A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council
Volume 16, Number 1
SPRING 2012
2012 Media Kit A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM
The Heat Is On
Performance and Cost Improvements Through Thermal Management Design
Tenth Annual
MEMS Technology Symposium
S A N
J O S E
•
C A L I F O R N I A
3.21.11
Presented by
A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM
MEMS -
Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion
DRIVING INNOVATION
page 18
Existing Technologies Enable Future Innovations S A N
Unisem Group – a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies.
J O S E
•
C A L I F O R N I A
5.19.11
Presented by
page 20
MEPTEC&SMTAPRESENT Microelectronics Packaging & Test Engineering Council
INSIDE THIS ISSUE
16
The Demand for Portable Internet Connectivity Devices is Strong, in Spite of Poor Economic Times
In Association With
Surface Mount Technology Association
A S P E C I A L T W O - D AY T E C H N I C A L S Y M P O S I U M
24
26
Roadmap to a $Trillion MEMS Market – The Third Industrial Revolution
34
The Market for Where is the Material ProDiversity? cessing Lasers is Where are the Estimated to Be Women? Nearly $3B SPRING 2011 MEPTEC Report 3
2011
Medical Electronics Symposium / Day One Vital Technologies for Health
MEPTEC & SMTA PRESENT
MEPTEC&SMTAPRESENT Microelectronics Packaging & Test Engineering Council
A
In Association With
ASU CAMPUS • TEMPE • ARIZONA
9.27.11
Surface Mount Technology Association
S P E C I A L
T W O - D A Y
T E C H N I C A L
S Y M P O S I U M
2012
2011
Medical Electronics Symposium / Day Two
Medical Electronics Symposium
Vital Technologies for Health
Wednesday September 28th Arizona State University • Tempe Campus • Tempe, Arizona
A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM
2.5D, 3D
and Beyond Bringing 3D Integration to the Packaging Mainstream S A N TA CL ARA • C ALIFORNIA
Presented by
11.9.11
Participating Companies: • • • • • • •
Corporate Sponsors
3M Electronic Solutions Arthur Jonath Associates Dyconex AG Ito Corporation Kyzen Corporation mc10 Incorporated Medtronic Microelectronics Center
• • • • • • •
PackageMate, Inc. Plexus Specialty Coating Systems St. Jude Medical Universal Instruments Corporation U.S. Army Research Laboratory Zarlink Semiconductor Inc.
Technology, Health and the Economy
A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM
KNOWN KGD GOOD 2011 DIE
In an Era of Multi-Die Packaging and 3D Integration
Association Sponsors
S A N TA CL ARA • C ALIFORNIA
Presented by
11.10.11
www.meptec.org