Magazine autumn99 productnews

Product News eS20 Automated E-beam Inspection System

The eS20 is an automated high-speed electron beam inspection system for both R&D and in-line production wafer monitoring. Electron-beam inspection is a critical technology to address today’s yield challenges because of its ability to detect defects within high aspect ratio structures (residues, underetch, particles, stringers, etc) and defects associated with high aspect ratio fills (voids). The eS20 detects all critical defect types at all critical layers at high speed, accelerating development of sub-0.18 µm technologies and copper processes. In addition, the system provides the vital link that IC manufacturers need to develop comprehensive in-line monitoring strategies for new processes, that leverage both e-beam and optical inspection technologies. cir cle RS#029

HRP-240

ETCH

Automated Surface Profilometer

The HRP-240 is the latest evolution of the versatile HRP series of highresolution surface profilometers. The HRP-240ETCH measures high aspect ratio features at sub- 0.25 µm levels using a unique scanning methodology. This methodology eliminates shear on the stylus, enhancing stylus reliability and enabling the use of smaller styli. The HRP-240ETCH provides reliable, repeatable, and cost effective measurements for applications such as STI etch, dual damascene trench etch, and DRAM recess measurements. In addition to high aspect ratio depth metrology, the HRP-240ETCH builds upon field-proven capabilities in CMP polishing using its dual stage scanner for both macro and micro scanning. cir cle RS#005 ETCH

AMRAY 4300+ Defect Reduction Tool

The KLA-Tencor 4300+ Defect Reduction Tool is an advanced, fully automated Scanning Electron Microscope (SEM) designed for defect review and analysis in a high-volume wafer production environment. The 4300+ automation feature assures optimum alignment on both patterned and unpatterned wafers. With variable wafer tilt capabilities of 0º to 45º and rotation of 360º, the 4300+ provides true-perspective images.

With optical inspection and a comprehensive defect management system, the 4300+ not only gathers defect excursion information but also analyzes and reports the results. Additionally, by porting the KLA-Tencor SEM-based IMPACT ADC onto the 4300+, the end-user realizes a significant cost-of-ownership benefit. cir cle RS#031

8100XP-T E-beam Metrology System

The 8100XP-T offers unique capabilities to meet today’s advanced metrology requirements for thin film head wafer applications. The 8100XP-T system combines secondary and backscattered electron imaging for precise pattern recognition and focusing at zero throat with advanced measurement algorithms, for unsurpassed correlation to final electrical measurements. Reticle measurements are also possible.

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Autumn 1999

Yield Management Solutions

8100XP-ABS E-beam Metrology System

The 8100XP-ABS offers unique capabilities to meet today’s advanced metrology requirements for thin film head slider applications. The 8100XP-ABS system combines unique charge reduction electronics with customized handling solutions to provide state-of-the-art metrology and inspection capabilities.

With the highest throughput and lower cost of ownership, the 8100XP product family provides ideal tools for the tough demands of both manufacturing process control and engineering qualification.

cir cle RS#004

365UV-HR High-NA UV Reticle Inspection System

The 365UV-HR meets the requirements for high volume 0.18 µm manufacturing and for the early development of the 0.13 µm generation. It allows users of current generation reticles to achieve very high defect sensitivity on critical layers, which is essential when using low and very low k1 lithography techniques. The 365UV-HR includes new high-NA optics, high-speed data preparation and rendering, plus advanced defect detection algorithms for OPC and PSM reticles.

cir cle RS#017

AIT

TFH

In-line Patterned Wafer Defect Inspection System

TFH

AIT is the industry’s first fully automated inspection system designed to detect yield-killing defect types generated in the thin film head manufacturing process. Replacing current manual inspection methodologies, where operator’s make process control decisions based on a less than 1 percent sampling of wafers containing up to 20,000 devices, the AITTFH automatically detects and classifies critical defect types, based on full wafer inspections. This helps prevent further investment in low-yielding wafers and dramatically reduces scrap further downstream in the manufacturing process. With exceptional defect sensitivity and high throughput of 65 wafers per hour, the AITTFH allows advanced production and engineering analysis enabling the continuous process improvements required as design rules for thin film heads move towards smaller geometries. cir cle RS#004

21 39 In-line Patterned Wafer Inspection System

Offered as a new system or as an upgrade to existing 2135/38 inspection systems, the 2139 is optimized for line monitoring applications during photolithography and etch processes, as well as for engineering analysis. With up to 20 percent higher sensitivity made possible with the addition of a new 0.16 µm pixel size, and 40 percent higher capital productivity, the 2139 extends the capability of the 2100 series for inspecting the latest generation of sub-0.18 µm semiconductor devices. Productivity improvements include job queuing, fast edge-die inspection, an easy-to-use NT user interface and recipe management software. Also available on the 2139 is KLA-Tencor’s new Real-Time Classification (RTC™) solution, which classifies defects as the wafer is being inspected. cir cle RS#040

Autumn 1999

Yield Management Solutions

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