Embedded Die Packaging Technology Market Forecast to 2028
COVID-19 Impact and Global Analysis
By Platform (IC Package Substrate, Rigid Board, and Flexible Board) By Application (Smartphones and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications)
o Gr
w
a at
GR A C
of
US$ 63.40 million in 2020
1
6 8.
%
du
g n i r
US$ 242.80 million by 2028
2 20
1
02 2 –
8