Magazine summer98 p30

Product News Klarity Automated Defect Data Analysis Module

For the first time Klarity, KLA-Tencor’s new automated defect data analysis module, allows semiconductor fabrication facilities, to automate analysis of defect data generated by inspection and classification tools. This new yield analysis module allows users to automate complex engineering methodologies using simple flowcharts, in effect, transferring expert engineering knowledge and defect analysis routines to fab operators. Such automation enables the user to quickly analyze huge volumes of defect data and helps reduce the defect data set to represent only the most critical yield deterrents. Implementation of Klarity at key customer sites has resulted in dramatic reductions in cycle time and significant improvement in engineering productivity. Offered as an enhancement module to KLA-Tencor’s Quest Defect Data Management System, Klarity improves the operating efficiency of wafer fabrication facilities by providing more relevant information in less time and with less effort. circle RS#014

SP1TBI Unpatterned Surface Inspection System

KLA-Tencor’s Surfscan SP1TBI (Triple Beam Illumination), a new addition to the company’s Surfscan family, is the only 300 mm unpatterned wafer inspection system that meets all the advanced development and production inspection needs of IC manufacturers, material manufacturers and equipment manufacturers in one system. It combines normal and oblique illumination with brightfield capabilities into a single system. Combining these illumination techniques allows comprehensive detection and classification of scratches, particles and other defect types on all types of unpatterned surfaces from bare silicon to extremely rough films. The SP1TBI also provides significantly enhanced sensitivity and capability to distinguish crystal-originated particles (COPs) from surface particles. Further, it incorporates an optional brightfield channel based on Nomarski differential interference contrast technology enabling unprecedented capture of non-scattering defects such as mounds, dimples and sliplines. These capabilities provide the surface quality and defect information critical for the development and production of 0.18 and 0.13 µm devices. circle RS#013

ILM-2230 Oblique Darkfield Imaging Inspection System

KLA-Tencor’s ILM-2230, the industry’s highest performance darkfield patterned wafer inspection system for production line monitoring, is optimized for advanced interconnect processes inspection applications, such as CMP. The ILM-2230 combines, for the first time, oblique angle darkfield illumination with small-pixel, high data rate image processing to provide superior capture rate, at high throughput and with a low nuisance defect rate, of a wide range of yield-critical defect types at 0.25 µm and smaller geometries. It complements KLA-Tencor’s 2138 ultra-broadband brightfield technology and shares industry-standard IMPACT/Online ADC and recipe portability with the 2138. circle RS#012 30

Summer 1998

Yield Management Solutions

8300 CD SEM

To meet the challenges of CD measurement requirements for 300 mm wafers, KLA-Tencor introduces the 8300 CD SEM, an extension of the 8100 CD SEM product line. Building upon the success of the 8100XP’s field-proven electron optics, the 8300 provides: superior imaging at the bottom of very high aspect ratio contact holes and excellent measurement precision on even the most difficult layers for tight process control. By incorporating the modular KLA-Tencor RITe loader, the 8300 CD SEM is available with dual FOUP (13 or 25 wafer) or dual cassette configurations. To assist in the process transfer from 200 mm to 300 mm fabs, 200 mm wafers can be accommodated as well.

Advanced networking and automation capabilities enable the 8300 to set new standards in productivity and system utilization. With the highest throughput in its class, the 8300 CD SEM provides the lowest cost-of-ownership. circle RS#024

STARlight SL3 Reticle Inspection System

KLA-Tencor’s STARlight SL3 reticle inspection system provides consistent contamination inspection for the life of the photomask. Frequent photomask inspections help prevent mask degradation that can cause wafer yield excursions or decreased yield value from lower device performance. The SL3 performs final inspections at the mask manufacturer, as well as mask inspections at wafer fab incoming quality control and photolithography process re-qualification. Using patented STARlight technology, the SL3 provides the highest sensitivity on detecting elusive “soft” defects on advanced reticles. This system is ideal for the wafer fab environment, with its smaller configuration, increased automation and sophisticated integration with KLA-Tencor’s Reticle Quality Management (RQM). circle RS#017

353UV Reticle Inspection System

KLA-Tencor’s 353UV is the first ultraviolet-based reticle inspection system for DUV lithography. It combines a new high-resolution UV laser optic and improved sensitivity algorithms to inspect binary, optical proximity correction (OPC) and phase shift masks. Advanced reticles have become much more complex in design and their use of pattern enhancement techniques. The 353UV detects subtle pattern errors below 180 nm, including those within sub-resolution features. It also provides new defect highlighting capabilities which help to ensure reticle defects are not overlooked or misclassified. The result is the highest sensitivity and reliability of advanced reticle inspection for DUV lithography. circle RS#017 Summer 1998

Yield Management Solutions

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