Wafer Front End Semiconductor Manufacturing Process

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WAFER FRONT END SEMICONDUCTOR MANUFACTURING PROCESS The Front End Production Process

The Wafer front end production process gets done, the wafers are then transmitted to the assembly facility to save the chip. The wafers are built up within the plastic cassettes and the production time with the specific production time and circumstances made out of steps.

What can we expect from the Wafer Handling Automation? Appropriately chemical distribution No more meters requirements High quality Budget-friendly option Low energy consumption 360 degrees rotation Ergonomic design Easy loading and filling Customized controls

What is the reason for the effectiveness of Wafer Handling? The Kensington Laboratories presents the 300mm FOUP of secured wafer handling, where the robots are processed with the optical sensing device to analyze the functionality and the environment. It is used to identify whether the wafers are placed at the appropriate place and if in case it is not, where it should be.

The Newport Wafer Robots Kensington AMAT includes: AMAT applied materials robot repair Removed from the AMAT applied materials 300mm endure PVD physical vapor deposition system It consists of non-copper material.

FOR REFERENCE: WWW.KENSINGTONLABS.COM

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