Thermal Interface Materials Market Overview and Forecast Up To 2023

Thermal Interface Materials Market Industry Analysis, Size, 2018 Share, Competitie Landscape and Forecast to 2023

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Thermal Interface Materials Market 2018

Thermal Interface Materials Market 2018: Industry Analysis, Size, Share, Competitie Landscape and Forecast to 2023 • The growth of the thermal interface materials market is majorly driven by the electrification of automobiles and the increased adoption of smart cars. The need for better connectivity in the automotive is also leading to the growth of the thermal interface materials market. • The other factor driving the growth of the thermal interface materials market is the increase in demand for small portable electronic devices. However, the growth of this market is expected to be hindered by the easy availability of the alternative technologies.

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Thermal Interface Materials Market 2018 Major Players in this Research: Key Players for Thermal Interface Materials Market: • 3M Company (U.S.), • Henkel Corporation (U.S.), • Bergquist Company (U.S.), • Indium Corporation (U.S.), • Parker Chomerics (U.S.), • Dow Corning (U.S.), • Laird Technologies (U.S.), • Momentive Performance Materials Inc. (U.S.), • Zalman Tech Co., Ltd. (South Korea)

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Thermal Interface Materials Market 2018 Market Segmentation The report has been analyzed based on the type, application and regions.

Amongst all types, the greases and adhesives segment is expected to dominate the thermal interface materials market. The growth can be attributed to the increase in use of greases and adhesives by the original equipment manufacturers owing to its properties such as heat spreader, flow ability and ability of minimizing the roughness of all the surfaces. The use of the greases and adhesives is also increasing with the advantages provided by its use such as ability of reworking, ability to form ultra-thin bond lines, low thermal resistance and the low cost of the materials.

Based on applications, the thermal interface materials market can be segmented as telecommunications, computer, automotive, industrial machinery and others. The computer segment is expected to grow rapidly with the increase in use of thermal interface materials in various parts of the device such as CPU, hard disk and chip set among others.

The thermal interface materials help in the removal of extra heat from the components of the device and to ensure that the computer operates in an efficient manner in the prescribed operating temperature.

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