DS-02032 MultiLink Robot.qxd
9/8/06
11:56 AM
Page 1
MultiLink™ Robot 300mm Single Arm Atmospheric Wafer Handling Robot Kensington Laboratories’ 300mm single arm atmospheric wafer handling robot, part of the MultiLink™ robot family, is designed to meet the industry’s most rigorous 300mm performance standards. The MultiLink Single Arm robot incorporates a host of unique, proprietary design features which combine to provide unsurpassed reliability, superior performance, and high throughput. Kensington Laboratories, a leader in advanced robotics technology, is committed to developing and manufacturing the highest quality and most cost effective atmospheric robots in the industry – all backed by Kensington Laboratories’ global service and support network.
• Automated Self Teach™: The patented Automated Self Teach feature reduces time required to bring systems online and provides faster time to production ramp. • High Throughput: Continuous rotation (i.e. no dead-zones) translates to short, discrete theta moves less than 180 degrees, which significantly increases throughput. • Accurate Wafer Placement: High performance design provides precise motion control and eliminates structural deflection and creep. All robot axes are guided by preloaded bearings mounted on monolithic frames machined from single ingots of highly stable aircraft-quality aluminum. • Cleanliness: Patented edge grip technology provides better than ISO Class 1 particle performance. In addition, the side-mounted MultiLink robot, combined with Kensington Laboratories’ side-mounted MultiLink robot track, maximizes the exhaust opening of the equipment front end module allowing uniform air flow from the fan filter unit through the perforated fab floor. • High Reliability: The MultiLink robot achieves industry-leading MCBF by employing direct-drive DC servo motors with real time force feedback and non-contacting glass scale encoders that monitor actual drive train output. • Precise Wafer Mapping: High performance through-beam wafer mapping allows fast, accurate wafer detection. • Zero Preventative Maintenance: Superior precision design requires no periodic lubrication or adjustments under standard operating conditions.
DS-02032 MultiLink Robot.qxd
9/8/06
11:56 AM
Page 2
MultiLinkTM Robot 300mm Single Arm Atmospheric Wafer Handling Robot Specifications Repeatability Radial axis Theta axis Z axis
±0.001" (±0.025 mm) ±0.01 degrees ±0.001" (±0.025 mm)
Maximum Velocity Radial axis Theta axis Z axis
34 inches/sec (0.86 m/sec) 1000 degrees/sec 24 inches/sec (0.46 m/sec)
Key Features
Maximum Acceleration
• Patented edge grip technology
Radial axis
400 inches/sec2 (10.16 m/sec2)
Theta axis
5000 degrees/sec2
Z axis
80 inches/sec2 (2.03 m/sec2)
• Patented Automated Self Teach • Through-beam wafer mapping • Advanced wafer cassette error detection
Range of Motion Radial axis Theta axis Z axis
Two links at 7.00" (177.80 mm), or three links at 5.25"-10.5"-5.25" (133.35 mm x 266.70 mm x 133.35 mm) Continuous 14.25", 17.25", 20.25" (361.95 mm, 438.15 mm, 514.35 mm)
Reliability MCBF
Standard Supinator wafer flipper available Two links at 7.00", or three links at 5.25"-10.5"-5.25" (133.35 mm x 266.70 mm x 133.35 mm)
Robot mounting type Bolt pattern Minimum swept radius End effector
• Reduced wear Z axis counter balance
Key Patents Effector, 6256555
8 lbs (3.63 kg) With vacuum <1 mil; without vacuum <7 mils ISO Class 1 Robot: 85 lbs (38.64 kg); Controller: 19 lbs (8.64 kg) 10 l/min at 635 mm Hg (25 SCFH at 25" Hg) 100-220 VAC 47-63 Hz (600W PS) Through-beam standard; reflective optional RS232, IEEE-488, or Device Net™
Mounting Specifications Overall dimensions
• High resolution optical encoders on all axes
• Robot Arm with Specimen Edge Gripping End
S2-93A
General Specifications Maximum Z axis load Z drop (distance and time) Cleanliness Weight Vacuum required Power required Mapper Communications
• State-of-the-art motion control
• Machine tool quality construction
Compliance S2
• Continuous rotation
• Off center pick and place 10 million cycles
Configurability Single arm (3 axis) Single arm (4 axis) Arms (lengths)
• Direct drive technology
• Robot Arm with Specimen Sensing and Edge Gripping End Effector, 6275748 • Self-Teaching Robot Arm Position Method, 6360144 • Self-Teaching Robot Arm Position Method to Compensate for Support Structure Component Alignment Offset, 6366830
Options Robot can diameter: 9.72" (246.89 mm); robot hole diameter: 10.00" (254 mm) Side or top mount Top mount: 3 x 1/4-20 x 0.50" DP equally spaced on a 10.375" (263.53 mm) bolt circle Wafer radius + end effector length + 1.175" (29.86 mm) 6 x #2-56 on a 1.625" (41.28 mm) bolt circle
• 4th axis: supinator wafer flipper • Vacuum end effectors (200mm and 300mm) • Reflective mappers • E-diagnostics with GUI
Specifications are subject to change without notice.
510-620-0235 ext 718 or visit www.kensingtonlabs.com © 2006 Kensington Laboratories, LLC. All rights reserved. Automatic Door Opener is a trademark of Kensington Laboratories. The Kensington logo is a registered trademark of Kensington Laboratories. All other trademarks are property of their respective owners.
FM27207 DS-02032
MultiLink Single Arm with supinator wafer flipper
Through-beam wafer mapping