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ThisinformationshouldbeusedasfeedbackinordertoimprovethesolderpasteprintingprocessIPCRequirementsforSolderPastePrintingDevelopedbythe SolderPastePrintingTaskGroupNordic(JND)oftheComponentMountingSubcommittee()oftheAssemblyandJoiningCommittee()ofIPC.Usersofthis publicationareencouragedtoparticipateinthedevelopmentoffuturerevisions模板设计信息见ipc《模板设计指导》。附录a提供了不同的错误类型，并列 出了推荐解决方案。本指南旨在帮助/改进膏体印刷的优化过程。在有差异的情况下，描述或文字标准总优先于插图。背景 诸如j-std与ipc-a标 准在电子行业提RequirementsforSolderPastePrintingPDFIPCStandardOnly:焊膏印刷要求IPCLakesideDrive,NBannockburn,ILPH+Thepurpose ofthisguidelinedocumentistosupporttheuserinthevisualevaluationofthesolderpasteprintingprocess,whichmakessubsequentprocessoptimizingpossible ThisstandardisacollectionofvisualqualityacceptabilitycriteriaforsolderpasteprintingPDFDRMContentProviderAddtoAlertAssociationConnecting ElectronicsIndustries[ipc]PDFPrice.ProductDetails2GeneralAspectsDefinitionofreworkandrepairThelineprocessasamodel.$AddtocartIPCBStencil DesignGuidelinesDevelopedbytheStencilDesignTaskGroup(e)oftheAssemblyandJoiningProcessesCommittee()ofIPCUsersofthispublicationare encouragedtoparticipateinthedevelopmentoffuturerevisionsContact:IPCLakesideDrive,SuiteSBannockburn,IllinoisTelIPCAGuidelinesforTemperature ProfilingforMassSolderingProcesses(ReflowandWave)DevelopedbytheThermalProfilingGuideTaskGroup(h)oftheAssembly&JoiningCommittee()ofIPC UsersofthisstandardareencouragedtoparticipateinthedevelopmentoffuturerevisionsAssociationConnectingElectronicsIndustries[ipc]PDFPriceThis standardisacollectionofvisualqualityacceptabilitycriteriaforsolderpasteprintingPurposeacceptabilitycriteriaforsolderpasteprintingIPC–Requirements forSolderPastePrintingContact:IPCSupersedes:IPCIPC/JPCAPerformanceGuideManualforSingleandDouble-SidedFlexiblePrintedWiringD Orig/IPC/JPCATerms&Definitions,Orig/RevB/RevA2/Orig/IPCStencilandMisprintedBoardCleaningHandbookgOrig/IPCRequirementsforSolderPaste PrintingjNDOrig/12IPCFreedownloadasPDFFilepdf),TextFiletxt)orreadonlineforfreeThisstandardisacollectionofvisualqualityacceptabilitycriteria forsolderpasteprintingThepurposeofthisguidelinedocumentistosupporttheuserinthevisualevaluationofthesolderpasteprintingprocess,whichmakes subsequentprocessoptimizingpossibleThisarticledescribesamethodtoensurequalitysecureddatafrombothsolderpasteprintersandinspectionmachinesin electronicassemblymanufacturingContact:IPCLakesideDrive,SuiteSBannockburn,IllinoisTelIPCJ-STDARequirementsforSolderingPastesAstandard developedbytheSolderPasteTaskGroup(b)oftheAssemblyandJoiningCommittee()ofIPCUsersofthispublicationareencouragedtoparticipateinthe developmentoffuturerevisionsInordertomeettheindividualthermalrequirementsandgeneralconditionsforthereworkingofelectronicassemblies,the solderingprocessestoThepurposeofthisguidelinedocumentistosupporttheuserinthevisualevaluationofthesolderpasteprintingprocess,whichmakes subsequentprocessoptimizingpossibleAddtoAlert$IPC–RequirementsforSolderPastePrintingPDFDRMContentProviderProductDetailsPublished DescriptionAddtoAlertThepurposeofthisguidelinedocumentistosupporttheuserinthevisualevaluationofthesolderpasteprintingprocess,whichmakes subsequentprocessoptimizingpossible