ChBE News—Fall/Winter 2009

Page 1

ChBE News

School of Chemical & Biomolecular Engineering @ Georgia Tech

FALL/WINTER

VOLUME 16

2009-2010

Semiconductor Research Corporation Funds $28M Interconnect Focus Center Collaboration ChBE professor Paul Kohl leads joint research effort for interconnect and packaging to slash chip footprint by 10x while decreasing power consumption and increasing performance.

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he Interconnect Focus Center (IFC) received $20 million in funding from the Semiconductor Research Corporation (SRC), the world's leading university‑based research consortium for semiconductors and related technologies, and an additional $8 million in matching funds. The IFC develops new electrical, optical, and thermal interconnect solutions that meet or exceed projections of the International Technology Roadmap for Semiconductors (ITRS). These solutions will enable hyper‑integration of heterogeneous components for future terascale systems. Results from the research will reduce the footprint of chips by a revolutionary factor of 10 while decreasing power consumption and increasing performance. Integrated circuits, which are the components that make electronic devices work, are composed of transistors made on semiconductor sub‑ strates with copper circuitry. Although the performance of the transistor improves as the size shrinks, the performance of the copper wiring does not. At very small dimensions, below 50 nm, the performance decrease of the copper wiring is exacerbated by scattering from the surface and grain boundaries. Thus, the performance of the integrated circuit is lim‑ ited by the wiring and not by the transistors themselves. The Centerʼs research is aimed at creating new technologies for connecting the billions of transistors on a chip, improving the chip‑to‑ chip communication with better electronic packages, creating new ways to stack chips in a three‑dimensional package, developing new ways for wireless devices to operate, and producing new ways to trans‑ fer heat from integrated circuits using advanced cooling methods. The IFC capitalizes on the enormous amount of research being conducted in nanoscience and nanotechnology to develop novel high‑conductance electrical interconnects to replace copper. For example, optical signals are being explored as a means to communicate across chips and from chip‑to‑chip rather than electrical signals. Optical signals, like those used in fiber optic cables, do not suffer from the same interference and delays as electrical signals, and many optical signals can be simultane‑ ously transmitted in a waveguide. Dr. Paul Kohl, Regentsʼ Professor, Institute Fellow, and Hercules, Inc./Thomas L. Gossage Chair in the School of Chemical & Biomolecular Engineering, is the director of the IFC. “Transistors have made enormous progress in speed, performance, and miniaturization, which places

Photo by Rob Felt

greater demand on the electrical connections be‑ tween transis‑ tors and between indi‑ vidual chips. The interconnect and packaging challenges are greater today than ever,” says Dr. Kohl. “Geor‑ gia Tech has been a leader in creating new in‑ terconnect and packaging tech‑ nologies for in‑ tegrated circuits, and Dr. Paul Kohl (right) working in the lab with PhD student weʼre very Nathan Fritz. pleased to part‑ ner with SRC in launching the IFC.” Two new areas of research are increasingly important in the IFC. First, the chip‑to‑chip connections can be shortened by stacking multi‑ ple chips to form a 3‑D network. This improves the electrical connectiv‑ ity but creates significant challenges in fabricating vertical connections and in cooling the inner layers. Second, small wireless devices, espe‑ cially sensors, will soon become ubiquitous in our lives. Thus, it is essen‑ tial to find new power sources and ways to communicate that conserve energy and maximize functionality. The IFC is based in the Nanoelectronics Research Center located in the Pettit Microelectronics Research Center (MiRC) building at Georgia Tech. There are 13 collaborating universities, including Stanford, MIT, and the University at Albany, which is part of the State University of New York (SUNY) network.


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