all of the company´s resources.

ELMECH & OPTO The Elmech business area offers electromechanical and opto components. We supply appliance and electronics manufacturers with standard components but also, in close co-operation, with customised solutions.

KEYBOARDS & DISPLAYS The Keyboards & Displays business area always focuses on and strives for the very best solutions for display and keypad applications. The products include displays; from monochrome to more advanced colour displays, with various touch schreen alternatives, keyboards, keypads and complete panel solutions - with finishing grades geared to each individual requirement.

THERMAL & POWER We are one of the leading players in Sweden when it comes to temperature-related components, working with everything from fans, heat sinks and radiators to more complex thermal solutions. In the power area we offer active and passive components. We also offer components in the EMC and RF/Microwave areas, e g absorbents, gaskets, waveguides and filters.

New Product Area starting 1st of April 2010.

This business area also offer a wide range of materials for industrial manufacturing and electronic applications which also includes bench top products and equipment.

Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se

denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk

The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee

39

BYRÅN I TRANÅS 2010

SWEDEN OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 Fax: +46 75 242 45 09 info@oemelectronics.se www.oemelectronics.se

FINLAND OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 Fax: +358 207 499 496 info@oemelectronics.fi www.oemelectronics.fi

POLAND OEM Electronics PL ul. Postepu 2 PL-02-676 WARSZAWA Phone: +48 22 863 27 22 Fax: +48 22 863 27 24 info@oemelectronics.pl www.oemelectronics.pl

Denmark OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 Fax: +45 70 10 64 10 info@oemklitso.dk www.oemklitso.dk

Norway OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Sverige Phone: +46 75 242 45 00 Fax: +46 75 242 45 09 info@oemelectronics.se www.oemelectronics.se

The Baltics OEM Eesti OÜ Kanali tee 1-328 EE-10112 Tallinn Phone: +372 6550 871 Fax +372 6550 873 info@oem.ee www.oem.ee