Pre Aligners- Wafer Aligner Field Proven In HVM Operations

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PRE ALIGNERS- WAFER ALIGNER FIELD PROVEN IN HVM OPERATIONS PRE-ALIGNERS Both integrated and external prealigners use transmissive sensors located within the prealigner to sense the wafer’s edge and accurately measure location and orientation during a single rotation. They accurately detect any combination of SEMI standard wafer alignment features.

EXTERNAL Our external prealigner is designed to mount inside the front end of the tool. It provides high throughput, up to 450 wafers per hour, while maintaining cleanliness, accuracy, and reliability. It also allows our edge grip and transmissive sensor equipped robots to perform an automated one-step self teach.

Wafer Sizes 100mm 125mm 150mm 200mm 300mm Rotational Accuracy < 2 arc sec Centration Accuracy < 0.002 inch (0.051mm)

EXTERNAL SMALL WAFER Our external small wafer prealigner is designed to mount inside the front end of the tool. It provides high throughput, up to 450 wafers per hour, while maintaining cleanliness, accuracy, and reliability.

INTEGRATED The integrated prealigner is designed to mount on the shoulder of the robot, minimizing the footprint of the robot and prealigner system and maximizing cleanliness, accuracy, and reliability.

Wafer Sizes 50mm Rotational Accuracy Centration Accuracy Wafer Sizes 125mm Rotational Accuracy Centration Accuracy

75mm

150mm

100mm < 2 arc sec < 0.002 inch (0.051mm) 200mm and 300mm < 2 arc sec < 0.002 inch (0.051mm)

Visit www.kensingtonlabs.com for more details.


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