2012 MEPTEC Media Kit

Page 1

A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council

Volume 16, Number 1

SPRING 2012

2012 Media Kit A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM

The Heat Is On

Performance and Cost Improvements Through Thermal Management Design

Tenth Annual

MEMS Technology Symposium

S A N

J O S E

C A L I F O R N I A

3.21.11

Presented by

A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM

MEMS -

Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion

DRIVING INNOVATION

page 18

Existing Technologies Enable Future Innovations S A N

Unisem Group – a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies.

J O S E

C A L I F O R N I A

5.19.11

Presented by

page 20

MEPTEC&SMTAPRESENT Microelectronics Packaging & Test Engineering Council

INSIDE THIS ISSUE

16

The Demand for Portable Internet Connectivity Devices is Strong, in Spite of Poor Economic Times

In Association With

Surface Mount Technology Association

A S P E C I A L T W O - D AY T E C H N I C A L S Y M P O S I U M

24

26

Roadmap to a $Trillion MEMS Market – The Third Industrial Revolution

34

The Market for Where is the Material ProDiversity? cessing Lasers is Where are the Estimated to Be Women? Nearly $3B SPRING 2011 MEPTEC Report 3

2011

Medical Electronics Symposium / Day One Vital Technologies for Health

MEPTEC & SMTA PRESENT

MEPTEC&SMTAPRESENT Microelectronics Packaging & Test Engineering Council

A

In Association With

ASU CAMPUS • TEMPE • ARIZONA

9.27.11

Surface Mount Technology Association

S P E C I A L

T W O - D A Y

T E C H N I C A L

S Y M P O S I U M

2012

2011

Medical Electronics Symposium / Day Two

Medical Electronics Symposium

Vital Technologies for Health

Wednesday September 28th Arizona State University • Tempe Campus • Tempe, Arizona

A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM

2.5D, 3D

and Beyond Bringing 3D Integration to the Packaging Mainstream S A N TA CL ARA • C ALIFORNIA

Presented by

11.9.11

Participating Companies: • • • • • • •

Corporate Sponsors

3M Electronic Solutions Arthur Jonath Associates Dyconex AG Ito Corporation Kyzen Corporation mc10 Incorporated Medtronic Microelectronics Center

• • • • • • •

PackageMate, Inc. Plexus Specialty Coating Systems St. Jude Medical Universal Instruments Corporation U.S. Army Research Laboratory Zarlink Semiconductor Inc.

Technology, Health and the Economy

A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM

KNOWN KGD GOOD 2011 DIE

In an Era of Multi-Die Packaging and 3D Integration

Association Sponsors

S A N TA CL ARA • C ALIFORNIA

Presented by

11.10.11

www.meptec.org


Turn static files into dynamic content formats.

Create a flipbook
Issuu converts static files into: digital portfolios, online yearbooks, online catalogs, digital photo albums and more. Sign up and create your flipbook.