Silicones Silicones offer highly diverse product properties for virtually unlimited applications. With their great versatility, silicone products are ideal for intelligent, customized solutions. They offer thermal stability, weatherability, hydrophobic and hydrophilic surface properties, and excellent release, lubricating and dielectric characteristics.
Potting and Encapsulation Silicone gel addition-curing dencity g/cm³
colour
1K
Transp.
pot life 23° C
0.96
150
6H
100˚/240 min 130˚/40 min 150˚/10 min
0.98
35 000 2 500
3 month 15˚C/ 6 month
100˚/240 min 130˚/40 min 150˚/10 min
1 000
1 000
features
Semicosil® 926
- Low viscosity - Ready-to-use, one-component - Rapid heat cure - Low content of uncured polymer - Low ion content
Semicosil® 924
- Thixotropic flow - Low ion content - Low content of volatiles - Low content of uncured polymer - Forms a soft gel on vulcanization
Wacker Silgel® 612
- Very low viscosity - Very low hardness (silicone gel) - Crystal clear vulcanizate - Pronounced tackiness - Excellent mechanical damping properites
1:1
Transp.
0.96
- Very low viscosity - Low ion content
1K
Transp.
0.97
Elastosil® RT745S
mix
Viscosity mPa s
product
1K
Transp.
cure time °C/ime for 1 cm
hardness cone mm/10
applications
60
Encapsulation of electronic components.
50
Recommended for local encapsulation of delicate electronic components,e.g.bonded chips on hybrid components which are exposed to extreme external influences.
2H
23˚/8 hrs 70˚/15 min 120˚/5 min
300
Encapsulation of electronic components and solar cells. Embedding of optical fibres. Production of shock absorbers. Sealing of clean-room filters.
>4 H
80˚/30 min 120˚/5 min 150˚/2 min
5 37 Shore 00
Encapsulation of electronic components
Silicone Rubber Addition-Curing RTV-2 product
Elastosil® RT 601
hardness cone mm/10
mix
colour
dencity g/cm³
Viscosity mPa s
pot life 23° C
- Low viscosity - Medium cured hardness - Excellent tensile strength - Crystal clear vulcanizate
9:1
Transp
1,02
3 500
90 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
45
All-round potting compound. Manufacture of moulded articles by casting.
9:1
Light Grey
1,17
3 500
80 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
30
All-round potting compound.
9:1
Transp
1,02
800
90 min
23˚/24 hrs 70˚/30 min 100˚/8 min 150˚/5 min
25
Encapsulation of electrical and electronic components.
9:1
Reddish brown
1,43
10 000
80 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
55
All-round potting compound.
9:1
Reddish brown
1,3
12 000
60 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
27
All-round potting compound. Technical mouldings. Encapsulation of electrical components.
9:1
Reddish brown
2,3
35 000
150 min
23˚/24 H 70˚/60 min 100˚/30 min 150˚/10 min
80
Encapsulation of electrical components.
9:1
Grey
1,50
1 100
8h
100˚/60 min 150˚/15 min
20
Encapsulation of electrical components.
Elastosil® RT 602
- Low viscosity - Medium hardness - Excellent heat stability
Elastosil® RT 604
- Very low viscosity - Low hardness - Crystal clear vulcanizates
Elastosil® RT607
- High hardness - Excellent heat stability - Flame retardant
Elastosil® RT 622
cure time °C/ime for 1 cm
features
- Good processing due to low viscosity - Very good mechanical properties - Soft vulcanizates
Elastosil® RT 675
- Low viscosity - Low hardness - Fast curing at higher temperatures
Elastosil® RT 743 LV
- Extreme hardness - Excellent heat stability - Extremely high thermal conductivity
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
applications
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
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