Digit Concept

DECAPSULATION GUIDE

REALASE 1

SESAMEACID SESAMELASER SESAMEplasmA SESAMEplaser TM

TM

TM

TM

SESAMEthermal SESAMEmechanical SESAMEDUOLASER SESAMEendpt TM

TM

TM

TM

A GREEN WORLD WITH DC - LESS ACID - LESS CF4 - AND ALL FOR YOUR FUTURE IC PACKAGES

OUR HISTORY IN SHORT Since 1992 DIGIT CONCEPT has been supplying tools for semiconductor Failure Analysis.

DIGIT CONCEPT invests considerable time and effort in the development of new and innovative techniques for the semiconductor industry, but also in developing new techniques and improvements for existing technologies.

It is not possible for one company to be the leader in chemical decapsulation, plasma, mechanical techniques, and laser ablation.

However, it is possible to be the best at understanding the actual needs for today’s decapsulations of IC packages, the needs of the future, as well as the needs for those technologies that have been in existence for some time.

That is why we have become a fabless company, which allows us to focus on the techniques of decapsulation, developing the equipment necessary for the task through collaboration with the leading manufacturers in each of the 4 ways of decapsulation.

With 20 years of experience in IC decapsulation, a young international team of experts, and an understanding of the needs of our clients, we have become the leader in decapsulation in just a few years.

DIGIT CONCEPT offers the following: Extensive knowledge of Failure Analysis: - All techniques used before and after IC decap Decapsulation Knowledge: - 12 years experience with LASER decapsulation - 20 years experience with ACID decapsulation - 20 years experience with PLASMA decapsulation - Worldwide Support: 7 Sesame Labs Technology Leader: - 12 international scientific papers - German and USA quality and robustness

INNOVATION

KNOWLEDGE

We do more than just develop new techniques or improve existing ones for the FA and reliability world. We scientifically verify results and share the data via the articles we publish with our clients at ISTFA, IPFA,ESREF,EPTC,IMAPS,etc ...

To be closer to the needs of our Customers, we distribute the equipment and techniques needed both before and after Chip Access.

Do not hesitate to contact us concerning any unresolved cases you may have in your laboratories. To this end we have 7 expertise centers around the world READY to help you with the techniques we currently use and those that we continue to develop.

“We will have many other new Sesame Products in the near future.”

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Veronique Poulain CEO

SUMMARY SESAMEACID

TM

S707

Acid Decapsulation system for traditional packages ..................................................................P. 8

S777Cu

Acid Decapsulation system for traditional packages and copper wired devices .................P. 9

SESAMElaser

TM

S500BASIC SesameLASERBASIC TM (TableTop) .................................................................................................P. 14 S500ULTRA SesameLASERULTRA TM (TableTop) ................................................................................................P. 15 S500GEL SesameLASERGEL TM (TableTop) .....................................................................................................P. 15 S1000 SesameLASER TM (TableTop) .............................................................................................................P. 16 S1000FS SesameLASERFS TM (Free-Standing) ...............................................................................................P. 16

SESAMEDUOLASER

TM

................................................................................................................................P.17

S3000 For SESAME1000FS TM Plus an additional UV LASER (355nm), or Green LASER (532nm), or other wavelengths and impulsion time (on demand).

SESAMEplaSMA

TM

FA2000P SesamePLASMADCAP TM...................................................................................................................P. 24 S2001FS SesamePLASERFS TM Free-Standing................................................................................................P. 25 S210 SesamePLASERRIE TM..........................................................................................................................P. 26

OTHERSESAME SESAMECLEANER TM S101

Spinner for the cleaning IC between backside processing steps ...........................................P. 28

SESAMEGASKETMAKER TM S4101/410 GASKETMAKER and PLATEMAKER for Acid Decapsulation Systems .....................................P. 28

SESAMETHERMAL TM S601 - SesameCOLDMOUNTPLATE™ ..................................................................................................................P. 30 S610 - SesameHOTMOUNTPLATE™ ....................................................................................................................P. 31

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We support our FA industry Since 1992 in Europe and since 2001 in USA and ASIA

Rep Trainning

Shanghai March 2012

Winner of the iPad ISTFA 2010 Steve Chun from Boeing Company 4

Winner of the iPad ISTFA 2011 Eugene Capito from Analog Devices

Winner of the Ipad IPFA 2012 Lau Chee Kiang INFINEON

WORK TOGETHER The most important people, your Customer Service Team. So two more : Falk Donner for Europe and Peter Pan for Asia

ELECTRICAL & THERMAL TESTS

TECH TIP

Artifacts… Do not forget to make electrical measurement before and after a decapsulation. With decapsulation you will have some possible artifact, acid, Plasma, Thermal reactions.

But also Mechanical due to the relaxation of the die and wires.

So an electrical test after a thermal curing at the temperature of the Acid or Plasma decap will help you to understand the artifact you can have.

COLLABORATION This Guide is yours. Do not hesitate to send your comments and Tips. We will be happy to integrate it into this guide.

DC BLOG Do not Forget

TECH TIP

Cannot access die with : • Laser (backside or frontside) • Mechanical (frontside) Use to reach the die : • Chemical wet (acid) • Chemical dry (plasma) For power package : • Do a pocket with : - Mechanical - Laser For copper wires : • Do a pocket with laser and use a special mixture @ 10°C

An idea, a request to modify some part of DC Equipment, you have a special case you want to share with our community… …Our Best DC Specialists and Manufacturers will answer you.

Fast Service Speed is not limited in Germany, but we are also very fast for service in any other country

Full Worldwide service - Preventive and Curative maintenance.

- Service centers in 3 continents.

- Maintenance Contract : light, Standard, Full - To optimize your maintenance Budget, maintain all your DC equipment in one service visit.

Trade-In or Up-Grade

7 EXPERTISE CENTERS 22 International Distributors & Representatives 5

Selection guide for FA Purpose

Method

Specification

EMC

Laser Decap. Laser output : > 8W

Equipment SESAME500

SESAME1000

Table top

Stand alone

Y

Y

Various EMC removal(Power device, No damage on Cu metals, SI Cutting, PCB cutting, Ceramic decap, etc)

Y

Y

Laser power, Hatch, Speed, ablation depth reference

Normalized of the Laser output Pulse

Y

Y

Remove of first irregular pulse

Laser beam scanner

Y

Y

LSM(Laser scanning mirror) with 112mm x 112mm scan range

Manual

Motorized

Stage (Motorized focus)

N

Y

Automatic

Stage (Motorized)

N

Y

Automatic. In option XY + R Base with Removable Rotating Table

Extraction Suction of fumes and particles

Y

Y

Small, Low Noise : < 65dB,easy to install and move

Industrial grade PC

Y

Y

Robust

Hall decap.

Y

Y

X-ray, SAT image insert and overlap for design

Laser X-section

N

O

Second dedicated LASER in option

Safety

Y

Y

Laser protection glass, Interlock, etc

Others

N

Y

Vision system

Platform

10X Zoom (Manual) OR 12X Programme Zoom (50mm x 50mm field)

Upgrade possible for Plasma option, Cooling, End stop, etc Clear edge Small sample

Pictures

Purpose

Method

Specification

LaserPLASER

LaserPLASMA

Comments

EMC Cleaning

Plasma Decap.

Platform

Integrated with Laser

Standalone

No Acid use

Etch gas

Y

Y

3 MFC ( CF4, O2, Ar)

Target materials

Y

Y

EMC, Polymer removal

Filers Blast

Y

Y

N2, CO2 gas

Plasma Source

Y

Y

RF 13,56 MHz

RF Power & Matching

Y

Y

300W

Temperature control of the chuck

Y

Y

Purpose

Method

Specification

SESAM707

SESAME777Cu

EMC Cleaning

Chemical Decap.

Chemical Mix

Y

Y

Temperature control

Room temp to 100℃ Plasma cleaning after laser decap.

No Chemical Si etch(SF6)

Pictures

Comments Nitric and Sulfuric acid

Ambiant~205°C

10°C℃~250°C

Chemical injection

Y

Y

From Bottom to Top

Recipe control

Y

Y

Chemical mix, Temperature control, etch, Rinse, Purge

No. of recipe

Y

Y

Up to 100 (1, 5:1, 4:1, 3:1, 2:1, 1:1 etc)

Dynamic etch

Y

Y

Forward & Backward chemical flow

Chemical drain

Y

Y

Automatic

Repeatability

Y

Y

Very good, No residual chemical in the chemical path of the tools

Safety

Y

Y

Leak detection sensor( 3 points)

Fume removal

Y

Y

Automatic by recipe, Low pressure tank

Small foot print

Y

Y

Possible to set up in the fume hood

Easy to use

Y

Y

Purpose

Method

Specification

FA2000RIE

Option

Deprocessing (Delayering)

Plasma etch

Platform

Standard

Option

Etch gas

2(CF4, O2)

4 (CF4, O2, Ar, CHF3)

Target materials

Y

Y

Plasma Source

Y

ICP

RF Power & Matching

Y

Temperature control

Y

Sample size

One touch

150mm

Comments Optionally up to 6 gas (???, Cl???)

Passivation(Si3N4, SiO2, polyimide) 300W 0 - 125°C

200mm

EPD option

Y

DC bias

Y

Separated pressure control

Y

Oil trap

Y

Vacuum pump

Y

Pictures

10℃ for Cu wire

No Damage on Cu wires, Bondings

Pictures

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Comments

OES

Included Comparison between before and after delayering of Passivation Layer

In collaboration with

• More than 100 SesameACID in worldwide from 2007 • 3 Technical Paper and 5 WW Chapter event presented (ask for your free copy) • In 7 years never a pump or a heat exchanger down.

• Ask for your application notes

SESAMEACID

TM

S707

(Ambiant tempeture to +250°C) SESAME707, A NEW TOOL ?

Yes, and No! The first patent for decapsulation apparatus was granted to Burt Wensink in 1982. At that time he worked for National Semiconductor. This patent was in turn licensed to Bert Wagner who developed the first commercial acid decapsulator. From his pioneering approach to IC package decapsulation until now there have been only a few minor improvements, but no real breakthroughs in decapsulator design - until now.

Kirk Martin, now with RKD Engineering, has patented many techniques with IC decapsulation. His first patent was awarded in 1998.

The most recent patent is pending for current technology improvements (2010). Kirk Martin, from RKD Engineering, introduced the EliteEtch early in 2000. This unit utilized new pump technology, developed by Mr. Martin that achieved substantially greater turbulence in the etched cavity, thereby reducing both process times and acid consumption. RKD Engineering also pioneered the use of a cooling system for the waste acid allowing the use of a single waste bottle.

This design has been in use for many years.

S777Cu

(+10°C to +250°C) ABOUT SESAME777Cu

Automated Dual Acid IC Decapsulator - innovative software - dynamic etch time adjustment - multiple acid rinse options - smallest footprint

As you may know DIGIT CONCEPT published its first technical paper at IMAPS2003 with the Freescale France Team researching problems with Aluminium Corrosion following chemical decapsulation. This was the beginning of our studies and the impetus for exploring lower decapsulation temperatures. For a long time we used 44°C, then 27°C in order to preserve copper bond wires.

A few years ago we have been working on trials with sub room temperature acid decapsulation. The results were very promising.

The S777Cu Dual Acid Decapsulator is the result of our work in this area with Kirk Martin. RKD Engineering has patented this technique.

20 years experience with ACID DECAPSULATION 7

SESAMEACID

TM

S707 Ambiant Temperature to +250°C Versatile System Configuration HANDHELD KEYPAD Operational simplicity results not only from software that continually checks and protects the system against operator error, but control from the Handheld Keypad is simple and intuitive. Anyone who can use a mobile phone can run a S707 Decapsulator. The remote control can be placed outside of the Fume Hood increasing the life time of the electronics parts and increasing the safety of the operator.

Fume Hood space is always at a premium so we have designed the smallest footprint in the industry while enhancing every possible safety feature. The incorporation of a separate heat exchanger for cooling waste acid below 90oC permits this size reduction. Now we only need a single waste bottle.

LookAhead software eliminates the danger of waste bottle overflow by preventing operation of the S 707 if the waste bottle does not have sufficient space in it for the programmed etch process to complete.

Schematic of System plumbing SAFETY COVER

PNEUMATIC RAM NOSE

PRESSURE TRANSDUCER

SILICON CARBIDE ETCH HEAD MULTI-SOURCE PUMP ASSEMBLY

BOTTLE SAFETY CABINET

HEAT EXCHANGER

WASTE ACID HEAT EXCHANGER LOW PRESSURE GAS RESERVOIR

NITROGEN GAS INLET 55 to 75 Lbs

FIXTURES and ACCESSORIES S707 can use all the accessory kits, gaskets and alignment plates. However, for significant cost savings and the advantage of always having the ability to design and cut gaskets for each and every package type, we recommend to use our material sheet. You can easily produce your gasket with the SesameLASER, or by our large choice of standard Gaskets and alignement plates.

DIGITAL PERISTALSIS PUMPING S707 employs an unique solution to ensure precise pumping of corrosive acids. This revolutionary design, of a multi-chamber fluid-metering module is protected by patents pending for its inventor Mr. Kirk Martin

GASKETS

The device hold down assembly (ram nose) is pneumatically activated and is designed for a large amount of travel. The ram nose is normally retracted and only extends after the safety cover is fully closed.

The vertical movement of the ram nose secures the device to the etch head thus eliminating movement of either the package or its fixturing.

Open Safety cover open to show ram nose linear motion of travel that eliminates the possibility of package/ gasket movement so often found in other systems where the ram travels through an arc

Closed TECH TIP

You need a specific gasket or alignment plateâ&#x20AC;Ś But you do not own a SesameLASER and you do not want to wait 3 weeks ! See our SesameGASKET MAKER 8

SAFETY COVER

Safety cover closed, to show closure onto cover seal that eliminates the

SAFETY COVER ERROR problem so frequently found in less sophisticated designs.

S777cu +10°C to +250°C THE FIRST ACID DECAPSULATOR MADE FOR COPPER… BUT NOT ONLY The S777Cu is an Automated Mixed Acid Decapsulator based on S707, with advanced feature integration to enable high productivity. This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.

The delivery of each micro-aliquot is done with sufficient pressure to create extreme turbulence in the etched cavity that greatly accelerates the rate of encapsulant removal.

Very low, precise acid temperatures, combined with high micro-aliquot delivery rates allow for the decapsulation of copper wired devices with no wire or metallization damage.

An exclusive acid delivery function can be selected that delivers the highest pulse rate possible while consuming less than maximum acid volume. The specially designed acid heat exchanger can accurately control acid temperature down to 10°C and up to 250°C, with flow rates to 8 ml. per minute. The high acid pulse rates achieve reasonable etch times even at the lowest temperatures.

255°C Temperature

The monolithic etch head is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process.

IMAPS2003 FREESCALE Digit Concept

85°C

<65°C 44°C 27°C 15°C

In the past

About the use of a LASER for precavitation In order to reduce the chemicals etch time. We have co-published 9 articles on this subject (ISTFA, IPFA, ESREF, etc.).

As a result of our research, the required use of +250°C for decapsulation of thermal plastic parts 20 years ago has been reduced to +10°C today!

888

TECH TIP

The goal is to remove the surface material (50μm) to either reduce the opening time at a given temperature, or decrease the temperature for the same opening time with less acid.

• Use an 800 Grid Paper • Do a 8 with the side to open on the grid paper • Do this 8 times

888

In 2003

10°C Today

Years

What temperature do I have to use for LASER precavitation?

It depends on the following: - EMC (Epoxy Molding Compound), - Percentage of Glass ball filler in the EMC (93% or more), - If the copper wires have Pd coating or not, - With or without prior LASER ablation, - Acid types Used such as HNO3 98%, H2SO4_20%SO3 ...

- Residual water in the package and in the Acids used - The rinse recipe As such, many parameters can affect the sample and the choice of decapsulation and precavitation techniques.

9

SESAMEACID

TM

S707 S777cu System Specification GENERAL SPECIFICATION

SAFETY DESIGN FEATURES

Dimensions - (W x D x H) Decapsulator 7.5 x 12.5 x 12 inch

190 x 318 x 305 mm Bottle Assembly 10 x 5 x 11 inch

254 x 127 x 279 mm Weight Gas

EMO Emergency Power Off Switch Etch Head Safety f over temperature sensor circuitry

in standard Leak Detection Sensors

f Decapsulator Body

f Bottle Box Assembly

f approx. 35 lbs.(16 Kg) f 5 bars 70 psi.

(N2) or CDA dew point of -40°C

Power Source f 90 to 250 VAC Acid temp. range f Sesame 707 f Room temp + 5°C to 250°C

f Sesame 777Cu f + 10°C to 250°C Acid temp. set point Etch cavity (up to)

f 1.0°C ± 0.1°C f 22 x 22 mm

SOFTWARE OPERATIONAL SPECIFICATION Acid selection f fuming or concentrated sulfuric acid f fuming or concentrated nitric acid f mixed acids NOTE: All mix ratios are dynamically prepared

within pumping assembly

Post etch rinse options

f fuming sulfuric acid

f fuming nitric acid

f mixed acids

f no rinse

NOTE: Acid rinse temperature settings are automatically

calibrated to etch temperature

f 1 to 1,800 seconds, in 1 sec. increments

NOTE: Etch time can be dynamically adjusted during etch process f Pulse Etch, f Reciprocating Etch - Acid Pulsation NOTE: REAP is a superior approach to maximizing the carrying

capacity for the etch acid(s) within the package volume.

It allows superior etch characteristics when nitric acid or mixed

acids are selected.

Etch modalities

Etch temperature ranges Sesame 707 Sesame 777Cu

f Room temp to 90°C f +10°C to 90°C

f Room temp to 250°C f +10°C to 250°C

f Room temp to 100°C f +10°C to 100°C Etchant volume

Software upgrades

CERTIFICATIONS & INDUSTRY COMPLIANCE

f RoHS

f CE

f SEMI S-2 f SEMI S-2, 93

Routine system maintenance of the Sesame 707/777Cu is simplicity itself. By selecting maintenance routines from the handheld keypad controller most maintenance routines can be run, including

f Temperature Calibration

f Optical Leakage Sensor Calibration

f Valve operation

f Ram Nose operation

f Low pressure gas supply and vent functions Sesame 707/777Cu uses no pressure regulators at all, it just connects directly to a nitrogen gas line at 5 bars (70 psi.).

WARRANTY Subject to Engineerings Standard Terms and Conditions of sale. All parts are warranted for a period of 24 months to be free of defects in material and workmanship when used under normal operating conditions and when recommended preventative maintenance is properly performed.

In cooperation with :

Your Rep in Americas :

(nitric acid) (sulfuric acid) (mixed acids)

f 2 to 8ml per minute in Pulse

mode 1 to 4 ml per minute in REAP mode

Operator program f 100 programs Storage f stored to non-volatile memory 10

Acid Fume Reduction

f Waste Acid Heat Exchanger to minimize acid fuming

SYSTEM MAINTENANCE

Acid mix ratios f 6:1, 7:2, 5:2, 9:2,

(nitric to sulfuric ratios)

other on request

Etch times

Secondary Containment

f Real Secondary Containment

f via RS232 or USB

SESAMELASERBASIC

f TableTop Equipment f Sesame1000 LASER quality fC ost-effective and Upgradeable

to 1000 or other

In collaboration with

SESAMElaser

TM

S500BASIC SesameLASERBASIC 500 (TableTop) S500GEL SesameLASERGEL 500 (TableTop) S500ULTRA SesameLASERULTRA 500 (TableTop) S1000 SesameLASER 1000 (TableTop) S1000FS SesameLASERFS 1000FS (LASER IR)

SESAMEDUOLASER

TM

S3000 An SESAME1000FS Plus an additional UV LASER (355nm), or Green LASER (532nm), or other wavelengths and impulsion time (on demand).

12 years experience with LASER DECAPSULATION

11

SESAMElaser

TM

LASER decapsulation The SesameLASER is the standard LASER ablation system that enables pre-decapsulation of packages.

Key applications for the SesameLASER. WHY GO TO LASER

Security is not in option for us. The suction unit we deliver in standard is a very good one with many protections for the Users and very quiet.

• Reduce time to opening • Reduction of the consumption of acid and the related risks.

• Allows removal of all the resin on the surface of a package (BGA for instance) which is impossible with wet chemistry.

• Lower temperature final clean up with chemical decapsulation. This is done at 40°C, or even 27°C and now 10°C ! which induces much lower thermal stresses.

• No more “wrapping in aluminum sheet” during manual opening and no more specific gaskets (opening shape).

• Single bonds can be revealed (Gold, Cu, Aluminum) • Marking and machining of other materials • Pre-thinning in Back-Side of ceramic packages • Numbering of the samples • Pre-cavitation of power devices • Circuitry can often be revealed without acid • Complex-shaped cavities can be made • Exposure of components without damage of Al, Cu, Au bondings • For applications requiring subsequent acid clean-up, low temperature, low corrosion conditions can be used.

• Glob top removal (flip chipped or wired dies on PCB or ceramic) • Gaskets Maker • Cross section preparation • Bonding cut • Thin PCB cut • Small cavity allowing visual check on a wire or on PCB or on stitch • Full BGA/QFN... decap down to PCB • Glued cover glass removal (ceramic package) • Silicon frame preparation (polishing preparation to decrease edge effect) • Disassembling of complex mechanical assembly by surgical cuts (motorized lens in front of ccd sensor, MEMS...)

• All bonding access for shear test • Allows reduced temperatures for wet decap and shorter opening times for Dry decap.

• Decap onto Hybrid Module • … a real Swiss knife

Our experience with laser decap dates back to 2001, allowing us to confidently say that there will be no damage to bond wires (Au, Al, Cu) and no artifacts during LASER decapsulation. Many papers describing this have been written by our Customers.

Other upgrade options include: A plasma option can be integrated (if requested) turning the SesameLASER into a SesamePLASER for which we have a Worldwide patent.

SesameDUOLASER (second LASER wavelength for Cross Section, other ablation material like Glass, PCB …).

The option SesameENDPT (End point detection) will also be adaptable to the S1000 in the near future.

The option SESAMECOLDMountPLATE (Temperature Control with a TEC).

And other… see options.

Many other LASER ablation recipes have been developed for all types of applications from the manufacturing of gaskets for JetEtcher, to the ablation of ceramic packages in the case of IC prototype, etc.

Pre-decapsulation of a package .

The remaining 100µm of resin on the Die will be removed with a mixture of H2SO4/HNO3 at 44°C. 12

Contact revealed on a memory stick (still active)

SESAMElaser

TM

In collaboration with :

The two leading manufacturers in the world of decapsulation by LASER ablation equipment are uniting their R&D efforts in order to present the new range of SesameLASER™ 2013.

The new range of SesameLASER™ integrates the best of hardware and software from CLC and DC, employing the same LASER source used for all the studies carried during the past 12+ years by DC, with 12 technique papers published at ISTFA, ESREF, IPFA, EPTC, IMAPS, …

UPGRADE

TECH TIP

As always, we take care about your previous investissement. You can upgrade your previous SesameLASER generation if elegible… or… trade-in.

The new features included : Hardwares • Programmable XY table • Holding Fixture W/ Tilt Feature • Real Time Color Vision System W/ 12X Programmable Zoom • High Resolution Camera • Cold Plate and Cool Blast • Auto-Stop Vision System • Gel Removal Software • New failure Analysis Pro Software • Fully automatic Calibration routine • Teach mode create a sequence inside a program

• 132 SesameLASER in WW from 2007 • 11 Technical Paper and 5 WW Chapter event presented (ask for your free copy) • ask for your application notes

The SesameLASER are protected by the patents 7,271,012 • 4,843,488 • ZL200480022971.0 • 1-2006-500131 • 2008090281A1 1

ALL SESAME LASER FAILURE ANALYSIS FIRMWARE SUPPLIED, CONTROL UNIT - Machine vision of component prior to ablation - Data import function (X-Ray or Sam images, co-ordinates) - Functions for alignment (right, left, symmetrical, or justified) - Mirror effect, extend, compress, shift and free choice of the positioning angle - Multi-GB HD / DVD Read-Write / USB Port

LASER RADIATION SAFETY CABINET, DRAW UP DEVICE FOR INORGANIC AND METAL PARTICLES - Compact design, small footprint (conforms to Class 1 LASER) - Draw-up Included: pre- filter and main filter for floating particles with automatic dust removal through the filter.

LASER SOURCE, BEAM DÉFLECTION SYSTEM - Sealed IR Laser Module enclosed in a CDRH Class I Workstation - High accuracy galvanometric system with variable focal distance, interchangeable - Marking area dimension : 112 x 112 mm. Motorized Z-axis

13

SESAMElaser

TM

S500BASIC S500 Laser Ablation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple die.

At the system’s heart is a Sealed IR Laser Module enclosed in a CDRH Class I Workstation.LASER, which is housed inside a chamber to provide full protection from LASER radiation, in compliance with applicable VBG 93, DIN EN, and CE standards.

The integrated optical vision system provides constant sample monitoring.

A previously- taken X-Ray or an Acoustic Microscope image can be superimposed onto the SESAME’s live component image to provide additional data for successful decapsulation.

SESAME 500’s intuitive Failure Analysis software incorporates drawing tools for definition of the material to be removed which can be draw onto the component image. The actual amount of material removed can be measured by camera focal-depth techniques or by using an external mechanical indicator.

The system’s firmware controls all process parameters such as power, frequency, scan speed, focal distance…

KEY APPLICATIONS - Encapsulant removal from ALL types of packaged device - Decapsulation and Cross-sectioning of PCB’s - Pre-cavitation of power devices - Multi decap on IC Tray PRODUCT HIGHLIGHTS - Circuitry can often be revealed without acid - Complex-shaped cavities can be produced - Exposure of components without damage of Al, Cu, Au - In subsequent acid clean-up operations, low temperature, low corrosion conditions can be used.

LASER Ablation of a power device.

The 100µm of resin will be removed with H2SO4 at 80°C

All process parameters can be stored by specific component and product family for easy recall.

Following laser ablation, the die surface can be revealed with a low temperature wet etch, applied either manually (with a suitable dropper) or automatically (with an automated acid decapsulation machine), avoiding electric and mechanical alteration of the component.

SOT-223

Ceramic backside opening

3 STEPS

TECH TIP

• pre decap, • decap, • post decap.

All these steps are important.

Do not undervalue any of them !

14

SESAMElaser

TM

S500ULTRA The S500Ultra utilizes and incorporates industry standard testing methods to solve the problems faced everyday in the Semiconductor Industry. The S500Ultra utilizes a patent pending multi wavelength Laser process in conjunction with the latest Alpha Spectrometry. The S500 Ultra provides a multitude of safe and economical processes.

The operator can remove the entire compound, individual layers (operator determines layer thickness) or sections of the mold compound (operator defined).

S500GEL Laser decapsulation system engineered with a patent process specifically for the removal of different types of gel encapsulants from the surface of an integrated circuit.

Unlike anything on the market today, the S500GEL laser decapsulation system will remove just about any type of gelbased mold compound found on even the most durably-built samples. Seen frequently in the automotive manufacturing industry and United States Military and Defense sectors for its robust and hermetic-sealing properties, historically speaking gel encapsulant has been notoriously difficult to remove by other means. The S500GEL decapsulation system puts an end to this problem with its proprietary gel removal technique not seen in any other system; only the S500GEL laser decapsulation system can perform this elite function. In literally seconds, the S500GEL can remove that pesky gel mold compound so that you can be on your way with your testing.

Whether that testing comprises failure analysis or counterfeit detection, the die will retain complete functionality and remain in perfect condition â&#x20AC;&#x201D; as if it had just been scribed from its wafer.

15

SESAMElaser

TM

S1000

In collaboration with :

Imagine an equipment with all the future techniques available. S1000 is the one. The single wavelength will be your only limitation.

Many options will be fully retrofittable at your site.

- The most used and most published

S1000FS Based on S1000 FS with more space inside for all options available such as plasma end decap (SESAME PLASER), additional LASER source for efficient cross sectioning (S3000) and automatic LASER end stop (S4000). All these options can be integrated into SESAME 1000 FS, making it a turnkey system for TOTAL DECAPSULATION.

- Plasma Option.

Incorporates Mutual Patents and IP developed by CNES, DIGIT CONCEPT SA and BSET EQ

16

SESAMEDUOLASER

TM

S3000 A n S1000 FS with an additional UV LASER (355nm), Green LASER (532nm), or other wavelengths and impulsion time at the begenning.

ALL WAVELENGHTS, AND PULSE DURATION ARE AVAILABLE CHOOSE YOUR SECOND LASER WAVELENGTH FOR...

- IC Cross-Sectioning - Bond and PCB Cutting

SESAME LASER ON REQUEST

TECH TIP

You need a special oneâ&#x20AC;Ś we can do it!

What are the differences between ?

High Accuracy Frame FS (Freestanding with legs) 10X Zoom (Manual) 12X Programmable Zoom (50mmx 50mm field) X -Y Automatic Tables Programmable Z (Laser moves) 200mm Programmable Z (Part moves) Cross Section Module (Req. Prep for 2nd Laser) High Res (5X) Imaging Prep for 2nd Laser Intelligent Vision System (Auto Stop)

S500BASIC

S500GEL

S500ULTRA

S1000

S1000FS S3000

N/A

O

N/A

Y

Y

Y

O

O

O

Y

Y

Y

Y

Y

N/A

N/A

N/A

N/A

O

O

Y

Y

Y

Y

N/A

N/A

N/A

O

O

Y

N/A

N/A

Y

Y

Y

Y

O

O

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

O

Y

N/A

O

O

O

O

O

N/A

N/A

N/A

N/A

O

Y

N/A

N/A

O

O

O

O

N/A Non Applicable O Option

Y

Included

17

SESAMElaser

TM

STANDARD Equipment for SESAME 500 & 1000 Suction Unit for inorganic and metallic particles is Standard Effective and powerful removal of particles coming from the processed material after decapsulation operations. f incl: pre-filter element and aerosol filter f Suction capacity: 20 – 250 cbm/h f Electrical connection: 100-240 V (50/60 HZ) / 1,2 kW f Noise emission: 64 dB(A) f Weight / color: 26 kg / RAL 7035 f Dimensions (LxWxH): 350 x 350 x 690 mm

VISION MODUL Real Time Color Vision System

STANDARD Equipment for SESAME 1000 Visualization by Mpixel camera A very accurate system of aiming enables to position on the electronic component, the area that will be decapsulate. Real Time Color Vision System W/ 12X Programmable Zoom.

X Axis control & X-Y sample Holder (SESAME1000 ONLY) Programmable Z-Axis Holding Fixture W/ Tilt Feature

18

The workstation support base is of a solid mechanical construction; fabricated from rugged aluminum components. Combination vibration/ isolation/leveling mounts support the base at each corner.

A universal chip holding fixture is mounted in the work handling area.

The Z-axis provides approximately 3” of vertical adjustment, allowing the chip being processed to be positioned at the focal point of the laser.

A vision system is mounted to the laser scan head, which will provide a co-focal, co-axial view through software. The camera is positioned to view an area which is on the same center line as the focused laser beam.

The work handling area is enclosed to comply with CDRH specifications for Class I laser systems. In compliance with CDRH specifications the laser assembly and work handling area are totally enclosed.

A door provides an opening, for access to the working area; for convenient parts loading, unloading, access for maintenance and part alignment. The enclosure door is electrically interlocked to the laser, inhibiting the lasing action when opened.

The CDRH enclosure contains an exhaust port and the associated plumbing required for the extraction of fumes and particles created by the lasing process. Plumbing originates at the lasing area and terminates at a 3” diameter port, located on the rear of the enclosure and connected to the suction unit.

SYSTEM - Sealed IR Laser Module enclosed in a CDRH Class I Workstation.

- 175mm X 175mm Scanning Area - 38mm X 38mm Processing Area - Manual Z-Axis - Self Centering Holding Fixture - Real Time Color Vision System W/ 10X Manual Zoom COMPUTER & SOFTWARE SYSTEM - Computer Based Controller - Multi-GB HD / DVD Read-Write / USB Port - Microsoft Windows Operating Environment - Flat Panel Display, Keyboard and Mouse - Failure Analysis Pro Software™ - Decapsulation Module

SESAMElaser

TM

All SesameLASER comes standard with Failure Analysis Pro Software, which is a comprehensive Windows based software package that enables a user to control all functions through simple easy to use graphical interface. Users have the ability to quickly and easily locate different shapes for defining the area for decapsulation. These results provide increased throughput and quality plus flexibility for multiple operations.

The following functions are available : f Alignment functions (flush left or right as well as centered or justified) f Mirroring, stretching, compressing, scaling and free choice of positioning angle f Possibility of consecutively numbering and incremental marking f Integration of all Windows True Type fonts f Importation of data from external CAD/CAM software like ArtCAM Type 3, or other common graphic software. f Many decapsulation parameters for typical semiconductor package are supplied.

19

SESAMElaser

TM

Optional Equipment for SESAME LASER • INTELIGENT VISION SYSTEM Auto-Stop - Provides the ability to stop the lasing process by recognizing contrasting features, such as wires to the mold compound. Auto - Calibration

• Coolplate Chip Holding Fixture • Auto – Calibration • Bench for S500 and S1000 • Gasket Making Module • Programmable 150mm X 150mm X-Y Table • High Resolution Color Camera System • Real Time Color Vision System W/ 12X Programmable Zoom

• Large Filler Diffuser

• Cross - Sectioning

Many of these options will be fully retrofittable at your site, with no need for return to DIGIT CONCEPT. 20

SESAMElaser

TM

Optional Equipment for SESAME LASER JEDEC TRAY Do all ablation decap in one shot.

LASER Ablation of IC on JDEC tray

SESAME PLASER Turn your S1000 FS into a complete decap equipment with this option.

APPLICATIONS • Encapsulant removal from ALL types of packaged device • Complete decapsulation down to die

KEY BENEFITS - Passivation can be reached without damage - Excellent selectivity to keep copper wires and/or metal layer - Only one tool: cost, time, footprint reduction

SESAME Technology incorporates Mutual Patents and IP developed

by CNES, DIGIT CONCEPT SA and BSET EQ

S2000 PLASER optional

(version 2012)

Specially designed for decapsulation by Plasma with FillerBlast™ has been integrated into your SESAME1000FS allowing complete decapsulation without acid.

Included : f Plasma Chamber with automatic door f FillerBlast™ f Vaccum pump and Filter for particles f 3 Mass Flow Controllers for O2 and CF4 f RIE and ICP (Inductive Coupled Plasma) f RF300W generator f Control Unit with automatic RF tune & Baratron vacuum Gauge f Thermal regulation of the sample stage (20/100°C) f Mechanical parts for adaptation on SESAME1000

In collaboration with :

21

is ALSO EUROPEAN EXCLUSIVE DISTRIBUTOR for the following brands f PACKAGE PREPARATION TECHNIQUES: f Mechanical Backside thinning f LASER package access

f INSPECTION: f IR, UV, LASER, ARC, AFP

f THERMAL / ELECTRICAL ANALYSIS: f LC, FMI, MOIRÉ, PHOTOEMISSION, SIFT, LASER Scan, AFP

f PHYSICAL ANALYSIS: f Delayering by Plasma, Mechanical, Polysaccharides f Cross section

f PACKAGE DECAPSULATION TECHNIQUES: f Acids, Plasma, Mechanical, LASER Ablation

ATOMIC FORCE PROBE (AFP II)

f FA ACCESSORIES AND CONSUMABLES

Nano-Probing

ARC-LITE

ARC coating system

ASAP-1S UC & IPS Back-side preparation and pre-decapsulation

ULTRAPOL ADVANCE UC Submicronic parallel Polisher with ULTRACOLLIMATOR

SIFT, LASER SCAN, EMMI BACK-SIDE, MOIRE, FMI, THERMAL 22

Suitable according to the requirements

NT3

Plasma Cleaner

ULTRASLICE Precision Saw Cross-section

SP8

Plasma Cleaner

In collaboration with :

SESAMEPLASMA

TM

FA2000P TableTop Plasma Decapsulation S2010 SesamePLASER FS S210 SesamePLASMA RIE RIE TableTop

15 years experience with PLASMA DECAPSULATION

23

SESAMEplasmaDCAP

TM

FA2000P

In collaboration with :

Decapsulation - Industry leader and I.P. forerunner - First and only qualified system to interface with patented laser decapsulation technology - Etch rates for many compounds more than 1 mil per hour - Fastest removal of epoxy and plastic molding materials - Uses unique FillerblastÂŽ technology

Versatile Onboard User Interface Key Features - Industrial computer running win XP - Hard drive storage - 9.5â&#x20AC;? display - IR keyboard w/pointer - 8 quick keys at front panel - Easy setup of advanced features - Display of all parameters simultaneously - Unlimited process storage with multi stepping - Process notes for every process or step - Error checking with diagnostics - Storage transfer via usb or ethernet

THE BSET USER INTERFACE IS THE RESULT OF MORE THAN 12 YEARS OF DEVELOPMENT. The interface was developed through our customers requests and almost all modifications were performed free of charge. We seldom have any requests for change anymore which indicates a well designed inteface.

24

The results are conclusive, bset tools have an unsurpassed onboard interface with features found nowhere else in our class. The interface appears in English, French and Japanese languages.

SESAMEplasERFS

TM

In collaboration with :

S2001FS

- Plasma Final Decapsulation Unit for Plastic IC Packages PLASER offers final decapsulation for precavitated plastic IC packages of most types and sizes. Proven to work with copper and other technologies, PLASER allows final ‘dry’ decapsulation, down to the die surface, without the use of acid. PLASER uses a novel design incorporating BSET EQ’s Plasma recipes, and FillerBlast™ technology PLASER is available in a standalone format, that can be added to any decapsulation lab toolkit.

PLASER is also available as a fully integrated system into the S1000 LASER. The combined tool is dubbed S2000.

PRODUCT HIGHLIGHTS - Available in STAND-ALONE or INTEGRATED versions - Adds Final Decapsulation Capability with no acid required - Enables Turnkey decapsulation -- in a single footprint (SESAME2000) - Large Chamber Size -- allows for multiple parts to be processed simultaneously Release 2013 for higher volume decapsualtion.

- Etch faster - Less damage - Less RF Power The most faster one - Build in / Industrial Grade - Automated - Vision control - small % of CF4 - Intuitive Use - 5 years research - ready to move to S2000LASER

ITEM Main Unit Material Removal Method

(SESAME Technology incorporates Mutual Patents and IP developed by CNES, DIGIT CONCEPT SA and BSET EQ)

DESCRIPTION PLASER Plasma Chamber with automatic door Plasma and BSET FillerBlast™

Filtering

Vacuum pump and Filter for particles

Mass Flow

3 Mass Flow Controllers for O2, CF4 and other gases

Plasma type

ICP (Inductive Coupled Plasma) + RIE for stand alone

RF Control Unit Controls Sample Thermal control Additional items FREE-STANDING SYSTEM

RF 300W generator Automatic RF tune and Baratron vacuum Gauge Independent color LCD touchscreen gathering all the controls Thermal regulation of the sample stage (20/100°C) - option Mechanical parts for adaptation onto the SESAME1000 Please note that PLASER is also available as a free-standing floor unit, for use with SESAME and other pre-cavitation systems -- Footprint 32”W x 24” D x 42» Tall 25

SESAMEPLASMARIE

TM

S210

In collaboration with :

Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated.

The system is capable of using any non-corrosive gas and uses mass flow controllers with precise gas mixing.

This is important to achieve selectivity and other issues requiring attention in the de-passivation of devices

ICP option Characteristiques - Baratron gauge - Microprocessor control withunlimited recipe storage - 9,5 SVGA display, parallel,serial, and external SVGA port - Software and hardware safety interlocks - Anodized Aluminium Chmaber and fixtures - CE certified DCVWR-RE104 : CHILLER - Maximum flow 1l/min, maximum pressure : 0,4 bars Failure Analysis for Semiconductors - Passivation removal - Isotropic polyimide removal, anisotropic or isotropic silicon nitride removal - Removal of interlayer dielectrics - packages and 150 mm or 200 mm wafers accommodated - Unsurpassed tabletop performance in single wafer cleaning, stripping, etching or reverse sputtering Other Applications - Research and development - Manufacture of wafer probe cards - Patterning and trenching in various materials - Material science Product Highlights - Quad input manifold provides uniform conductance of process gases and high etch uniformity on wafers - Operation within a wide pressure band enables fast isotropic etching at higher temperatures and exceptionally clean anisotropic etching at lower temperatures - Operation within a temperature range from 0 - 125°C enhances etch rates and selectivity - I.C.P , endpoint detection and other advanced options 26

Inductive Coupled Plasma

IPC option Independent pressure controller. The IPC monitors and controls the vacuum level for have a stable pressure level for an reproducible recipe.

OIL FILTRATION option DCBS-OilFiltr : Oil Filtration with oil

ENDPT option DCJY-G50 : OPTION LASER INTERFEROMETER DIGILEM G50 MANUAL. -C CD Camera, LASER Interferometer : magnification X50, LASER diode : 670nm spot size : about 50 micro millimeters.

-C ontrolled with a 15â&#x20AC;&#x153; screen, keyboard, mouse, computer with HD - Special software -M odification of the FA2000 lid : addition of a sapphire window and mounting of the camera + all necessary securities - Integration of a End of Etch in the software.

OTHER SESAME SESAMEcleaner

TM

S101 SesameCLEANER

SESAMEMECHANICAL

TM

S401 SesameGASKETMAKER S410 SesamePLATEMAKER

SESAMETHERMAL

TM

S601 SesameCOLDMOUNTPLATE S610 SesameHOTMOUNTPLATE

20 years experience in SAMPLES PREPARATION

27

SESAMEcleaner

TM

S101

In collaboration with

is a spinner used for the cleaning of integrated circuit devices between backside processing steps.

A high-pressure dispensing pump sprays the device being cleaned with different cleaning solutions while the device is rotated at high speed. The force of the spray dislodges debris from the grinding, lapping, and polishing process while the rotation of the part removes this debris from the die surface.

Both waste liquids and debris drain into a waste bottle located on the side of the unit next to the solution source bottles.

A typical cleaning process has a source bottle containing D.I. water and another containing a solvent e.g. isopropanol.

The part to be cleaned, while mounted to its holding fixture, is placed on the spindle and the safety cover closed. The part is spun at the programmed RPM and the pump dispenses the solvent for a programmed time. The device is then rinsed with D.I. water and finally dried with either dry nitrogen gas or compressed air.

The entire process occurs in a closed chamber eliminating any safety issues resulting from an improperly mounted device.

The device and its holding fixture are always cleaned together, thus eliminating the need to re-mount the device. This of course reduces the chance of transferring any diamond particles into the next â&#x20AC;&#x153;backsideâ&#x20AC;? processing step. A special process is included that allows for spinning of the device without any dispensing of cleaning liquids. This process can be used for applying anti-reflective coatings on a die that has been completely polished.

PRODUCT HIGHLIGHTS - Effectively cleans devices during backside processing - Self contained - contains source and waste bottles - Part is cleaned on its holding fixture, cleaning both - Part does not need to be re-mounted - Easy to use operator interface - Special cycle for Anti Reflective coatings - Up to 30 stored process programs

28

Specifications : Spinner programming range RPM control accuracy RPM repeatability Clean dispense rate Rinse dispense rate DI clean process time Solvent clean process time Rinse time Bottle volume Size Weight Facilities requirements Power CDA/nitrogen 1000 to 6000 RPM +/- 5% +/- 2% 7 ml per minute 9.5 ml per minute programmable from 0 to 60 seconds programmable from 0 to 60 seconds programmable from 0 to 60 seconds 250 ml 11 inches high X 11 inches deep X 11 inches wide (280mm X 280 mm X 280 mm) 22 pounds ( 10 Kg) 95 to 260 Vac, 49-61 Hz 4 amps max 37to43PSIat10CFMmaxflowrate

SESAMEmechanical

TM

SesameGASKETMAKER S401 AND S410

In collaboration with

why buy expensive gaskets and alignment plates when you can easily make them yourself now?

The S401/410 is a high precision, micro-machining tool designed for producing accessories and fixtures for dual acid decapsulation systems.

The S401/410 produces gaskets and alignment plates of any custom design.

Key measurements of the package to be decapsulated are entered into the controller. For advanced operations the S401/410 can be connected to a PC via a standard serial port. Complex gasket or various custom device machining operations can be performed through direct G code execution from a PC. The simple interface allows fast set up time to create these accessories. From set up into the controller interface to finished product, gaskets can be made in as little as 3 minutes.

The S401/410 comes complete with gasket holders for 1.00 inch (25.4mm) and 1.375 inch (34.9mm) diameter gaskets; a Tool Holder and Tool Height Gauge; Digital Precision Caliper Software and a selection of gasket material.

Metric tool holders can be substituted for English measurement holders at no extra charge.

WHAT KIND OF MATERIAL

TECH TIP

< 7 Treated (pronounced â&#x20AC;&#x153;sub7â&#x20AC;?) AFLAS gasket blanks are available in 1 and 1,3/8 inch diameters and in three thicknesses ~ 0.031, 0.062 & 0.094 inches.

Benefits - Elimination of lead time in procuring gaskets and other accessories for acid decapsulator systems - Increased productivity with various custom package for decapsulation - Flexibility in producing various accessories and capable of device machining operation Features - User friendly interface with various selection of defnition and monolithic gaskets.

- Precut defnition gaskets for RKD, Technology and NSC decapsulators.

- Special programmable mode for making complex gaskets and/or device machining operations.

- Removal of heat sinks - Cut standard and/or BGA alignment plates.

- Second bond plastic removal.

- Machine device holding fixture.

- Selected Area Mechanical Decapsulation.

- S410 : Alignment plate for ACID and PLASMA Decapsulators

29

SESAMEmechanical

TM

Do not forget these two tools S410 TO OPENER

S420 CDIP OPENER

SESAMEthermal

TM

SesameHOTMOUNTPLATE S610 Is a specially designed hot plate used for wax mounting of integrated circuit packages in preparation for backside thinning and polishing.

The unit heats the sample holding fixture at a controlled rate thereby preventing thermal damage to the sample during mounting. When the programmed temperature is reached, the operator is prompted to mount and align the sample. After alignment and mounting the unit cools the sample and holding fixture at a controlled rate to harden the mounting wax.

When the sample is cooled to room temperature, the operator is prompted to remove the mounted device and holder.

In collaboration with

30

SPECIFICATIONS - Temperature programming range 30 to 140 degrees C. - Hea@ng ramp rate Programmable from 0.1 to 0.8 degrees per second - Cooling ramp rate Programmable from 0.1 to 0.8 degrees per second - Soak @me Programmable from 1 to 60 seconds - Rest temperature 30 degrees C nominal - Temperature accuracy +/‐ 1.0 degrees C - Size 5.5 inches high X 6.5 inches deep X 11 inches wide - (140mm X 165 mm X 180 mm) - Weight 10 pounds ( 4.6 Kg)

SESAMEthermal

TM

SesameCOLDMOUNTPLATE S601 Temperature Control with Thermoelectric Cooler (TEC).

• Holds package with low mechanical stress • Reduces ESD • Cools down package during LASER ablation* (See IPFA2010 Technical Paper from NTU Singapore) Included: - Sample holder with a TEC - Temperature Controller 50/60Hz 150W Features - Accurately controlled sample temperature - Controlled heating rate to minimize thermal stresses - Controlled cooling rate - Fast cycling - Easy to use operator interface - Special cycle for manual acid decapsulation - Low profile - can be placed under a microscope

Temperature Control with a Thermoelectric Cooler (TEC) during Laser Decapsulation of Plastic Packages

Nanyan

Pho

Abstract – Ablation was carrie rectifiers at 25°C and -5°C (with a at 1.0 W and 3.9 W of laser pow reverse current was conducted junction temperature. It was fo increases the number of laser s compliance of 100 µA after exposi Ab although eventual damage to the incorporation of a TEC below the recti be effective in reducing the devic at 1. laser ablation.

H. B. Kor, A. C. K. Chang and C. L. Gan

I.

Nanyang Technological University, School of Materials Science & Engineering, 50 Nanyang Avenue, Singapore 639798.

Phone: (65) 65141035 Fax: (65) 67900920 Email: hbkor@ntu.edu.sg

I.

INTRODUCTION

With the continual shrinking of devices and the introduction of new materials such as copper bond wires [1], chemical, mechanical and plasma decapsulation [2] have nearly reached their limits. For instance, chemical decapsulation may damage the copper bond wires, the die or interconnections, since it is isotropic in nature [3, 4].

Laser decapsulation is a promising failure analysis (FA) technique, which works with high speed and precision. Besides, it minimizes the effects of corrosion and overetching of leadframes [2-4]. Apart from being able to alleviate some of the problems of chemical, mechanical and plasma decapsulation, laser decapsulation is not constrained by geometry and it provides a good selectivity of plastic ablation over metals [5].

However, laser decapsulation may cause thermal stresses [2], damages to metallization or passivation [4], and thermal elevation or electrostatic damages (ESD) [6] to devices.

Therefore, the aim of this work is to investigate the effectiveness of incorporating a thermoelectric cooler (TEC) on a cooling plate below the sample during laser ablation to reduce the thermal effects.

II. EXPERIMENTAL DETAILS A. Experimental Setup The laser decapsulation system used in this project is the Sesame 1000 from Digit Concept, with a Nd:YAG laser (1064 nm) and a maximum power of 10 W. The sample is a high voltage power Schottky rectifier STPS80170C comprising two diodes, as shown in Fig. 1.

reve INTR junc incre

With the continual shrinking of new materials such ascomp copp altho mechanical and plasma decapsu their limits. For instance, chemi incor the copper bond wires, the die be e isotropic in nature [3, 4].

laser

Laser decapsulation is a pr technique, which works with hig it minimizes the effects of c leadframes [2-4]. Apart from bei problems of chemical, mechaniW laser decapsulation is not con n provides a good selectivityof of pla

mec

However, laser decapsulatio theiro [2], damages to metallization elevation or electrostaticthe damc Therefore, the aim of this work is isotr of incorporating a thermoelectr plate below the sample during thermal effects.

L

tech II. EXPERIMEN

Fig. 1. High voltage Schottky rectifier comprising two diodes.

Figure 2 shows the linear relationship between the reverse current and the junction temperature of one of the two diodes at an applied reverse voltage of 100 V, which was re-plotted from the graph of reverse leakage current versus applied reverse voltage (per diode), from the sample data sheet [7].

Reverse Current ()

Abstract – Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 µA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.

Temperat Cooler (T

10

4

10

3

10

2

10

1

10

0

Temperature Control with a Thermoelectric Cooler (TEC) during Laser Decapsulation of Plastic Packages H. B. Kor, A. C. K. Chang, and C. L. Gan IPFA 2010

Temperature Control with a Thermoelectric Cooler (TEC) during Laser Decapsulation of Plastic Packages 1

it m

A. Experimental Setup lead The laser decapsulation syste prob Sesame 1000 from Digit Concep nm) and a maximum power of laser voltage power Schottky rectifier diodes, as shown in Fig. 1.prov

H [2], elev Ther of in plate therm

A. E T Sesa nm) volta diod

H. B. Kor, A. C. K. Chang, and C. L. Gan 20

40

60

80

100

120

140

IPFA 2010

160



Junction Temperature ( C) Fig. 2. Graph of reverse current vs junction temperature at an applied reverse voltage of 100 V for one diode.

The relationship of the reverse current versus junction temperature at an applied reverse voltage of 100 V is obtained by a linear fit as given in Equation (1).

Log Ir = –0.0383 + 0.0322T.

1

(1)

where Ir is the reverse current and T is the junction temperature in C.

31

7 Expertise Centers

Orlando

â&#x20AC;Ś

2, Chemin Saint Sulpice - 14740 SECQUEVILLE EN BESSIN - FRANCE +33 (0) 231 354 354 - info@digit-concept.com - www.digit-concept.com

All non-DC brands products, processes and trademarks mentioned or illustrated in this brochure remain the property of the respective owners.

Artwork : LE KLUB.fr - November 2012 - DC-2012-0316 REV. A3 - Data contained in this document can change at any time. Consult Digit Concept or Representative for latest information

FA Knowledge - 20 years in Wet Decap, - 12 years in LASER decap - 15 years in Plasma Decap Assured Safety - High level suction unit Upgrade Path - all Sesame options Worldwide Support - 6 Sesame Labs Low Price - Sesame500, Sesame707 LASER - High Quality, High Pulse repitition rate Technology Leader - 12 international scientific papers Recipes and Protocols - Best known techniques for most package types and bonding types German quality and robustness

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