Advanced Packaging Market Analysis by Product Type, by Deployment, by End User

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Advanced Packaging Market

“With rapid growth in advanced packaging market, specifically fan out wafer level packaging, along with increase in demand for smartphone and devices and Internet of Things (IoT), advanced packaging suppliers are developing process and ways to reduce the overall cost of advanced packaging and provide maximum operational efficiency. During the recent times, advanced packaging is mainly used for high-end products and for applications related to niche-market such as wafer and die production due to its high cost in its operation..”

Divyanshi Tewari Lead Analyst, Semiconductor and Electronics at Allied Market Research

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Advanced Packaging Market

The advanced packaging market is steadily gaining traction, owing to rise in demand for enhanced technologies in various industry verticals such as integration of IoT, AI, and surge in demand for smart consumer electronics.

According to a recent report published by Allied Market Research, titled, “Advanced Packaging Market by Type (Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 2.5D/3D, Fan-Out WLP, and Others), and End Use (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027,” the global advanced packaging market size was valued at $29.42 billion in 2019 and is projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027.

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Advanced Packaging Market

Advanced packaging market is expected to leverage high potential for the consumer electronics and automotive vertical in 2026. The current business scenario is witnessing an increase in the demand for smart consumer electronics, particularly in the developing regions such as China, India, and others, due to an increase in demand for technological advancements in this sector such as adoption of AI and IoT. Companies in this industry are adopting various innovative techniques such as mergers and acquisition activities, to strengthen their business position in the competitive matrix.

The advanced packaging market is analyzed by type, end use, and region. By type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. On the basis of end use, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others.

By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

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Advanced Packaging Market Key Findings Of The Study • • •

By type, the flip-chip ball grid array segment held the highest revenue of $9.63 billion in 2019 and contributed a major part in advanced packaging market share.

By end use, the consumer electronics segment held the highest revenue share of the market in 2019, generating $18.51 billion as per the advanced packaging market analysis.

By region, Asia-Pacific is expected to dominate the market, garnering a major market share during the forecast period.

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Advanced Packaging Market

Major Companies: Key players operating in the advanced packaging market trends include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices, which are profiled in this report.

The Advanced packaging industry key market players adopt various strategies such as product launch, product development, collaboration, partnership, agreements, among others to influence the market growth.

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Advanced Packaging Market Contact: David Correa 5933 NE Win Sivers Drive #205, Portland, OR 97220 United States Toll Free (USA/Canada): +1-800-792-5285, +1503-894-6022, +1-503446-1141 UK: +44-845-528-1300 Hong Kong: +852-30184916 India (Pune): +91-2066346060 Fax: +1⟨855⟩550-5975

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