HYC Launched A Full Range of High-speed Fiber Array Subassembly With the development of ultra-high-speed and integrated optical communications, optical transceiver modules are also expected to adopt smaller and more integrated solutions, which have high demand for parallel high-speed optical subassembly. Due to the high cost caused by strict material usage and processing technology, the optical fiber array has not been widely used for 10G transmission. With the rapid advance of 400G and 800G high-speed transmission, FA with high-density packaging can be said to be a more ideal solution. Optical fiber arrays are most commonly used in the packaging of planar optical waveguide splitters (PLC) and arrayed waveguide gratings (AWG). With the explosive growth of data flow, the demand for optical fiber arrays in data centers and 5G commercial applications is growing rapidly, and FA has become more and more widely used in MEMS systems, sensors, silicon photonics and other fields. Relying on the technical advantages and rich experience of ultra-precision component assembly, HYC quickly launched high-speed optical component products to meet market demand. Now, HYC has high-precision glass cutting,fiber array design, surface optical coating design, fiber array bonding, convex surface fiber grinding and processing capabilities, and can provide customers with a full series of fiber array with various end-face grinding angles (such as 0 degree, 8 degree, 42.5 degree, 45 degree,and other customized angles). High precision pitch cores and low-cost high speed optical fiber array subassembly will be provided to meet different customer needs.