300mm Wafer Automation Robotic Technology

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300MM WAFER AUTOMATION ROBOTIC TECHNOLOGY Patented Edge Grip Technology Kensington Labs exclusive patented edge grip technology is a prime example of our technology leadership in automation systems. Other robots contact the wafer within the edge exclusion zone increasing the risk of failures caused by particle contamination.

REACH CONFIGURATIONS

WORKING ENVELOPE

Our advanced Multi-Link reach

Our robots are designed to provide wafer handling operations within a

design utilizes a superior fieldtested and proven Direct Drive system that provides wellbalanced and smooth motion.

Z TRAVEL OPTIONS Kensington robots utilize a proprietary vacuum counterbalancing system on the

very compact footprint. The working envelope, or minimum swept area, is dependant on the type of robot, its reach, and the end effector selected.

PREALIGNERS Both integrated and external prealigners use transmissive sensors located within the

Z axis to allow rapid movement with a minimal amount of

prealigner to sense the wafer’s edge and accurately measure location and orientation during a

applied force.

single rotation.

INTEGRATED The integrated prealigner is designed to mount on the shoulder of the robot, minimizing the footprint of the robot and prealigner system and maximizing cleanliness, accuracy, and reliability.

TRACK SYSTEMS Kensington Labs standard track solutions provide high acceleration and overall speed in a reliable and proven design. The track and robot are mounted vertically.

SUPINATION Kensington Labs single arm robots can be equipped with a supinating wrist for an additional rotational axis, allowing the robot to transfer the wafer to the tool in a vertical or inverted mode. www.kensingtonlabs.com


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