BON D IN G QUESTIONNAIRE To:
Sender: Company:
GODIVA BEARINGS Unit 1, Crackley Way Peartree Lane, Dudley West Midlands DY2 0UW United Kingdom T: +44 (0) 1384 240 005
Person in charge: Telephone: Telefax:
You have bonding problems? Please give us some details about your specific application, we then will be able to recommend the right WEICON product.
1. Which materials (standard designation, trade name) will be bonded to each other? Sample parts are enclosed
Sample parts can be provided
2. Surface conditions: dust-free
anodised
degreased
lacquered with:
roughened
etched with:
sand blast
surfaces cannot be pre-treated
other: 3. Bonding methods: overlapping
plug-in connection
surface to surface
4. Size of area to be bonded:
5. Permissable size of bonding gap (mm): without importance
permissable tolerance:
6. What are the loads or treatments the joint is exposed to during the manufacturing process? bonderizing
planing
anodizing
lacquering
levelling
burning-in
°C
Min.
milling
mechan. deforming
drying
°C
Min.
grinding
galvanizing
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