Adhered to ieee 802. compact, robust and versatile connectors system. the lv214 standard has been superseded by te testing standard. simplification of the spec. the impact of lv 214- 4 – the german automotive oem connector test specification by rob boyd, senior product manager, schleuniger, inc. the product design, construction and physical dimensions corresponds to the latest customer drawings. 27mm ( staggered) pitch. the standard outlines terminal requirements specifically for the automotive industry. lv 214- 4 defines what an empty crimp is. please note, prototype parts or lv214 pdf pre- serial parts can be differing slightly in dimensioning, form- and position tolerances to the interface drawings. 14 contact resistance acc. humidity insulation resistance at 1kvdc: > 200mω lv214 b 20. 6 and uscar 21 / rev. an empty crimp has a full insulation crimp, but the conductor. mavt – multi- axial vibration testing. 15 contact resistance continuous during dynamic load, broad- band random. page 6 vw 75174: tg load type reference l 20. this specification is applicable to the termination characteristics of the microspacexstm family of products which provides a unique design enables lv214 ( severity 2) & uscar ( t2v2) compliant for lv214 pdf tin plating. 2) continuous contact resistance [ lv214 e14. 00mm ffc/ fpc connectors with autolock mechanism ideal for automotive and robotic operations are lv214 s1 qualified. the microspace™ is an lv214 s2 qualified crimp- to- wire connector system while microspacexs™ is qualified for both lv214 s2 and uscar- t2v2 specifications. 3 inspection of asreceived condition [ lv214 pg 0] ( 1) visual inspection [ e 0. it has many advantages over its uscar certified counterparts. the standard addresses the ability of terminals to be effectively evaluated by crimp force monitors. 2 damp heat, constant din en.
15, – it goes without saying that every manufacturer wants to ensure they are producing a quality product. test method■ ■ ■ monitor voltage drop during the test. 1 aging in dry heat din en* vde, test b l 20. unsealed and sealed. furthermore, the pcon12 contact system is released for the application of thick wall, thin wall, ultra- thin wall wires in accordance iso6722, considering that their minimum wire size fulfils the geometrical requirements according to uscar- 21 rev3 and uscar- 2 rev 6, lv112- 1, lv214- 1 and lv214- 3.
wire- to- board and wire- to- wire configuration. lv 214- 4 is an pdf automotive standard that was developed by representatives of the german car manufacturers audi ag, bmw ag, daimler ag, porsche ag and volkswagen ag. te connectivity solutions for miniaturized automotive connectivity nanomqs miniaturized interconnection system based on the mqs terminals design, the nanomqs interconnection system was launched to address manufacturers’ need to miniaturize electronic components. microspacetm will be available in single ( side- to- pdf side or staggered) and double row versions, with top pdf and side latch configuration. microspacexstm will be available in: 1. dry heat 120h / 140° c lv214 b 20.
1 drop test after aging not performed lv215- 2 din enpg 21. measurement setup in principle like lv214 e14. lv214, in europe and uscar2, in north america. gateway can, pdf lin, flex, power, gnd and buffer interfaces ethernet ( 100mbps). the gateway control module ( gateway), similar to a car’ s centralized lv214 pdf router, provides secure and reliable interconnections across multiple local area networks within a vehicle, enabling connected interactions between functional devices that share data. 1] number of test sample■ ■ ■ each part n= 5. microspacetm crimp- to- wire connector platform’ s unique design enables lv214 severity- 2 and performs at 1. requirement■ ■ ■ record must be maintained. – removed
test sequence table ( redundant with, redundant test requirements withhave been removed, removed german language.
the minitek microspace ™ has an operating temperature of 130■ c which makes it suitable to be even used inside an engine. design and construction / entwurf und konstruktion. updated pg8 test requirements. in a good crimp, the conductor crimp is filled with all wire strands, while the insulation crimp contains all the undamaged insulation material ( photos b and d). the automotive lv 214- 4 standard provides guidance on terminal requirements for crimp force monitoring.
13 derating with housing acc. vehicle connectors test specification lv214 ( edition march ) given in paragraph 3. crimp parameters are at the nominal values as specified by the manufacturer. plate size: payload: diameter 2, 2m max. alliance, uscar, lv214, iso 8092, kojiri, and sae j 2223 • solutions enable signaling technologies like lvds and ethernet • leader in automotive ethernet and committed to open alliance tc2 / tc9 with 100 base- t1 ( 100 mbps) and 1000 base- t1 ( 1 gbps). microspacetm will be available in single and double row versions, with top and side latch configurations. this specification is applicable to the termination characteristics of the microspacetm family of products which provides a unique design enables lv214 severity- 2 and performs at 1. 2 legend btb: board- toboard. 680kg acceleration: frequency range: max. read this white paper to learn more about how this standard can help make crimp force monitoring more efficient. update of the spec. amphenol icc’ s minitek microspace ™ crimp- to- wire connector platform' s unique design enables lv214 severity- 2 and performs at 1. 1 for different contact size and conductor cross section acc. table elevation monoaxial motion: vertical ( z) lateral ( y) longitudinal ( x) ± 150 mm ± 120 mm ± 140 mm velocity: vertical lateral. the following table shows which variants meet the re- quirements of lv214- 2 / slow- motion test, uscar- 2 / rev. 3 bp/ bw and broadr- reach™.
1 dry heat dry heat 48h / 80° c lv214 b6. test connector standard lvdefines terminal requirements for automotive wire harnesses. it goes without saying that every manufacturer wants to ensure they are producing a quality product. lv214 severity- 2 compatible.
3 climatic cold climatic cold 48h / - 40° c plugging / unmating possible at - 20° c lv214 b 20. all tests are per- formed at ambient environmental conditions per din iec 60512 unless otherwise specified. standards and specifications from various organizations provide a guideline from which manufacturers can measure different areas of quality, while also providing the end- user with the reassurance they are purchasing a trustworthy, long- lasting product. 2 damp heat damp heat 10 days / 40° c / 95% rel. the microspace™ families of products are available in staggered. to be in conformity with the. ( z) ( y) longitudinal ( x) 1 m/ s 0, 8 m/ s 0, 8 m/ s.