Magazine spring03 product news

Product News CDExpress

This run-time regression software option on the SpectraCD spectroscopic CD metrology system significantly reduces time-to-results in R&D environments compared to offline library generation systems. While most advanced CD metrology systems can perform run-time regression, CDExpress is unique in that it uses SE data and runs completely on-tool without the need for expensive computer clusters dedicated to each metrology tool. CDExpress has also demonstrated exceptional performance in terms of precision, stability, and MAM (move-acquire-measure) time.

TeraSim

TeraSim, an option available with the TeraStar reticle inspection system and the previous-generation 300 series, is the semiconductor industry’s most advanced reticle defect printability software solution. Leveraging KLA-Tencor’s industry-leading PROLITH lithography simulation technology, TeraSim provides optical lithography modeling capabilities that ensure correct defect dispositioning, enabling improved reticle yield through reduction in reticle defect repair. TeraSim enables mask makers and IC manufacturers to reduce the number of defect review and repair steps, while improving reticle yield and cycle time without impacting wafer yield.

Alpha-Step IQ

The Alpha-Step IQ state-of-the-art, stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for pilot lines and materials research with guaranteed 8Å (1σ) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ provides the best repeatability and performance to analyze and monitor processes. This system offers the most complete suite of two-dimensional analysis features for topography on a variety of surfaces including semiconductor wafers, C4 bumps, MEMS, ceramics, SIMS craters, microlenses, and displays. The Alpha-Step IQ features advanced and customizable two-dimensional analysis capabilities that can measure step heights from 10 nm to 2 mm in vertical range. Software is available in English, Japanese, Mandarin, German, French, Italian, and Spanish, making it easy for customers with a worldwide presence to communicate their results, free of possible error in data interpretation.

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Spring 2003

Yield Management Solutions

Klarity ProDATA v1.4

With the inclusion of new functions and capabilities, Klarity ProDATA version 1.4 software redefines the state of the art in advanced lithography data analysis.

Important new benefits to users include instantaneous viewing of SEM wafer map images to study across-wafer variation of CDs when accessing either the current NT-based, or earlier Mac-based, KLA-Tencor CD SEM data; MackCD fitting function for CD that requires fewer parameters for a fit, improves noise filtering, and creates a lithographically intelligent fit to FE data; polynomial fitting functions for sidewall angle and resist loss data that now support scatterometry (SpectraCD) datasets; focus-exposure process window creation from raw data, without fitting; and weighting factors that automatically weight KLA-Tencor CD SEM data points for more accurate fit and process windows. µPCM

The new µPCM (Micro Photo Cell Monitoring) solution is an efficient and costeffective methodology for controlling defect density in the lithography cell.

Leveraging KLA-Tencor’s 23xx high-resolution inspection platform with inline automatic defect classification (iADC), together with optimized test vehicles, µPCM provides the highest sensitivity and capture rate required for eliminating lithography-related micro defects. The µPCM solution consists of: the µPCM Reticle™, optimized test vehicles, customized SPC and sampling strategies, industry-proven methodologies, and expert implementation and defect source isolation assistance. The µPCM Reticle, consisting of contact/via holes, lines and spaces, and trenches, is used in conjunction with optimized film stacks on test wafers and KLA-Tencor’s 23xx wafer inspection system to reduce the time to characterize new lithography processes and defect level baselines, and identify excursions during manufacturing. µPCM provides the highest sensitivity to "true" process excursions, increases resolution to critical lithography defects, and decreases engineering time for root-cause determination.

NanoPro NP1™

Designed to address 200-mm and 300-mm volume product requirements, the NanoPro NP1 is the industry's first single-tool solution for wafer geometry and nanotopography metrology. Combining wafer shape, thickness, flatness and nanotopography metrology in a single scan, it is the only metrology system that can monitor SOI and bare wafers inline at multiple points during the wafer production process. NanoPro NP1 features the precision/tolerance ratio required for sub-130-nm technologies, and its near-zero contamination allows the tool to be used in critical modules like bonding, where contamination would result in yield loss due to bonding voids. NanoPro NP1’s Grazing Incidence Differential Interferometer enables detection of topography changes of the top silicon layer for new generation ultra-thin SOI wafers. This feature provides consistent measurement performance on all surfaces, while NanoPro NP1’s pattern wafer capability decreases stepper qualification time and eliminates the production opportunity loss due to routine wafer flatness measurement on the stepper by replacing the same measurements on the NanoPro NP1.

Spring 2003

Yield Management Solutions

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O FR rde EE r y co ou py r .

Your next device shrink just got closer.

Want some useful insight into sub-100 nm process control? Look no further than Think Shrink. This must-read book for litho and etch professionals offers proven pattern transfer process control strategies, including many that have been successfully implemented in today’s most advanced fabs. All of which points to a thrilling conclusion: That with the right strategies and tools, it is possible to gain control of your litho and etch process and achieve high yield and productivity. Bringing your next device shrink into focus much faster than you ever imagined.

Order your FREE copy today. www.kla-tencor.com/thinkshrink Š2003 KLA-Tencor Corporation. Think Shrink is a trademark of KLA-Tencor. Allow 4-6 weeks for delivery of book.

Accelerating Yield