Wafer Handling-Offering Secure Wafer Protection & Explicit Automation Interface

One wafer handling solution is suitable for all whether it’s MEMS, LEDs, or 3D packaging. These solutions are perfectly designed to balance the high-dynamic servo drives, pneumatic actuators, and linear sub-systems. Performed with high rigidity and no backlash, these solutions enable less idle time and offer standardized handling throughout the front-end operations.

The multilink SCARA Wafer Robot handling offers a wide selection of services in order to address the automation, contamination, and concerns related to productivity. These wafer handlers are safe and are made with semiconductor wafer loader that is designed to use with all major microscopes, inspection, and optics devices.

The wafer handling systems provide easy operation, seamless integration, consistent and reliable handling to the automated workstations and labs. Thus, it increases the yield and reduces the unscheduled downtime.

Here are SOme of the FEATUREs embedded into it: The SCARA Wafer Robot with its long arms can reach maximum up to 4LPs. High-speed transportation is achieved with the vacuum chucking hand provided in it. It is also possible to interchange two wafers with two hands.

The driver stored inside the body of the robot facilitates energy saving and also reduces the number of wires to be used.

Here’S how motion control hAs made wafer handling efficient: The vacuum wafer handling system is configured with linear and linkable architecture that offers OEM an edge over the traditional radial systems. The M4000 Controller embedded provides a common vacuum platform for a wide range of tools and process applications.

The greatest challenge in developing the wafer handling systems was implementing and executing the motion control system that could match the requirements of scalability, expandability, reliability, resolution, and stiffness and that too at a competitive price. The M4000 Controller used in wafer handling supports quality and gives a competitive edge in the market. The speed requirements and demanding repeatability are met with ease and consequently, it has reduced the costs and offers greater efficiency.

The linear transfer chambers provided are smaller than the radial chambers which have reduced the raw materials and also the machining costs. Thus it seamlessly provides high throughput and short process times.