Product News TeraStar SLF77
The TeraStar SLF77, the latest version of KLA-Tencor’s series of advanced reticle inspection systems, provides high-performance, high-sensitivity die-to-database inspection that meets critical layer requirements for 130 nm production and 100 nm research and development. Database rendering capabilities include advanced database modeling, high-precision algorithms, and high-speed image-computing hardware. Reticle defect detection features include advanced Tera algorithms that enable high-sensitivity inspection and low false-defect counts. Advanced image-computing capabilities allow inspection of small linewidths and optical proximity correction (OPC) features, including sub-resolution assist features.
TeraPro HP high productivity mode
The TeraPro HP High Productivity Mode, a feature of the TeraStar SLF77 reticle inspection system, provides pattern, contamination and must-be-black (MBB) border inspections all in one inspection, saving time and increasing productivity. This multi-faceted inspection using MBB inspects for yieldkilling pinhole defects in the opaquing border, eliminating the need for an extra inspection. With TeraPro HP, multiple algorithms now run concurrently in multiple areas. Concurrent inspection modes—STARlight and die-to-die or STARlight and die-to-database—save time by reducing the number of inspection passes performed in the reticle flow.
Viper 2430
The Viper 2430 is an automated macro-defect inspection system for inspecting 300 mm wafers using a multi-channel, multi-algorithm setup to capture yield-limiting defects at design rules of 0.13 µm and below. Built upon the extensive knowledge base developed in the field with customers who use the 2401 (the Viper 2430’s predecessor), this system is ideal for process modules such as litho, CMP, and etch, or in passivation and final inspection. It also captures defects in advanced processes and materials such as copper dual damascene, low-κ dielectrics, and silicon-oninsulator (SOI). The Viper 2430 plays an important role in a fab’s overall strategy to improve yield because it also monitors process excursions. It complies with all I300I factory-automation standards for immediate and seamless integration into the 300 mm production environment. For rapid dispositioning of wafer lots and faster root-cause analysis, the Viper 2430 features inline binning and flexible, on-board review capability that allows users to view individual defect images, wafer maps, wafer images, and galleries of wafer maps. 66
Winter 2002
Yield Management Solutions