SYSTEM INTEGRATION THEME
AROKIA NATHAN
The project will develop design tools to optimise system manufacturing processes by: • minimising the number of materials in the materials set; • using the minimum number of the highest yielding processes in the total process flow; • reducing the total number of process steps through parallel processing strategies; • optimising device architecture and dimensions to maximise yield without compromising system performance (“just good enough” performance approach); and • using “sub-system” integration where monolithic integration is not possible or cost-effective.
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Design for Manufacture
T
his project is currently in the definition phase with a planned start date in October 2014. The aim is to apply design for manufacture thinking to LAE system manufacturing based on a model set of selected functional elements that can be brought together in different ways to produce a wide variety of systems. In conjunction with the development of functional testing approaches, we will develop test structures to facilitate functional testing both during and after manufacturing. We will also investigate the use of “make-or-break” strategies to make repairs. It is possible to cut conductive tracks by processes such as laser ablation. It is also possible, albeit with significant registration, linewidth and curing challenges, to reconnect open-circuit defects. With these capabilities, it will be possible to investigate the potential to repair simple open- or closed-circuit defects. Furthermore, it will be possible to investigate the use of manufacturing, at minimal incremental cost, redundant functional elements which might be connected into a system to replace a defective element.
EPSRC CENTRE FOR INNOVATIVE MANUFACTURING IN LARGE-AREA ELECTRONICS ANNUAL REVIEW 2014