WAFER PRE ALIGNERS
Wafer Aligner Field In HVM Operations
Kensington’s Pre Aligners have a long history of operation in semiconductor wafer fabrication. Several configurations of wafer aligners are available that support wafer sizes from 50 mm to 300 mm.
OPTIONS Small wafers: 50 mm to 100 mm Transparent Substrates Thin Wafer Edge Grip Crown/Taiko Wafers
FEATURES Rotational Accuracy < 2 arc sec Centration Accuracy < 0.002” (0.051 mm) Supports Transparent Substrates Glass and Quartz Plastic SiC Throughput of up to 450 WPH Station Self Teach Functionality LEAR N M O R E AT FOR REFERENCE: KENS I N G T O NLABS.COM! WWW.ENTREPRISESCANADA.CA