Product News AIT II In-Line Defect Inspection System
The industry’s first 300 mm bridge tool for sub-0.18 µm design rules, the AIT II offers exceptional defect sensitivity, high throughput and low cost-of-ownership for fast and accurate feedback on process tool performance as well as advanced line monitoring for films, CMP, non-critical etch and photo modules. The AIT II detects particle and pattern yield-limiting defects at up to 40 wafers per hour at maximum sensitivity, independent of device type. Further, the system’s MultiSpot™ feature provides tremendous inspection flexibility by offering multiple, operator-selectable sensitivity setting options — large, medium, and small spot — that can be optimized based on whether the inspection system is used for line monitoring or tool monitoring. circle RS#030
2401 Automated Macro Defect Inspection System
KLA-Tencor’s 2401 system is the industry’s first fully automated inspection system designed to detect yield-killing macro defects (50 µm and larger) generated in the lithography process. Replacing current manual after-develop inspection (ADI) methodologies where operators miss up to 80 percent of photo-related defects, the 2401 enables reliable and repeatable detection of critical macro defect types, preventing further investment in low-yielding wafers and dramatically reducing scrap/yield loss further downstream in the manufacturing process. In addition, the 2401 system allows advanced production and engineering analysis never before possible using manual macro ADI, enabling continuous process improvements for maximum ROI in minimum circle RS#034 time. FabVARS 500 Digital Image Management System
To serve the current image management requirements in the semiconductor industry, the FabVARS 500 stores and retrieves images generated from a broad variety of on-line and off-line image generating systems. While previous generation systems accepted and stored images only in analog format, the recent migration of many image producing systems to a pure digital format has rendered this capability inadequate. The FabVARS 500 accepts and stores both analog and digital images in a digital format, enabling the system to be connected to a wider variety of tools and yield enhancement systems. This in turn allows wider deployment within manufacturing facilities for faster resolution of yield problems. SEMSpec Random Mode
KLA-Tencor’s SEMSpec advanced e-beam inspection system enables faster time to results with its unique voltage contrast capabilities and 0.1 µm sensitivity for sub-0.25 µm fabs. It meets the challenges of today’s high aspect ratio structures, new materials and damascene processing. Engineers quickly identify killer defects with advanced SEM-based inspection in Array mode. For increased capability and additional flexibility, SEMSpec now offers Random mode, or die-todie comparison. Without being limited to repeating array features, a larger part of the device can be inspected. With increased capabilities in advanced e-beam inspection, SEMSpec continues to add value and a strong competitive edge for process development, process transfer, and line auditing in leading-edge fabs. circle RS#010 50
Spring 1999
Yield Management Solutions