Cadence Sigrity SI / PI Analysis Point Tools Introduction

Sigrity SI / PI Analysis Point Tools https://www.pcb.maojet.com.tw 1

© 2020 Cadence Design Systems, Inc. All rights reserved.

Sigrity PowerSI II – SIGR302 •

PowerSI is a virtual multi-port Vector Network Analyzer for signal integrity, power integrity and design-stage EMI analysis of entire designs for boards and packages.

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PowerSI supports … o

S-parameter model extraction

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3D Spatial Model: Noise Coupling Analysis & EMI/EMC Radiation Analysis

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Resonance analysis modes.

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Trace impedance and coupling checking simulation.

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Simulation based design check: S-parameter Assessment and VR Noise Metrics Check

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Full consideration of power delivery effects in all analysis modes.

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Analysis of single or multi-fabric designs.

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Integration with DC and 3DFEM analyses.

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AC analysis capabilities for XtractIM and OptimizePI

Note: 8 core limits can be extended with accelerators 2

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PowerSI Primary Advantages •

Market leader and product of choice where power and signal integrity analysis is essential

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Highly accurate modeling of IC package and PCB structures

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Single-ended and mixed-mode results and post-processing

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Adaptive frequency sampling and intelligent result storage

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Supports component / circuit models with unlimited terminals

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Unique capability for ensuring accuracy down to DC with integrated PowerDC analysis

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Targeted workflows to streamline setup operations

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Integration with full wave and quasi-static solver

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Frequency domain SI, PI and EMC

Sigrity PowerDC II – SIGR203 • PowerDC is an efficient DC sign-off solution for IC package and PCB designs with electrical / thermal cosimulation to maximize accuracy. IR drop and current hot-spots are quickly pinpointed. Best remote sense locations are automatically found.

Note: 8 core limits can be extended with accelerators 4

© 2020 Cadence Design Systems, Inc. All rights reserved.

PowerDC Primary Advantages

Multi-board E/T Co-simulation

• The first and only integrated and automated electrical and thermal co-simulation for PCBs and packages • Patented time saving automation for remote sense line positioning • Fastest and most accurate IR drop solution

• Unique block diagram results visualization supporting what-if updating • Unified library management for setting parameters

• Integration with Sigrity Advanced PI solution • Chip/package/board E/T co-simulation • Multi-fabric E/T co-simulation for complicated system

• AMM and TCL scripting for automation • Allegro PowerTree technology for early simulation and quick setup Power DC block diagram view 5

© 2020 Cadence Design Systems, Inc. All rights reserved.

Sigrity OptimizePI II – SIGR053 • OptimizePI is a highly automated AC analysis solution for IC packages and PCBs. Optimizes decoupling capacitor selection and placement during pre- and post-layout for target device and EMI. Identifies impedance and PDN resonance issues.

• DeCap implementations are optimized for performance, cost, area and number.

Note: 8 core limits can be extended with accelerators 6

© 2020 Cadence Design Systems, Inc. All rights reserved.

OptimizePI Primary Advantages •

Back-annotation of optimized DeCap scheme to Allegro

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OptimizePI provides an environment for decoupling capacitor design

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Easily applied by design engineers, layout designers and SI/PI engineers

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Reduces engineering time and overall design cycle time

OptimizePI applied to real designs improves PDN performance with simultaneous savings for cost, number of decaps, area, & emissions o

Unique device impedance and EMI resonance checking

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Device Per-Pin inductance checking and display

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Loop inductance analysis identified poorly mounted decaps

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Proved analysis accuracy of optimization results

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OptimizePI enables

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Analytically-assured design tradeoffs

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Elimination of costly performance over-design

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Pre-route guidance, post-layout verification, and EMI decap optimization

AMM and PowerTree technologies to speed up the setup © 2020 Cadence Design Systems, Inc. All rights reserved.

Sigrity XtractIM II – SIGR803

• XtractIM is a fast IC package RLC extraction and assessment solution with an option to generate highly accurate broadband models.

Supports a broad range of package types including BGA, SiP and leadframe designs.

Note: 8 core limits can be extended with accelerators 8

© 2020 Cadence Design Systems, Inc. All rights reserved.

XtractIM Primary Advantages • Directly run XtractIM in Allegro Package Designer environment o

GUI and Batch mode

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Electrical Performance Assessment

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RLC Extraction

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View Results

• Electrical Aware Design Optimization

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Impedance Cross-probing

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Coupling Cross-probing

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Plane Current Density Cross-probing Check

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Via Current Density Cross-probing Check

© 2020 Cadence Design Systems, Inc. All rights reserved.

Sigrity SPEEDEM – SIGR402 • SPEEDEM is a FDTD based simulation tool for PCB/ package layout based time domain EM simulation tool for select net signal integrity, design-stage EMI, and ESD analysis.

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SPEEDEM Primary Advantages • Only solution for ESD and EMI simulations with non-linear drivers and receivers (supports ESD gun model) • Unique layout-based transient simulation environment for signal analysis • Able to simulate groups of signals together with non-ideal power delivery networks (PDN) • Unique animation of transient field propagation across PCBs and packages

• Explore impact of Transient Voltage Suppression (TVS) Diodes during an ESD event 11

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SystemSI Only available in Adv. SI Bundle SIGR913

• SystemSI is a comprehensive and automated signal integrity environment for the accurate assessment of high-speed chip-to-chip parallel bus and serial link interface implementations.

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SystemSI Primary Advantages Only available in Adv. SI Bundle SIGR913 • Supports wire-based or bus-based topology connectivity • IBIS and SPICE-based power-aware system-level modeling

• Integration with Sigrity and Clarity interconnect extraction • Concurrent, comprehensive simulation of SI and PI effects • Advanced channel simulation engine for high-capacity parallel bus and serial link simulation and BER analysis • Comprehensive, parameterized AMI modeling of advanced equalization • Highly automated JEDEC-based measurement, reporting, and crossprobing capabilities for DDR interfaces • Compliance kits for popular serial link interfaces

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Above = DDR / Below = Serial Link

XcitePI Only available in Adv. Clarity ICP Extraction Suite SYS944 • XcitePI is a full-chip power integrity solution targeting on chip / system co-design applications. It supports early chip power planning, IO and core model extraction, and simulation in both the time and frequency domains.

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© 2020 Cadence Design Systems, Inc. All rights reserved.

XcitePI Primary Advantages • Accurate distributed model to reflect the true circuit behavior • High pin resolution – each bump can have a district circuit terminal • Concise circuit size – compressed from the model of the entire multi-layer power, ground and/or signal connections • Fast what-if analysis to see the effects of onchip and off-chip decoupling capacitors, change of power/ground/signal grid and stimulus, and so on • Simply and easy to run at any chip design stage even when chip is not completed 15

© 2020 Cadence Design Systems, Inc. All rights reserved.

Power net self loop inductance at each IO cell

Power net impedance (L = power net only / R = power net plus on-die circuit

Broadband SPICE Only available in suites • Broadband SPICE offers a combination of S-parameter checking, tuning and extraction capability to convert N-port network parameters to efficient SPICE compatible circuits that can be used in time domain circuit simulators.

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Broadband SPICE Primary Advantages Only available in suites • Market leader for SPICE macro-model extraction • Extensive checking functions for S-parameter model tuning and improvement • Automated adaptive port reference impedance technique to enhance model accuracy (patent pending) • Enables faster S-parameter simulations • Integration with PowerSI and SystemSI for streamlined design flows

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© 2020 Cadence Design Systems, Inc. All rights reserved.

Red curve shows impact off S-parameter tuning

T2B Only available in Adv. IBIS Suite SIGR953 • Transistor to Behavioral Model Conversion (T2B) provides an efficient way to create accurate power-aware IBIS IO models for simulations with SSO effects.

These models run orders of magnitude faster than the original transistor models.

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T2B Primary Advantages Only available in Adv. IBIS Suite SIGR953 • Industry’s most advanced tool for converting transistor models to power-aware IBIS • Convenient GUI verifies conversion accuracy • Simulation speed-up makes full bus simulations practical that would otherwise take weeks

• Optional IBIS plus model provides additional level of accuracy

Built-in simulation check compares transistor to IBIS power-aware model 19

© 2020 Cadence Design Systems, Inc. All rights reserved.

Impact of pre-driver current

Advanced AMI Builder Only available in Adv. IBIS Suite SIGR953 • Advanced AMI Builder contains all the features of SystemSI SLA and PBA plus the ability to create IBIS-AMI models that can run in any vendor’s simulator that supports IBISAMI 20

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Advanced AMI Builder – Primary Advantages Only available in Adv. IBIS Suite SIGR953 • Includes all the features of SystemSI SLA and PBA

• AMI models have no restrictions – can run in any vendor’s channel simulator • Fast turnaround – model gets created at the click of a button

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© 2020 Cadence Design Systems, Inc. All rights reserved.

System Analysis 22

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Clarity 3D Solver – SYS300 Clarity 3D Solver V8 – SYS308 •

Clarity 3D Solver is a finite element method (FEM) based, 3D full-wave electromagnetics solver. Solving full Maxwell equations without any assumption.

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Subdivide entire volume into many small tetrahedral elements, and could preciously capture the boundary of the complex objects.

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A trusted approach for high frequency interconnect and power deliver network extraction

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Provide popular format as the results

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S-parameter

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RLCG

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Near/far field

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Antenna parameter

Two user interfaces o

Layout style interface: Layout Workbench

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CAD style interface : 3D Workbench

Two “core” options o

SYS300 – 32 cores of simulation

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SYS308 – 8 cores of simulation

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Accelerators available in 8, 16, and 32-core increments

© 2020 Cadence Design Systems, Inc. All rights reserved.

Layout Workbench

3D Workbench

Clarity 3D Solver Primary Advantages • The first product in Cadence’s system analysis initiative, breakthrough EM simulation technology delivers up to 10X performance with virtually unlimited capacity and goldstandard accuracy • Architecture allows solver to be run on hundreds of CPUs optimized for both cloud and on-premises distributed computing • True 3D model extraction eliminates risk from manually reducing the size of structures being modeled • Easily reads design data from all standard chip, IC package, and PCB platforms and offers unique integration with Cadence implementation platforms

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© 2020 Cadence Design Systems, Inc. All rights reserved.

Clarity 3D Transient Solver – SYS400 •

Clarity 3D Transient Solver is a finite difference time domain (FDTD) based, 3D full-wave electromagnetics solver. Solving full Maxwell equations without any assumption.

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Architecture allows solver to be run on hundreds of CPUs and multiple GPUs optimized for both cloud and on-premises distributed computing

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Large-scale solution addresses “system of systems” modeling to reduce number of prototypes needed for EMI compliance testing

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Base product supports 8 cores of simulation power o

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Accelerators can be added in 8-cores (1 GPU), 16-cores (2 GPUs), or 32 core (4 GPUs) increments

“The Clarity 3D Transient Solver from Cadence allows us to simulate with test-measurement accuracy so we can predict what will be measured during EMI testing, thereby ensuring our customers pass EMI compliance checking on the first pass while dramatically reducing the number of prototype designs.”

- Satoshi Utsumi, CEO Ultimate Technologies, Inc

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© 2020 Cadence Design Systems, Inc. All rights reserved.

Celsius Thermal Solver– SYS100 Celsius 2D Electrothermal Solver– SYS125 •

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Celsius Thermal Solver is an end-to-end solution for all modes of heat transfer. Resolves both 2D layer and 3D structure, without any model simplifications required. It also offers o

(FEM+CFD) based solution for both transient and steady state simulations

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Capable of 3D CAD model import

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In addition to package/PCB, includes, heatsinks and enclosures

Celsius 2D Electrothermal Solver, is a superset of PowerDC, not only has all the features of PowerDC it offers, o

Enables transient E-T co-sim

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interface with CFD

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Thermal Chip Only flow

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Thermal Stress Analysis

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Voltus Thermal Model Support

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Thermal Network Extraction and Simulation

Two “core” options o

SYS100 – 32 cores of simulation

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SYS125 – 32 cores of simulation

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Accelerators available in 8, 16, and 32-core increments

© 2020 Cadence Design Systems, Inc. All rights reserved.

PKG

PCB

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http://www.pcb.maojet.com.tw

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