What is Decapsulation, and How It Differs from Delidding

What is Decapsulation, and How It Differs from Delidding Decapsulation is one of the most commonly used failure analysis processes which is used to open plastic components. The opening process is essential for the chemical analysis, inspection, or electrical examination of the internal components of any particular package. The proper opening of these components is imperative so that the integrity of the package is maintained.

Difference Between Decapsulation and Delidding The most commonly used processes of electronic component testing are decapsulation and delidding.

Both of these processes involve the removal of a cap, lip, or any other encapsulation material from an integrated circuit. This removal can be done through mechanical, thermal, and laser chemical means.

Even though decapsulation and delidding are often used interchangeably, they differ on some technicalities. Both of these systems have different requirements and are used for different components.

Both these processes serve to have the same end result, but there is a significant difference in the type of process they both are.

Decapsulation – When it comes to decapsulation, we are strictly dealing with a wet chemical process.

The component that is meant to be de-capped is put in contact with acids that corrode the surface of the component till the bond holding the cap in place is visible. This wet chemical process requires a specialized acid etching machine, and it is most commonly used with plastic components which melt away easily with acid.

Delidding – Delidding, on the other hand, is a purely mechanical process. It essentially pries open the top of the component and does not require any chemical agent in the process whatsoever. With components that have ceramic packaging or ones that are hermetically sealed, erosive chemicals and acids do not work. In such cases, the lid has to be manually removed from the component in order to reveal the interiors.

JetEtch Pro

If you are looking for a system for automated decapsulation of electronic components, there should only be one product in your consideration, and that should be the JetEtch Pro Decapsulation System. Made by the Nisene Technology Group, this automated, integrated circuit decapsulation system has made its name in the industry to such an extent that the original name of the product, ‘Jet Etch’ has become synonymous with the technique of decapsulating an integrated circuit.

Through constant research and innovation, Nisene Technology Group remains at the top of the decapsulation system food chain, especially with their latest automated decapsulation system, the JetEtch Pro, which houses all the same safety and operation features of the older model, with little enhancements and tweaks to improve each aspect.

In the updated version of the JetEtcher, you can find two different types of acid delivery methods, thirteen mixed-acid ratios, a wide range of etchant acid volumes, one-hundred etch recipe storage, and multiple post-etch rinse options.