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Alphanumerical product list art. no. ABM 2550 ABM 3050 ABM 4070 ABM 5080 ABM TE 04 ABM TE 04 DIN ABM TE 06 ABM TE 06 DIN ABM TE 08 ABM TE 08 DIN ABP 2550 ABP 3060 ABP 4080 AHG K 27 AHG K 28 AHG L 7 AHG V 14 AHG V 17 AHM 3260 AHM 4380 AKK 127 AKK 191 AOS 3 AOS 3 P AOS 3 P 2 AOS 3 P SL AOS 5 AOS 18 AOS 32 AOS 66 AOS 93 AOS 127 AOS 218 247 AOS 218 247 1 AOS 220 AOS 220 3 AOS 220 4 AOS 220 SL AOS 247 AOS P 1 AOS P 1.1 AOS P 2 AOS P 3 AOS P 4 AOS P 5 AOS P 6 AOS P 7 AOS P 8 AOS P 9 AOS P 10 CLIP 151 DR 071 V0 DR 072 V0 DR 073 V0 DR 074 V0 DR 075 V0 DR 076 V0 DR 077 V0 DR 078 V0 DR 079 V0 DR 081 V0 DR 082 V0 DR 083 V0 DR 084 V0 DR 085 V0 DR 086 V0 DR 087 V0 DR 088 V0 DR 089 V0 DR 105 V0 DR 110 V0 DR 115 V0 DR 120 V0 DR 125 V0 DR 130 V0

page E 38 E 38 E 38 E 38 E 39 E 39 E 39 E 39 E 39 E 39 E 38 E 38 E 38 E 31 E 31 E 31 E 31 E 31 E 39 E 39 A 125 A 125 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 26 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40

art. no. DR 135 V0 DR 140 V0 DR 145 V0 DR 150 V0 DR 710 V0 DR 711 V0 DR 712 V0 DR 713 V0 DR 714 V0 DR 715 V0 DR 720 V0 DR 725 V0 DR 730 V0 DR 735 V0 DR 740 V0 DR 745 V0 DR 750 V0 DR 760 V0 DR 810 V0 DR 811 V0 DR 812 V0 DR 813 V0 DR 814 V0 DR 815 V0 DR 820 V0 DR 825 V0 DR 830 V0 DR 835 V0 DR 840 V0 DR 845 V0 DR 850 V0 DR 860 V0 ELS 3 EPN 1 FK 201 SA FK 201 SA 3 FK 201 SA CB FK 202 SA FK 202 SA 3 FK 202 SA CB FK 205 SA L FK 206 SA L FK 207 SA L FK 208 SA L FK 209 SA 32 FK 210 SA CB FK 211 32 FK 212 CB FK 213 SA 32 FK 214 SA CB FK 215 32 FK 216 CB FK 217 SA CB 2 FK 218 32 FK 219 CB 1 FK 219 CB 2 FK 219 CB 3 FK 220 SA 220 FK 222 FK 222 THF FK 223 SA FK 223 SA 3 FK 223 SA CB FK 224 ... 218 1 FK 224 ... 218 2 FK 224 ... 220 1 FK 224 ... 220 2 FK 224 ... P SIP FK 225 SA L 1 FK 225 SA L 2 FK 227 SA L 1 FK 228 SA L 1 FK 229 SA L 1 FK 230 SA L 1 FK 231 SA 220

page E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 A 88 E 44 C2 C2 C2 C2 C2 C2 C2 C2 C2 C2 C6 C6 C7 C7 C6 C6 C7 C7 C3 C8 C9 C9 C9 C 10 C7 C7 C3 C3 C3 C 11 C 11 C 11 C 11 C 10 C5 C5 C8 C5 C5 C5 C6

art. no. FK 232 220 FK 233 220 FK 234 SA L 1 FK 234 SA L 2 FK 234 SA L 3 FK 234 SA L 4 FK 235 MI L 1 FK 235 MI L 2 FK 235 SA L 1 FK 235 SA L 2 FK 236 220 FK 236 CB FK 237 SA 220 H FK 237 SA 220 O FK 237 SA 220 V FK 237 SA 220 VL FK 238 SA L 1 FK 239 SA 32 FK 240 SA 220 H FK 240 SA 220 O FK 240 SA 220 V FK 240 SA 220 VL FK 241 SA 218 V FK 242 SA 220 H FK 242 SA 220 O FK 242 SA 220 V FK 242 SA 220 VL FK 243 MI 247 H FK 243 MI 247 O FK 243 MI 247 V FK 244 08 D2 PAK FK 244 08 D3 PAK FK 244 08 D PAK FK 244 13 D2 PAK FK 244 13 D3 PAK FK 244 13 D PAK FK 245 MI 247 H FK 245 MI 247 O FK 245 MI 247 V FK 247 220 FK 248 SA 220 FK 249 SA 220 FK 250 06 LF PAK FK 250 08 LF PAK FK 250 10 LF PAK FK 251 06 LF PAK FK 251 08 LF PAK FK 251 10 LF PAK FK 252 SA 220 H FK 252 SA 220 O FK 252 SA 220 V FK 252 SA 220 VL FK 253 FK 254 SA 3 FK 255 FK 256 FK 257 FK 258 SA 220 FK 318 SA FK 318 SA 3 FL 0,55 FL 1,1 FLKI 80 FLKI 80 G 200 FLKI 80 G 300 FLKI 80 G 500 FLKR 1 FLKU 140 FLKU 140 G 200 FLKU 140 G 300 FLKU 140 G 500 FS 6 065 FS 6 070 FS 6 080 FS 6 090

page C8 C8 C4 C4 C4 C4 C4 C4 C4 C4 C9 C9 C 14 C 13 C 14 C 14 C8 C6 C 14 C 13 C 14 C 14 C 11 C 14 C 13 C 14 C 14 C 12 C 12 C 12 C 21 C 21 C 21 C 21 C 21 C 21 C 12 C 12 C 12 C7 C 11 C5 C 22 C 22 C 22 C 22 C 22 C 22 C 15 C 15 C 15 C 15 C 16 C2 C 16 C 22 C 16 C 10 C2 C2 A 128 A 128 A 131 A 132 A 132 A 132 A 133 A 131 A 132 A 132 A 132 E 27 E 27 E 27 E 27

art. no. FS 6 100 FS 6 110 FS 6 120 FS 6 130 FS 85 FS 85 50 FS 85 60 FS 85 70 FS 100 FS 109 FS 151 P FS BF 06 FS BF 07 FS BF 10 FS BF 11 FS BF 13 FS BF 15 FS BF 19 FS BF 20 FS BT 06 FS BT 08 FS BT 10 FS BT 11 FS BT 13 FS BT 15 FS BT 16 FS BT 19 FS BT 20 FSF 52 P FS LP 05 FS LP 07 FS LP 08 FS LP 10 FS LP 11 FS LP 13 FS LP 15 FS LP 16 FS LP 17 FS LP 22 FS LP 30 FS S 06 2 FS S 07 2 FS S 08 2 FS S 10 2 FS S 11 2 FS S 12 2 FS S 13 2 FS S 15 2 FS S 16 2 FS S 19 3 FS S 20 3 FS S 21 2 FS S 21 3 FS U 06 FS U 11 FS U 20 GBM 2550 GBM 3050 GBM 4070 GBM 5080 GBP 3060 GBP 4080 GEL ... GEL G ... GEL 27 S ... GEL 28 ... GEL 28 G ... GEL 45 ... GEL 45 G ... GEL 60 ... GEL 60 G ... GEL F 15 ... GEL F 15 G ... GS 3 GS 3 P

page E 27 E 27 E 27 E 27 E 28 E 28 E 28 E 28 E 27 E 27 E 26 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 20 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 30 E 30 E 30 E 37 E 37 E 37 E 37 E 37 E 37 E 12 E 15 E 13 E 14 E 15 E 11 E 19 E 19


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Alphanumerical product list art. no. GS 3 P SL GS 32 P GS 66 P GS 218 GS 220 4 GS 220 C GS 220 P IB 1 IB 2 IB 3 IB 4 IB 5 IB 6 IB 7 IB 8 IB 9 IB 10 IB 11 IB 12 IB 13 IB 14 IB 15 IB 16 IB 17 IB 18 IBT 1 IBT 2 IBT 3 IBT 4 IBT 6 IBT 7 IBT 8 IBT 9 IBT 10 IBT 11 IBT 12 IBT 14 IBT 15 IBT 18 ICK 6 8 L ICK 14 16 B ICK 14 16 L ICK 14 H ICK 16 H ICK 18 H ICK 20 L ICK 24 B ICK 28 B ICK 35 SA ICK 36 B ICK 40 B ICK 1000 B ICK 1000 H ICK BGA 10 x 10 ICK BGA 10 x 10 x 10 ICK BGA 14 x 14 ICK BGA 14 x 14 x 10 ICK BGA 21 x 21 ICK BGA 23 x 23 ICK BGA 23 x 23 x 10 ICK BGA 27 x 27 ICK BGA 27 x 27 x 10 ICK BGA 27 x 27 x 14 ICK BGA 27 x 27 x 22 ICK BGA 31 x 31 ICK BGA 31 x 31 x 10 ICK BGA 35 x 35 ICK BGA 35 x 35 x 10 ICK BGA 37 x 37 x 6 ICK BGA 37 x 37 x 10 ICK BGA 40 x 40 ICK BGA 40 x 40 x 10 ICK BGA 42,5 x 45 ICK EM 25 ICK LED R 23,5 x 14

page E 19 E 19 E 19 E 19 E 19 E 19 E 19 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 B 52 B 52 B 52 B 52 B 52 B 52 B 52 B 52 B 52 A 124 B 52 B 52 B 52 B 52 B 17 B 17 B 17 B 17 B 18 B 18 B 18 B 18 B 18 B 18 B 19 B 19 B 19 B 19 B 19 B 19 B 20 B 20 B 20 B 20 B 56 B 35

art. no. ICK LED R 23,5 x 14 G ICK LED R 27 x 10 ICK LED R 27 x 10 G ICK LED R 28 x 15 ICK LED R 28 x 15 G ICK LED R 29 x 11,5 ICK LED R 29 x 11,5 G ICK LED R 32 x 14 ICK LED R 32 x 14 G ICK LED R 33 x 10 ICK LED R 33 x 10 G ICK LED R 33 x 16,5 ICK LED R 33 x 16,5 G ICK LED R 35 x 10 ICK LED R 35 x 10 G ICK LED R 36 x 12 ICK LED R 36 x 12 G ICK LED R 40 x 10 ICK LED R 40 x 10 G ICK LED R 40 x 27 ICK LED R 40 x 27 G ICK LED R 45,7 x 16,5 ICK LED R 45,7 x 16,5 G ICK LED R 50,8 x 16,5 ICK LED R 50,8 x 16,5 G ICK LED R 50 x 10 ICK LED R 50 x 10 G ICK LED R 54 x 20 ICK LED R 54 x 20 G ICK LED R 66 x 40 ICK LED R 75 x 10 ICK LED R 84 x 40 ICK LED R 100 x 40 ICK LED R 160 x 40 ICK LED R 200 x 40 ICK PEN 3 FC ICK PEN 3 XE ICK PEN 3 XE 1 ICK PEN 38 F ICK PEN 38 W ICK PEN 45 W ICK PGA 6 x 6 x 14 ICK PGA 8 x 8 x 12 ICK PGA 9 x 9 ICK PGA 11 x 11 ICK PGA 11 x 11 x 8 ICK PGA 11 x 11 x 12 ICK PGA 14 x 14 ICK PGA 14 x 14 x 10 ICK PGA 14 x 14 x 12 ICK PGA 14 x 14 x 14 ICK PGA 15 x 15 ICK PGA 16 x 16 x 8 ICK PGA 16 x 16 x 10 ICK PGA 16 x 16 x 12 ICK PGA 17 x 17 ICK PGA 17 x 17 x 8 ICK PGA 17 x 17 x 12 ICK PGA 18 x 18 ICK PGA 19 x 19 ICK PGA 19 x 19 x 12 ICK PGA 20 x 20 ICK PGA 20 x 20 K ICK PGA 20 x 20 x 8 ICK PGA 20 x 20 x 10 ICK PGA 20 x 20 x 12 ICK PGA 21 x 21 ICK PGA 22 x 22 ICK PGA 25 x 25 ICK PLCC 28 ICK PPC 51 ICK PRO 40 W ICK R ICK S 10 x 10 x 6,5 ICK S 10 x 10 x 10

page B 35 B 35 B 35 B 35 B 36 B 36 B 36 B 36 B 36 B 36 B 36 B 37 B 37 B 37 B 37 B 37 B 37 B 37 B 38 B 38 B 38 B 38 B 38 B 39 B 39 B 38 B 39 B 39 B 39 B 39 B 40 B 40 B 40 B 40 B 41 B 57 B 56 B 56 B 57 B 57 B 57 B 11 B 11 B 11 B 11 B 11 B 12 B 12 B 12 B 12 B 12 B 12 B 13 B 13 B 13 B 13 B 13 B 13 B 14 B 14 B 14 B 14 B 15 B 15 B 14 B 15 B 15 B 15 B 16 B 52 B 56 B 57 B 52 B 21 B 21

art. no. ICK S 10 x 10 x 12,5 ICK S 10 x 10 x 18,5 ICK S 14 x 14 x 6,5 ICK S 14 x 14 x 10 ICK S 14 x 14 x 12,5 ICK S 14 x 14 x 18,5 ICK S 17 x 17 x 15 ICK S 17 x 17 x 20 ICK S 18 x 18 x 6,5 ICK S 18 x 18 x 10 ICK S 22 x 22 x 10 ICK S 22 x 22 x 18,5 ICK S 25 x 25 x 6,5 ICK S 25 x 25 x 12,5 ICK S 25 x 25 x 18,5 ICK S 29 x 29 x 10 ICK S 29 x 29 x 20 ICK S 29 x 29 x 30 ICK S 32 x 32 x 10 ICK S 32 x 32 x 20 ICK S 36 x 36 x 10 ICK S 36 x 36 x 15 ICK S 36 x 36 x 20 ICK S 36 x 36 x 30 ICK S 40 x 40 x 10 ICK S 40 x 40 x 20 ICK S 40 x 40 x 25 ICK S 45 x 45 x 10 ICK S 45 x 45 x 20 ICK S 50 x 50 x 20 ICK S 50 x 50 x 25 ICK S 50 x 50 x 40 ICK S 50 x 50 x 50 ICK S 98 x 98 x 30 ICK S 98 x 98 x 45 ICK S D 12 x 12 x 7,5 ICK S D 18 x 12 x 7,5 ICK S D 24 x 18 x 7,5 ICK S D 98 x 98 x 10 ICK SMD A 5 ICK SMD A 8 ICK SMD A 10 ICK SMD A 13 ICK SMD A 17 ICK SMD A 22 ICK SMD B 5 ICK SMD B 7 SA ICK SMD B 10 SA ICK SMD B 13 SA ICK SMD B 19 ICK SMD BOX 1 ICK SMD C 7 SA ICK SMD C 10 SA ICK SMD C 17 ICK SMD E 15 SA ICK SMD E 22 SA ICK SMD E 29 SA ICK SMD F 8 ICK SMD F 10 ICK SMD F 17 SA ICK SMD F 19 ICK SMD F 21 ICK SMD F 26 ICK SMD G 8 MI ICK SMD G 10 ICK SMD G 13 SA ICK SMD G 17 SA ICK SMD G 19 SA ICK SMD G 21 ICK SMD H 8 ICK SMD H 10 ICK SMD H 17 ICK SMD H 19 SA ICK SMD H 25 ICK SMD K 8

page B 21 B 22 B 22 B 22 B 22 B 22 B 22 B 23 B 23 B 23 B 23 B 23 B 23 B 24 B 24 B 24 B 24 B 24 B 24 B 25 B 25 B 25 B 25 B 25 B 25 B 26 B 26 B 26 B 26 B 26 B 26 B 27 B 27 B 27 B 27 B 28 B 28 B 28 B 28 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 55 B 53 B 53 B 53 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54

art. no. ICK SMD K 10 SA ICK SMD K 13 ICK SMD K 17 ICK SMD K 19 ICK SMD K 21 ICK SMD M 8 SA ICK SMD M 10 SA ICK SMD M 17 MI ICK SMD M 19 SA ICK SMD M 21 SA ICK SMD N 8 ICK SMD N 10 ICK SMD N 17 ICK SMD N 19 ICK SMD N 21 ICK SMD N 26 ICK S R 28,5 x 6,5 ICK S R 28,5 x 10 ICK S R 28,5 x 12,5 ICK S R 28,5 x 18,5 ICK S R 32,5 x 10 ICK S R 32,5 x 20 ICK S R 32,5 x 30 ICK S R 32,5 x 40 ICK S R 32,5 x 50 ICK S R 36,5 x 20 ICK S R 40 x 10 ICK S R 40 x 20 ICK S R 40 x 30 ICK S R 40 x 50 ICK S R 45 x 30 ICK S R 45 x 45 ICK S R 50 x 10 ICK S R 50 x 20 ICK S R 50 x 30 ICK S R 50 x 45 ICK S R 54 x 20 ICK S R 54 x 30 ICK S R 54 x 45 ICK S R 70 x 30 ICK S R 70 x 50 ICK S R 85 x 30 ICK S R 85 x 45 ICK S R 98 x 30 ICK S R 98 x 50 ICK S R A 40 x 20 IK 3 IK 341 3 IS 1 IS 2 IS 3 IS 4 IS 5 IS 6 IS 7 IS 8 IS 53 ISAB 3 A ISAB 3 B ISAB 3 C ISAB 4 A ISAB 4 B ISAB 4 C ISAB 5 B ISAB 5 C ISAB 6 A ISAB 6 B ISAB 6 C ISAB 25 A ISAB 25 B ISAB 25 C ISAM 2 A ISAM 2 B ISAM 2 C ISAM 3 A

page B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 55 B 55 B 55 B 55 B 55 B 55 B 29 B 29 B 29 B 29 B 29 B 29 B 30 B 30 B 30 B 30 B 30 B 30 B 31 B 31 B 31 B 31 B 31 B 32 B 32 B 32 B 32 B 32 B 33 B 33 B 33 B 33 B 33 B 34 B 34 B 31 E 51 E 51 E 49 E 49 E 49 E 49 E 49 E 49 E 50 E 50 A 127 E 32 E 33 E 33 E 32 E 33 E 33 E 33 E 33 E 32 E 33 E 33 E 32 E 33 E 33 E 34 E 34 E 34 E 34


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Alphanumerical product list art. no. ISAM 3 B ISAM 3 C ISAS 25 A ISAS 25 B ISAS 25 C ISAS 30 A ISAS 30 B ISAS 30 C ISAS 40 A ISAS 40 B ISAS 40 C ISAS 50 A ISAS 50 B ISAS 50 C ISAS 60 A ISAS 60 B ISAS 60 C ISP 218 ISP 220 ISP 220 V ISP 247 K 0,55 K 1,1 K3 K3T K5 K9 K 15 KAP 1 P KAP 3 G KAP 3 K KAP 218 KAP 218 O KAP 220 G KAP 220 K KAP 220 O KAP 247 O KF 5/10 KF 5/15 KF 5/5 KK 1 3,96 KK 1 6,35 KK 1 12,7 KK 1 19,05 KK 32 KK 92 KK 562 GS KL 35 50 KL 35 75 KL 35 100 KL 35 K 40 KL 35 K 50 KL 35 K 75 KL 35 K 100 KTE 1 KTE 2 KTE R LA 1 01 LA 1 02 LA 1 03 LA 1 04 LA 1 05 LA 1 06 LA 1 07 LA 1 08 LA 1 09 LA 1 10 LA 2 01 LA 2 02 LA 2 03 LA 2 04 LA 2 05 LA 2 06 LA 2 07 LA 2 08

page E 34 E 34 E 35 E 36 E 36 E 35 E 36 E 36 E 35 E 36 E 36 E 35 E 36 E 36 E 35 E 36 E 36 E 45 E 45 E 45 E 45 A 128 A 128 A 126 A 126 A 126 A 126 A 127 E 16 E 16 E 16 E 16 E 16 E 16 E 16 E 16 E 16 C 18 C 18 C 18 C 17 C 17 C 17 C 17 C 19 C 19 C 18 E 25 E 25 E 25 E 25 E 25 E 25 E 25 A 129 A 129 B 47 D5 D5 D5 D5 D5 D5 D5 D5 D5 D5 D7 D7 D7 D7 D7 D7 D7 D7

art. no. LA 2 09 LA 2 10 LA 4 LA 5 LA 6 LA 7 LA 8 LA 9 LA 10 LA 11 LA 14 LA 15 LA 17 LA 18 LA 20 LA 21 LA 22 LA 25 LA 26 LA 27 K LAGI 40 LAGI 60 LAGI 80 LAGI 92 LAGI 119 LA HL 1 LA HL 2 LA HL 3 LAHL D 1 LAHLR 1 500 LA HLV 1 LA HLV 2 LA HLV 3 LA ICK 15 x 15 F 05 LA ICK 15 x 15 F 12 LA ICK 17 x 17 F 12 LA ICK 17 x 17 F 12 A LA ICK 17 x 17 W 05 LA ICK 17 x 17 W 12 LA ICK 18 x 18 F 12 LA ICK 18 x 18 W 12 LA ICK 21 x 21 F 05 LA ICK 21 x 21 F 12 LA ICK 21 x 21 W 05 LA ICK 21 x 21 W 12 LA ICK PEN 2 K 12 LA ICK PEN 3 XE LA ICK PEN 4 1 K LA ICK PEN 8 F 05 LA ICK PEN 8 F 12 LA ICK PEN 8 W 05 LA ICK PEN 8 W 12 LA ICK PEN 16 K 12 LA ICK PEN 16 W 12 LA ICK PEN 16 W 12 A LA ICK PEN 18 W 12 LA ICK PEN 38 W 12 LA ICK PRO 25 F 12 LA LED 40 x 30 LA LED 50 x 20 LA LED 50 x 45 LA LED 68 LAM 1 LAM 2 LAM 3 LAM 3 K LAM 4 LAM 4 K LAM 5 LAM 5 K LA V 6 LA V 7 LA V 8 LA V 9 LA V 10

page D7 D7 D 14 D 14 D 15 D 15 D 15 D 17 D 17 D 17 D 19 D 19 D 21 D 21 D 34 D 23 D 23 D 33 D 33 D 13 D 36 D 36 D 36 D 36 D 36 D 27 D 27 D 27 D 29 D 35 D 28 D 28 D 28 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 60 B 60 B 60 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 49 B 49 B 49 B 50 D9 D9 D 10 D 10 D 11 D 11 D 12 D 12 D 16 D 16 D 16 D 18 D 18

art. no. LA V 11 LA V 14 LA V 15 LA V 17 LA V 18 LA V 21 LA V 22 LA V 24 LS 101 LS 102 LS 103 LS 104 LS 105 LS 106 LS 107 LSD 07520 LSD 08910 LSD 08920 LSD 13510 LSD 13520 MD A 04 MD A 06 MD A 07 MD A 09 MD A 12 MD B 07 MD B 10 MD B 11 MD B 12 MD B 15 MD C 13 MD C 22 MLW 32 MLW 44 MLW 51 MRL 20 MS 34 518 MS 53 3 MS 53 7 MS 53 25 MS 54 25 MS 56 15 MS 58 5 MS 58 7 MS 58 15 MS 84 4 MS 183 7 MS 183 25 MS 183 35 MS 184 7 MS 184 25 MS 184 35 MS 510 15 MS 923 25 MS 3518 25 MS 3518 35 MS 4016 MSHV 90 MST 3 MST 220 MSTS 3 MSTS 220 MSVL 50 MSVL 60 MSVL 70 MSVL 85 MSVL 100 SFP 005 SFP 006 SFP 007 SFP 016 SFP 028 SFP 029 SFP 037 SFP 046

page D 18 D 20 D 20 D 22 D 22 D 24 D 24 D 25 E 43 E 43 E 43 E 43 E 43 E 43 E 43 E 42 E 42 E 42 E 42 E 42 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 47 E 47 E 47 E 47 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 28 E 44 E 44 E 44 E 44 E 28 E 28 E 28 E 28 E 27 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135

art. no. SFP 054 SFP 057 SFP 058 SFP 060 SFP 067 SFP 074 SFP 076 SFP 079 SFP 090 SFP 100 SFP 106 SFP 112 SK 01 SK 02 SK 03 SK 04 SK 05 SK 06 SK 07 SK 08 SK 09 SK 11 SK 12 SK 12 SA 2 x 32 SK 12 SA 32 SK 13 SK 13 35 SA 220 SK 13 35 SA 220 3,2 SK 13 35 SA 220 3,5 SK 14 SK 15 SK 16 SK 18 SK 19 SK 20 SK 21 SK 23 SK 25 SK 28 SK 30 SK 31 SK 32 SK 33 SK 34 SK 36 SK 39 SK 40 SK 42 SK 44 SK 45 SK 46 SK 47 SK 48 SK 49 SK 50 SK 51 SK 52 SK 53 SK 55 SK 56 SK 57 SK 58 SK 59 SK 60 SK 61 SK 63 SK 64 SK 65 SK 66 SK 67 SK 68 SK 69 SK 71 SK 72 SK 73

page A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 66 A 66 A 66 A 64 A 62 A 79 A 72 A 73 A 59 A 79 A 123 A 124 A 124 A 123 A 124 A 124 A 124 A 67 A 77 A 72 A 62 A 63 A 68 A 70 A 79 A 61 A 63 A 67 A 72 A 76 A 42 A 67 A 66 A 67 A 82 A 49 A 90 A 63 B 43 A 49 A 73 A 51 A 37 A 61 A 74 A 74 A 83 A 54 A 64 A 45 A 60 A 74 A 82 A 62 A 70 A 70 A 55 A 69 A 89 A 71 A 64 A 63 A 64


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Alphanumerical product list art. no. SK 74 SK 75 25 SK 75 25 STS TO 220 SK 75 25 TO 220 SK 75 37,5 SK 75 37,5 STS TO 220 SK 75 37,5 TO 220 SK 75 50 SK 75 50 STS TO 220 SK 75 50 TO 220 SK 75 75 SK 75 1000 SK 76 25 SK 76 25 STS TO 220 SK 76 25 TO 220 SK 76 37,5 SK 76 37,5 STS TO 220 SK 76 37,5 TO 220 SK 76 50 SK 76 50 STS TO 220 SK 76 50 TO 220 SK 76 75 SK 76 1000 SK 78 SK 79 SK 80 SK 81 SK 82 SK 83 SK 84 SK 85 SK 86 SK 88 SK 89 SK 90 SK 91 SK 92 SK 93 SK 94 SK 95 15 SK 95 15 SOT 32 S SK 95 15 STS SOT 32 S SK 95 25 SK 95 25 1 x M2,5 1 x M3 SK 95 25 2 x M3 SK 95 25 SOT 32 SK 95 25 STS SOT 32 SK 95 25 STS TO 220 SK 95 25 TO 220 SK 95 1000 SK 96 SK 97 SK 98 SK 99 SK 100 SK 101 SK 102 SK 104 ... LS SK 104 ... STC SK 104 ... STIC SK 104 ... STCB SK 104 ... STS SK 104 ... STIS SK 104 ... STSB SK 105 SK 106 SK 107 SK 108 SK 109 SK 110 SK 111 SK 112 SK 113 SK 115 SK 118

page A 71 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 61 A 73 A 74 A 41 A 75 A 79 A 68 A 46 A 75 A 73 A 77 A 48 A 52 A 41 A 56 A 49 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 91 A 62 A 65 A 37 A 38 A 54 A 50 A 98 A 97

A 97

A 90 A 31 A 60 A 80 A 80 A 80 A 81 A 89 A 48 A 123 A 51

art. no. SK 119 SK 120 SK 121 SK 122 SK 124 SK 125 SK 126 25 SK 126 25 2 x M3 SK 126 25 STS TO 220 SK 126 25 TO 220 SK 126 37,5 SK 126 37,5 2 x M3 SK 126 37,5 STS TO 220 SK 126 37,5 TO 220 SK 126 1000 SK 128 SK 129 ... STC SK 129 ... STIC SK 129 ... STCB SK 129 ... STS SK 129 ... STIS SK 129 ... STSB SK 130 SK 132 SK 133 SK 134 SK 135 SK 136 SK 138 SK 139 SK 140 SK 144 SK 145 SK 145 25 STC SK 145 25 STS TO 220 SK 145 30 STC SK 145 37,5 STS TO 220 SK 145 50 STC SK 145 50 STS TO 220 SK 147 SK 148 SK 149 SK 150 SK 153 SK 154 SK 155 SK 156 SK 157 SK 158 SK 159 SK 160 SK 161 SK 162 SK 163 SK 165 SK 166 SK 168 SK 172 SK 173 SK 174 SK 175 SK 176 SK 177 SK 178 SK 179 SK 180 SK 181 SK 181 94 C 3 x TO 220 SK 182 SK 184 SK 185 SK 185 25 STC TO 220 SK 185 25 STS TO 220 SK 185 25 TO 220 SK 185 37,5 STC TO 220

page A 47 A 45 A 42 A 60 A 71 A 91 A 107 A 107 A 107 A 107 A 107 A 107 A 107 A 107 A 107 A 91 A 103

A 103

A 56 A 44 A 44 A 28 A 39 A 48 A 91 A 53 A 77 A 82 A 59 A 106 A 106 A 106 A 106 A 106 A 106 A 74 A 68 A 53 A 61 A 83 A 46 A 45 A 36 A 54 A 58 A 58 A 58 A 58 A 58 A 78 A 61 A 48 A 50 A 81 A 59 A 30 A 83 A 78 A 27 A 28 A 30 A 36 A 60 A 60 A 40 A 68 A 73 A 104 A 104 A 104 A 104

art. no. SK 185 37,5 STS TO 220 SK 185 37,5 TO 220 SK 185 50 C TO 220 SK 185 50 STC TO 220 SK 185 50 STS TO 220 SK 185 50 TO 220 SK 187 SK 189 SK 190 SK 191 SK 193 SK 194 SK 195 SK 197 SK 198 SK 199 SK 400 SK 400 20 1 x M3 L SK 400 40 2 x M3 L SK 400 60 3 x M3 L SK 401 SK 402 SK 403 SK 404 SK 405 SK 406 SK 407 SK 408 SK 409 ... STC SK 409 ... STIC SK 409 ... STCB SK 409 ... STS SK 409 ... STIS SK 409 ... STSB SK 410 SK 411 SK 412 SK 413 SK 414 SK 415 SK 416 SK 417 SK 418 SK 419 SK 420 SK 421 SK 422 SK 423 SK 424 SK 425 SK 426 SK 427 SK 429 SK 431 1 SK 431 2 SK 431 3 SK 432 SK 433 SK 434 SK 435 SK 436 SK 437 SK 437 ... STC SK 437 ... STC 2 SK 437 ... STS SK 437 ... STS 2 SK 438 SK 439 SK 440 SK 441 SK 442 SK 443 SK 444 SK 445 SK 446

page A 104 A 104 A 104 A 104 A 104 A 104 A 76 A 32 A 52 A 56 A 50 A 81 A 71 A 65 A 53 A 51 A 28 A 111 A 111 A 111 A 63 A 62 A 64 A 65 A 47 A 38 A 39 A 40 A 100

A 100

A 44 A 42 A 47 A 43 A 90 A 90 A 47 A 46 A 58 A 70 A 31 A 47 A 32 A 32 A 34 A 34 A 36 A 36 A 37 A 124 A 124 A 124 A 82 A 41 A 35 A 81 A 37 A 24 A 109 A 109 A 109 A 109 A 52 A 55 D 30 D 30 A 42 A 59 A 38 A 34 A 53

art. no. SK 447 SK 448 SK 448 20 1 x M3 L SK 448 40 2 x M3 L SK 448 60 3 x M3 L SK 450 SK 451 SK 452 SK 452 20 1 x M3 SK 452 20 2 x M3 SK 452 40 2 x M3 SK 452 40 4 x M3 SK 452 60 3 x M3 SK 452 60 6 x M3 SK 452 80 4 x M3 SK 452 80 8 x M3 SK 452 100 5 x M3 SK 452 100 10 x M3 SK 453 SK 454 SK 454 20 1 x M3 SK 454 20 1 x M3 L SK 454 20 2 x M3 SK 454 40 2 x M3 SK 454 40 2 x M3 L SK 454 40 4 x M3 SK 454 60 3 x M3 SK 454 60 3 x M3 L SK 454 60 6 x M3 SK 454 80 4 x M3 SK 454 80 8 x M3 SK 454 100 5 x M3 SK 454 100 10 x M3 SK 455 SK 456 SK 456 20 1 x M3 L SK 456 40 2 x M3 L SK 456 60 3 x M3 L SK 458 SK 459 ... STC SK 459 ... STIC SK 459 ... STCB SK 459 ... STS SK 459 ... STIS SK 459 ... STSB SK 459 25 2 x TO 220 SK 459 25 M SK 459 37,5 2 x TO 220 SK 459 37,5 M SK 459 50 2 x TO 220 SK 459 50 M SK 460 25 SK 460 37,5 SK 460 50 SK 461 SK 463 SK 464 SK 466 SK 467 SK 468 SK 469 SK 469 ... STS SK 470 SK 470 25 STS SK 470 30 STS SK 470 35 STS SK 470 50 STS SK 471 SK 472 SK 473 SK 475 SK 476 SK 477 SK 478 SK 479

page A 26 A 27 A 111 A 111 A 111 A 34 A 91 A 27 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 33 A 24 A 96 A 111 A 96 A 96 A 111 A 96 A 96 A 111 A 96 A 96 A 96 A 96 A 96 A 33 A 30 A 111 A 111 A 111 D 30 A 101

A 101

A 102 A 102 A 102 A 102 A 102 A 102 A 112 A 112 A 112 D 30 A 43 A 39 A 43 A 33 A 36 A 23 A 110 A 22 A 110 A 110 A 110 A 110 A 29 A 31 A 25 A 35 A 24 A 24 A 23 A 55


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Alphanumerical product list art. no. page SK 480 A 84 SK 481 A 85 SK 482 A 86 SK 483 A 87 SK 484 A 110 SK 485 A 38 SK 486 A 25 SK 487 A 87 SK 489 A 85 SK 490 A 84 SK 492 A 84 SK 493 A 28 SK 494 A 83 SK 495 A 87 SK 496 A 22 SK 497 D 30 SK 498 D 30 SK 499 A 87 SK 500 A 72 SK 501 A 54 SK 502 A 49 SK 503 A 46 SK 504 A 45 SK 505 A 41 SK 507 A 40 SK 508 A 41 SK 509 A 29 SK 510 A 46 SK 511 A 32 SK 512 A 84 SK 513 A 31 SK 514 A 86 SK 515 05 10 A 94 SK 515 05 10 S A 94 SK 515 05 23,5 A 94 SK 515 05 23,5 S 2 A 94 SK 515 05 37 A 94 SK 515 05 37 S 3 A 94 SK 515 10 S TO 220 A 94 SK 515 10 TO 220 A 94 SK 515 23,5 S 2 x TO 220 A 94 SK 515 23,5 TO 220 A 94 SK 515 37 S 3 x TO 220 A 94 SK 515 37 TO 220 A 94 SK 516 15 S TO 218 A 94 SK 516 15 TO 218 A 94 SK 516 33 S 2 x TO 218 A 94 SK 517 A 93 SK 518 A 93 SK 519 A 48 SK 520 A 50 SK 521 A 24 SK 522 A 23 SK 523 A 55 SK 524 A 52 SK 525 15 A 95 SK 525 15 ST A 95 SK 525 20 ST A 95 SK 525 25 ST A 95 SK 525 30 A 95 SK 525 30 ST A 95 SK 526 30 ST A 95 SK 527 A 35 SK 530 A 57 SK 531 A 57 SK 533 A 57 SK 535 A 57 SK 536 A 57 SK 537 A 57 SK 538 A 57 SK 539 A 57 SK 540 A 57 SK 544 A 76 SK 545 A 39 SK 546 A 40

art. no. SK 547 SK 548 SK 549 SK 550 SK 551 SK 552 SK 553 SK 554 SK 555 SK 556 SK 557 SK 558 SK 559 SK 560 SK 561 SK 562 SK 563 SK 564 SK 565 SK 566 SK 567 SK 568 SK 569 SK 570 SK 571 SK 572 SK 573 SK 574 SK 575 SK 576 SK 577 SK 578 SK 579 SK 580 SK 581 SK 582 SK 583 SK 584 SK 585 ... SK 586 SK 587 SK 588 SK 589 SK 590 SK 591 SK 592 SK 593 SK 594 SK 595 SK 596 SK 597 SK 598 SK 599 SK 600 ... SK 600 ... SK 600 ... SK 600 ... SK 600 ... SK 600 ... SK 601 SK 602 SK 603 SK 604 SK 605 SK 606 SK 607 SK 608 SK 609 SK 610 SK 611 SK 612 SK 613 SK 614 SK 615 SK 616

STC STIC STCB STS STIS STSB

page A 31 A 34 A 29 A 27 A 25 A 23 A 44 A 26 A 51 A 77 A 50 A 23 A 25 A 26 A 26 A 29 A 30 A 30 A 22 A 26 A 35 A 54 B 43 B 44 B 44 B 44 A 85 A 86 A 84 A 85 B 43 B 43 A 55 A 51 A 28 A 25 A 53 B 44 B 42 A 22 A 29 A 45 A 86 B 46 A 49 B 45 A 87 A 38 A 43 A 76 A 27 B 42 B 45 A 99

A 99

A 44 B 43 D 31 D 31 D 31 D 31 D 31 D 31 A 92 A 92 A 92 A 39 A 43 A 52 B 45 A 22

art. no. SK 617 SK 618 SK 619 SK 620 SK 621 SK DC 2 1 76 SA SK DC 4 1 117 SA SK DC 5 1 59 SA SK DC 5 59 SA SK DC 6 1 60 SA SK DC 7 1 117 SA SK DC 7 117 SA SK DC 8 1 60 SA SK DC 8 60 SA SK DC 10 60 SA SKK 56 SKK 58 SKK 510 SK LED 1 SK LED 2 SK LED 3 SK LED BOX 1 SMP 410 A SMP 410 B SMP 410 C SMP 415 A SMP 415 B SMP 415 C SMP 515 A SMP 515 B SMP 515 C STP 4 STP 5 SU 02 SU 03 SU 05 SU 09 SU 16 SU 27 SU 29 SU 32 SVP 01 SVP 04 SVP 10 SVP 12 SVP 13 SWP 02 SWP 06 SWP 10 SWP 15 SWP 23 SWP 25 SWP 29 SWP 36 SWP 40 SWP 55 SWP 57 TF 3 2 THF 104 THF 129 TO 220 THF 220 THF 220 17 THF 247 THF 247 4 THF 249 THF 409 220 1 THF 409 220 2 THF 409 SOT 32 THF 409 TO 220 THF 600 THFA 1 THFA 2 THFA 3 THFA 4 THFK 220

page A 88 B 42 B 42 B 42 A 56 A 114 A 113 A 114 A 114 A 113 A 114 A 114 A 113 A 113 A 113 C 19 C 19 C 19 B 48 B 48 B 48 B 51 E 41 E 41 E 41 E 41 E 41 E 41 E 41 E 41 E 41 A 136 A 136 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 136 A 136 A 136 A 136 A 136 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 E 50 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 117 A 117 A 117 A 117 A 116

art. no. THFK 247 THFM THFMG THFU 1 THFU 2 THFU 3 THFU 4 THFU 5 THFU 6 THFU 7 UK 14 SA 220 UK 14 SA 220 3,2 UK 14 SA M3 US 58 4 US 512 4 WB 3 WB 3 P WBT 30 WBT 300 WG 3 WG 3 P WGT 300 WK 3 WK 3 P WK 3/4 WKT 24 WKT 300 WL 0,55 WL 1,1 WLFG 9010 R 25 WLFG 9010 R 50 WLFG 9010 R 100 WLFG 9015 R 25 WLFG 9015 R 50 WLFG 9015 R 100 WLFG 9020 R 25 WLFG 9020 R 50 WLFG 9020 R 100 WLFG S 900 K R 25 WLFG S 900 K R 50 WLFG S 900 K R 100 WLFT 88 ... WLFT 404 ... / WLFT 405 .../ WLFT 414 ... WLFT 8943 ... WLK 5 WLK 10 WLK 30 WLK 120 WLK DK 4 WLK DK 10 WLK DK 50 WLK M 4 WLK M 50 WLK P WLP 004 WLP 035 WLP 300 S WLP 500 WLP 500 S WLPF 05 WLPF 10 WLPF 20 WLPF 50 WLPF 300 S WLPK 3 WLPK 5 WLPK 10 WP 4030 100 WP 4030 100 3 WS 3 WS 3 M WS 3 P WS 3/4

page A 116 A 116 A 116 A 119 A 119 A 120 A 120 A 120 A 121 A 121 A 123 A 123 A 123 E 46 E 46 E4 E4 E4 E4 E4 E4 E4 E4 E4 E4 E4 E4 A 128 A 128 E9 E9 E9 E9 E9 E9 E9 E9 E9 E9 E9 E9 E8 E7

E6 E 23 E 23 E 23 E 23 E 24 E 24 E 24 E 24 E 24 E 24 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 22 E 22 E 22 A 125 A 125 E4 E4 E4 E4


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Alphanumerical product list art. no. WSC-220 WSF 16 WSF 32 WSF 635 WSFS 635 WSI 220 210 WSI 220 225 WSI TO 3 PL WSI TOP 3 235 WSI TOP 3 280 WSM-220 WST 30 WST 36 WST 85

page E4 E 10 E 10 E 10 E 10 E5 E5 E5 E5 E5 E4 E4 E4 E4


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Index Active heatsinks for processors Aluminium flat-, quadrangular-, angled-, U- & T-profiles Aluminium oxide wafers Attachable heatsink Cooling aggregates with axial fan Cooling aggregates with radial fan Die-cast heatsinks Distance sleeves and spacers Extruded heatsinks for DC/DC converter Extruded heatsinks for lock-in retaining spring Extruded heatsinks for PCB mounting Fastening for mounting rail Fin coolers Finger shaped heatsinks Fluid coolers Guide rails Heat conductive foam and gel foils Heatsinks for BGAs Heatsinks for DIL-IC, PLCC and SMD Heatsinks for D PAK and others Heatsinks for LEDs Heatsinks for PGA High-performance heatsinks High thermoconducting graphite foils Insulating caps and insolater sleeves Insulating clamping parts for power transistors Kapton insulator washers Mica wafers Miniature cooling aggregates Mounting kits for insulation of power transistors Mounting parts for heatsinks Mounts Passive heatsinks for processors Pin heatsinks Protection grid for fans Retaining springs for transistors Segment cooling aggregates Small heatsinks Standard extruded heatsinks Thermal conductive foil one-sided adhesive Thermally conductive adhesive Thermally conductive foil both sides adhesive Thermally conductive foil made of siliconelastomer Thermal transfer compound and thermal interface film U-Extruded heatsinks Vibration dampers and solder terminals

B A E C D D A E A A A E A C A E E B B C B B D E E E E E D E E E B B D A D C A E E E E E A E

58-61 135-136 17-18 10-16 13-29 33-35 125-128 32-40 113-114 84-88 89-112 25 129 2-9 131-134 26-31 10-15 17-20 52-55 21-22 35-51 11-16 30-32 9 51-52 45 16 19 9-12 44 49-50 46-48 56-57 21-34 36 115-122 5-9 17-20 22-83 6 23-24 7-8 2-5 20-22 123-124 41-43


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Explanations – references – printings

A

... index area: shows topics/categories “current“

“following”

... page number

D 15 Standard aluminium profiles Technical explanations Extruded heatsinks Assignment table

B

... index area: shows topics/categories

A A A A

135 - 136 2-8 22 - 83 18 - 22

SA = black anodised MI = solderable surface ME = clear anodised TP = chrom-free transparent passivated

A 10

... footnotes, give references to pages with combinable or similar products ... option for surface finishing

... link to page ... length on stock in mm ... hole pattern ... symbol of heatsink geometry

Rth

... thermal resistance in K/W ... thickness of sheet/plate

v

... air/speed in m/s

Imprinting of cardholders - Your and our time is expensive An order for imprinting must state the font, the font size and the exact position of the imprint with dimensions, taking due account of countersunk holes etc.. When placing the first order, the company logo must be supplied as a vector file. If these conditions are not complied with, the order for imprinting may have to be turned down, or additional costs will have to be charged. Compliance with the following criteria ensures smooth handling: Adobe Illustrator (.ai/.eps) without half-tone images, fonts transformed into paths or supplied CorelDraw (.cdr) Adobe Acrobat (.pdf) all fonts enclosed; half-tone images colour-separated (full-tone or scale colours) and QuarkXPress (.qxd) InDesign (.indd) with correct resolution (300 dpi colour, black / white 600 dpi), no RGB All this takes additional time and consequently incurs extra costs. The usability must be checked by our printing shop: screen formats (.jpg, .gif, .png) and paper copies, stickers and the like are not suitable for preparing printer‘s copies! Copies that definitely cannot be used: Imperfect copies such as fax copies / Microsoft Office files (.doc, .xls, .ppt) can only be used for information or for transmitting texts. Please always add dimensional drawings (.dxf) to the parts to be imprinted! Please note as a general rule: Retouching work extending beyond the standard time will be invoiced additionally at cost price.

No part of this catalogue may be reproduced or distributed without prior written consent of Fischer Elektronik. All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to copyright and the provisions of DIN ISO 16016. All rights reserved. © Copyright Fischer Elektronik 1969 ... 2014


Machined heatsinks Fluid heatsinks Lamella heatsinks Extruded heatsink with solder pins

Fluid heatsinks – fluid heatsinks for dissipation of big heat flow volumes – compact design with internal lamella structure – thick bottom plates for optimal heat dissipation – I- and U streamed versions – water connection or mounting flange for your special application – customized treatments and solutions

.26 - Fax 0 2. 16 . 2 1 .6

.09 .10 26 6.

Tel 0 2. 33

Machined heatsinks – several hundreds of extrusion profiles available – future orientated stockkeeping of heatsink profiles in a fully automatic honeycomb warehouse – precise milling treatments in highest quality – effective heat spreading by means of heatsinks with grouted copper areas – designs and modifications according to your demand

A

LI

IT

AW

.EL

EB

.I T

WWW LI

AW

EB

Lamella heatsinks – compact lamella heatsinks with a big surface – special design for forced convection – thermotechnical optimal fitted lamellas – precise milled flat semiconductor mounting surface – single and double sided bottom plate made of aluminium or copper – production according to customer specified demands

.I T - I N F O @

EL

IT

A

Extruded heatsinks with solder pins – solid pressed in soldering pins and threaded bolts for a direct pcb-mounting – for horizontal and vertical mounting position – standard drilling patterns and transistor retaining springs for various semi-conductive elements – soldering pins with insulation for spacing help – variations and modifications according to drawing


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Technical introduction

A

1. General points In order to provide optimum performance of semi-conducting devices it is essential not to exceed the maximum junction temperature indicated by the manufacturer.

B

Generally this maximum junction temperature can only be maintained without exceeding it by running the device concerned at lower power outputs. At outputs approaching the maximum ratings semi-conductor devices have to be cooled by so called heatsinks, sometimes called dissipators.

C

The thermal performance of these heatsinks primarily depends on the thermal conductivity of the material from which they are made, size of surface area and mass. In addition, surface colour, mounting position,temperature, ambient air velocity and mounting place all have varying influence on the final performance of the heatsink from one application to another..

D

However, a figure for thermal resistance can be experimentally determined in a reliable manner and used in the equations that follow in part 2. There are no agreed international standard methods for testing electronic cooling systems or for the determination of the thermal resistance.

E

Therefore the diagrams and values given in our catalogue have been determined under practical operating conditions and therefore allow the most suitable heatsink from the range to be selected. We expressly point out that all information and data is given to the best of our knowledge and belief. The user is solely responsible for the proper use of our products and he should check their suitability for the intended application. Fischer Elektronik do not assume any warranty, whether expressed or implied, for the suitability, function or merchantibility of their products in specific or general applications, and they cannot be held liable for accidental or consequential damage due to non-observance of the above. Furthermore Fischer Elektronik reserve the right to carry out technical modifications to their products at any time. All orders are subject to the General Sales Conditions of Fischer Elektronik.

F

G

2. The determination of thermal resistance The thermal resistance is the parameter that is the most important in cooler selection, apart from mechanical considerations. For determination of the thermal resistance the following equation applies:

Equation 1:

RthK =

H

Δϑ ϑi − ϑu − ( RthG + RthM ) = − RthGM P P

In case of an application where the maximum junction temperature is not exceeded the temperature has to be verified. When the case temperature has been measured the use of the following equation will enable the maximum junction temperature to be calculated: Equation 2: ϑi = ϑG + P x RthG

I

The meaning of the determinants:

K

ϑi

= maximum junction temperature in °C of the device as indicated by manufacturer. As a »safety factor« this should be reduced by 20-30 °C.

ϑu

= ambient temperature in °C. The rise in temperature caused by radiant heat of the heatsink should be increased by a margin of 10-30 °C.

Δϑ

= difference between maximum junction temperature and ambient temperature.

ϑG

= measured temperature of device case (equation 2).

P

= maximum power rating of device in watts

Rth

= thermal resistance in K/W

RthG

= internal thermal resistance of semiconductor device (as indicated by manufacturer)

Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts

L

M A A A A

13 - 17 137 - 138 140 10

Heatsinks for SSR Die-cast heatsinks Assigment table Order example

A A A A

11 - 12 125 18 - 20 21

A2

N


A

B

C

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Technical introduction RthM = thermal resistance of mounting surface. For TO 3 cases the following approximate values apply: 1. dry, without insulatar 0.05 - 0.20 K/W 2. with thermal compound/without insulator 0.005 - 0.10 K/W 3. Aluminium oxide wafer with thermal compound 0.20 - 0.60 K/W 4. Mica wafer (0.05 mm thick) with thermal compound 0.40 - 0.90 K/W RthK = thermal resistance of heatsink, which can be directly taken from the diagrams RthGM = sum of RthG and RthM. For parallel connections of several transistors the value RthGM can be determined by the following equation:

D

1 = RthGM ges.

Equation 3:

1 RthG1 + RthM1

+

1 1 + ... + RthG2 + RthM2 RthGn + RthMn

The result can be substituted into equation 1. K

= Kelvin, which is the standard measure of temperature differences, measured in °C, therefore 1°C = 1 K.

K/W = Kelvin per watt, the unit of thermal resistance. Calculation examples:

E

F

1. A TO 3 power transistor with 60 watt rating has a maximum junction temperature of 180 °C and an internal resistance of 0.6 K/W at an ambient of 40 °C with aluminium oxide wafers. What thermal resistance is required for the heatsink? given: P = 60 W ϑi = 180 °C - 20 °C =160 °C (for safety margin) ϑu = 40 °C

ϑ -ϑ RthK = i u − (RthG + RthM) =160 °C - 40 °C − (0.6 K/W + 0.4 K/W) = 1,0 K/W P 60 W

find: RthK using equation 1

G

RthG = 0.6 K/W RthM = 0.4 K/W (average value)

2. Same conditions as above but for three devices with equally distributed power ratings. solution use equation 1 and equation 3

1 1 1 1 + = + =3 RthGM ges. 0.6 + 0.4 K/W 0.6 + 0.4 K/W 0.6 + 0.4 K/W 1 W/K RthGM ges. = 1 K/W = 0.33 K/W 3

H

RthK = 160 °C – 40 °C _ 0.33 K/W = 1.67 K/W 60 W

substitute into Equation 1 gives:

I

K

L

M

N

With these values determined, the tabulation on page A 13 - 17 can be used to give a choice of possible heatsink profiles. Then by examination of the drawings and curves the final choice can be made. 3. A transistor with power rating of 50 W and internal thermal resistance of 0.5 K/W has a case temperature of 40 °C. What is the actual value of junction temperature? given: P = 50 W

RthG = 0.5 K/W

find: ϑi using equation 2 ϑi = ϑG + (P

• RthG)

ϑG = 40 °C

ϑi = 40 °C + (50 W • 0.5 K/W) = 65 °C a

Thermal resistances of any profiles with forced convection RthKf RthKf RthK a

≈ = = =

1 0,8

a • RthK thermal resistance with forced convection thermal resistance with natural convection factor of proportion

0,6 0,4 0,2 0

A3

Standard aluminium profiles Extruded heatsinks Lamella heatsinks Fluid coolers

A A A A

135 - 136 22 - 83 129 - 130 131 - 133

0

1

2

3

Thermal conductive material Hole pattern Drilling pattern for SSR Technical introduction

4

5

6 v [m/s]

E 2 - 24 A 21 A 12 A2-8


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Technical introduction Computer based thermal simulation for optimal cooling concepts Performance, service life and reliability of electronic semiconductor devices are significantly determined by the thermal load to which the devices are exposed. An exceeding of the maximum operating temperature leads to malfunctions. An exceeding of the permissible junction temperature leads to a destruction of the semiconductor. To make it worse there is an advancing trend in the semiconductor industry for continuous increasing integration- and power densities of electronic devices. For the solution of thermal problems the first question is which kind of heat dissipation has to be considered. For this there are different processes available: by means of free convection (passive) with different heatsink solutions, by means of forced convection (active with help of fans, cooling aggregates) or by means of fluid media (fluid cooling). However, electronic devices and systems have many different boundary and installation conditions. Therefore the choice of the optimum thermal management is often difficult. There are surely possibilities to find the right heat dissipation concept by using the thermal resistance for calculations or by testing and verifying prototypes directly in the application, but nowadays customer specified mechanical adjustments are requested and demanded more than ever. Small mechanical post-machinings, such as additional integrated threads or drilling can be considered in the calculation with safety reserves in the temperature of the thermal resistance, but extensive modifications demand a repeated inspection of the thermal circumstances.

A

B

C

D

E

F

To facilitate the determination of passive heat dissipation concepts Fischer Elektronik offers a computer based thermal simulation as a kind of service.

G

Considered factors in the thermal simulation With help of the computer based thermal simulation the necessary characteristics of the cooling concept can be determined exactly. Based on physical concepts such as mass, energy and impulse the software especially considers the thermal requirements for free or forced convection. Simultaneously the system is aligned to thermal dissipation by means of fluid. Moreover the thermal simulation calculates physical effects such as thermal radiation and turbulences. The emission factor of the different surfaces also plays its role. As a result the simulation software delivers a precise cooling solution for the application and is a big help for the decision-making and interpretation of the electronic design.

Advantages of a computer based simulation The computer based thermal simulation is already used for the prototype development. Herewith the development cycles of heat dissipation concepts is reduced considerably. Unsuitable concepts can be discarded quickly and without big costs of material. A lot of features and options of the simulation system also reduce the temporary and apparatuses efforts compared to a conventional simulation in the measurement chamber.

H

I

K

L

We will be happy to advise you in detail about the theme thermal simulation.

M Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts

A A A A

13 - 17 137 - 138 140 10

Heatsinks for SSR Die-cast heatsinks Assigment table Order example

A A A A

11 - 12 125 18 - 20 21

A4

N


A

B

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Technical introduction Remarks: 1. The values indicated in the diagrams apply only for heatsinks with black anodised surface, mounted vertically and natural convection. Correction factors: natural surface: +10 to 15 % for horizontal mounting: +15 to 20 %

C

D

E

F

G

2. Heatsink profiles are extruded to European standard DIN EN 12020 (former DIN 17615). For profiles exceeding a circumscribed circle of 350 mm, the tolerances to DIN EN 755 (former DIN 1748) apply. Important note: Manufacturers of certain electronic components, especially modules with a large surface area, IGBT etc., specify installation surfaces for heatsinks etc. with an flatness, which is beyond standard tolerances. Such perfect flatness can only be achieved by milling the installation surface. Furthermore, it should be noted that threaded wire inserts may be required in order to reach higher tightening torques in aluminium (e.g. Heli-Coil or similar.). Please observe the semiconductor manufacturers‘ information. 3. The mentioned heatsink profiles in our catalogue contain so called extrusion marks between the fins for a profile identification. To avoid misuse the operator has to check the size and position for the mechanical treatment or placement of the components. 4. Profile extruded threaded channels are no threads conforming to standards, as they have no thread pitch. The thread pitch is imitated by staggered webs (ribs). The customer is responsible for appropriate use. 5. Machining of our extruded and non extruded profiles conforms to requirements of DIN ISO 2768 m - unless otherwise stated. For all ICK S types DIN ISO 2768c is valid. 6. The lengths of extruded profiles [ ] and the pin layouts [ ] indicate only the standard range. We offer every profile cut to customer’s exact length and machining requirement made to drawing or sample. We bore, countersink, mill, saw, grind and cut threads into your heat sink to meet your specific requirements. With our modern machine tools including CNC machining centres, multispindled drills (up to 26 drillings/threads at the same time) and digital milling and stamping tools plus our own “in house” tool room we are able to manufacture competetively priced prototypes as well as batch and mass produced parts with short lead times. 7. The standard material of our heatsinks is warm age-hardened aluminium alloy according to EN AW 6060 – T66 (former AlMgSi05 – F22 acc. to DIN 1748). Our standard surface treatments are raw degreased aluminium (Al) and black anodised (SA). On request, we anodise clear natural (ME) or decorative in any colour that is technically possible. 8. If you cannot find a suitable profile within our range of approx. 400 profiles, 13 small heatsinks and 50 finger shaped heatsinks, we can design and produce to your requirements. Please contact us at the start of your next project so that we can work together, either directly or through our representatives. Remember that we have the ability to find the solution for “your” cooling problem.

H

9. Note on tolerances All dimensions given in this cataloque for products, items and machined parts are acc. to DIN ISO 2768 m if not otherwise stated. Not included are items like extruded profiles, diecasts, handles, vibration dumpers etc. for which different standards apply.

I

K

Update - August 2014 The information given in this catalogue were established and examined carefully. Nevertheless, mistakes or printing errors, and especially technical modifications and updating and improvement of our products, cannot be excluded. All trade marks are recognised even if they are not specifically identified or mentioned. No identification does not imply that a product or trademark is not registered. No part of this catalogue may be reproduced or distributed without prior written consent of Fischer Elektronik. All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to copyright and the provisions of DIN ISO 16016. All rights reserved. © Copyright Fischer Elektronik 1969 ... 2014

L

M

N

A5

Standard aluminium profiles Extruded heatsinks Lamella heatsinks Fluid coolers

A A A A

135 - 136 22 - 83 129 - 130 131 - 133

Thermal conductive material Hole pattern Drilling pattern for SSR Technical introduction

E 2 - 24 A 21 A 12 A2-8


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A

Technical introduction General information

B

Blind holes are produced after anodising. Through holes are produced before anodising. With completely visual parts, additional painting is recommended. The sections are extruded according to DIN EN 12020. For sections that exceed a circumscribed circle of 300 mm, DIN EN 755 apply. The machining tolerances are specified according to DIN ISO 2768 m. Visual parts: Please indicate at which place clamp points are allowed! We recommend e.g. supplementary laquering.

C zero point

15 5

+

3 x M 3 - 6/8 deep and/or continuous

D

49.7 44.7 24.7

5

200 – 1.2

E

B

C

D

Ø 3.4

C

F

M6

9.6

A

Ø 6.5

11.6

zero point

A

face counterbore Ø 12/0.5 deep

G

break-through Ø 8

B

zero point

H

M4

3.2

6.4

49.7 39.7 24.7 10

D

8.4

Ø 4.5

4 33.4 50.4 65

I

Ø8 plunge-through and counterbore with Ø 8

135 149.6 166.6 196

K

L

M Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts

A A A A

13 - 17 137 - 138 140 10

Heatsinks for SSR Die-cast heatsinks Assigment table Order example

A A A A

11 - 12 125 18 - 20 21

A6

N


A

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Technical introduction Information for dimensioning, shown on SK 47 general:

B

C

D

The deflection can be up to 0.8 mm concave, 0.2 mm convex. If a certain flatness of the bottom surface is required the bottom thickness can be decreased by a maximum of approx. 0.8 mm by means of face-milling. This situation must be taken into consideration with the bore hole depths for blind holes. Counterbores and bore hole diameters are to be produced according to DIN 74, if not explicitly stated otherwise. The depth of thread should be calculated as follows. Example M 5: thread: <M> 5 x 1.6 mm = 8 mm Examples: cutout A: cutout B: cutout C: cutout D:

core bore: 8 mm + 2 mm = 10 mm

Through-hole according to DIN 74 A m 3, counterbore bottom side, undercut of the fins. Through hole with break-through of the fins according to DIN 74 H m 4, counterbore on fin side. Thread M 6. Depth of thread 1.6 x 6 mm = 9.6 mm, bore depth 9.6 mm + 2 mm = 11.6 mm. Bore hole on fin base is plunged through. Face counterbore dia. 12 x 0.5 on bottom side. Blind thread M 4. Depth of thread 1.6 x 4 mm = 6.4 mm, bore depth 6.4 mm + 2 mm = 8.4 mm.

Extrusion tolerances â&#x20AC;&#x201C; production tolerances

E

There is often the problem, that the production tolerances cannot be adhered to, due to the extrusion tolerances. The two examples show how the production tolerances can be cut in half by means of suitable dimensioning (here: extension of the zero point from the outer edge to the center of the section). When taking unfavourable extrusion tolerances into consideration a difference of 1.1 mm arises between the two types of dimensioning with respect to the axis of symmetry.

F

SK 82

.75

R220

extrusion tolerance Âą3.5 mm 440

G

55 165 275 385

H

437.8 1.93

I

zero point

55 165 275

K

385

1.1 0.83

L zero point 55

M

55

165

165

437.8

N

A7

Standard aluminium profiles Extruded heatsinks Lamella heatsinks Fluid coolers

A A A A

135 - 136 22 - 83 129 - 130 131 - 133

Thermal conductive material Hole pattern Drilling pattern for SSR Technical introduction

E 2 - 24 A 21 A 12 A2-8


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Technical introduction

A

SK 34

B extrusion tolerance ± 0.8 mm

C

125 ± 0.8

124.20

dimensioning set to the outer edges

zero point

4.2

D

E

58.3 120.8

0.4

124.20

F dimensioning set to the center

G

zero point 58.3

58.3

When taking unfavourable extrusion tolerances into consideration, a difference of 0.4 mm arises between the two types of dimensioning with respect to the axis of symmetry.

H

Milling If, when milling heatsinks, cooling aggregates, etc., the milling tool diameter is smaller than the area being milled for production reasons, so called „milling grooves“ with steps or edges are produced (see sketch). Even if the roughness depth value for the surface is observed, it is a good idea to specify the area of the component in which no milling edges are allowed.

I

K

milling groove

milling tool

milling groove

milling tool milling tool bigger than milled surface (no milling edge)

milling tool smaller than milled surface

L

M Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts

A A A A

13 - 17 137 - 138 140 10

Heatsinks for SSR Die-cast heatsinks Assigment table Order example

A A A A

11 - 12 125 18 - 20 21

A8

N


Precision machining and highly decorative surfaces

Chromium plating and gold plating – chromium plating and gold plating of front panels, extruded profiles and construction parts – qualitative constant and reproducible, high quality surfaces – various gloss levels by means of different polishing processes – processing of brass, aluminium and steel

.26 - Fax 0 2. 16 . 2 1 .6

.09 .10 26 6.

Tel 0 2. 33

Decorative aluminium milled parts – high quality, very precise milled, decorative aluminium parts – exact radii and sharp-edged cutouts – precision ground surfaces – natural colour and black anodized

A

LI

IT

AW

.EL

EB

.I T

WWW LI

AW

EB

Surface refinements – corrosion resistant and decorative anodize layers – lacquerings and durable powder coatings in all current RAL colours – anti-glare surfaces, Nextel®-Suide Coating – electrically conductive surfaces, chromate VI free – prevention of clamp marks by means of special contacting systems

.I T - I N F O

L @E

IT

A

Development and construction – compentent partner with experience of more than 40 year – Innovative product development, product-specific support by means of application engineers – design assistance, feasibility analyses and product optimizations – construction support and preparation of drawings


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Heatsinks for decorative purposes and as visual parts

A

B

C

D

E

F

G Anodising (also known as ELOXAL: ELectrically OXidised ALuminium) is used in many cases for decorative surface protection of aluminium. In this process, the aluminium parts to be treated are connected to the positive pole of a direct-current source (anode) in a suitable electrolyte where aluminium, in so doing, forms the negative pole (cathode). The flowing direct current now causes a migration of oxygencontaining ions, with electrically negative charge, to the anode in order to deposit the oxygen. At this point, the aluminium reacts with this oxygen, forming aluminium oxide. A non-porous, electrically insulating, abrasion free, oxide barrier, or „eloxallayer“, then develops. The development and therefore thickness of this layer can be controlled by the amount of current flow. For process handling, secure transportation and electrical connection, the parts to be anodised must be placed on „racks“ (figure 1). As excellent electrical contact is necessary and the parts being processed must be mounted on the carrying racks in a totally secure manner a high clamping force is required especially for those large and heavy heatsinks (figure 2). This will mean that „clamp marks“ are visible. These are mere bare points in the case of small and light weight heatsinks with black anodising (figure 3) but for heavy parts the clamping pressures and current can cause deformation of the surface (figure 4). Any such deformations on large heatsinks is unavoidable and varies with each part (figure 5). If heat sinks are used as visual parts, in other words parts whose surface must be blemish-free in appearance, it is suggested that the customer will define specific areas which should have no clamp marks. If, for technical production reasons, it is not possible to place clamps on the remaining points then consideration should be either given to the construction of separate specialpurpose frames which will allow processing (figure 6). Existing or additional threaded holes may possibly also be used for screwing on fixing angles, upon which the clamps may then be placed (figure 7). Furthermore, there is always the possibility to remove the clamp marks by hand finishing, although some slight indentation may still be visible. Alternatively, instead of using the anodising process there are various paint finishes available. With visual parts and mouldings, both discussion of all technical details and determination of the desired design in cooperation with the manufacturer - even at the initial enquiry stage - are imperative for the smooth completion of orders to the satisfaction of the customer.

H

I

K

L

Our experts are at your disposal for all technical advice.

M Standard aluminium profiles Technical introduction Extruded heatsinks Assigment table

A A A A

135 - 136 2-8 22 - 83 18 - 20

Drilling pattern for SSR Die-cast heatsinks High capacity heatsinks Heatsinks for PCB

A A D A

12 125 30 - 32 89 - 112

A 10

N


A

tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Heatsinks for solid state relays

B

C

D

E

F

– universal clip fastening, suitable for all 35 mm mounting rails

according to DIN EN 50 022, rail thickness from 1 to 2.3 mm

E 25

– fast and simple asssembly of heatsinks by means of snapping them onto the mounting rail

G

– secure hold due to a stable extruded profile with integral stainless steel spring – special lengths (≥40 mm) and drillings on request

7.4

50

1.5

35

1

37.5

35

35

H 2.3

3.5

I

7.5

15

15

Examples of mounting rail versions suitable for KL 35

8.5

K surface:

finish clear anodised

L

M

N

A 11

Distance sleeves Fastening for mounting rail Guide rails for PCBs Mounting material f. semiconduct.

E E E E

32 - 39 25 26 - 30 44 - 48

Spacers Mica wafers Aluminium oxide wafers Technical introduction

E 40 E 19 E 17 - 18 A2-8


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Heatsinks for solid state relays perforations

with KL 35

– drilling pattern rotated by 90° – fixing of the SSR by means of screws with the help of as well as further drilling insert nuts in the heatsink patterns upon request

57

without KL 35

– fixing of the SSR by means of screws with the help of tapped holes in the heatsink

– fixing of the SSR by means of screws with the help of tapped holes in the heatsink

art. no.

art. no.

art. no.

SK 172 75 KL SSR 1

SK 89 75 KL SSR 1 SK 89 100 KL SSR 1 SK 111 75 KL SSR 1 SK 434 75 KL SRR 1 SK 453 75 KL SRR 1 SK 467 75 KL SRR 1 SK 507 75 KL SSR 1

SK 04 75 SSR 1 SK 33 75 SSR 1 SK 453 75 SSR 1 SK 455 75 SSR 1 SK 467 75 SRR 1 SK 507 75 SRR 1

SK 89 100 KL SSR 2 SK 89 150 KL SSR 2 SK 176 100 KL SSR 2 SK 176 150 KL SSR 2 SK 194 75 KL SSR 2 SK 507 100 KL SSR 2

SK 04 150 SSR 2 SK 33 75 SSR 2 SK 507 100 SSR 2 SK 507 150 SSR 2

47.5

SSR 1

A

B

C

D

M4

45

SSR 2

E

F

92

104.5

47.6

G

M4

73.5

SSR 3

SK 187 75 KL SSR 3

SK 111 75 KL SSR 3

SK 48 50 SSR 3

30.2

38.1

H M4

17

SSR 4

SK 172 150 KL SSR 4

SK 455 100 KL SSR 4

SK 455 100 SSR 4 SK 467 100 SSR 4

I

M4

80

94

K

L 34

M Distance sleeves Fastening for mounting rail Guide rails for PCBs Mounting material for semiconduct

E E E E

32 - 39 25 26 - 30 44 - 48

Spacers Mica wafers Aluminium oxide wafers Mounting parts for heatsinks

E 40 E 19 E 17 - 18 A2-8

A 12

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsink-chart SK 440

D 30 SK 441

SK 47

A 49 SK 49

D 30 SK 458

D 30 SK 461

D 30 SK 497

D 30 SK 498

D 30

A 54 SK 66

A 55 SK 90

A 48 SK 91

A 52

B A 51 SK 56

C SK 93

A 56 SK 101

A 54 SK 102

A 50 SK 130

SK 149

A 53 SK 154

A 46 SK 155

A 45 SK 157

SK 159

A 58 SK 160

A 58 SK 161

SK 168

A 50 SK 190

A 52 SK 191

A 56 SK 139

A 53

D A 54 SK 158

A 58

E A 58 SK 162

A 58

F A 56 SK 193

A 50

G SK 198

A 53 SK 199

A 51 SK 416

A 47 SK 418

A 58 SK 438

A 52

SK 439

A 55 SK 446

A 53 SK 466

A 43 SK 479

A 55

A 46 SK 520

A 50 SK 523

A 55

H

I SK 501

A 54 SK 502

A 49 SK 507

A 40 SK 510

SK 524

A 52 SK 530

A 57 SK 531

A 57 SK 533

A 57

SK 535

A 57 SK 536

A 57 SK 537

A 57 SK 538

A 57

K

L

M Heatsink-chart classified in categories of thermal resistance at 75 mm length

N

A 13


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A

Heatsink-chart SK 539

A 57 SK 540

A 57 SK 553

A 44 SK 555

A 51 SK 557

A 50

B SK 568

A 54 SK 579

A 55 SK 580

A 51 SK 588

A 45 SK 591

A 49 SK 601

A 44

C SK 613

A 43 SK 614

A 52 SK 621

A 56 SK 57

A 64 SK 30

A 67 SK 53

A 74

D SK 82

A 75 SK 86

A 75 SK 15

A 77 SK 163

A 78 SK 556

A 77

E SK 83

A 79 SK 108

A 80 SK 109

A 80 SK 110

A 80 SK 435

A 81 SK 144

A 82 SK 584

B 44 SK 590

B 46 SK 592

B 45

F SK 615

B 45 SK 33

A 42 SK 42

A 49 SK 58

A 45 SK 85

A 46 SK 92

A 41

G SK 94

A 49 SK 113

A 48 SK 118

A 51 SK 119

A 47

H SK 120

A 45 SK 121

A 42 SK 132

A 44 SK 133

A 44 SK 135

A 39 SK 136

A 48 SK 411

A 42

I SK 412

A 47 SK 413

A 43 SK 429

SK 504

A 45 SK 519

A 48 SK 583

A 66 SK 34

A 67 SK 67

A 37 SK 463

A 43 SK 467

A 33 SK 503

A 53 SK 595

A 43 SK 71

A 64 SK 98

A 68 SK 88

A 73 SK 80

A 46

K A 65 SK 197

A 65

A 74 SK 147

A 74

L SK 404

A 65 SK 02

A 69 SK 148

M < 1 K/W

1-1,5 K/W

1,5-2 K/W

2-2,5 K/W

2,5-3 K/W

3-4 K/W

4-5 K/W

> 5 K/W

A 14

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsink-chart SK 89

A 77 SK 140

A 77 SK 06

A 79 SK 23

A 79 SK 194

A 81 SK 40

A 82 SK 61

A 82 SK 415

A 90 SK 569

B 43

SK 570

B 44 SK 571

B 44 SK 572

B 44 SK 577

B 43 SK 578

B 43 SK 599

B 45 SK 602

B 43 SK 50

A 37 SK 100

A 38

B

C SK 166

A 48 SK 408

A 40 SK 410

A 44 SK 417

A 46

A 47 SK 433

A 41 SK 442

A 42 SK 453

A 33 SK 455

A 33 SK 464

A 67 SK 39

A 67 SK 20

A 68 SK 84

A 68

A 71 SK 500

A 72 SK 08

A 73 SK 60

A 74

B 42 SK 407

A 39 SK 436

A 37 SK 450

A 34 SK 505

A 41

A 64 SK 97

A 62 SK 03

A 66 SK 419

A 70

A 90 SK 81

A 41

D SK 421

A 39 SK 527

A 35

E SK 04

A 64 SK 72

A 63 SK 401

A 63 SK 403

SK 184

A 68 SK 74

A 71 SK 124

A 71 SK 195

SK 176

A 78 SK 172

A 81 SK 432

A 82 SK 46

A 64 SK 14

F

G B 43 SK 598

H SK 508

A 41 SK 612

SK 16

A 72 SK 79

A 39 SK 73

I A 73 SK 187

A 76 SK 11

A 79 SK 111

A 81 SK 44

A 47 SK 406

A 38 SK 434

A 35 SK 445

A 34 SK 05

A 62 SK 18

A 62 SK 25

A 61

A 62 SK 402

A 62 SK 01

A 66 SK 64

A 70 SK 48

A 73 SK 52

A 74 SK 32

A 76

K SK 189

A 32 SK 405

L SK 28

A 63 SK 63

M Heatsink-chart classified in categories of thermal resistance at 75 mm length

N

A 15


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A

Heatsink-chart SK 544

A 76 SK 596

A 76 SK 175

A 83 SK 105

A 90 SK 484

A 110 SK 487

A 87 SK 499

A 87 SK 514

A 86

B SK 593

A 87 SK 617

A 88 SK 99

A 37 SK 106

A 31 SK 134

A 28 SK 182

A 40 SK 424

A 34 SK 425

A 34 SK 426

A 36

C SK 475

A 35 SK 545

A 39 SK 546

A 40 SK 567

A 35 SK 594

A 38 SK 19

A 63

D SK 45

A 63 SK 51

A 61 SK 165

A 61 SK 181

A 60 SK 36

A 66 SK 21

A 70 SK 65

A 70

E SK 69

A 71 SK 07

A 72 SK 55

A 83 SK 68

A 89 SK 112

A 89 SK 128

A 91 SK 414

A 90

F SK 481

A 85 SK 482

A 86 SK 483

A 87 SK 489

A 85 SK 495

A 87 SK 517

A 93 SK 518

A 93 SK 585 ... B 42 SK 589

A 86

G SK 610

A 92 SK 618

B 42 SK 619

B 42 SK 620

B 42 SK 156

A 36 SK 174

A 30 SK 179

A 30 SK 180

A 36 SK 422

A 32

H SK 444

A 38 SK 468

A 36 SK 472

A 31 SK 485

A 38 SK 566

A 26 SK 78

A 61 SK 107

A 60 SK 122

A 60 SK 150

A 61

I SK 173

A 59 SK 185

A 73 LA LED 68 B 50 SK 96

A 91 SK 138

A 91 SK 451

A 91 SK 490

A 84 SK 573

A 85 SK 574

A 86

SK 576

A 85 SK 611

A 92 SK LED 2

B 48 SK LED 3

B 48 SK 177

A 27 SK 178

A 28 SK 400

A 28 SK 420

A 31 SK 423

A 32

SK 427

A 36 SK 437

A 24 SK 447

A 26 SK 448

A 27 SK 452

A 27 SK 454

A 24 SK 456

A 30 SK 469

A 23

K

L

M < 1 K/W

1-1,5 K/W

1,5-2 K/W

2-2,5 K/W

2,5-3 K/W

3-4 K/W

4-5 K/W

> 5 K/W

A 16

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsink-chart SK 470

A 22 SK 471

A 29 SK 473

A 25 SK 476

A 24 SK 477

A 24 SK 478

A 23 SK 486

A 25 SK 493

A 28 SK 496

A 22

SK 509

A 29 SK 511

A 32 SK 513

A 31 SK 521

A 24 SK 522

A 23 SK 547

A 31 SK 548

A 34 SK 549

A 29 SK 550

A 27

SK 551

A 25 SK 552

A 23 SK 554

A 26 SK 558

A 23 SK 559

A 25 SK 560

A 26 SK 561

A 26 SK 562

A 29 SK 563

A 30

SK 564

A 30 SK 565

A 22 SK 581

A 28 SK 582

A 25 SK 586

A 22 SK 587

A 29 SK 597

A 27 SK 616

A 22 SK 09

A 59

SK 59

A 60 SK 145

A 59 SK 443

A 59 SK 31

A 72 SK 153

A 83 SK 494

A 83 ICK ... B

B 52 ICK ... H

B 52 ICK ... L

B 52

B

C

D

E

F SFP

A 135 SK 12

A 123 SK 13

A 123 SK 75

A 105 SK 76

A 105 SK 95

A 108 SK 115

A 123 SK 125

A 91 SK 126

A 107

A 94 SK 515 05 A 94 SK 516

A 94 SK 575

A 84 SK 609

A 92

G SK 431 ... A 124 SK 480

A 84 SK 492

A 84 SK 512

A 84 SK 515

H SK LED 1

B 48 STP

A 136 SU

A 135 SVP

A 136 SWP

A 135 UK 14 SA ...

A 123

I

K

L

M Heatsink-chart classified in categories of thermal resistance at 75 mm length

N

A 17


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Assignment table of transistor heatsinks

extruded profiles

TO 3

TO 66

SOT 9

TO 220

SOT 32

SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 67 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 84 SK 88 SK 97 SK 122 SK 124 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404

SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 122 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404

SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 122 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404

SK 09 SK 59 SK 145

SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 122 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404

A

B

C

D

E

F

G

H

I

K

L

M Extruded heatsinks Heatsinks f. printed circuit boards Thermal conductive material Mount. material f. semiconductors

A 22 - 83 A 89 - 111 E 2 - 24 E 44 - 48

Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction

A A A A

125 115 - 117 84 - 88 2-8

A 18

N


A

tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Assignment table of transistor heatsinks TO 3

B

C

TO 66

SOT 9

TO 5

extruded heatsink with solder pins

D

TO 247

TO 3 P

SK 126

SK 104

SK 145

SK 129

SK 437

SK 400

SK 459

SK 409

SK 484

SK 448 SK 456 SK 484

E

extruded

set-up/clip-on heatsinks

F

WP 4030

SK 126

heatsinks

SK 452 AKK 127

FK 243

AKK 191

FK 245

finger-shaped

FK 201

FK 201

FK 201

heatsinks

FK 202

FK 202

FK 202

FK 205

FK 205

FK 205

FK 206

FK 206

FK 206

FK 223

FK 207

FK 207

FK 236

FK 208

FK 208

FK 217

FK 217

FK 225

FK 234

FK 234

FK 236

G

H

SK 452

FK 236

I

small heatsinks

KF KK 562 SKK

K

L

M

N

A 19

Extruded heatsinks Heatsinks f. printed circuit boards Thermal conductive material Mount. material f. semiconductors

A 22 - 83 A 89 - 112 E 2 - 24 E 44 - 48

Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction

A A A A

125 115 - 117 84 - 88 2-8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Assignment table transistor heatsinks TO 218

U-heatsinks

TO 220

SOT 32

ICK 35 SK 13 SK 431 UK 14

SK 12

extruded heatsink with solder pin

SK 145 SK 437 SK 459 SK 460

SK 75 SK 104 SK 129 SK 145 SK 185 SK 409 SK 459 SK 460

SK 104 SK 129 SK 409 SK 459 SK 469 SK 470

extruded heatsinks

SK 126 SK 452

SK 95 SK 126 SK 452 SK 454 SK 517 SK 518

SK 95 SK 454

set-up/clip-on heatsinks

FK 224 FK 241 SK 516

FK 220 FK 224 FK 237 SK 515

finger-shaped heatsinks

FK 224 FK 243 FK 245

FK 205 FK 206 FK 207 FK 208 FK 210 FK 212 FK 214 FK 216 FK 217 FK 218 FK 219 FK 220 FK 222 FK 225 FK 227 FK 228 FK 229 FK 230 FK 231 FK 232 FK 233 FK 234 FK 235 FK 247

small heatsinks

DIL

PLCC

P-SIP

PGA/BGA

assignment table B 2 - 10 SK 459 SK 460

ICK...B ICK..H ICK...L

A

B

C

D

E

ICK PLCC ICK R

F FK 224 FK 241

FK 201 FK 205 FK 206 FK 207 FK 208 FK 209 FK 210 FK 211 FK 212 FK 213 FK 214 FK 215 FK 216 FK 217 FK 218 FK 219 FK 223 FK 234 FK 235 FK 236 FK 239

G

FK 224

H

I

K

L KK 32 KK 92

M Extruded heatsinks Heatsinks f. printed circuit boards Thermal conductive material Mount. material f. semiconductors

A 22 - 83 A 89 - 112 E 2 - 24 E 44 - 48

Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction

A A A A

125 115 - 117 84 - 88 2-8

A 20

N


Hole pattern CB

TO 3 S 33,5°

13.2

4.7 7

15.1

5.6

10.9

6

30.2

CB = TO 3 + SOT 9 + TO 66 + SOT 32 at 37.5 mm oblique drilling

TO 3 oblique drilling for

TO 220

E

4.2

4.2

4.2

D

10.9

30.2

13.2

3.6

14.9

32

13.2 10 3

10.9 4.2

C

TO 3

37.5 mm

TO 3 exceeding

SOT 32

50 mm

K

5

F

4 x10

24.4

4.5

4

3.2

10

14.75

M 2.5

37.5 (50)

Ø 3.2

14.8

B

Heatsinks

15.1

A

tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

9 13

SOT 32 / TO 220 exceeding

G

Standard hole pattern are processed as complete pin layouts, centered on the length of the heatsink. Other positions of the pin layout on the heatsink, multiple drillings or changes of the drillings are processed according to customer‘s requirements. For heatsinks exceeding

75 mm standard hole pattern can be supplied in multiple design.

Fixing slots 18.75

6.4

H

I

25 9

Heatsinks with the following shape

L

M

[mm] 37.5

number of fixing slots 2 4

75

9

6.4

K

37.5 mm

[mm] 50

100

number of fixing slots 2 4

and a standard hole pattern have these fixing slots as part of the serial production

Order example

SK 01

50

SA

profile

length

surface

TO3 pin layout

Surface treatment for heatsinks with standard drilling: black anodised (SA). Raw degreased aluminium (AL) and clear natural anodise (ME) on request.

N

A 21

Extruded heatsinks Heatsinks for printed circuit boards Thermal conductive material Mount. material for semiconductors

A 22 - 83 A 89 - 112 E 2 - 24 E 44 - 48

Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction

A A A A

125 115 - 117 84 - 88 2-8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks Rth [K/W] 40

art. no.

B

35

6

30 25 20

2

8

15

SK 586 ... please indicate:

50

100

150

200 [mm]

...

C

37.5 50 75 100 1000 mm Rth [K/W] 40

art. no.

35

6

30

D

25

2

8

20 15

SK 616 ... please indicate:

50

100

150

200 [mm]

...

E

37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 32 30

6

28 26

F

24

1,8

10

22

SK 496 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

art. no.

G

Rth [K/W] 32

10

30 28 26 24

1,8

10

H

22

SK 565 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 30

I

8

25 20 15

2,5

11,8

10 50

SK 470 ... please indicate:

100

150

200 [mm]

K

extruded heatsinks for PCB mounting ➔ A 110 ...

... 25 37.5 50 75 100 1000 mm

(optional) SOT 32; TO 220

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 22

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 36

6,3

33

3,9 6,5

1,3

B

30 27

10,6 12,6

C

24

SK 522 ... please indicate:

15

30

45

60 [mm]

100

150

200 [mm]

100

150

... 15 25 37.5 50 1000 mm Rth [K/W] 14

art. no.

12

15,24

3,5

D

10 8 6

13,5

E

50

SK 469 ... please indicate:

extruded heatsinks for PCB mounting ➔ A 110 ...

... 25 37.5 75 100 1000 mm

(optional) SOT 32; TO 220 Rth [K/W] 32

art. no.

F

30

6

28 26

G

24

1,8

14

SK 478 ... please indicate:

50

200 [mm]

... 25 37.5 50 75 1000 mm Rth [K/W]

art. no.

20

H 10

16 12 8

I

4

1,8

14

SK 552 ... please indicate:

50

100

150

200 [mm]

... 25 37.5 50 75 100 1000 mm Rth [K/W] 25

art. no.

K 14

20 15 10

L

SK 558 ... please indicate:

2,5

5

14

50

100

150

200 [mm]

... 25 37.5 50 75 100 1000 mm

M

N

A 23

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks art. no.

Rth [K/W] 26

B

24

3

8

22 20

15,3

18

SK 521 ... please indicate:

50

100

150

200 [mm]

C

... 25 37.5 50 75 100 1000 mm

art. no.

Rth [K/W]

Ø 1,4

24

D

20 16

16

3,5

Ø 2,5

5

12 8

16

SK 437 ... please indicate:

50

100

150

200 [mm]

extruded heatsinks for PCB mounting ➔ A 109 ...

... 100 1000 mm

E

(optional) TO 218; TO 220; TO 247; TO 248 Rth [K/W] 26

art. no.

F

24

6

22 20 18

1,8

21

SK 476 ... please indicate:

50

100

150

200 [mm]

G

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 12

H

19

3

10 8 6 4

21,45 50

SK 454 ... please indicate:

100

150

200 [mm]

I

extruded heatsinks for PCB mounting ➔ A 96 ...

... 37.5 50 75 100 150 1000 mm

(optional) SOT 32; TO 220 Rth [K/W] 24

art. no.

K

6

22 20

1,8

18

23

16

L

SK 477 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 100 1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 24

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks art. no.

Rth [K/W] 24

B 10

22 20 18

C

16

1,8

23

SK 582 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 14

2,5

12

12,3

D

10 8

23

E

6

SK 559 ... please indicate:

50

... 37.5 75 100 1000 mm

art. no.

Rth [K/W] 12,5

F

12,3

10,0 7,5 5,0

G

2,5

3,5

24,2

SK 551 ... please indicate:

50

... 37.5 50 75 100 1000 mm Rth [K/W] 16 14 12

art. no.

3

8

H

10 8 6 4 2

25,8

SK 486 ...

I

please indicate:

50

... 37.5 50 75 100 1000 mm Rth [K/W] 20

art. no.

18

6

K

16

1,8

14

27

SK 473 ...

L

please indicate:

12 50

... 37.5 50 75 1000 mm

M

N

A 25

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks art. no.

Rth [K/W] 12,5

B

10

10,0 7,5 5,0

1,8

27

2,5

SK 554 ... please indicate:

50

100

150

200 [mm]

C

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 10

D

8

10

6

3

4 2

27

SK 447 ... please indicate:

50

100

150

200 [mm]

E

... 37.5 1000 mm Rth [K/W]

art. no.

10

F

14

8 6 4

SK 560 ... please indicate:

2,5

2

27

50

100

150

200 [mm]

...

G

37.5 50 75 100 1000 mm Rth [K/W] 10

art. no. 22

8

H

6 4

27

SK 566 ... please indicate:

3,5

2

50

100

150

200 [mm]

...

I

37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 20

8

16

K

12 8

SK 561 ... please indicate:

4

2,5

27,95

50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 26

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks art. no.

Rth [K/W] 12

B 12,5

10 8 6 4

3,5

27,95

C

50

SK 448 ... please indicate:

100

150

200 [mm]

extruded heatsinks for PCB mounting ➔ A 111 ... 37.5 50 75 mm

D

Rth [K/W] 10

art. no.

E

15,24

3,5

8 6 4 2

27,95

SK 177 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 50 75 100 1000 mm Rth [K/W] 11

art. no.

F 11,5

10 9 8

G

3,5

29

7

SK 550 ... please indicate:

50

... 37.5 50 75 100 1000 mm Rth [K/W] 12

art. no.

H 3,5 25

10 8 6 4

I

29 50

SK 452 ... please indicate:

extruded heatsinks for PCB mounting ➔ A 96 ...

... 37.5 100 1000 mm

art. no.

Rth [K/W]

K 17,5

12

3

L

(optional) TO 218; TO 220; TO 247; TO 248; TO 3 P

30

SK 597 ... please indicate:

10 8 6 4

50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

M

N

A 27

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks Rth [K/W] 20

art. no.

B

16

6

12

1,8

8

31

4

SK 493 ... please indicate:

50

100

150

200 [mm]

C

... 37.5 50 75 100 1000 mm Rth [K/W] 20

art. no.

D

10

16 12

1,8

8

31

4

SK 581 ... please indicate:

50

100

150

200 [mm]

...

E

37.5 50 75 100 1000 mm Rth [K/W] 12

art. no.

10

F

3

10

8 6 4

33

50

SK 400 ... please indicate:

100

150

200 [mm]

G

extruded heatsinks for PCB mounting ➔ A 111 ... 37.5 50 75 100 1000 mm Rth [K/W] 10

art. no.

H

16,5

8 6

5

4 2

34,5

SK 178 ... please indicate:

50

100

150

200 [mm]

...

I

37.5 75 100 1000 mm

art. no.

K 50

Rth [K/W] 5 4

L

3 2

5

1

SK 134 ... please indicate:

34,5

50

100

150

200 [mm]

M

... 37.5 50 100 1000 mm

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 28

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks

Rth [K/W] 18

art. no.

B 6

16 14

1,8

12

35

C

10

SK 471 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 37.5 50 75 1000 mm

art. no.

Rth [K/W] 16

10

D

14 12

1,8

10

35

E

8

SK 587 ... please indicate:

50

... 37.5 50 75 100 1000 mm Rth [K/W]

art. no.

9 8

10

F

7 6

2,5

35

5

SK 549 ...

G

please indicate:

50

... 37.5 50 75 100 1000 mm Rth [K/W]

art. no.

8

14

7

H

6 5 4

2,5

35

SK 562 ...

I

please indicate:

50

... 37.5 50 75 100 1000 mm Rth [K/W] 10

art. no. 12,3

8

K

4 2

3,5

36

SK 509 ...

L

6

please indicate:

50

... 37.5 50 100 1000 mm

M

N

A 29

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks Rth [K/W] 16

art. no.

B

6

14 12 10 8

1,8

37

SK 563 ... please indicate:

50

100

150

200 [mm]

C

... 37.5 50 75 100 1000 mm Rth [K/W]

art. no.

20

D

10

16 12 8 4

1,8

37

SK 564 ... please indicate:

50

100

150

200 [mm]

...

E

37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 10

F

30

8 6

SK 174 ... please indicate:

10 12

6

4 2

38

50

100

150

200 [mm]

...

G

75 1000 mm

art. no.

Rth [K/W] 10

16,5

3,5

8

H

6 4 2

38,1

SK 179 ... please indicate:

50

100

150

200 [mm]

...

I

37.5 50 100 1000 mm Rth [K/W]

art. no.

16

6

14

K

12

40

1,8

10 8 50

SK 456 ... please indicate:

100

150

200 [mm]

extruded heatsinks for PCB mounting ➔ A 111

L

... 37.5 50 75 100 1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 30

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks art. no.

Rth [K/W] 14

B 8

12 10 8

C

3,5

40

6

SK 420 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 37.5 75 1000 mm

art. no.

Rth [K/W] 15

D 10

12 9 6

1, 8

40

E

3

SK 513 ... please indicate:

50

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 16

F 10

14 12 10

G

2,5

40

8

SK 547 ... please indicate:

50

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 10

H 27

8 6 4

5

2

I

SK 106 ... please indicate:

40

50

... 50 75 1000 mm

art. no.

Rth [K/W] 6

K 8

22

5 4 3 2

L

41,5

SK 472 ... please indicate:

50

... 37.5 50 75 100 1000 mm

M

N

A 31

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks art. no.

B

Rth [K/W] 5

34

4 3

8

2

41,5

SK 189 ... please indicate:

C

1 50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

D

Rth [K/W]

art. no.

14

10

3

8

12

8

43,1

E

6

SK 423 ... please indicate:

50

100

150

200 [mm]

... 100 1000 mm 7

16,51

6 5

4

4

G

3

43,1

SK 422 ... please indicate:

F

Rth [K/W]

art. no.

50

100

150

200 [mm]

... 50 1000 mm Rth [K/W] 15

art. no.

H

6

12

1,8

45

9 6 3

I

SK 511 ... please indicate:

50

100

150

200 [mm]

... 50 75 100 1000 mm

K

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 32

N


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A Standard extruded heatsinks art. no.

B

60

C

Rth [K/W] 5 4 3

1

45

SK 453 ... please indicate:

E

2

10

D

50

...

... 37.5 75 mm

100

150

200 [mm]

(optional) SSR 1

5

art. no.

80

F Rth [K/W] 3,0 2,5

G

2,0 1,5

12

1,0

H

SK 455 ... please indicate:

0,5

45

50

...

... 75 mm

art. no.

100

150

200 [mm]

(optional) SSR 4

5

I

85

K

Rth [K/W] 3,0 2,5 2,0

L

1,5

12

1,0

SK 467 ...

M

N

please indicate:

45

50

...

... 37.5 50 75 100 1000 mm

A 33

0,5

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

100

150

200 [mm]

(optional) SSR 1; SSR 4

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks Rth [K/W]

art. no. 16,51

6

B

5

4

4 3

45,7

SK 424 ... please indicate:

50

100

150

200 [mm]

...

C

75 1000 mm Rth [K/W]

art. no. 16,51

6 5

4

3

48,3

SK 425 ... please indicate:

D

4

50

100

150

200 [mm]

... 75 mm

E

art. no. Rth [K/W]

38

5

F

4 3

5

2

SK 445 ... please indicate:

1

49,5

50

100

150

200 [mm]

G

... 100 1000 mm

art. no.

50

H Rth [K/W] 3,0

I

2,4

7

1,8 1,2 0,6

SK 450 ... please indicate:

49,5

50

100

150

200 [mm]

K

... 75 1000 mm

art. no.

Rth [K/W]

10

10

L

8

SK 548 ... please indicate:

2,5

6

50

50

100

150

200 [mm]

...

M

37.5 50 75 100 1000 mm

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 34

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks

Rth [K/W] 5

art. no.

B

25

4,5

4 3 2 1

C

50

SK 567 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

art. no.

D

Rth [K/W]

40

5 4 3

E

10

2

SK 434 ... please indicate:

F

1

50

50

...

... 50 75 100 1000 mm

(optional) SSR 1

art. no.

Rth [K/W] 4,0

45

G

3,5 3,0

3,5

2,5 2,0

H

SK 475 ... please indicate:

50

50

100

150

200 [mm]

... 37.5 50 100 1000 mm

art. no.

60

I

K

Rth [K/W] 5 4 3

10

L

2 1

SK 527 ... please indicate:

50

100

150

200 [mm]

... 50 75 100 1000 mm

M

N

50

A 35

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks Rth [K/W]

art. no.

12

B

8

10

3

8 6

50,8

4

SK 427 ... please indicate:

50

100

150

200 [mm]

...

C

50 75 1000 mm Rth [K/W]

art. no.

6

16,51

5

D

4

4

3 2

50,8

SK 426 ... please indicate:

50

100

150

200 [mm]

...

E

37.5 50 75 100 1000 mm Rth [K/W]

art. no.

10

12

8

F

5

6 4

51

2

SK 156 ... please indicate:

50

100

150

200 [mm]

G

... 37.5 50 75 100 1000 mm Rth [K/W] 7,5

art. no. 12,3

6,5 5,5

H

4,5

51

3,5

3,5

SK 468 ... please indicate:

50

100

150

200 [mm]

...

I

37.5 75 1000 mm Rth [K/W]

art. no.

10

16,5

8 6

K

5

4 2

53,3

SK 180 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 36

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks art. no.

Rth [K/W] 5

B 20

4 3

4

2 1

C

54

SK 99 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 75 100 150 1000 mm

art. no.

5,5

3

6,3

D

Rth [K/W]

55

M3

2,2

1,5

3,5

7,5

SK 429 ...

F

6

4

E

19

22

3,0

please indicate:

M3 M3 35,6

2,5 2,0 1,5

5,2

54

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 3,5

55

3

SK 436 ... please indicate:

1,5

58

50

... 75 1000 mm

art. no. 55

H

2

16,8

22,6

G

2,5

Rth [K/W]

20,5

I

5 4

30

3 2 1

K

6,4

SK 50 ... please indicate:

58

50

... 75 1000 mm

L

M

N

A 37

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks Rth [K/W]

art. no.

10

B

8,9

8 6

3,7

4

61

2

SK 485 ... please indicate:

50

100

150

200 [mm]

C

... 50 75 100 1000 mm Rth [K/W]

art. no.

6

D

5

20

4 3

62,5 3,5

SK 444 ... please indicate:

2 50

75

100

150 [mm]

...

E

37.5 50 75 1000 mm Rth [K/W]

art. no.

4

25

4,5

5

F

3

6

2 1

63

SK 406 ... please indicate:

50

100

150

200 [mm]

G

... 37.5 50 75 100 1000 mm Rth [K/W]

art. no.

5

40

4

10

2 1

66

SK 100 ... please indicate:

H

3

50

100

150

200 [mm]

...

I

37.5 50 75 100 150 1000 mm Rth [K/W]

art. no.

5

25

4 3

K

5

2 1

75

SK 594 ... please indicate:

50

100

150

200 [mm]

...

L

37.5 50 75 100 1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 38

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard extruded heatsinks

Rth [K/W] 5

art. no.

B 10

4 3 2

C

2,5

80

1

SK 545 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

... 50 75 100 150 1000 mm Rth [K/W]

art. no.

5

D

32

4

5

2 1

82

E

3

SK 612 ... please indicate:

50

... 37.5 50 75 100 150 1000 mm

art. no.

85

F

Rth [K/W] 2,2

69

1,8

1,0

6

8

10

1,4

G

0,6

SK 135 ... please indicate:

50

82

150

100

200 [mm]

... 50 100 1000 mm

art. no.

Rth [K/W] 5 4

25

4,2

H

3 2

I

83

1

SK 407 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

... 37.5 50 75 100 1000 mm

K

Rth [K/W]

art. no.

5

L

10

40

4

84

SK 464 ... please indicate:

3 2 1 50

... 50 75 100 150 1000 mm

M

N

A 39

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks Rth [K/W]

art. no.

5

B

4

10

3

2

2

89

1

SK 182 ... please indicate:

50

100

150

200 [mm]

C

... 37.5 50 75 100 150 200 1000 mm

art. no.

100

D Rth [K/W] 1,8

E

1,4 1,0

12

0,6

SK 507 ... please indicate:

0,2 50

90

...

... 37.5 75 100 1000 mm

100

150

200 [mm]

F

(optional) SSR 1; SSR 2

art. no.

Rth [K/W] 5

G

40

5,5

4 3 2 1

98

SK 408 ... please indicate:

50

100

150

200 [mm]

H

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 5

I

4

10

3

2,5

2

100

1

SK 546 ... please indicate:

50

100

150

200 [mm]

K

... 37.5 50 75 100 150 1000 mm

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 40

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 5

B 15

4 3 2

C

4

100

1

SK 81 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 37.5 50 75 100 1000 mm Rth [K/W]

art. no.

5,0

D 15

4,0 3,0 2,0

E

4

100

1,0 50

SK 505 ... please indicate:

weight reduced like SK 81 ... 37.5 50 75 100 150 1000 mm

art. no.

Rth [K/W] 4,0

F 25

4,3

3,0

1,0

100

G

2,0

SK 508 ... please indicate:

50

... 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 2,5

H

40

2,0 1,5

10

1,0 0,5

I

100

SK 92 ... please indicate:

50

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 3,0

K

33

7,6

2,5 2,0 1,5 1,0

L

111,1

SK 433 ... please indicate:

50

... 37.5 50 75 1000 mm

M

N

A 41

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks art. no. Rth [K/W]

B

10,5

67,5

2,5 2,0 1,5 1,0

C

0,5

112

SK 121 ... please indicate:

50

100

150

200 [mm]

... 75 100 150 1000 mm

art. no.

114,5

70

D

E

Rth [K/W] 2,5 2,0

31,8

44,5

1,5

F

1,0 0,5

108,2

50

SK 33 ... please indicate:

100

150

200 [mm]

114,2

...

... 50 75 100 1000 mm

G

(optional) SSR 1

art. no.

Rth [K/W] 2,5

50

2,0 1,5

H

15

1,0

SK 411 ... please indicate:

0,5

116,5

50

100

150

200 [mm]

...

I

50 75 100 150 1000 mm Rth [K/W] 2,5

4 10,3 40

art. no.

2,0 1,5

K

1,0 0,5

6

SK 442 ... please indicate:

120

50

100

150

200 [mm]

... 50 75 100 150 1000 mm

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 42

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 2,5

B 60

2,0 1,5 1,0

9

0,5

C

SK 595 ... please indicate:

120

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 50 75 100 150 1000 mm Rth [K/W]

art. no.

2,5

4,2 25

D

2,0 1,5 1,0 0,5

130

E

SK 463 ... please indicate:

50

... 50 75 100 150 1000 mm

art. no.

F

Rth [K/W]

84

2,5 2,0 1,5

G

1,0

15

0,5

SK 613 ... please indicate:

H

130

50

... 37.5 50 75 100 150 1000 mm

art. no.

Rth [K/W]

10,2 50

2,5

1,5 1,0

I

0,5

138

SK 466 ... please indicate:

K

2,0

50

100

150

100

150

200 [mm]

... 50 75 100 150 1000 mm

art. no.

Rth [K/W]

120,25

2,5

L

33,3

7,9

2,0 1,5 1,0 0,5

141,05

SK 413 ... please indicate:

50

200 [mm]

... 100 1000 mm

M

N

A 43

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks Rth [K/W]

art. no.

8

B

9

6

2

4

149,6

4

SK 601 ... please indicate:

50

100

150

200 [mm]

C

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 3,7 3,0

D

19

2,2 1,5 0,7

6

150

SK 553 ... please indicate:

50

100

150

200 [mm]

...

E

37.5 50 75 100 150 1000 mm Rth [K/W]

art. no.

2,5

4,5 25

2,0 1,5

F

1,0 0,5

150

SK 132 ... please indicate:

50

100

150

200 [mm]

...

G

37.5 50 75 100 150 1000 mm Rth [K/W]

art. no.

2,5

4,7 25

2,0 1,5

H

1,0 0,5

150

SK 410 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 75 100 150 1000 mm

art. no.

I

Rth [K/W] 2,5

27

5

2,0 1,5 1,0

150

K

0,5

SK 133 ... please indicate:

50

100

150

200 [mm]

... 50 75 100 1000 mm

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 44

N


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A Standard extruded heatsinks

Rth [K/W] 2,5

art. no.

B 5

27

2,0 1,5 1,0 0,5

150

C

SK 58 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 1,7

D 27

5

1,5 1,3 1,1 0,9

150

E

50

SK 504 ... please indicate:

weight reduced like SK 58 ... 37.5 50 75 100 150 1000 mm Rth [K/W]

art. no.

2,5

F 39,5

2,0 1,5

9

1,0 0,5

G

150

SK 588 ... please indicate:

50

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 2,5

H 40

4,5

2,0 1,5 1,0 0,5

I

150

SK 120 ... please indicate:

50

... 50 75 100 150 1000 mm Rth [K/W]

art. no.

2,5

K 15

50

2,0

L

SK 155 ... please indicate:

150

1,5 1,0 0,5 50

... 75 100 150 1000 mm

M

N

A 45

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks art. no.

11

71

B Rth [K/W] 1,0 0,8

3

0,6

C

0,4 0,2

8 156

SK 154 ... please indicate:

4 50

100

150

200 [mm]

...

D

50 75 100 150 mm

art. no.

Rth [K/W] 5

19

4 3

E

160

6

2 1

SK 417 ... please indicate:

50

100

150

200 [mm]

...

F

75 100 150 1000 mm Rth [K/W] 2,5

art. no. 40

2,0 1,5

G

10

1,0 0,5

160

SK 85 ... please indicate:

50

100

150

200 [mm]

... 37.5 50 75 100 150 1000 mm

art. no.

H

Rth [K/W] 1,4

40

1,2 1,0

I

10

0,8 0,6

160 50

SK 503 ... please indicate:

100

150

200 [mm]

weight reduced like SK 85 ...

K

75 100 1000 mm

art. no.

Rth [K/W] 2,5

50

2,0 1,5

L

9

1,0

SK 510 ... please indicate:

0,5

160

50

100

150

200 [mm]

...

M

50 75 100 150 1000 mm

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 46

N


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A Standard extruded heatsinks

Rth [K/W] 2,5

art. no.

B 50

2,0 1,5

10

1,0

C

SK 416 ... please indicate:

0,5

160

50

100

150

200 [mm]

100

150

200 [mm]

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 2,0

D 4 25

1,6 1,2 0,8 0,4

162

E

SK 119 ... please indicate:

50

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 2,0 1,6

40

F 10

0,8

please indicate:

0,4

163

SK 412 ...

G

1,2

50

100

150

200 [mm]

... 50 75 100 150 1000 mm

art. no.

Rth [K/W] 2,5 2,0

15

H

1,5 1,0

4,5

167

0,5

SK 421 ...

I

please indicate:

50

150

200 [mm]

100

150

200 [mm]

50 75 100 150 200 1000 mm Rth [K/W]

art. no.

5 4

2,5

3

10

K

2

169

SK 405 ...

L

100

...

please indicate:

2 1 50

... 100 1000 mm

M

N

A 47

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks Rth [K/W] 2,0

art. no.

B

9,8 40

1,6 1,2 0,8 0,4

177,5

SK 519 ... please indicate:

50

100

150

200 [mm]

C

... 50 100 1000 mm Rth [K/W] 1,0

art. no.

D

50

0,8

5

0,6 0,4 0,2

SK 90 ... please indicate:

190

50

100

150

200 [mm]

...

E

50 75 100 1000 mm

art. no.

Rth [K/W] 2,5

15

2,0

1,0

3,5

200

F

1,5

0,5

SK 136 ... please indicate:

50

100

150

200 [mm]

...

G

75 100 150 1000 mm

art. no.

Rth [K/W] 2,5

15

2,0

1,0

3,5

200

H

1,5

0,5

SK 166 ... please indicate:

50

100

150

200 [mm]

I

... 1000 mm

art. no.

Rth [K/W] 2,5

20

2,0

K

1,5

200

4

1,0 0,5

SK 113 ... please indicate:

50

100

150

200 [mm]

L

... 50 75 100 150 1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 48

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 2,5

B

2,0

25

1,5 1,0

C

0,5

4

200

SK 42 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 50 75 100 150 200 1000 mm Rth [K/W] 2,5

art. no. 200

D

25

2,2

2,0 1,5 1,0

E

1,5

188,3

SK 94 ... please indicate:

5,7

4

3,7

0,5 50

... 1000 mm

art. no.

Rth [K/W] 1,3 1,1

39,9

9,2

F

0,9 0,7 0,5

200

G

50

SK 502 ... please indicate:

weight reduced like SK 47 ... 37.5 50 75 100 150 1000 mm

art. no.

Rth [K/W] 1,2

H 10

40

1,0 0,8 0,6 0,4

I

200

SK 47 ... please indicate:

50

100

200 [mm]

150

... 75 100 150 1000 mm

art. no.

Rth [K/W]

K

2,0

60

1,6 1,2

L

10

0,8

200

SK 591 ... please indicate:

0,4

50

100

150

200 [mm]

... 75 100 150 1000 mm

M

N

A 49

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks art. no.

Rth [K/W] 1,0

B

16,5 83

0,8 0,6 0,4 0,2

SK 520 ... please indicate:

200

50

100

150

200 [mm]

C

... 75 100 150 1000 mm

art. no.

Rth [K/W] 1,0

D

40

10

0,8 0,6 0,4 0,2

213

SK 193 ... please indicate:

50

100

150

200 [mm]

E

... 100 150 1000 mm Rth [K/W]

art. no.

1,0

F

77

0,8 0,6 0,4

17

0,2

216

SK 557 ... please indicate:

50

100

150

200 [mm]

G

... 75 100 150 1000 mm

art. no.

Rth [K/W] 1,0

H

83

0,8 0,6 0,4

15

0,2

SK 102 ... please indicate:

216

50

100

150

200 [mm]

...

I

75 100 150 1000 mm

art. no.

104,5

13,5

80

Rth [K/W] 1,2

15

13,5

K

0,8

40

7,6

1,0

0,6 0,4

SK 168 ... please indicate:

226,5

50

100

150

200 [mm]

...

L

1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 50

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 1,0

B 60

0,8 0,6

8

0,4

C

235

SK 580 ... please indicate:

0,2 50

100

150

200 [mm]

... 75 100 150 200 1000 mm

art. no.

Rth [K/W] 1,2

D 25

5

1,0 0,8 0,6

245

E

0,4

SK 118 ... please indicate:

50

100

200 [mm]

150

... 75 100 150 1000 mm

art. no.

Rth [K/W] 2,5

F

6 28

2,0 1,5 1,0 0,5

250

G

SK 49 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 50 75 150 200 1000 mm Rth [K/W] 1,0

art. no.

0,8

6 40

H

0,6 0,4 0,2

I

250

SK 555 ... please indicate:

50

... 75 100 150 1000 mm

art. no.

Rth [K/W] 1,0 0,8

6 40

K

0,6 0,4 0,2

250

SK 199 ...

L

please indicate:

50

... 75 100 1000 mm

M

N

A 51

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks Rth [K/W] 1,1

10 40

art. no.

B

0,9 0,7 0,5 0,3

250

SK 524 ...

50

100

150

200 [mm]

C

...

please indicate:

75 100 150 1000 mm

art. no.

Rth [K/W] 1,0

250

D

3,4 40

10

0,8 0,6

1,9

0,4 0,2

230,5 4

SK 91 ... please indicate:

7,5

50

100

150

200 [mm]

...

E

75 100 150 1000 mm

art. no.

Rth [K/W] 0,6

F

83

0,5 0,4

15

0,3

SK 438 ...

0,2

50

250

100

150

200 [mm]

...

please indicate:

G

75 100 150 1000 mm

art. no.

Rth [K/W]

252

1,0

H

2

6

40

0,8 0,6 0,4 0,2

6

5 258

SK 190 ... please indicate:

50

100

150

200 [mm]

...

I

150 1000 mm

art. no.

Rth [K/W] 1,0

K

11,5 67,5

0,8 0,6 0,4 0,2

260

SK 614 ... please indicate:

50

100

150

200 [mm]

...

L

75 100 150 200 1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 52

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 2,5

B 6

50

2,0 1,5 1,0 0,5

C

265

SK 149 ...

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

...

please indicate:

200 1000 mm

art. no. 54

0,8 0,6

10

74 6,5

D

Rth [K/W] 1,0

E

SK 139 ...

10,7

15 20

0,4

please indicate:

3,5

265

0,2

9

50

... 100 150 200 1000 mm Rth [K/W]

art. no.

1,3

F

6 28

1,1

0,7

6

G

0,9

0,5

282

SK 583 ...

50

please indicate:

... 100 150 200 1000 mm Rth [K/W]

art. no.

1,2

3,9

H

15

1,0 0,8 0,6

300

0,4

I

SK 198 ...

50

please indicate:

... 100 150 1000 mm Rth [K/W]

art. no. 6,5

1,2 1,0

27

K

0,8 0,6

300

0,4

SK 446 ...

L

please indicate:

50

... 75 100 150 1000 mm

M

N

A 53

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks Rth [K/W]

art. no.

1,0

B

0,6

40

10

0,8

0,4 0,2

300

SK 56 ...

50

please indicate:

100

150

200 [mm]

C

... 75 100 150 200 1000 mm

art. no.

Rth [K/W] 0,6

D

0,4

40

10

0,5

0,3 0,2

300 50

SK 501 ...

100

150

200 [mm]

weight reduced like SK 56

E

...

please indicate:

37.5 50 75 100 150 200 1000 mm

art. no.

Rth [K/W]

F

0,5 0,4

60

0,3

12

0,2 0,1

300

SK 568 ...

50

please indicate:

100

150

200 [mm]

G

... 75 100 150 200 1000 mm

art. no.

Rth [K/W] 0,5

H

40 12

83,5

0,4 0,3 0,2 0,1

SK 157 ...

300

please indicate:

50

100

150

200 [mm]

I

... 100 150 200 1000 mm

art. no.

Rth [K/W]

39,5

4,5

1,0

K

0,8 0,6 0,4

304

0,2

SK 101 ... please indicate:

50

100

150

200 [mm]

L

... 75 100 1000 mm

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 54

N


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A Standard extruded heatsinks

Rth [K/W] 2,0

art. no.

B 4

1,6

20

1,2 0,8

320

C

0,4

SK 579 ...

50

100

150

200 [mm]

...

please indicate:

75 100 150 200 1000 mm

art. no.

Rth [K/W] 1,0

338 285

0,8

32

D

0,6

5

0,4

E

126

SK 66 ... please indicate:

0,2

5

8 126

50

200 [mm]

150

100

... 75 100 1000 mm Rth [K/W] 0,7

art. no.

0,6

40

F

0,5 0,4 0,3

G

7,2

350

SK 523 ... please indicate:

50

150

100

200 [mm]

... 100 150 200 1000 mm

art. no.

Rth [K/W] 0,8

8 25

0,7

H

0,6 0,5

5

380

0,4

SK 439 ...

I

please indicate:

50

100

150

50

100

150

200 [mm]

... 100 150 1000 mm

art. no.

Rth [K/W] 1,0 0,8

40

K

0,4

9,2

400

SK 479 ...

L

0,6

please indicate:

0,2 200 [mm]

... 75 100 150 1000 mm

M

N

A 55

High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

Standard extruded heatsinks art. no.

Rth [K/W] 1,0

400

B

40

10

0,8 0,6

SK 93 ... please indicate:

3,4

1,9

0,4

380,5

0,2

7,5

4

50

100

150

200 [mm]

C

... 75 100 150 1000 mm

art. no.

Rth [K/W] 1,0

D

40

0,8 0,6 0,4

6

420

0,2

SK 130 ... please indicate:

50

100

150

200 [mm]

...

E

200 1000 mm

art. no.

Rth [K/W] 1,0

F

57,5

0,8 0,6 0,4

SK 621 ... please indicate:

0,2

10,5

426,4

50

100

150

200 [mm]

...

G

75 100 150 200 1000 mm Rth [K/W] 1,0

33,5

art. no. 11,4

0,8

H

0,6

482,8 = 19"

8

0,4 0,2 50

SK 191 ... please indicate:

100

150

200 [mm]

I

suitable heatsink for rear panal in 19'' cases ... 75 100 150 200 1000 mm

K

L

M High decorative surfaces  Order example  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 56

N


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A Welded high perfomance heatsinks

B

– – – – – –

optimum fin geometry and fin quantity for free convection well suited for forced convection flat milled base (not SK 530, SK 531) * = welded joint (not SK 530, SK 531) length according customer´s details customer specific versions and machining on request Rth

C

[K/W] 0,40 0,38 0,36 0,34 0,32

D

0,30 0,28 0,26 0,24

E

0,22 0,20 SK 530

0,18 12,5

0,16

F

0,14 SK 531

A

C

0,12

G

< Rz10

*

0,10

SK 533

0,08

SK 535 SK 536 SK 537 SK 538 SK 539 SK 540

0,06 0,04

< 0,1 100 B

100

200

300

400 [mm]

art. no.

H

I

K

SK SK SK SK SK SK SK SK SK

530 531 533 535 536 537 538 539 540

number of fins

... ... ... ... ... ... ... ... ...

please indicate:

14 22 30 38 42 46 50 54 58

A 15 ±0.7 15 ±0.7 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5

dim. [mm] B 200 ±0.7 300 ±1 400 +0.6/ -1.6 500 +0.6/ -1.6 550 +0.6/ -1.6 600 +0.6/ -1.6 650 +0.6/ -1.6 700 +0.6/ -1.6 750 +0.6/ -1.6

C 84 ±0.7 84 ±0.7 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5

... 200 300 400 500 600 mm

L

M

N

A 57

High decorative surfaces  Heatsink profile-overview  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

heatsinks for Solid State Relais Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8


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A

High performance heatsinks with press-in fins – other length according to customer´s details – customer specific versions and machining upon request

B

4

art. no.

R 0,3

6,2

3, 6

71

4

R 1

C

Rth [K/W]

12,5

0,35 8

6

0,3

7,5

0,25

D

0,15 0,1

16

12

84 ±0,6

0,2

0,05

200 ±1,2

SK 418 ... please indicate:

100

150

200

250

300

350

400 [mm]

E

... 100 150 200 1000 mm Rth [K/W]

4,8

0,35

F

0,3 0,25

R 0,4

0,2 0,15

5,2

SK 158

0,1

5

13,5

69

R 1,1

SK 159 SK 160 SK 161 SK 162

0,05

100

12,5

4,8

150

200

250

300

350

G

400 [mm]

v = 5 m/s Rth 0,08

H

[K/W] 0,07

0,06

83,5– 1

+ 1,2

0,05 0,04

A

0,03

0,01

15

B

SK 158 SK 159 SK 160 SK 161 SK 162

0,02

100

art. no. SK SK SK SK SK

158 159 160 161 162

number of fins

... ... ... ... ...

please indicate:

150

200

250

300

350

400 [mm]

dim. [mm] A 20 20 20 20 20

22 30 38 46 58

I

K

B 300 ±2 400 ±2 500 ±2.5 600 ±3 750 ±4

L

... 200 300 400 500 600 mm

M High decorative surfaces  Heatsink profile-overview  Heatsink as visual & decor-parts  Drilling pattern for Solid State Relais 

A A A A

9 21 10 12

heatsinks for Solid State Relais Special heatsink design Special profiles Technical introduction

   

A A A A

11 – 12 137 – 138 140 2–8

A 58

N


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A Standard extruded heatsinks SK 09 37,5 TO 220 1 SK 09 50,0 TO 220 1

SK 09 37,5 TO 220 ∅ 3,2

17 20

9,6 14,8

4,5

4,5

11,3 14,75 37,5

4,5

C

∅ 3,2

7 29

29

29

Rth [K/W] 16 14

7 29

12

12 10

SK 09 ...

8

11,5

2,5

D

6

...

... 20 37.5 50 1000 mm

37,5

50

100 [mm]

75

SK 145 37,5 TO 220

7 29

G

7 29

15,5

25 5,1 14,75

29

∅ 3,2

14,75 50

11,3 14,75 37,5

4,5

17 20

F

∅ 3,2

∅ 3,2

∅ 3,2

SK 145 25 TO 220

SK 145 50 TO 220

4,5

SK 145 20 TO 220

(optional) K; TO 220

17,7

art. no.

20

29

please indicate:

4,5

E

∅ 3,2

∅ 3,2

∅ 3,2 7

SK 09 20 TO 220

14,75 50

B

SK 09 50 TO 220

17,7

art. no.

7 29 Rth [K/W] 14 12

12

10

3

8

H

SK 145 ... please indicate:

6

25,4 29

50

...

... 20 25 37.5 50 1000 mm

art. no.

3,6

3,5

100

150

200 [mm]

100

150

200 [mm]

(optional) TO 220 20

12

12,5

2,5

16

8 4

11,7

K

150

Rth [K/W]

3,6

I

200 [mm]

100

30,1

SK 443 ... please indicate:

50

... 37.5 75 100 1000 mm

art. no.

Rth [K/W] 10

37,5

L

39

6,7

8 6 4 2

M

44,5

SK 173 ... please indicate:

76,2

50

... 1000 mm

N

A 59

Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

   

E 26 – 27 E 2 – 24 D 14 A2–8


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A

Standard extruded heatsinks art. no.

Rth [K/W] 10

19,5

B

12,5

2,5

8 6 4 2

42,7

SK 59 ... please indicate:

50

...

... 37.5 50 75 100 1000 mm

art. no.

100

200 [mm]

150

C

(optional) TO 220 Rth [K/W] 8

27,4

D

12,5

3

6 4 2

45

SK 122 ... please indicate:

50

...

... 37.5 50 mm

100

200 [mm]

150

(optional) TO 3; CB

art. no.

E

Rth [K/W] 7

32

6

F

4

24

2,4

3

4

25

5

2 1

46

SK 107 ... please indicate:

50

100

200 [mm]

150

G

... 50 75 100 1000 mm Rth [K/W]

art. no.

5

11

7,5

H

4

2,5

20

3 2 1

50

SK 181 ... please indicate:

50

100

150

200 [mm]

I

... 50 75 100 1000 mm 11

2xM3

7,5

20

2,5

20

art. no.

K

83,82 94 50 16,5

Rth [K/W]

4,2

4,2

5

3xM3

L

4 50

4

17,25 8

3 2 1

19,06 27,94

27,94

SK 181 94 C 3 x TO 220 retaining spring for transistor THF 409 TO 220 ➔ A 115 Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

50

   

E 26 – 27 E 2 – 24 D 14 A2–8

100

150

200 [mm]

A 60

M

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 10

B

8

33 4

15

6 4 2

C

60

SK 78 ... please indicate:

50

...

... 37.5 50 75 100 1000 mm

100

150

200 [mm]

(optional) TO 3; CB Rth [K/W] 10

art. no.

D

35,5

6

20

3,5

8

4 2

E

SK 51 ... please indicate:

60

50

...

... 37.5 50 75 100 1000 mm

150

100

200 [mm]

(optional) TO 3; CB

art. no.

Rth [K/W] 5

F

34 4

17,5

4 3 2 1

G

62

SK 165 ... please indicate:

50

...

... 37.5 50 75 1000 mm

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

1,7

art. no.

100

(optional) TO 3; CB

5

Rth [K/W] 5

28,5

H

I

4 3 2

9,2

29

1

28 63,2

SK 25 ... please indicate:

50

with slots for cover plates or PCBs ... 37.5 50 1000 mm Rth [K/W]

25,4

10

5

12,1

8

2,6

2

K

art. no.

6

L

1,5

4

63,8

SK 150 ... please indicate:

3,2

57,4

2 50

... 1000 mm

M

N

A 61

Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

   

E 26 – 27 E 2 – 24 D 14 A2–8


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A

Standard extruded heatsinks art. no.

Rth [K/W]

33

5

B

24

4

4

3 2 1

SK 18 ... please indicate:

65

50

...

... 37.5 50 75 1000 mm

art. no.

100

150

200 [mm]

C

(optional) TO 3; CB Rth [K/W] 5

29

D

27

4

4

3 2 1

SK 63 ... please indicate:

65

50

...

... 37.5 50 75 100 1000 mm

150

200 [mm]

(optional) TO 3; CB

1,7

art. no.

100

5

Rth [K/W]

3,7

F

4

28,5

25

5

29

E

3 2 1

65

SK 05 ... please indicate:

50

100

150

200 [mm]

G

with slots for cover plates or PCBs ...

... 50 75 1000 mm

art. no.

(optional) TO 3; CB

27,1

H

Rth [K/W]

33,8

5 4 3

4

2

I

1

SK 402 ... please indicate:

71,1

...

50

... 100 mm

100

150

200 [mm]

(optional) TO 3; CB

art. no.

K

Rth [K/W] 5

37,8 23,5

4 3 2

L

1

please indicate:

...

4,5

72

SK 97 ...

... 37.5 50 75 100 1000 mm

50

100

150

200 [mm]

(optional) TO 3

M Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

   

E 26 – 27 E 2 – 24 D 14 A2–8

A 62

N


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A Standard extruded heatsinks

Rth [K/W]

art. no.

5

B

31,5 15

4

4 3 2 1

C

79

SK 45 ... please indicate:

50

...

... 37.5 50 75 100 1000 mm

100

150

200 [mm]

(optional) TO 3; CB Rth [K/W]

art. no.

5 4

5

35

14,5

D

3 2 1

E

94

SK 19 ... please indicate:

50

...

... 37.5 50 75 100 1000 mm

100

150

200 [mm]

(optional) TO 3; CB Rth [K/W]

art. no.

5 4

36 20

3,5

F

3 2 1

94,5

SK 28 ...

G

please indicate:

50

...

... 37.5 50 75 1000 mm

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

(optional) TO 3; CB

art. no.

Rth [K/W] 5

33 4

H

25

4 3 2 1

95

SK 401 ...

I

please indicate:

50

...

... 100 1000 mm

(optional) TO 3; CB

art. no.

Rth [K/W] 5

33 4

K

24 25

4 3 2 1

97

SK 72 ...

L

please indicate:

50

...

... 37.5 50 75 100 1000 mm

(optional) TO 3; CB

M

N

A 63

Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

   

E 26 – 27 E 2 – 24 D 14 A2–8


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A

Standard extruded heatsinks Rth [K/W] 5

3

1,6

art. no.

B

4 3

4

25

36

2 1

97

SK 04 ... please indicate:

50

100

150

200 [mm]

C

with slots for cover plates or PCBs ...

... 37.5 50 75 100 1000 mm

(optional) SSR 1; SSR 2; TO 3; CB

art. no. 38

D

10

40

Rth [K/W] 5 4 3 2

E

1

SK 403 ... please indicate:

104

50

100

150

200 [mm]

... 1000 mm

art. no.

Rth [K/W] 5

23

4

3,5

30,6

F

3 2

G

1

105

SK 73 ... please indicate:

50

...

... 50 75 1000 mm

100

150

200 [mm]

(optional) TO 3; CB Rth [K/W] 2,5

art. no. 34

H

37

2,0

6

1,5 1,0 0,5

120

SK 71 ... please indicate:

50

...

... 37.5 50 75 100 1000 mm

100

150

200 [mm]

I

(optional) TO 3

10

art. no.

K

50

1,6

Rth [K/W] 2,5

36

2,0

8

1,5

L

1,0 0,5

120

SK 57 ... please indicate:

50

100

150

200 [mm]

with slots for cover plates or PCBs ...

M

37.5 75 100 1000 mm

Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

   

E 26 – 27 E 2 – 24 D 14 A2–8

A 64

N


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A Standard extruded heatsinks art. no.

B

Rth [K/W] 2,5 2,0

2,35

4,7

32,6 1,4

35

1,5 1,0

3,85

C

SK 197 ... please indicate:

5,85

125,65 145

0,5 50

...

... 37.5 1000 mm

art. no.

32

0,5

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

Rth [K/W] 2,5 2,0 1,5

40

29

1,6

D

100

(optional) TO 3; CB

6

1,0

E

0,5

150

SK 98 ... please indicate:

50

with slots for cover plates or PCBs ... 100 150 mm

art. no.

Rth [K/W]

52,9

15,4

1,4

F 40

10

1,2 1,0 0,8 0,6

G

SK 404 ... please indicate:

160

50

...

... 50 75 1000 mm

(optional) TO 3; CB

H

I

K

L

M

N

A 65

Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting

   

A A A A

21 91 89 89 – 112

Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction

   

E 26 – 27 E 2 – 24 D 14 A2–8


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A

Standard extruded heatsinks art. no.

Rth [K/W] 5

69,4 37

B

4

26

3

4

2 1

88

SK 36 ...

50

100

150

200 [mm]

C

mounting parts IS 1, IS 2, IS 3 ➔ E 49

please indicate:

...

... 50 75 1000 mm

art. no.

(optional) TO 3; CB

93

Rth [K/W] 5

36

D

4

4

26

3 2 1

115

SK 01 ...

50

100

150

200 [mm]

E

mounting parts IS 1, IS 2, IS 3 ➔ E 49

please indicate:

...

... 37.5 50 75 100 1000 mm

art. no.

(optional) TO 3; CB

F

G 63

4

10

1,6

92 38,5

Rth [K/W] 2,5 2,0

36

1,5

H

2

1,0 0,5

115

SK 02 ... please indicate:

50

...

...

200 [mm]

I

(optional) TO 3; CB

1,6

100 Rth [K/W] 5

4

3

art. no.

K

4

32

3

2

2

36

1

120

please indicate:

150

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49 37.5 50 75 100 1000 mm

SK 03 ...

100

50

100

150

200 [mm]

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49 ...

... 50 75 100 1000 mm

L

(optional) TO 3; CB

M Thermal conductive material  Mounting material for semiconduct.  Mounting parts for heatsinks  Distance sleeves for PCB´s in HP grid 

E E E E

2–5 44 – 48 49 – 50 39

Order example Guide rails for PCBs Heatsink-cooling aggregates Technical introduction

   

A 21 E 26 – 27 D 14 A2–8

A 66

N


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A Standard extruded heatsinks 100

5 4 3

31,4

4,8

B

Rth [K/W]

5

1,7

art. no.

2 1

34

C

121,3

SK 39 ... please indicate:

50

150

200 [mm]

100

150

200 [mm]

100

150

100

150

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49 ...

... 75 100 1000 mm

art. no.

(optional) TO 3; CB

10

100,6

Rth [K/W] 2,5

4,8

67

1,6

D

100

2,0 1,5

E

33,8

1,0 0,5

122

F

SK 30 ... please indicate:

50

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49 ...

... 75 100 1000 mm

(optional) TO 3; CB

104 10

art. no.

65

5

1,6

G

Rth [K/W] 2,5 2,0 1,5 1,0

36

H

0,5

125

SK 34 ... please indicate:

50

...

... 50 75 100 1000 mm

art. no.

(optional) TO 3; CB

106

Rth [K/W] 2,5

66

5

1,7

10

I

200 [mm]

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49

K

2,0 1,5 1,0 0,5

34 125

L

SK 14 ... please indicate:

50

200 [mm]

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49 ...

... 50 75 100 mm

(optional) TO 3; CB

M

N

A 67

Thermal conductive material  Mounting material for semiconduct.  Mounting parts for heatsinks  Distance sleeves for PCB´s in HP grid 

E E E E

2–5 44 – 48 49 – 50 39

Order example Guide rails for PCBs Heatsink-cooling aggregates Technical introduction

   

A 21 E 26 – 27 D 14 A2–8


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A

Standard extruded heatsinks

7 28

4

4,5

34

art. no.

B

Rth [K/W] 5 4 3

2,5

1,6

2

89 100

SK 20 ...

C

1 50

100

150

200 [mm]

with slots for cover plates or PCBs; mounting parts IS 5, IS 8 ➔ E 49

please indicate:

...

... 37.5 75 100 1000 mm

(optional) TO 3; CB

D

4

art. no. 50,5

4

8,4 38

5

5,5

Rth [K/W] 5

E

17,5

3 2 1

SK 184 ... please indicate:

106,4

50

100

150

200 [mm]

F

... 100 1000 mm 34

5,8 Rth [K/W] 2,5

50

1,8

5

3,5

5

art. no.

G

2,0 1,5 1,0 0,5

119 132

SK 148 ... please indicate:

50

100

150

200 [mm]

H

with slots for cover plates or PCBs ...

... 37.5 100 1000 mm

(optional) TO 3; CB Rth [K/W] 2,5

art. no. 35,5

I

4

2,0

25

1,5 1,0 0,5

142

SK 84 ... please indicate:

50

...

... 50 150 1000 mm

100

150

200 [mm]

K

(optional) TO 3

L

M Guide rails for PCBs Mounting material for semiconduct. Mounting parts for heatsinks Heatsink-cooling aggregates

   

E 26 – 30 E 44 – 48 E 49 – 50 D 14

Order example Assignment table Hole pattern Technical introduction

   

A A A A

21 18 – 20 21 2–8

A 68

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 2,5

34 40

B

2,0

6,5

1,5 1,0

145

C

0,5

164

SK 67 ... please indicate:

50

100

150

200 [mm]

mounting part IS 6 ➔ E 49 ...

... 37.5 50 100 1000 mm

(optional) TO 3

D

E

F

G

H

I

K

L

M

N

A 69

Guide rails for PCBs Mounting material for semiconduct. Mounting parts for heatsinks Heatsink-cooling aggregates

   

E 26 – 30 E 44 – 48 E 49 – 50 D 14

Order example Assignment table Hole pattern Technical introduction

   

A A A A

21 18 – 20 21 2–8


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A

Standard extruded heatsinks 46

37,5 37,5

14 5

75 mm 3,6 K/W

for cases SOT 32 ...

... 37.5 75 mm

art. no.

D

(optional) 1xM3; 2xM3 62 18,75 37,5 37,5

13

37,5 mm 4,1 K/W

SK 64 ...

13

17 54 70

18,75

5

4

3,5 25

12

75 2xM3

please indicate:

37,5 1xM3

SK 65 ...

14

54

C

18,75

12 38

37,5 mm 5,5 K/W

B

18,75

37,5 1xM3

22,5

3,5

4

10

75 2xM3

art. no.

75 mm 2,7 K/W

E

F

for cases TO 220, TOP 3

please indicate:

...

... 37.5 75 mm

art. no.

(optional) 1xM3; 2xM3

G

4

78 4,3

26,5

Rth [K/W] 3,0

H

3

9

2,5 2,0 1,5

SK 419 ... please indicate:

1,0

25,1 47 77

50

100

150

200 [mm]

...

I

1000 mm

art. no.

Rth [K/W]

36

21

4

4

1,6

3

5

K

3 2 1

120

50

SK 21 ... please indicate:

100

150

200 [mm]

with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔ E 49 ...

... 37.5 1000 mm

L

(optional) TO 3; CB

M Mounting for TO 3 angle Order example Special heatsink design Heatsinks for DC/DC converter

   

A A A A

125 21 137 – 138 113 – 114

Insulting clamping parts Mica wafers Insulator sleeves Technical introduction

   

E 45 E 19 E 52 A2–8

A 70

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 5

100 34

3

11,7

1,5

4

3

B

2 1

120,5

C

50

SK 69 ...

100

150

200 [mm]

100

150

200 [mm]

100

150

100

150

mounting parts IS 1, IS 2, IS 3 ➔ E 49

please indicate:

...

... 50 75 100 1000 mm

art. no.

(optional) TO 3; CB Rth [K/W] 5

31,5

4

22

5,5

D

3 2

E

1

127

SK 74 ...

50

...

please indicate:

... 37.5 100 1000 mm

(optional) TO 3; CB

art. no.

Rth [K/W] 2,5

38

F

8

33

2,0 1,5 1,0 0,5

G

140

SK 124 ...

50

please indicate:

...

... 50 100 150 1000 mm

(optional) TO 3

165

art. no.

200 [mm]

Rth [K/W] 2,5

32,5

SK 195 ... please indicate:

25

0,5

32,5

85

1,5 1,0

7,6

4,2

I

2,0

2,8

5,1 1,5

H

60

185

50

...

... 75 100 mm

200 [mm]

(optional) TO 3; CB

K

L

M

N

A 71

Mounting for TO 3 angle Order example Special heatsink design Heatsinks for DC/DC converter

   

A A A A

125 21 137 – 138 113 – 114

Insulting clamping parts Mica wafers Insulator sleeves Technical introduction

   

E 45 E 19 E 52 A2–8


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A

Standard extruded heatsinks Rth [K/W] 10

art. no.

B

8 6

12

3

29

4 2

50

SK 31 ...

50

please indicate:

...

... 37.5 50 75 1000 mm

100

150

200 [mm]

C

(optional) TO 3; CB

art. no.

Rth [K/W] 5

36

D

15

3,2

4 3 2 1

70

SK 07 ...

50

...

please indicate:

... 37.5 50 75 1000 mm

100

150

200 [mm]

(optional) TO 3; CB

art. no.

E

Rth [K/W] 5

34

F

4,7

25,4

4 3 2 1

104,8 50

SK 16 ...

100

150

200 [mm]

mountingpart IS 3 ➔ E 49

please indicate:

...

... 75 1000 mm

art. no.

G

(optional) TO 3; CB

39

Rth [K/W]

H

3,0

8

39

2,5 2,0 1,5 1,0

105

SK 500 ... please indicate:

50

100

150

200 [mm]

I

... 37.5 50 75 100 1000 mm

K

L

M Special heatsink design Mounting for TO 3 angle Special profiles Fin coolers

   

A A A A

137 – 138 Hole pattern 125 Profiles for lock-in fixing spring 140 Extruded heatsinks 129 Technical introduction

   

A A A A

21 84 – 88 22 – 83 2–8

A 72

N


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A Standard extruded heatsinks art. no.

Rth

30

6

2 18

2,7

4

B

8

[K/W] 7

5

4,5

34,4 65

C

SK 185 ... please indicate:

4 50

100

150

200 [mm]

50

100

150

200 [mm]

50

100

150

200 [mm]

50

100

150

200 [mm]

50

100

150

extruded heatsink for PCB mounting ➔ A 104 ...

... 37.5 50 1000 mm

art. no.

(optional) TO 3; CB Rth

30

3

20

4

D

5

[K/W] 4

2 1

65

SK 48 ... please indicate:

...

... 37.5 50 75 100 1000 mm

(optional) SSR 3; TO 3; CB Rth

30

3,5

art. no.

5

[K/W] 4 3 2

25

1,7

F

4,5

E

1

88

SK 79 ...

G

please indicate:

with slots for cover plates or PCBs ...

... 37.5 50 75 100 1000 mm

Rth

30

3

35

15

5

H

5

[K/W] 4

1,6

art. no.

(optional) TO 3; CB

2 1

88

SK 08 ...

I

please indicate:

with slots for cover plates or PCBs ...

... 37.5 50 75 100 1000 mm

art. no.

(optional) TO 3; CB Rth

30 1,6

[K/W] 2,5

30

50

2,0

K

1,5

6

1,0 0,5

100

L

SK 88 ... please indicate:

200 [mm]

with slots for cover plates or PCBs ...

... 37.5 50 75 100 1000 mm

(optional) TO 3

M

N

A 73

Assignment table Standard aluminium profiles Extruded heatsinks High capacity cooling aggregat.

   

A 18 – 20 A 135 – 136 A 22 – 83 D 26 – 28

Retaining springs for transistors  Thermal. conductive silicone foam foil Thermal conductive foil  Technical introduction 

A 115 – 117 E 10 E7 A2–8


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A

Standard extruded heatsinks Rth [K/W]

art. no.

5

26,5

28

B

4 3

19

4,6

28

2 1

105

SK 52 ...

50

please indicate:

...

... 37.5 50 75 100 1000 mm

art. no.

200 [mm]

C

2,5

34

32,5

D

2,0 1,5

2,2

4

1,5

25

150

Rth [K/W]

135 32,5

100

(optional) 2xTO 3; 2xCB

1,0 0,5

3,7

SK 60 ... please indicate:

5,7

125

50

...

... 50 75 100 1000 mm

art. no.

10 34

150

200 [mm]

(optional) 2xTO 3; 2xCB 2,5

29

F

1,5

30

4

25

2,0

2,5

E

Rth [K/W]

10 29

100

1,0 0,5

135

SK 147 ... please indicate:

50

...

... 50 150 1000 mm

100

150

200 [mm]

(optional) 2xTO 3; 2xCB

art. no.

G

Rth [K/W]

32

2,5

37

2,0

H

1,5

20

4

37

1,0 0,5

179

SK 80 ... please indicate:

50

...

... 75 100 1000 mm

art. no.

68

38

100

150

200 [mm]

I

(optional) 2xTO 3; 2xCB Rth [K/W]

38

2,5

48

2,0

K

1,5

5

1,0 0,5

SK 53 ... please indicate:

180

...

50

... 50 75 100 150 1000 mm

100

150

200 [mm]

L

(optional) 2xTO 3; 2xCB

M Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material

   

A 21 A 135 – 136 A 22 – 83 E2–5

Heatsink as visual & decor-parts Assignment table Kapton insulator washers Technical introduction

   

A 10 A 18 – 20 E 16 A2–8

A 74

N


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A Standard extruded heatsinks art. no.

Rth [K/W]

B

28

29

2,5

28

29

28

29

2,0 1,5

38

4,5

29

1,0 0,5

C

232

SK 86 ...

50

100

150

200 [mm]

100

150

200 [mm]

...

please indicate:

100 150 1000 mm

art. no.

D

110

110

Rth [K/W] 1,0

110

30 28

6

0,8 0,6 0,4 0,2

440

E

SK 82 ... please indicate:

50

... 100 1000 mm

F

G

H

I

K

L

M

N

A 75

Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material

   

A 21 A 135 – 136 A 22 – 83 E2–5

Heatsink as visual & decor-parts Assignment table Kapton insulator washers Technical introduction

   

A 10 A 18 – 20 E 16 A2–8


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A

Standard extruded heatsinks art. no.

Rth [K/W]

8 9

12

B

10

45

8

17

26

6 4

C

2

SK 596 ... please indicate:

3

5

50

100

150

200 [mm]

... 37.5 50 75 100 1000 mm 30

art. no.

D

3 Rth [K/W] 6

45

5

29

4

E

3 2

2

1

SK 544 ... please indicate:

8

11,4

50

25

100

150

200 [mm]

...

F

50 75 100 1000 mm 38 8

art. no.

Rth [K/W] 5

G

54

4

26

3 2 1

6

SK 32 ... please indicate:

50

20

100

150

200 [mm]

...

H

37.5 50 75 100 1000 mm

art. no.

30,5 4,5

3

6,5

I

59

Rth [K/W] 3

2

6

K

10,5

SK 187 ... please indicate:

...

1

6,5 20 40

50

... 75 1000 mm

100

150

200 [mm]

(optional) SSR 3

L

M Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material

   

A 21 A 135 – 136 A 22 – 83 E2–5

heatsinks for Solid State Relais Assignment table Kapton insulator washers Technical introduction

   

A 11 – 12 A 18 – 20 E 16 A2–8

A 76

N


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A Standard extruded heatsinks art. no.

10

5

72

B 94

Rth [K/W] 2,5 2,0 1,5

C

7

1,0

8,5

please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 1000 mm

art. no. Rth [K/W] 1,2

5,3

D

13,5

22

3

SK 140 ...

0,5

94,3

1,0

E

0,8 0,6

4

0,4 0,2

SK 556 ... please indicate:

50

... 75 100 150 1000 mm 14

art. no. 35

48 62

30

F

72

G

Rth [K/W]

124

1,2 1,0 0,8 0,6 0,4

H

0,2

SK 15 ... please indicate:

50

72

... 75 1000 mm

art. no.

80

Rth [K/W] 1,4 1,2

14,5

78,6

6

I

K

1,0 0,8 0,6

1 58,5

SK 89 ... please indicate:

50

with slots for cover plates or PCBs ...

... 100 150 1000 mm

L

(optional) SSR 1; SSR 2

M

N

A 77

Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material

   

A 21 A 135 – 136 A 22 – 83 E2–5

heatsinks for Solid State Relais Assignment table Kapton insulator washers Technical introduction

   

A 11 – 12 A 18 – 20 E 16 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard extruded heatsinks art. no. 8

80

B

160

Rth [K/W] 1,2

C

1,0 0,8 0,6 0,4

D

8

SK 163 ... please indicate:

71

9

50

100

150

200 [mm]

... 100 150 1000 mm 82 25

E

Rth [K/W] 1,8

8

art. no.

58

1,6 1,4 1,2

SK 176 ... please indicate:

...

50

... 75 100 150 1000 mm

F

1,0

16 78

100

150

200 [mm]

(optional) SSR 2

G

H

I

K

L

M Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material

   

A 21 A 135 – 136 A 22 – 83 E2–5

heatsinks for Solid State Relais Assignment table Kapton insulator washers Technical introduction

   

A 11 – 12 A 18 – 20 E 16 A2–8

A 78

N


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A Standard extruded heatsinks

Rth [K/W] 5

art. no. 2

B 12 ,

55 + 0

52

4 3 2 1

C

52

SK 11 ... please indicate:

50

100

150

200 [mm]

threads, through holes and fixing according to your demand; mounting parts IS 1, IS 2, IS 3 ➔ E 49 ... 1000 mm

art. no.

11 Rth [K/W]

30

2,5

6

11

D

70

2,0

6

3,5

1,5 1,0

E

0,5

10

SK 83 ... please indicate:

6

87,9

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 100 1000 mm

art. no.

50 Rth [K/W] 2,5

G

107

6,4

F

2,0

40,3

1,5 1,0 0,5

107

H

SK 06 ... please indicate:

50

mounting part IS 4 ➔ E 49 ... 75 1000 mm 119

art. no.

105

3,6

1,5

I

Rth [K/W] 2,5

7,8

K

119

105

55

2,0 1,5 1,0 0,5 50

SK 23 ...

L

please indicate:

with slots for cover plates or PCBs; equipped with fan and endplates = LA 4 ➔ D 14 ... 75 mm

M

N

A 79

Profiles for PCB components High capacity heatsinks Mounting for TO 3 angle Heatsinks for PCB

   

A A A A

91 57 – 58 125 89 – 112

heatsinks for lock-in retaining spring Heatsink-cooling aggregates  Special heatsink design  Technical introduction 

A 85 – 88 D 14 A 137 – 138 A2–8


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A

Standard extruded heatsinks art. no.

76,9

22

8,5

70,5

8,3

13

50

52,5

8

B

120

Rth [K/W]

15

12

1,0

C

0,8 0,6

12,4

0,4

SK 110 ... please indicate:

0,2

52,5 120,5

50

100

150

200 [mm]

D

... 150 200 1000 mm

art. no. 6

125 80

E

135

115 101,5 96

4,2

5,3

F Rth [K/W]

4,2

1,0

SK 109 ... please indicate:

96 101,5 110

0,8 0,6

13

2,2

15,2

2,2

G

0,4

5,3

0,2 50

100

150

200 [mm]

with slots for cover plates or PCBs ...

H

100 150 200 1000 mm

art. no. 8,3 5,2

126 80

6,5 4

I 96 101,5 115 136

20

2,5 4,7

K

4,5

1,2

2,2

1,0

14

13

7,2 4,2

Rth [K/W]

0,8

SK 108 ... please indicate:

15,2

8,5

0,6

8,3

5,2

L

0,4

101,5 110

50

100

150

200 [mm]

with slots for cover plates or PCBs ...

M

100 1000 mm

Profiles for PCB components High capacity heatsinks Mounting for TO 3 angle Heatsinks for PCB

   

A A A A

91 57 – 58 125 89 – 112

heatsinks for lock-in retaining spring Heatsink-cooling aggregates  Special heatsink design  Technical introduction 

A 85 – 88 D 14 A 137 – 138 A2–8

A 80

N


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A Standard extruded heatsinks art. no.

Rth [K/W] 2,8

81

B

2,0

40

4 38

2,4

1,6 1,2

C

58

SK 111 ... please indicate:

50

...

... 75 100 1000 mm

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

7

2,0

1,0

4,3 47,6 80 96

SK 172 ... please indicate:

200 [mm]

1,5

5,3

E

150

Rth [K/W] 2,5

12 20,5

41

D

2

76

5

art. no.

100

(optional) SSR 1; SSR 3

5,3

0,5 50

...

... 50 75 100 150 1000 mm

(optional) SSR 1; SSR 4

145

art. no.

Rth [K/W] 2,5

F

1,5

8

5,3

8,4

75

2,0

G

7

1,0

SK 194 ... please indicate:

0,5

7 120

50

...

... 75 1000 mm

art. no.

200 Rth [K/W] 1,0

6,5

10,3

20

H

(optional) SSR 2

8,5

5,3 8,3

77

0,8

17

I SK 435 ... please indicate:

0,6 0,4 0,2

215

50

... 150 200 1000 mm

K

L

M

N

A 81

High capacity heatsinks  Heatsinks for DC/DC converter  heatsinks for lock-in retaining spring Heatsink profile-overview 

A A A A

57 – 58 113 – 114 85 – 88 13 – 17

Extruded heatsinks Die-cast heatsinks High decorative surfaces Technical introduction

   

A A A A

22 – 83 125 9 2–8


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A

Standard extruded heatsinks 76,2 4,4

1,85

Ø 4,4

B

3,2 2,4 1,6

C

0,8

4,4 7,3 47,6 87

5,1

SK 432 ...

Rth [K/W] 4,0

7,3

7,3

4,4

2,2

21,5

16,65 41

5,1

1,8

art. no.

50

100

150

200 [mm]

with slots for cover plates or PCBs

please indicate:

... 100 1000 mm

art. no.

108

1,2

9,6 6,5 12,5 63,5

19

27

6,5

6,5

6,5

D

Rth [K/W] 1,4

12,5

1,0

E

0,8 0,6

46,8 127

SK 40 ... please indicate:

50

100

150

200 [mm]

... 100 1000 mm

F Rth [K/W] 2,5

2 2,4 1,5

1,5

28

1,0 0,5

72,5 130 143

SK 61 ...

G

2,0

91 8

80

103 91

6,4

art. no.

50

100

150

200 [mm]

with slots for cover plates or PCBs; cooling case ➔ M 29

please indicate:

H

... 75 100 150 1000 mm

art. no.

175

13,5

8,5

12

I

108

8,5 13,5

48 Rth [K/W] 1,0

K

0,8

25

0,6 0,4

102 122 240

8,5

SK 144 ... please indicate:

13,5

0,2 50

100

150

200 [mm]

...

L

1000 mm

M High capacity heatsinks  Heatsinks for DC/DC converter  heatsinks for lock-in retaining spring Heatsink profile-overview 

A A A A

57 – 58 113 – 114 85 – 88 13 – 17

Extruded heatsinks Die-cast heatsinks High decorative surfaces Technical introduction

   

A A A A

22 – 83 125 9 2–8

A 82

N


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A Standard extruded heatsinks art. no.

Rth [K/W]

M3 3,5

40 38 36 34 32 30 28 26

36,5

B

C

SK 494 ... please indicate:

6

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 25 37.5 50 75 100 1000 mm

art. no. Rth [K/W]

19

D

30

20

21,2

2,5

1,6

25

15 10

E

10,7

50

SK 153 ... please indicate:

F

... 50 mm Rth [K/W] 5

art. no. 71 35

4

10

20

4

3

G

2 1

41

SK 55 ... please indicate:

50

...

... 37.5 1000 mm

art. no.

7

10 Rth [K/W] 3,5

69,8

39,9

4

7

7

22

H

(optional) TO 3; CB

I

3,0 2,5 2,0

12 6

1,5

9,5

SK 175 ...

K

please indicate:

80

50

100

200 [mm]

150

... 50 1000 mm

L

M

N

A 83

High capacity heatsinks  Heatsinks for DC/DC converter  heatsinks for lock-in retaining spring Heatsink profile-overview 

A A A A

57 – 58 113 – 114 85 – 88 13 – 17

Extruded heatsinks Die-cast heatsinks High decorative surfaces Technical introduction

   

A A A A

22 – 83 125 9 2–8


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A

Extruded heatsinks for lock-in retaining spring art. no.

B 10

50

Rth [K/W]

30,5 25

8 6 4

C

2

2,5

SK 575 ... please indicate:

M3 6

50

100

150

200 [mm]

... 25 37.5 50 75 84 100 1000 mm

art. no.

Rth

10,3

D

40

[K/W] 30

14,5

20

20 10

8

SK 512 ... please indicate:

E 50

100

150

200 [mm]

... 25 50 100 1000 mm

art. no.

14

Rth

10,3

[K/W]

F

12 10

22,8

28

8 6 4 2

M3 8

SK 480 ... please indicate:

50

100

150

200 [mm]

G

... 25 37.5 50 75 84 100 1000 mm 11

art. no.

M3

[K/W]

50

8

please indicate:

6 4

21,7

31,8

SK 490 ...

H

10

Rth

I

2 50

M3

100

150

200 [mm]

... 37.5 50 75 84 100 1000 mm

art. no.

Rth

16,8

K

14

[K/W] 12

20

20 26

10 8 6 4

M3

SK 492 ... please indicate:

12

50

100

150

200 [mm]

L

... 25 37.5 50 75 84 100 1000 mm

please note: profile threads ➔ A 5

Mounting parts for heatsinks  Insulating caps  Mounting pads  Lock-in retaining spring for transistors

M E 49 – 50 E 51 E 46 A 119 – 121

Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction

   

A A A A

89 91 93 2–8

A 84

N


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A Extruded heatsinks for lock-in retaining spring 29,4

art. no.

B

10

Rth

45

[K/W]

6

27,4

12

8

4 2

C

M3 8

SK 489 ... please indicate:

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 25 37.5 50 75 84 100 1000 mm

art. no.

Rth [K/W] 8 7 6

30

25

19,9 3,5

D

5 4

6

3 2

E

M3

SK 573 ... please indicate:

1

7 8

12

50

... 25 37.5 50 75 84 100 1000 mm Rth [K/W] 8 7 6

art. no.

5

45

F

4

19,25

3

G

2 1

M3

SK 576 ... please indicate:

6

19

50

... 25 37.5 50 75 84 100 1000 mm 30

art. no.

Rth [K/W] 7 6

25,6

45

H

SK 481 ... please indicate:

4 3 2

8

I

5

8

M3 17

1 50

... 25 37.5 50 75 84 100 1000 mm

K

please note: profile threads ➔ A 5

L

M

N

A 85

Mounting parts for heatsinks  Insulating caps  Mounting pads  Lock-in retaining spring for transistors

E 49 – 50 E 51 E 46 A 119 – 121

Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction

   

A A A A

89 91 93 2–8


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A

Extruded heatsinks for lock-in retaining spring art. no.

30

B 52

Rth [K/W] 6

25,6

5 4

8

please indicate:

3,4 17

8

2 1

2

M3

SK 514 ...

C

3

50

100

150

200 [mm]

...

D

25 37.5 50 75 100 1000 mm

art. no.

Rth [K/W] 8

32,3

5

E

4

3,5

28 19,9

14

7 6

3 2 1

M3 7 8

SK 574 ... please indicate:

22

50

100

150

200 [mm]

F

... 25 37.5 50 75 84 100 1000 mm

art. no.

33 M3

G

Rth [K/W]

66,5

7 6 5

31

4 3

H

8

2

SK 589 ... please indicate:

1

M3 12

9

50

100

150

200 [mm]

... 25 37.5 50 75 84 100 1000 mm 10,3

art. no.

I

Rth [K/W] 7 6

35 22,8

5

12,5

3

K

2 1

M3

SK 482 ... please indicate:

4

8

25

50

100

150

200 [mm]

... 25 37.5 50 75 84 100 1000 mm

L

please note: profile threads ➔ A 5

M Mounting parts for heatsinks  Insulating caps  Mounting pads  Lock-in retaining spring for transistors

E 49 – 50 E 51 E 46 A 119 – 121

Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction

   

A A A A

89 91 93 2–8

A 86

N


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A Extruded heatsinks for lock-in retaining spring art. no.

47,8 36,75

Rth [K/W] 7 6

M3

B 21,2

4

33

21,2

5 3 2

4

1

C

SK 495 ... please indicate:

M3

35,6 43,1

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

... 25 37.5 50 75 100 1000 mm

art. no.

50,7

Rth [K/W] 7 6

3,5

26,1

26,1 33

D

E

SK 499 ... please indicate:

4 3 2 1

M3

35,6 46

5

50

... 25 37.5 50 75 100 1000 mm

art. no.

Rth [K/W]

52,3

10 8

12,5

28

6

22,5

F

4 2

M3

SK 487 ...

G

please indicate:

42

8

50

... 25 37.5 50 75 84 100 1000 mm

art. no.

Rth [K/W] 7 6

57

5

28 22,5

H

14

4 3 2 1

M3

SK 483 ...

I

please indicate:

47

8

50

... 25 37.5 50 75 84 100 1000 mm 75,5 50

art. no.

Rth [K/W] 7 6

60

K

5

26,4

4

L

3 2 1

50 57,5

SK 593 ... please indicate:

50

... 25 37.5 50 75 84 100 1000 mm

M

N

please note: profile threads ➔ A 5

A 87

Mounting parts for heatsinks  Insulating caps  Mounting pads  Lock-in retaining spring for transistors

E 49 – 50 E 51 E 46 A 119 – 121

Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction

   

A A A A

89 91 93 2–8


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A

Extruded heatsinks for lock-in retaining spring art. no.

B Rth [K/W] 7 6

50

65,8

75,5 50

5

C

29,5

4 3 2 1

50 57,5

SK 617 ... please indicate:

50

100

150

200 [mm]

D

... 25 37.5 50 75 84 94 100 1000 mm

please note: profile threads ➔ A 5

Screw-in solder pin ELS 3 – – – – – – –

E

screw in solder pin made of brass easy mounting secure hold surface coating suitable for soldering suitable for all heatsinks with M3 profile thread position in the threaded channel as required specific designs upon customer´s request

F

art. no.

12,5

G

0,8

4

1

7,5

M3

ELS 3

Ø6

0,8 Ø 2,3

H

I

K

L

M Mounting parts for heatsinks  Insulating caps  Mounting pads  Lock-in retaining spring for transistors

E 49 – 50 E 51 E 46 A 119 – 121

Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction

   

A A A A

89 91 93 2–8

A 88

N


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A Extruded heatsinks for PCB mounting Heatsinks for printed circuit boards – matching cylindrial screws according to DIN 84 with zinc coated surface – M 3 thread diameter: 2.90 ... 2.94 mm (art. no.: SZ M 3 x 8) – screw-in solder pin M 3 (art. no.: ELS 3)

art. no.

C

M3

4

33

6 5 4 3

M3

SK 68 ...

22 M3

31

Rth [K/W]

M 2,5

D

36,75

M3

17

B

35,6

2

M3

46

50

100

150

200 [mm]

100

150

200 [mm]

46

art. no.

34

33 31

Rth [K/W]

E

6 5

8

4

28

SK 112 ...

F

please indicate:

35,6

3 2

M3 50

... 37.5 50 75 94 100 1000 mm

please note: profile threads ➔ A 5

G

H

I

K

L

M

N

A 89

Lock-in retaining spring for transistors Profiles for PCB components  Vibration dampers  Heatsinks with threaded rail 

A 119 – 121 Miniature distance sleeves A 91 Thermal conductive glue E 41 Thermal conductive paste A 93 Technical introduction

   

E 34 E 23 – 24 E 21 – 22 A2–8


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A

Extruded heatsinks for PCB mounting Heatsinks for printed circuit boards – the heatsinks SK 414, SK 105, SK 44 and SK 415 are especially suitable for printed circuit board heatsinks for 19'' plug in units

art. no.

B

Rth [K/W] 5

15

4

4 3

C

2

99

1 50

SK 414 ... please indicate:

100

150

200 [mm]

...

D

100 233.4 1000 mm

art. no.

Rth [K/W] 5

10

4

4

E

3 2

159

1 50

SK 105 ... please indicate:

100

150

200 [mm]

F

... 37.5 50 75 100 150 200 233.4 1000 mm

art. no.

Rth [K/W] 5

G

4

4

15

3 2

159

1 50

SK 44 ... please indicate:

100

150

200 [mm]

H

... 50 75 100 150 200 233.4 1000 mm

art. no.

Rth [K/W] 5

I

15

4

4 3 2

219

1 50

SK 415 ... please indicate:

100

150

200 [mm]

K

... 37.5 100 150 1000 mm

L

M Lock-in retaining spring for transistors Heatsink profile overview  Heatsinks for PCB  Heatsinks with threaded rail 

A A A A

119 – 121 13 – 17 89 93

Thermal conductive material Profiles for lock-in fixing spring Retaining springs for transistors Technical introduction

   

E 2 – 23 A 84 – 88 A 115 – 117 A2–8

A 90

N


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A Extruded heatsinks for PCB mounting Heatsinks for printed circuit boards

B

– for use on eurocards Rth [K/W] 10

art. no.

8 6 4

C

2 50

SK 125 ...

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

Thermal conductive material Profiles for lock-in fixing spring Retaining springs for transistors Technical introduction

   

E 2 – 23 A 84 – 88 A 115 – 117 A2–8

Rth [K/W] 10

14

10

art. no. 28

D

100

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

6

M3

E

47

4

SK 96 ... please indicate:

8

4 2

M3 55

50

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 ... 50 84 94 1000 mm

F

Rth [K/W]

art. no.

10 8 6 4

G

2

SK 138 ...

50

art. no. Rth [K/W] 7,0

H

5,6 4,2 2,8 1,4

I

50

SK 451 ...

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

art. no. Rth [K/W] 10 8

K

6 4 2 50

L

SK 128 ... please indicate:

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 ... 50 84 94 1000 mm

M please note: profile pressed threads ➔ A 5

N

A 91

Lock-in retaining spring for transistors Heatsink profile overview  Heatsinks for PCB  Heatsinks with threaded rail 

A A A A

119 – 121 13 – 17 89 93


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A

Extruded heatsinks for PCB mounting 30

art. no.

6,5

Rth [K/W] 10

B

6 4

14

8

23

M3

31

8

2

C

M3 4

50

8

SK 609 ...

100

150

200 [mm]

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 55

art. no.

6,5

Rth [K/W] 10

D

14

6

8

23

M3

31

8

4 2

M3 4

50

8

SK 610 ...

100

150

200 [mm]

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

E

50

art. no.

6,5

Rth [K/W] 7,0

F

12,5

4,2

8

23

M3

31

5,6

2,8 1,4

M3 4 8

SK 611 ... please indicate:

50

100

150

200 [mm]

screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

G

... 50 84 94 1000 mm

H

I

K

L

M please note: profile pressed threads ➔ A 5 Lock-in retaining spring for transistors Heatsink profile overview  Heatsinks for PCB  Heatsinks with threaded rail 

A A A A

119 – 121 13 – 17 89 93

Thermal conductive material Profiles for lock-in fixing spring Retaining springs for transistors Technical introduction

   

E 2 – 23 A 84 – 88 A 115 – 117 A2–8

A 92

N


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A Extruded heatsinks for PCB mounting Heatsink for PCB with threaded rail transistor mounting onto the heatsink using a slide-in rail with M 3 thread easy positioning using a grid 6.35mm other rail grids upon request suitable for TO 220, TO 218, TO 247 and similar suitable screws M 3 (art. no.: SZ M 3 x 8) screw-in solder pin M 3 (art. no.: ELS 3) specific versions upon customer´s request 55

2

14

18

28

C

– – – – – – –

6

B

D

6,35 -1

M3 8

E

M3

SK SK SK SK SK SK

517 517 517 517 517 517

47

art. no.

[mm] Rth [K/W]

50 GS 75 GS 84 GS 50 75 84

50 75 84 50 75 84

version

5.0 3.9 3.6 5.0 3.9 3.6

TO 220 TO 220 TO 220 — — —

F

with threaded rail with threaded rail with threaded rail without threaded rail without threaded rail without threaded rail

6

45

30

2

M3

6,35 -1

8

18

G

8

H

I

SK SK SK SK SK SK

518 518 518 518 518 518

art. no.

[mm] Rth [K/W]

50 GS 75 GS 84 GS 50 75 84

50 75 84 50 75 84

4.3 3.3 3.0 4.3 3.3 3.0

M3 17

version TO 220 TO 220 TO 220 — — —

with threaded rail with threaded rail with threaded rail without threaded rail without threaded rail without threaded rail

please note: profile threads ➔ A 5 surface:

black anodised

K

L

M

N

A 93

Profiles for lock-in fixing spring  Assignment table  Thermal conductive material  Lock-in retaining spring for transistors

A 84 – 88 A 18 – 20 E2–5 A 119 – 121

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


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A

Extruded heatsinks for PCB mounting Attachable heatsinks for transistors – – – –

compact heatsink in transistor dimensions for horizontal and vertical transistors can be screwed or glued specific versions upon customer´s request

B SK 515 23,5 S 2 x TO 220

10,7

Ø 2, 8

C

15 8,4

3,1

3,1

3,1

SK 515 37 S 3 x TO 220

Ø 2,8

Ø 2,8

10

3,2

5

SK 515 10 S TO 220

art. no. SK 515 10 S TO 220 SK 515 23,5 S 2 x TO 220 SK 515 37 S 3 x TO 220 SK 515 10 TO 220 SK 515 23,5 TO 220 SK 515 37 TO 220

13,5 23,5

D

version

30.0 27.5 26.1 30.0 27.5 26.1

TO 220 2xTO 220 3xTO 220 — — —

SK 516 15 S TO 218 10

13,5 37

[mm] Rth [K/W] 10.0 23.5 37.0 10.0 23.5 37.0

13,5

5

for screw fastening M2.5 for screw fastening M2.5 for screw fastening M2.5 without screw fastening without screw fastening without screw fastening

SK 516 33 S 2 x TO 218

Ø 3,5

Ø 3,5

F

21 12,45

4,6

4,6

E

art. no. SK 516 15 S TO 218 SK 516 33 S 2 x TO 218 SK 516 15 TO 218

7,5

15

3,5

18 33

[mm] Rth [K/W] 15 33 15

surface:

G

version

28.4 26.9 28.4

TO 218 2xTO 218 —

for screw fastening M3 for screw fastening M3 without screw fastening

black anodised

H

Attachable extruded heatsinks for transistors with thin bottom plate (0.5 mm) SK 515 05 37 S 3

SK 515 05 23,5 S 2 10,7

Ø

Ø 2,8

2,8

3,1

3,1

3,1

Ø 2,8

15 8,4

I

10 3,95

SK 515 05 10 S

art. no. SK SK SK SK SK SK

515 515 515 515 515 515

05 05 05 05 05 05

10 S 23,5 S 2 37 S 3 10 23,5 37

5

13,5 23,5

5

surface:

13,5 37

[mm] Rth [K/W] 10.0 23.5 37.0 10.0 23.5 37.0

13,5

version

30.0 27.5 26.1 30.0 27.5 26.1

TO 220 2xTO 220 3xTO 220 — — —

K

for screw fastening M2.5 for screw fastening M2.5 for screw fastening M2.5 without screw fastening without screw fastening without screw fastening

L

black anodised

M Profiles for lock-in fixing spring  Assignment table  Thermal conductive material  Lock-in retaining spring for transistors

A 84 – 88 A 18 – 20 E2–5 A 119 – 121

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 94

N


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A Extruded heatsinks for PCB mounting Attachable heatsinks for transistors

B

– – – – –

extruded heatsink with intergrated spring locking function simple assembly by pushing the heatsink onto the transistor optimum heat transfer between component and heatsink solderable pin for PCB mounting specific versions upon customer´s request 19,4

30

25

32,5

28

C 4,8

4

Ø 2,1 Ø4

2,7

=

=

5

4,5

1

D

15

2,3

25,4

3,3 13,5

art. no.

E

F

SK SK SK SK SK SK

525 525 525 525 525 525

15 30 15 20 25 30

for transistor

[mm] Rth [K/W]

TO 220 TO 220 TO 220 TO 220 TO 220 TO 220

ST ST ST ST

15 30 15 20 25 30

13.3 7.8 13.3 10.7 9.0 7.8

22

spring force [N]

version

54 100 54 70 85 100

without solder pins without solder pins with 1 solder pin with 1 solder pin with 2 solder pins with 2 solder pins

35

30

G

H

4,5

4,8

1

4,5

Ø 2,1 Ø4 3,3

2,7

2,3

25,4

15

art. no. SK 526 30 ST surface:

for transistor

[mm] Rth [K/W]

TO 247

30

6.3

spring force [N]

version

100

with 2 solder pins

black anodised

I

K

L

M

N

A 95

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting Extruded heatsinks for transistors compact PCB heatsink effective heat dissipation for single and double row transistor mounting profile SK 454 ➔ A 24 profile SK 452 ➔ A 27 specific versions upon customer´s request M 3 bei TO 220

2xM3

M 3 bei SOT 32

16

3 19

1xM3

B

10

21,45

C

10

– – – – –

20

20

20

10

D art. no.

[mm] Rth [K/W]

SK 454 20 1 x M3 ... SK 454 60 3 x M3 ... SK 454 20 2 x M3 ... SK 454 40 4 x M3 ... SK 454 60 6 x M3 ... SK 454 40 2 x M3 TO 220 SK 454 80 4 x M3 TO 220 SK 454 100 5 x M3 TO220 SK 454 80 8 x M3 TO 220 SK 454 100 10xM3 TO220 please indicate:

20 60 20 40 60 40 80 100 80 100

10.8 7.7 10.8 9.4 7.7 9.4 6.5 5.9 6.5 5.9

SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 TO 220 TO 220 TO 220 TO 220 TO 220

E

F

... SOT 32; TO 220

G 19

29

art. no. SK SK SK SK SK SK SK SK SK SK

452 452 452 452 452 452 452 452 452 452

20 1 x M3 40 2 x M3 60 3 x M3 80 4 x M3 100 5 x M3 20 2 x M3 40 4 x M3 60 6 x M3 80 8 x M3 100 10 x M3

M3

2xM3

3,5 25

1xM3

10

20

20

20

10

H

[mm] Rth [K/W] 20 40 60 80 100 20 40 60 80 100

surface:

11.1 7.5 5.9 4.9 4.3 11.1 7.5 5.9 4.9 4.3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P

I

K

L

black anodised

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 96

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting

B

– for semiconductor clip-mounting – special lengths and transistor drillings upon request – P = raised retaining stud, E = mounting method 34,9 16

P 6,5

18,3

C

12,7

1,5

Ø 3,2

25,4

10,8 25,4

… STC

… STIC Ø 2,3 max.

E

F

art. no. SK SK SK SK

104 104 104 104

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

… STCB Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

14 11 9 8

TO 220 TO 220 TO 220 TO 220

... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass

surface:

G

6,5 1,5

D

6 max. 3

4,5 max.

E

black anodised

– for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method Ø 3,2

25,4

10,8 25,4

… STS

K art. no.

L

SK SK SK SK

104 104 104 104

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

M surface:

N

A 97

6,5

6,5 1,5

… STIS Ø 2,3 max.

10,8 25,4

E

6 max. 3

4,5 max.

I

6,5

25,4 18,3 13,5

12,7

1,5

H

25,4 18,3 13,5

Ø 3,2

34,9 16

… STSB Ø6 Ø 2,3 max.

Ø7 M3

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

14 11 9 8

SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – horizontal for semiconductor screw-mounting – special lengths and transistor drillings on request Ø 3,2

Ø 3,2

B

10,8

art. no. SK 104 25,4 LS SK 104 38,1 LS SK 104 50,8 LS

C

9,5

25,4

18,3 13,5

25,4

25,4

18,3 13,5 9,5

12,7

1,5

34,9 15,9

10,8

[mm] Rth [K/W] 25.4 38.1 50.8

14 11 9

surface:

SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P

D

black anodised

E

F

G

H

I

K

L

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 98

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting

B

– for semiconductor clip-mounting – special lengths and transistor drillings on request – P = raised retaining stud, E = mounting method Ø 3,2

25,4

35 17

18,3

P

2,5

6,5

C 25,4

10,8

… STC

… STCB

… STIC Ø 2,3 max.

E

F

art. no. SK SK SK SK

600 600 600 600

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

11.0 9.0 7.3 6.5

TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P

... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass

surface:

G

6,5 1,5

D

6 max. 3

4,5 max.

25,4 E

black anodised

– for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method 35

Ø 3,2

Ø 3,2

2,5

K

L

600 600 600 600

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

M

N

surface:

A 99

25,4

6 max. 3

4,5 max.

Ø 2,3 max.

SK SK SK SK

10,8

E

… STSB

… STIS

… STS art. no.

25,4

10,8

25,4

6,5 1,5

I

18,3

6,5 13,5

25,4

H

6,5 13,5 18,3 25,4

17

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

11.0 9.0 7.3 6.5

TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – for semiconductor clip-mounting – special lengths and transistor drillings on request – P = raised retaining stud, E = mounting method

B Ø2,8

9 6

C

Ø 2,3 max.

art. no. SK SK SK SK

409 409 409 409

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

E

6,5 1,5

… STIC

15 16,5 25,8 35,5

6 max. 3

… STC

4,5 max.

12,7

3

18,3

45 26,2

14

P

… STCB

D Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

8.2 7.0 6.2 5.6

E

TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P

... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass

surface:

F

black anodised

– for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method

G 3,2

SK SK SK SK

409 409 409 409

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

6

12,5

… STSB

E

I

6,5 1,5

6 max. 3

… STIS Ø 2,3 max.

art. no.

H 15 35,5

4,5 max.

… STS

18,3

12,7

3

25,4

45 26,2

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

8.2 7.0 6.2 5.6

K

TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P

L

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass

surface:

black anodised

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 100

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting

B

– for semiconductor clip-mounting – special lengths and transistor drillings on request – E = mounting method

20

Ø5 Ø5

11,7

10,5

3

C

0,72

12,22 8,5

30,8 25,33

11,7 3,1

20

30,3 50

… STC

… STIC

… STCB

Ø 2,3 max.

E

art. no. SK 459 25 ... SK 459 37,5 ... SK 459 50 ... please indicate:

F

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.0 37.5 50.0

7.9 6.3 5.6

TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass

surface:

G

E

6,5 1,5

D

6 max. 3

4,5 max.

30,3

black anodised

– for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method

20

M3

11,7

21,2

3

H

0,72

12,22 8,5

30,8 25,33

11,7 3,1 30,3 50

… STS

… STIS

… STSB

Ø 2,3 max.

K

art. no. SK 459 25 ... SK 459 37,5 ... SK 459 50 ... please indicate:

L surface:

E

6,5 1,5

I

6 max. 3

4,5 max.

30,3

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.0 37.5 50.0

7.9 6.3 5.6

TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised

M

N

A 101

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method

B 30,8 25,33

18

3

0,72

12,22 8,5

20

M3

11,7

11,7 3,1 30,3 50

… STS

… STIS

25.0 37.5 50.0

7.9 6.3 5.6

E

SIP-Multiwatt SIP-Multiwatt SIP-Multiwatt

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass

surface: – – – –

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W]

SK 459 25 M ... SK 459 37,5 M ... SK 459 50 M ... please indicate:

D

… STSB

Ø 2,3 max.

art. no.

E

6,5 1,5

6 max. 3

4,5 max.

30,3

C

F

black anodised

for semiconductor screw-mounting with combination-hole pattern for mounting of 2 x TO 220 or 2 x SOT 32 special lengths and transistor drillings on request E = mounting method

G

30,8 25,33 M3

11,7

18

3

0,72

12,22 8,5

20

M3

11,7 3,1

18,9

30,3 50

Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W]

SK 459 25 2 x TO 220 ... SK 459 37,5 2 x TO 220... SK 459 50 2 x TO 220 ... please indicate:

I

… STSB

… STIS Ø 2,3 max.

art. no.

E

6,5 1,5

6 max. 3

4,5 max.

30,3

… STS

25.0 37.5 50.0

7.9 6.3 5.6

K

2xSOT 32/ 2xTO 220 2xSOT 32/ 2xTO 220 2xSOT 32/ 2xTO 220

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass

surface:

H

L

black anodised

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 102

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting

B

– for semiconductor clip-mounting – special lengths and transistor drillings on request – P = raised retaining stud, E = mounting method 42 17

Ø 2,8

D SK SK SK SK

129 129 129 129

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

F

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

7.8 6.5 5.3 4.5

TO 220 TO 220 TO 220 TO 220

... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass

surface:

G

black anodised

– for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method 42 17

Ø 3,2

25

13,5 18,3 25,4

1,8

Ø 3,2

H

Ø 2,3 max.

SK SK SK SK

129 129 129 129

25,4 38,1 50,8 63,5

... ... ... ...

please indicate:

L surface:

E

6,5 1,5

… STIS

I art. no.

25,4

6 max. 3

4,5 max.

Ø 2,3 max. 25,4

… STS

K

Ø7 M3

Ø6 Ø 2,3 max.

13,5 18,3 25,4

E

… STCB

Ø 2,3 max.

art. no.

E 6,5 1,5

… STIC

10 25,4

6 max. 3

… STC

4,5 max.

C

19,5

8 4

25

1,8

P

… STSB Ø7 M3

Ø6 Ø 2,3 max.

[mm] Rth [K/W] 25.4 38.1 50.8 63.5

7.8 6.5 5.3 4.5

SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P

... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised

M

N

A 103

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting for semiconductor clip-mounting profile SK 185 ➔ A 73 special lengths and drillings on request L = solderable pins

B 10,25

– – – –

C

4

Ø5

21,5 Ø 3,1 max. 34,4

art. no. SK SK SK SK

185 185 185 185

25 STC TO 220 37,5 STC TO 220 50 STC TO 220 50 C TO 220

[mm] Rth [K/W] 25.0 37.5 50.0 50.0

7.9 6.4 4.9 4.9

surface: – – – –

D

version TO 220 TO 220 TO 220 TO 220

with solder pins with solder pins with solder pins without solder pins

E

black anodised

for semiconductor screw-mounting profile SK 185 ➔ A 73 special lengths and drillings on request L = solderable pins

F 3,2

34,4 65

art. no. SK SK SK SK SK SK

185 185 185 185 185 185

25 STS TO 220 37,5 STS TO 220 50 STS TO 220 25 TO 220 37,5 TO 220 50 TO 220

G

4

4,5

18,3

4

2,7

2 18

30

3,1 max. 34,4

L

[mm] Rth [K/W] 25.0 37.5 50.0 25.0 37.5 50.0

surface:

version

7.9 6.4 4.9 7.9 6.4 4.9

TO 220 TO 220 TO 220 TO 220 TO 220 TO 220

with solder pins with solder pins with solder pins without solder pins without solder pins without solder pins

H

I

black anodised

K

L

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 104

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting for semiconductor screw-mounting hole pattern is centered to the total length of the heatsink special lengths and drillings on request *1 = versions with solder pins; *2 = versions without solder pins L = solderable pins

*1

15

18,3

13 5

5

14,75

14

3

=

C

Ø 3,2

*2

Ø 3,2

4 max.

B

– – – – –

=

17,78 32 Ø 1,3

D 75 75 75 75 75 75 75 75 75 75 75

25 STS TO 220 37,5 STS TO 220 50 STS TO 220 25 25 TO 220 37,5 37,5 TO 220 50 50 TO 220 75 1000

25.0 37.5 50.0 25.0 25.0 37.5 37.5 50.0 50.0 75.0 1000.0

version

12.5 10.0 8.5 12.5 12.5 10.0 10.0 8.5 8.5 7.0 —

TO 220/*1 TO 220/*1 TO 220/*1 — TO 220/*2 — TO 220/*2 — TO 220/*2 — —

*1

15

Ø 3,2

*2

Ø 3,2

14,75

13 5

7

20

4

=

G

with solder pins with solder pins with solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins

18,3

F

SK SK SK SK SK SK SK SK SK SK SK

[mm] Rth [K/W]

4 max.

E

art. no.

L

=

17,78 32

Ø 1,3

H art. no.

I

K

L

SK SK SK SK SK SK SK SK SK SK SK

76 76 76 76 76 76 76 76 76 76 76

25 STS TO 220 37,5 STS TO 220 50 STS TO 220 25 25 TO 220 37,5 37,5 TO 220 50 50 TO 220 75 1000

surface:

[mm] Rth [K/W] 25.0 37.5 50.0 25.0 25.0 37.5 37.5 50.0 50.0 75.0 1000.0

L

version

10.0 8.0 7.0 10.0 10.0 8.0 8.0 7.0 7.0 5.9 —

TO 220/*1 TO 220/*1 TO 220/*1 — TO 220/*2 — TO 220/*2 — TO 220/*2 — —

with solder pins with solder pins with solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins

black anodised

M

N

A 105

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – – – –

for semiconductor clip-mounting profile SK 145 ➔ A 73 special lengths and drillings on request L = solderable pins

B 20,5 Ø 4,5

4,5

15

C

Ø 2,8 max. 25,4

art. no.

[mm] Rth [K/W]

SK 145 25 STC

25

13.5

SK 145 30 STC

30

12.4

SK 145 50 STC

50

10.0

surface: – – – –

L

version TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

D

with solder pins with solder pins

E

with solder pins

black anodised

for semiconductor screw-mounting profile SK 145 ➔ A 73 special lengths and drillings on request L = solderable pins

F Ø 3,2 15,5

3

12

18,3

G 4,5

25,4 29

Ø 2,8 max. 25,4

L

art. no.

[mm] Rth [K/W]

SK 145 25 STS TO 220

25.0

13.5

SK 145 37,5 STS TO 220

37.5

12.0

SK 145 50 STS TO 220

50.0

10.0

surface:

version TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

H

with solder pins with solder pins

I

with solder pins

black anodised

K

L

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 106

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting

B

– special lengths and drillings on request – L = solderable pins

SK 126 25 TO 220 SK 126 37,5 TO 220

SK 126 25 STS TO 220 SK 126 37,5 STS TO 220

SK 126 25 2 x M 3 SK 126 37,5 2 x M 3

8 M3 6,35

3

6,35

12,7

C 34,5

D M3

4,5 max.

art. no.

G

H

18,3 8

18,3

18,3

E

F

M3

M3

[mm] Rth [K/W]

SK 126 25 STS TO 220

25.0

8.0

SK 126 37,5 STS TO 220

37.5

6.5

SK 126 25 TO 220

25.0

8.0

SK 126 25 2 x M3

25.0

8.0

SK 126 37,5 TO 220

37.5

6.5

SK 126 37,5 2 x M3

37.5

6.5

25.0 37.5 1000.0

8.0 6.5 —

SK 126 25 SK 126 37,5 SK 126 1000 surface:

M3 Ø 2,3

L

version TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 — — —

with solder pin and thread M3 with solder pin and thread M3 ohne Lötstift, mit M3-Gewinde ohne Lötstift, mit M3-Gewinde ohne Lötstift, mit M3-Gewinde ohne Lötstift, mit M3-Gewinde — — —

black anodised

I

K

L

M

N

A 107

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – special lengths and drillings on request – L = solderable pins

B M3

L

25

13,5

18,3

Ø 1,3

SK 95 25 STS TO 220

SK 95 25 STS SOT 32

D

[mm] Rth [K/W] 38.5 36.0 36.0

SOT 32 SOT 32 TO 220 SK 95 25 1 x M2,5 1 x M3

E

2,6

4,4

M2,5

2,6

1,1

1,3

15 25 25

6,5

art. no.

L

Ø 1,3

SK 95 15 STS SOT 32 S

SK 95 15 STS SOT 32 S SK 95 25 STS SOT 32 SK 95 25 STS TO 220

L

Ø 1,3

C

3,5 max.

6,3 10,6 12,6

3,5 max.

11

M3

3,5 max.

6,5

1,3

3,9

4,4

15

1,1

25

M3

10,6 12,6

M3

M3

M3

SK 95 15 SOT 32 S

art. no. SK SK SK SK SK SK SK SK

95 95 95 95 95 95 95 95

15 SOT 32 S 25 SOT 32 25 TO 220 25 1x M2,5 1x M3 25 2 x M3 15 25 1000

SK 95 25 SOT 32

25

M3

SK 95 25 TO 220

SK 95 25 2 x M3

G

[mm] Rth [K/W] 15 25 25 25 25 15 25 1000

F

7

18,3

18,3

18,3

25

M3

13,5

M3

11

15

M3

25

25

M3

38.5 36.0 36.0 36.0 36.0 38.5 36.0 —

SOT 32 SOT 32 TO 220 1xM2.5/ 1xM3 (TO 220) 2xM3 (TO 220) — — —

surface:

black anodised

type of thread:

not anodised

H

I

K

L

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 108

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting

SK SK SK SK

437 437 437 437

art. no.

[mm] Rth [K/W]

25 30 35 50

25 30 35 50

STC STC STC STC

24 22 18 14

M3

4,5 max.

5

20

16

E 16

F

G

L Ø 2,55

TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 3,5

D

4,5 max.

C

14,5

single solder pin profile SK 437 ➔ A 24 special lengths and drillings on request L = solderable pin

10,5

B

– – – –

SK SK SK SK

437 437 437 437

art. no.

[mm] Rth [K/W]

25 30 35 50

25 30 35 50

STS STS STS STS

surface: – – – –

24 22 18 14

L Ø 2,55

TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

black anodised

double solder pin profile SK 437 ➔ A 24 special lengths and drillings on request L = solderable pin

10,5

4,5 max.

[mm] Rth [K/W]

SK 437 25 STC 2 SK 437 30 STC 2 SK 437 35 STC 2

25 30 35

24 22 18

TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

M

N

M3 4,5 max.

3,5

K 10 16

L

art. no.

A 109

L Ø 1,45

L

[mm] Rth [K/W]

SK 437 25 STS 2 SK 437 30 STS 2 SK 437 35 STS 2 surface:

L

L Ø 1,45

20

art. no.

16

I

14,5

H

25 30 35

24 22 18

TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248

black anodised

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – special versions on customer´s request – L = solderable pin

B

8

18

2,5

1,25

M3

C

3,5 max.

5,9 11,8

L Ø 1,3

SK SK SK SK

470 470 470 470

art. no.

[mm] Rth [K/W]

25 30 35 50

25 30 35 50

STS STS STS STS

29.0 27.2 25.6 23.2

SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220

D

E 18

3,5 max.

3,5

1,75

15,24

M3

6,75 13,5

SK SK SK SK

469 469 469 469

art. no.

[mm] Rth [K/W]

25 30 35 50

25 30 35 50

STS STS STS STS

15.3 14.3 13.0 10.6

surface: – – – – –

F

L Ø 1,3

SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220

G

black anodised

as mounting- and connecting piece for clamp mounting of the transistors triple unit can be seperated solder pin mounting possible special versions on customer´s request

H

20,4

20,4

I

20,4 5,2 11,5

Ø 2,6

20

15

20

15

20

2

K

94

art. no. SK SK SK SK

484 484 484 484

25 37,5 50 75

[mm] Rth [K/W] 25.0 37.5 50.0 75.0

6.0 4.5 3.7 2.8

TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P

L

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 110

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for PCB mounting compact PCB heatsinks especially suitable for vertical PCB mounting in housings, racks etc. easy solder fixing special versions on customer´s request L = solderable pin

17,8

M3

Ø 2,3 max

10

20 M3

M3

Ø 2,3 max

[mm] Rth [K/W] 10.1 8.8 7.5

SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SK 448 40 2 x M 3 L 10

27,95

20

10

10 M3

20 M3

20

10

M3

M3

Ø 2,3 max

12,5

Ø 2,3 max

5,6

5,6

L

6,25

Ø 2,3 max

[mm] Rth [K/W] 11.8 9.8 7.1

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P SK 400 20 1 x M 3 L

SK 400 40 2 x M 3 L 10

20

20

SK 400 60 3 x M 3 L

10

M3

Ø 2,3 max

M3

11.6 8.2 7.2

M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P SK 456 40 2 x M 3 L 10

20

SK 456 60 3 x M 3 L

10

M3

10

20

M3

20

M3

10

M3

5

L

M3

20,3

40

M3

20

20,3

20 40 60

SK 456 20 1 x M 3 L

K

10

3 max

[mm] Rth [K/W]

SK 400 20 1 x M3 L SK 400 40 2 x M3 L SK 400 60 3 x M3 L

20

Ø 2,

4

Ø 2,3 max

10

art. no.

M3

20

L

5

4

H

M3

22,5

33

M3

22,5

10

22,5

20 40 60

4

SK 448 20 1 x M3 L SK 448 40 2 x M3 L SK 448 60 3 x M3 L

20,3

art. no.

M3

20,6

M3

20

SK 448 60 3 x M 3 L

20,6

20 40 60

20,6

SK 454 20 1 x M3 L SK 454 40 2 x M3 L SK 454 60 3 x M3 L

E

I

20

3,9

3,9

Ø 2,3 max

SK 448 20 1 x M 3 L

G

M3

M3

10

10

L

19

F

20

17,8

21,45

M3

9,5

art. no.

10

SK 454 60 3 x M 3 L

3,9

20

C

D

SK 454 40 2 x M 3 L

17,8

SK 454 20 1 x M 3 L

5,6

B

– – – – –

L

art. no.

Ø 2,3 max

Ø 2,3 max

Ø 2,3 max

5

6

5

3,4

[mm] Rth [K/W]

SK 456 20 1 x M3 L SK 456 40 2 x M3 L SK 456 60 3 x M3 L

20 40 60

13.0 10.5 8.5

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P

M

N

A 111

Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for PCB mounting – for semiconductor clip-mounting – special lengths and transistor drillings on request – E = mounting method

18,16

14,54

7,1

4

5,1

20

B

C

34 2,25

18,16 6,5 1,5

6 max. 3

4,5 max.

E

D Ø 2,3 max.

… STC art. no. SK 460 25 ... SK 460 37,5 ... SK 460 50 ... please indicate:

Ø7 M3

Ø6 Ø 2,3 max.

… STIC

… STCB

[mm] Rth [K/W] 25.0 37.5 50.0

9.0 7.9 7.0

E

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248

... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass

surface:

F

black anodised

– for semiconductor screw-mounting – special lengths and transistor drillings on request – E = mounting method

G

21,2

4

5,1

20

M3

18,16

6 max. 3

4,5 max.

34

18,16

H

E

I Ø 2,3 max.

Ø6 Ø 2,3 max.

STS art. no. SK 460 25 STS SK 460 37,5 STS SK 460 50 STIS

STIS

[mm] Rth [K/W] 25.0 37.5 50.0

9.0 7.9 7.0

surface:

K

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248

black anodised

L

M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks

   

A 84 – 88 A 18 – 20 E2–5 C 10 – 16

Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction

   

E 19 E 16 E 21 A2–8

A 112

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Extruded heatsinks for DC/DC converter – special versions on customer´s request

art. no.

7

Rth [K/W]

3,3

8,0

3,5 16,51

B

32,3

6,0 4,0

38,1

C

2,0 0

SK DC 10 60 SA

13,5

16,5

art. no.

16,5

7

D

0

13,5

1

2

3

4

5 6 V [m/s]

1

2

3

4

5 6 V [m/s]

1

2

3

4

5 6 V [m/s]

1

2

3

4

5 6 V [m/s]

1

2

3

4

5 6 V [m/s]

Rth [K/W]

3,3

1,8

8,0

32,3

6

6,0

40

4,0 2,0

E

0 16,5

13,5

SK DC 8 60 SA art. no.

16,5

0

13,5

Rth [K/W]

3,3

7 1,8

8,0 6,0 32,3

6

F 40

4,0 2,0

G

0 16,5

13,5

SK DC 8 1 60 SA art. no.

16,5

0

13,5

Rth [K/W]

3,8

4,0 3,0 53,3

10

H 2

61

2,0 1,0 0

SK DC 4 1 117 SA art. no.

Rth [K/W] 5,0

20

4,0 53,3

K

0

12,8

45,7 3,8

3,5

I

45,7

12,8

62,5

3,0 2,0 1,0 0

13,5 16,5 16,5 13,5

SK DC 6 1 60 SA

L

surface:

0

black anodised

M

N

A 113

Heatsink profile-overview  Drilling pattern for Solid State Relais  Heatsinks for Solid State Relais  Special profiles 

A A A A

13 – 17 12 11 – 12 140

Standard aluminium profiles Extruded heatsinks Profiles for PCB mounting Technical introduction

   

A A A A

135 – 136 22 – 83 89 – 112 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Extruded heatsinks for DC/DC converter – special versions on customer´s request

art. no.

B

Rth [K/W]

3,8

3,5 20

4,0

53,3

3,0

62,5

2,0

C

1,0 0 12,8

45,7

45,7

0

12,8

1

2

3

4

5 6 V [m/s]

SK DC 7 117 SA art. no.

D

R th [K/W]

3,8

3,5 20

4,0

53,3

3,0

62,5

2,0

E

1,0 0 12,8

SK DC 7 1 117 SA

45,7

0

12,8

45,7

art. no.

1

2

3

4

5 6 V [m/s]

Rth [K/W]

F

6,0

Ø 3,2

4,0

30,5

8

3

5,0

50,8

3,0 2,0

G

1,0 0

66 76,2

SK DC 2 1 76 SA

0

art. no.

1

2

3

4

5 6 V [m/s]

H

4,0 Ø 3,2 3,0

50,8

3,5 20

Rth [K/W]

62,5

2,0 1,0

SK DC 5 59 SA

I

0

48,3 59

0

art. no.

1

2

3

4

5 6 V [m/s]

Ø 3,2

K

3,0 50,8

3,5 20

Rth [K/W] 4,0

62,5

2,0 1,0 0

48,3

SK DC 5 1 59 SA

0

1

2

59

surface:

3

4

5 6 V [m/s]

L

black anodised

M Heatsink profile-overview  Drilling pattern for Solid State Relais  Heatsinks for Solid State Relais  Special profiles 

A A A A

13 – 17 12 11 – 12 140

Standard aluminium profiles Extruded heatsinks Profiles for PCB mounting Technical introduction

   

A A A A

135 – 136 22 – 83 89 – 112 2–8

A 114

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

4

THF 129 TO 220

4

13,2

7,8

SK 409

1.5-3.0

stainless steel 5 4,6

16,5

2-3

stainless steel 5

SK 409

16,5

THF 409 220 2

K THF 249

4,5

5,5

14,1 9

stainless steel

5,5

6,9

16,1

4,3

stainless steel

3,9

4,5

3,5 3

SK 409/ SK 459

2-3

16,5 1,5

1,8

16,9

3,6

stainless steel Ø5

21,6

SK 145/ SK 185/ SK 437

4

20 3

stainless steel Ø5

21,5

18 3

FK 249

1.0-1.5

spring steel, corrosion protected

16,4

3

SK 600

2.5

spring steel, corrosion protected

15

3,7

14,4

TO 218/ TO 220/ TO 247/ TO 3 P

3,5

17,4

12

THF 600

29,5 3,5 5

8,8

1.0-1.5

7,54 37,1

M

N

A 115

3,5

32,9

31,3

UK 35

29,5

3,2

I

4

3,5 5

30,4

11

THF 409 220 1

SK 460

2,2

stainless steel

9,2

H

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 220

2

12,3

THF 220 17

SK 484

15,5 11,3

G

TO 220/ TO 247/ TO 248/ TO 3 P

11,5 1,5

3,1

12,1

6,3

THF 247

3,9

spring steel, corrosion protected

7,15

1-2

4,6

FK 219/ FK 222

3

4,5

TO 220

4,25

4,25

4,6

THF 220

4,25

4,25

3

18

18,2

THF 247 4

L

4

31,3 38,5

2,45

F

3,1

4,6

E

4

stainless steel

4,5

THF 409 SOT 32

1-2

13,3 9,2

D

SK 104

11,4 7,2

THF 409 TO 220

TO 220/ TO 247/ TO 248/ TO 3 P TO 220/ TO 247/ TO 248/ TO 3 P TO 126/ SOT 32/ SOT 82

7,5

C

THF 104

10

4

B

for transistor- suitable for plate thickmaterial housing heatsinks ness [mm] TO 220 FK 219/ 1-2 spring steel, FK 222/ corrosion protecSK 129 ted

6,6

art. no.

13,8 11,3

Retaining springs for transistors

Mica wafers Kapton insulator washers Heatsinks for PCB Profiles for lock-in fixing spring

   

E 19 E 16 A 89 – 112 A 84 – 88

Thermal conductive material Insulating caps Thermal conductive paste Technical introduction

   

E2–5 E 51 E 21 A2–8

3


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Retaining springs for transistors universal retaining spring for transistor housings types TO 218, TO 220, TO 247, TO 264, SOT 32 and various SIP Multiwatt etc. utility patent 200 14 739.0 fast and easy mounting of the transistors number of retaining spring elements can be chosen (n = max. 10) THFMG with thread M 4 specific versions and modifications on customer´s request

material stainless steel 10,4

D 15

60 ±5

stainless steel

11 14

10,4

3,25

11 14

for transistor- spring housing force [N] TO 220 79

stainless steel

6,5

stainless steel

12 0,6

16,5 22,5 29,7

4,2

H

18

119

5,9

TO 218/ TO 247

F

G

4,2

3,4

THFK 247

3,5

material

5,1

THFK 220

E

... number of retaining-spring elements 1 - 10

0,6

art. no.

6,5

n (max. 172,5 mm) 25 17,5 M4 7,5

15

please indicate:

3,5

8

TO 218/ TO 220/ TO 247/ TO 264/ SOT 32/ SIP Multiwatt

30

THFMG ...

C

n (max. 172,5 mm) 25 17,5 n x Ø 3,2 7,5

3,25

THFM ...

for transistor- spring housing force [N] TO 218/ 60 ±5 TO 220/ TO 247/ TO 264/ SOT 32/ SIP Multiwatt

B

8

art. no.

30

– – – – – –

3,4

15,5 23,5 30,55

I

K

L

M Mica wafers Kapton insulator washers Heatsinks for PCB Profiles for lock-in fixing spring

   

E 19 E 16 A 89 – 112 A 84 – 88

Thermal conductive material Insulating caps Thermal conductive paste Technical introduction

   

E2–5 E 51 E 21 A2–8

A 116

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Retaining springs for transistors able to slide on the transistor and mounting plate easy mounting high pressure force and firm grip specific versions upon customer´s request

art. no.

C

THFA 1

for transistor- plate thick- holdhousing ness [mm] ing force [N] TO 220 2 20

material

stainless steel

10,2

10,7

22,1

B

– – – –

0,6

D 2,5 7,9

THFA 2

TO 220

6.5

20

spring steel, corrosion protected

10

13,2

0,5

26,5

E

F 6,3 13,1

THFA 3

TO 220

5.5

33

G

spring steel, corrosion protected

10

12,2

17,7

0,6

4 8,5

H THFA 4

TO 218/ TO 247

6.5

59

spring steel, corrosion protected

0,5

26,5

I

15

13,2

6,3 13,1

K

L

M

N

A 117

Mica wafers  Lock-in retaining spring for transistors Heatsinks for PCB  Mounting material for semiconduct. 

E 19 A 119 – 121 A 89 – 91 E 44 – 48

Thermal conductive material Mounting parts for heatsinks Thermal conductive paste Technical introduction

   

E2–5 E 49 – 50 E 21 – 22 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Retaining springs for transistors – universal lock-in retaining spring for types TO 218, TO 220, TO 247, TO 264 and various SIP-Multiwatt etc. transistor housings – clip fastening also for power transistors without holes, MAX types etc. – easy assembly and secure hold when using a special groove geometry in heatsinks, housing parts etc. – optimal heat transfer between component and cooling element – various spring clip shapes available for fastening the components (see sketch) – the range of suitable heat sinks is continuously extended – versions specifically designed to meet customers requirements on request

B

C

Installation THFU 1

D

A

– insert the lock-in retaining spring for transistors THFU 1 (A) into the groove of the profile – push transistor (B) below the springinu

E

B

F THFU 2, THFU 3, THFU 4, THFU 5, THFU 6, THFU 7

G

A

– place transistor (B) onto the mounting area – press the lock-in retaining spring for transistors THFU 2 - 7 (A) into the groove of the profile (a suitable installation aid will facilitate pressing in)

H

B

I

K – Once in place, the spring will keep its position and fix the transistor with a high contact pressure on the installation surface (the spring remains in its position and it can neither be moved in a lengthwise direction nor fall it can out of the groove in a cross direction).

material:

stainless steel

material thickness:

0.8 mm

Mica wafers  Lock-in retaining spring for transistors Heatsinks for PCB  Mounting material for semiconduct. 

E 19 A 119 – 121 A 89 – 91 E 44 – 48

L

M Thermal conductive material Mounting parts for heatsinks Thermal conductive paste Technical introduction

   

E2–5 E 49 – 50 E 21 – 22 A2–8

A 118

N


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A Lock-in retaining spring for transistors

THFU 1

C

D

E

F THFU 2

G

H

I

K

10,3 17,2 14

B

for transistor- suitable for spring materihousing heatsinks force [N] al ±5 TO 218/ SK 480/ stain60 TO 220/ SK 481/ less TO 247/ SK 482/ steel TO 262/ SK 483/ TO 3 P/ SK 487/ SOT 199/ SK 489/ SOT 429 SK 490/ SK 492/ SK 495/ SK 499/ SK 512/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K TO 218/ SK 480/ stain60 ±5 TO 220/ SK 481/ less TO 247/ SK 482/ steel TO 262/ SK 483/ TO 3 P/ SK 487/ SOT 199/ SK 489/ SOT 429 SK 490/ SK 492/ SK 495/ SK 499/ SK 512/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K

0,8 2,9

10

10,5 17,7 14,4

art. no.

0,8 2,5

10

L

M

N

A 119

Heatsinks for PCB Heatsink profile-overview Assignment table Profiles for lock-in fixing spring

   

A A A A

89 13 18 84

– – – –

93 17 20 88

Mounting parts for heatsinks Profiles for PCB mounting Thermal conductive material Technical introduction

   

E 49 – 50 A 89 – 112 E 2 – 24 A2–8


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A

Lock-in retaining spring for transistors

THFU 4

THFU 5

B

C

20,5 17

10,4

D

0,8

2,8

10

E

F

G

10,4 23,6 19,7

THFU 3

for transistor- suitable for spring materihousing heatsinks force [N] al ±5 TO 218/ SK 480/ stain50 TO 220/ SK 481/ less TO 247/ SK 482/ steel TO 262/ SK 483/ TO 3 P/ SK 487/ SOT 199/ SK 489/ SOT 429 SK 490/ SK 492/ SK 495/ SK 499/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K TO 218/ SK 480/ stain32 ±5 TO 202/ SK 481/ less TO 220/ SK 482/ steel TO 248/ SK 483/ TO 262/ SK 487/ TO 264/ SK 489/ TO 3 P/ SK 490/ SOT 199 SK 495/ SK 499/ SK 514/ SK 575/ SK 589/ SK 593/ SK 617/ LAM 5 K/ LA 27 K TO 218/ SK 490/ stain25 ±5 TO 202/ SK 589/ less TO 220/ SK 617/ steel TO 247/ LAM 5 K/ TO 248/ LA 27 K TO 262/ TO 264/ TO 3 P/ SOT 199/ SOT 429

0,8

1

10

H

I 10,4

27,8 23,7

art. no.

K

0,8

1,4

10

L

M Heatsinks for PCB Heatsink profile-overview Assignment table Profiles for lock-in fixing spring

   

A A A A

89 13 18 84

– – – –

93 17 20 88

Mounting parts for heatsinks Profiles for PCB mounting Thermal conductive material Technical introduction

   

E 49 – 50 A 89 – 112 E 2 – 24 A2–8

A 120

N


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A Lock-in retaining spring for transistors – THFU for transistors with low component height

THFU 6

C

D

E

F THFU 7

G

H

for transistor- suitable for spring materihousing heatsinks force [N] al TO 126/ SK 480/ stain65 ±5 TO 218/ SK 481/ less TO 220/ SK 482/ steel TO 225/ SK 483/ TO 247/ SK 487/ TO 248/ SK 489/ TO 251/ SK 490/ TO 3 P/ SK 492/ SOT 32 SK 495/ SK 499/ SK 512/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K eSIP SK 480/ stain46 ±5 SK 482/ less SK 483/ steel SK 487/ SK 490/ SK 492/ SK 495/ SK 573/ SK 574/ SK 576/ LAM 3 K

10,5

17,5 14,7

art. no.

0,8

1,5

10

10,4

20,25 16,9

B

0,8

3,6

10

I

K

L

M

N

A 121

Heatsinks for PCB Heatsink profile-overview Assignment table Profiles for lock-in fixing spring

   

A A A A

89 13 18 84

– – – –

93 17 20 88

Mounting parts for heatsinks Profiles for PCB mounting Thermal conductive material Technical introduction

   

E 49 – 50 A 89 – 112 E 2 – 24 A2–8


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A U-Extruded heatsinks

Rth [K/W]

art. no.

25

9

B

20 15

15

1,5

10 5

C

12

SK 12 ...

25

please indicate:

50

100 [mm]

75

... 1000 mm

art. no.

D

Rth [K/W] 25

14

20 15

13

1,5

10

E

5

17 25

50

75

100 [mm]

100

150

200 [mm]

SK 13 ... please indicate:

...

F

25 35 mm 12

art. no.

Rth [K/W] 10 8

40

4

G

6 4 2

SK 115 ... 37.5 50 1000 mm

UK 14 SA 220

I

M 2,5 Ø 1,8

Ø 3,2

4

Ø 1,8

UK 14 SA M3

4

M3

Ø 1,8

4

5

5

1,5

UK 14 SA 220 3,2

15

5

H

50

...

please indicate:

5 12,5 20 25

14

5 12,5 20 25

K art. no.

L

Rth [K/W]

UK 14 SA 220 UK 14 SA 220 3,2 UK 14 SA M3 surface:

5 12,5 20 25

20 20 20

TO 220 TO 220 TO 220

black anodised

M

N

A 123

Profiles for PCB components Heatsink profile-overview Heatsinks for PCB Hole pattern

   

A A A A

91 13 – 17 89 – 91 21

Profiles for PCB mounting Extruded heatsinks Retaining springs for transistors Technical introduction

   

A A A A

89 – 112 22 – 83 115 – 117 2–8


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A

U-Extruded heatsinks 3 x Ø 3,2

B

15

9,5

1,2

4

1,2

14,8

18,5

35

27,5

C art. no.

Rth [K/W]

ICK 35 SA

15

TO 220 SK 12 SA 32 M 2,5

SK 12 SA 2 x 32 M 2,5

4,5

D

3

15

4

8

1,5

10

10 20

20 25

12

45 50

E

Rth [K/W]

SK 12 SA 32 SK 12 SA 2 x 32

30 15

1xSOT 32 2xSOT 32

SK 13 35 SA 220 M3

Ø 3,2

5

17

Ø 3,5

F

5

8

10,1 24,85 35

10,1 24,85 35

10,1 24,85 35

G

Rth [K/W]

SK 13 35 SA 220 SK 13 35 SA 220 3,2 SK 13 35 SA 220 3,5

17 17 17

TO 220 TO 220 TO 220 SK 431 1

SK 431 2

H

SK 431 3 Ø 3,2

Ø 3,8

3,2

art. no.

SK 13 35 SA 220 3,5

5

8

13

1,5

SK 13 35 SA 220 3,2

8

art. no.

35

12

11

11

12

11

9 11

12

2

5,5 8 21 25

16

art. no.

2,5

8 17

25

25

I

17

Rth [K/W]

SK 431 1 SK 431 2 SK 431 3

18 18 18

surface:

TO 220 TO 220 TO 220

K

black anodised

L

M Profiles for PCB components Heatsink profile-overview Heatsinks for PCB Hole pattern

   

A A A A

91 13 – 17 89 – 91 21

Profiles for PCB mounting Extruded heatsinks Retaining springs for transistors Technical introduction

   

A A A A

89 – 112 22 – 83 115 – 117 2–8

A 124

N


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A Die-cast heatsinks Setup heatsinks and angle for TO 3

12,7

27

4,2

B

C

Ø 22 Ø 24

art. no.

30,2 40

[mm]

AKK 127

Rth [K/W]

27

14

8,6

E art. no. AKK 191

F

27

0,8 3,5

19,1

4,2

D

Ø 22 Ø 24

30,2 40

[mm]

Rth [K/W]

27

12

surface:

black lacquered

material:

die-casting aluminium

,9 10

H

art. no.

5

41

4,5

[mm]

WP 4030 100 ... WP 4030 100 3 ... please indicate:

°

7

13

30

G

33 ,5

Ø 4,2

Ø 4,2

11

40 ,2 30 17

9

41

5,56

Rth [K/W]

100 100

3.7 3.7

— TO 3

... surface SA = black anodised AL = raw degreased aluminium

I socket: TF 3 2 ➔ E 50

K

L

M

N

A 125

Mounting for TO 3 angle Order example Standard aluminium profiles Heatsinks for PCB

   

A A A A

125 21 135 – 136 89 – 112

Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction

   

A A A A

113 – 114 84 – 88 13 – 17 2–8


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A

Die-cast heatsinks Die-cast acc. to german standard DIN 41882 – other lengths and drillings on request

B

art. no.

C

30

°

M6

4,5 59,5 60,5

71

40

2,8 K/W

M6 20,1 82

K 3 ... please indicate:

D

for mounting use insulator: art. no.: IS 53 ... semiconductor retaining thread M 6, M 8, M 10, M 12, 1/4"-28 UNF

art. no. 2,8 K/W

30

°

M6

4,5 59,5 60,5

71

40

E

F

M6 20,1 82

G

... semiconductor retaining thread M 6, M 8

art. no.

5 K/W

4

30 °

35 M5

M6

20,1 61

... semiconductor retaining thread M 5, M 6, M 8, 1/4"-28 UNF 55

art. no.

9 K/W

K 3

30

20

M4

°

please indicate:

I

for mounting use insulator: art. no.: IS 53

41,5

K 5 ...

44

H

33,5

please indicate:

Cathode lug insulator with an additional insulated connection (M 3). for mounting use insulator: art. no.: IS 53

53,5

K 3 T ...

M4 14 55

K 9 ... please indicate:

M4

L

... semiconductor retaining thread M 4, M 5

surface:

black lacquered

M Mounting for TO 3 angle Special profiles Standard aluminium profiles Heatsinks for PCB

   

A A A A

125 21 135 – 136 89 – 112

Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction

   

A A A A

113 – 114 84 – 88 13 – 17 2–8

A 126

N


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A Die-cast heatsinks Die-cast acc. to german standard DIN 41882

B

– other lengths and drillings on request

art. no.

53

M4

please indicate:

D

3 M4

14 37

K 15 ...

27,5

C

34,5 30 °

20

15 K/W

... semiconductor retaining thread M 4, M 5

surface:

black lacquered

Mounting parts for heatsinks art. no.

16,3

9,7

E

13,3

Ø 25,5

50

37

31

27

Ø 6,5

F

Ø 25,5

G

IS 53

H

I

K

L

M

N

A 127

Mounting for TO 3 angle Special profiles Standard aluminium profiles Heatsinks for PCB

   

A A A A

125 21 135 – 136 89 – 112

Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction

   

A A A A

113 – 114 84 – 88 13 – 17 2–8


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A

Die-cast heatsinks – – – – – –

completely milled mounting surface for semiconductors with square bottom plates the mounting surface can be equipped with threads for fastening semiconductors with screwed glands (semiconductor thread tapping) threads from M 4 to M 32 x 1.5 or 4 x threads for semiconductors with clamping plate mounting are available strap fastening thread M 8 delivery without anode strap other lengths and drillings on request

B

50

135

0,55 K/W

C

50

39

5xM8

Ø 61

36 36 100

art. no.

[mm]

K 0,55 ...

Rth [K/W]

120

please indicate:

D

0.55

... semiconductor retaining thread M 12, M 24 x 1,5

E 94 100

75 90

3xM8

1,1 K/W

Ø 42

F

25 50 68

art. no.

[mm]

K 1,1 ...

Rth [K/W]

90

please indicate:

1.1

G

... semiconductor retaining thread M 8, M 12, M 16 x 1,5

surface:

black lacquered

Accessories

H

– anode end strap made of tin-plated cathode copper

FL 0,55

Ø 52

FL 1,1

Ø 42 Ø 8,5 2

1,5

Ø 9,4

86

I

65

art. no.

art. no.

FL 0,55

FL 1,1 WL 1,1

Ø 13,5 Ø 42

K

Ø 11,4 1,5

Ø 8,5

2

80 95

Ø 9,5

45 55

WL 0,55 Ø 52

80

L

90

art. no.

art. no.

WL 0,55

WL 1,1

M Mounting for TO 3 angle Special profiles Standard aluminium profiles Heatsinks for PCB

   

A A A A

125 21 135 – 136 89 – 112

Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction

   

A A A A

113 – 114 84 – 88 13 – 17 2–8

A 128

N


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A Standard fin coolers for thermoelectrical elements

B

C

D

E

F

G

– – – – – – – – – – – –

fin coolers in special design especially suitable for thermoelectric elements (Peltier-elements) and similar power modules compact design with reduced volume large surface, therefore more efficient than extruded profiles particularly low heat resistance with forced air cooling ideally fitted fins from a heat engineer´s point of view accurately flat milled surfaces very low roughness machining for module mounting according to drawing heat bridges (spacing bridges) on request lapped surface on request customer specific special design 32 x 3 = 96 mm

H

Rth [K/W]

8

0,8

I

0,05 100

Rz10

2

100

art. no.

K

KTE 1

Rth [K/W]

0,9 0,8

0,9 0,8

0,7 0,6 0,5 0,4 0,3 0,2 0,1 0

0,7 0,6 0,5 0,4 0,3 0,2 0,1 0

0

1

2

3

4

5

6 V [m/s]

KTE 1

[mm] 58

material:

aluminium, construction with copper on request

0

1

art. no. KTE 2

KTE 2

2

3

4

5

6 V [m/s]

[mm] 46

L

M

N

A 129

Fluid coolers Standard aluminium profiles High capacity cooling aggregat. Heatsink profile-overview

   

A 131 – 133 A 135 – 136 D 26 – 29 A 13 – 17

Drilling pattern for Solid State Special heatsink design Special profiles Technical introduction

   

A A A A

12 137 – 138 140 2–8


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A

Fin coolers KTE/KTED custom design KTE

B

C

B

D

E

≤ Rz10

C

0,05 100

A

possible dimensions:

F

dimensions [mm]

D

A

B

C

D

E

F

max. 400

max. 30

max. 150

0.8 / 1 / 1.5 / 2

min. 2

max. 400

E

F

please indicate with your order:

dimensions [mm] A

B

C

D

E

aluminium, construction with copper upon request

material:

F

≤ 0,2 100 B1

≤ Rz10

C

G

–­ fin coolers in special design – for forced convection, thus particularly low thermal resistance – two opposite bottom plates as mounting surfaces for power modules and similar – mounting surfaces precisely flat milled – compact design with reduced volume – ideally fitted fins from a heat engineering point of view – lapped finish on request – additional machining according to customer’s requirements – fan versions on request – special constructions to customer’s indications

B

KTED D

E

ʺ 0,2 100

H

F

≤ Rz10 A

I

possible dimensions:

dimensions [mm A

B

B1

C

D

E

F

max. 400

max. 30

max. 30

max. 150

0.8 / 1 / 1.5 / 2

min. 2

max. 400

please indicate with your order:

L

dimensions [mm] A

B

B1

C

D

E

F

max. 400

max. 30

max. 30

max. 150

0.8 / 1 / 1.5 / 2

min. 2

max. 400

material:

Fluid coolers Standard aluminium profiles High capacity cooling aggregat. Heatsink profile-overview

M

aluminium, construction with copper upon request

   

A 131 – 133 A 135 – 136 D 26 – 29 A 13 – 17

K

Drilling pattern for Solid State Special heatsink design Special profiles Technical introduction

   

A A A A

12 137 – 138 140 2–8

A 130

N


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A Fluid coolers for power modules

B

C

˙ w [l/h] V

∆πw [mbar] 900

2600

800

2400

700

2200

U-flow (FLKU 140)

2000

I-flow (FLKI 80)

400 300

1400

200

1200

100 100 200 300 400 500 600 700 800 900 1000

0

FLKU 140

300

500

1600

0

400

600

1800

1000

FLKI 80

500

U-flow (FLKU 140)

1000

˙ [W] Q

I-flow (FLKI 80)

200 100

0

˙ [l/h] Vw

0 ....

100 200 300 400 500 600 700 800 900 1000

24

33

51

42

˙ [l/h] Vw

60

Temperatur [°C]

– water-gycol mixture (60/40); inlet temperature approx. 26 °C

D

E

F

Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable for water pH 6.5-8.5 with anticorrosives, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure for particularly good heat transfer to the fluid; minimised flow pressure losses (see diagram); operating pressure up to 2 bar possible; thick base plate for optimum heat distribution and to secure the heat-emmiting elements; mounting flange for the cooler according to customer's instructions; precisely face milled surface of component mounting area with very good flatness and low roughness depth; dimensionally accurate adjustment to given mounting conditions; connections using hole ports 12 mm in diameter with reinforcing seam to DIN 71550 or installation flange to customers instuctions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base plate: 7 mm To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids. – dimensions and designs using customer's instructions

art. no. 500

68

_1 +

Ø 12 x 1,5

80

G

DIN 71550

_2 +

40

16

8,5

H

11,5

580 ʺ 0,1 100

Rz10

FLKI 80 500

DIN 71550

140

119

+ _ 1,5

I

_2 +

40

FLKU 140 material:

16

8,5

Rz10

540 ʺ 0,1 100

11,5

K

L

Ø 12 x 1,5

art. no.

EN AW 6060 (AlMgSi 0.5)

M

N

A 131

Fin coolers Cooling aggregates with axial fan High capacity cooling aggregat. Heatsink profile-overview

   

A 129 D 13 – 25 D 26 – 29 A 13 – 17

Special heatsink design Special profiles Hole pattern Technical introduction

   

A A A A

137 – 138 140 21 2–8


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A

Fluid coolers for power modules 1 = FLKI 80 G 500 2 = FLKI 80 G 300 3 = FLKI 80 G 200

1 = FLKU 140 G 500 2 = FLKU 140 G 300 3 = FLKU 140 G 200

˙ w [l/h] V

Δπw [mbar]

Δπw [mbar]

500

1000

˙ w [l/h] V

1

500

1000

900

900 400

800 700

3

600 500

800

300

2

C

1

500 200

100 0 ....

100 200 300 400 500 600 700 800

24

33

˙ [l/h] Vw

300 100

200

1

100 0

51

42

3 2

200

400

3 2 1

100

200

300

600

300

0

400

700

400

0

3 2

B

0

100 200 300 400 500 600 700 800

0 ....

˙ [l/h] Vw

Temperatur [°C]

24

33

42

51

Temperatur [°C]

D

– water-gycol mixture (60/40); inlet temperature approx. 26 °C Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable for water pH 6.5-8.5 with anticorrosive, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure for particularly good heat transfer to the fluid; minimised flow pressure losses; operating pressure up to 2 bar possible; thick base plate for optimum heat distribution and to secure the heat-emitting elements; mounting flange for the cooler according to customer's instructions; precisely face milled surface of component mounting area with very good eveness and low roughness depth; for power modules like IGBT-module, Thyristor-module, SCR diode module, bridge amplifiers and others; dimensionally accurate adjustment to given mounting conditions; conncetions with thread muffle 1/8" or mounting flange according to customer's instructions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base plate: 17 mm

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids.

E

F

G

– dimensions and designs using customer's instructions Q [W] Ø 20

2600

20 15

2400 2200

60

80

ʺ 0,1 100

Rz10

2000

FLKI 80 G 500

1800

FLKI 80 G 300

1600

FLKI 80 G 200

H

1400

20

29

20

1200

1/8”

1000

100 200 300 400 500 600 700 800 900 1000

0

˙ [l/h] Vw

art. no. FLKI 80 G 200 FLKI 80 G 300

[mm] 200 300

art. no. FLKI 80 G 500

[mm] 500

I

˙ [W] Q

K

2600

Ø 20

2400

Rz10

140

ʺ 0,1 100

100

15

20

2200

FLKU 140 G 500

2000

FLKU 140 G 300

1800

FLKU 140 G 200

1600 1400

art. no. FLKU 140 G 200 FLKU 140 G 300

[mm] 200 300

material:

Fin coolers Cooling aggregates with axial fan High capacity cooling aggregat. Heatsink profile-overview

20

29

20

1200

1/8”

1000

0

100 200 300 400 500 600 700 800 900 1000

˙ [l/h] Vw

art. no. FLKU 140 G 500

[mm] 500

M

EN AW 6060 (AlMgSi 0.5)

   

A 129 D 13 – 25 D 26 – 29 A 13 – 17

Special heatsink design Special profiles Hole pattern Technical introduction

L

   

A A A A

137 – 138 140 21 2–8

A 132

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Recooling systems for liquid coolers

B

C

D

– – – – – – – –

recooling system for all types of liquid coolers cools up to 2,600 watts thermal power loss consists of pump and recooler pump as normally aspirating, single-stage centrifugal pump with spiral housing in block construction recooler with liquid-conducting tube system with air lamella and electrically driven fan motor further information free of charge under: FLK R1-Info notes: anticorrosive agents are required when water is used as coolant (eg. water/glykol - 60/40) the hose systems used (NOT in scope of delivery) must be resistant to anticorrosive agents (eg. material EPDM according to DIN 73411, ISO 4081)

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids.

art. no. 25 225

56

75

E

120

64

1/8”

82

90

90 106

276

177

F

288

G

3/4”

H FLKR 1

I

thermal cooling capacity:

max. 2.600 W

pump:

single-phase 230 V AC, 120 W

recooler:

single-phase 230 V AC, 120 W/ three-phase 400 V AC, 90 W

type of delivery:

pump and recooler

K

L

M

N

A 133

Fin coolers Cooling aggregates with axial fan High capacity cooling aggregat. Heatsink profile-overview

   

A 129 D 13 – 25 D 26 – 29 A 13 – 17

Special heatsink design Special profiles Hole pattern Technical introduction

   

A A A A

137 – 138 140 21 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Standard aluminium profiles

B

– length, drilling and surface finishes to customer's instructions – other standard profiles on request U-profiles

C

A

D

C

E

A [mm] 20 20 30 20

B [mm] 40 40 20 20

C [mm] 20 20 30 20

D [mm] 2.5 2.0 2.0 1.5

art. no. SU 16 SU 27 SU 29 SU 32

tolerances:

EN 755

material:

EN AW 6060 (AlMgSi 0.5)

A [mm] 30 40 40 30

B [mm] 30 40 40 30

C [mm] 30 40 40 30

D [mm] 2.0 2.5 4.0 3.0

flat profiles B

D

B

art. no. SU 02 SU 03 SU 05 SU 09

A

F

G

H

art. no. SFP 005 SFP 006 SFP 007 SFP 016 SFP 028 SFP 029 SFP 037 SFP 046 SFP 054 SFP 057

A [mm] 40 30 40 70 40 30 55 25 50 115

B [mm] 15 8 5 15 10 10 10 5 10 100

art. no. SFP 058 SFP 060 SFP 067 SFP 074 SFP 076 SFP 079 SFP 090 SFP 100 SFP 106 SFP 112

tolerances:

EN 755

material:

EN AW 6060 (AlMgSi 0.5)

A [mm] 40 80 30 70 60 90 120 100 40 100

B [mm] 8 8 15 10 30 100 15 15 20 25

B

I

C

angled profile

A

K

L

art. no. SWP 02 SWP 06 SWP 10 SWP 15 SWP 23 SWP 25

A [mm] 80 80 30 40 20 50

B [mm] 80 40 20 20 15 30

C [mm] 8 6 2 4 2 5

art. no. SWP 29 SWP 36 SWP 40 SWP 55 SWP 57

tolerances:

EN 755

material:

EN AW 6060 (AlMgSi 0.5)

A [mm] 15 75 40 40 60

B [mm] 10 50 30 40 30

C [mm] 2 5 5 5 5

M

N

A 135

Hole pattern Extruded heatsinks Mounting for TO 3 angle High capacity heatsinks

   

A A A A

21 22 – 83 125 – 126 57 – 58

Construction parts made of aluminium Heatsink as visual & decor-parts  Special profiles  Technical introduction 

A A A A

139 10 140 2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Standard aluminium profiles quadrangular profile

B

B A

art. no. SVP 01 SVP 04 SVP 10

A [mm] 8 25 10

B [mm] 8 25 10

art. no. SVP 12 SVP 13

tolerances:

EN 755

material:

EN AW 6060 (AlMgSi 0.5)

A [mm] 50 55

B [mm] 50 55

C

D C

T-profile

B

A

art. no. STP 4

A [mm] 60

B [mm] 60

C [mm] 6

tolerances:

EN 755

material:

EN AW 6060 (AlMgSi 0.5)

E art. no. STP 5

A [mm] 20

B [mm] 20

C [mm] 2

F

G

H

I

K

L

M Hole pattern Extruded heatsinks Mounting for TO 3 angle High capacity heatsinks

   

A A A A

21 22 – 83 125 – 126 57 – 58

Construction parts made of aluminium Heatsink as visual & decor-parts  Special profiles  Technical introduction 

A A A A

139 10 140 2–8

A 136

N


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CNC treatments of cooling profiles Streamlined omnidirectional fin geometrie Heatsinks with pressed-in fins Precise milled flat surfaces

Customer specified CNC treatments of cooling profiles – latest CNC machining centres for highest quality demands – profile treatments for seizes up to 1600 mm – future orientated stockkeeping of the aluminium profiles in fully automated honeycomb warehouses – batch size optimized production flow – special profiles, modifications and surfaces according to your special demand

Streamlined omnidirectional fin geometrie – free-standing cooling fingers for forced cooling – incident flow of the heatsinks by means of fans from all sides (omnidirectional) – no direction-oriented installation position – fin spacings according to your demand – special designs, treatments and versions according to customer’s request

Extruded heatsinks with pressed-in fins – for highest thermal dissipation losses – channelled fin geometrie for increasing the surface – thermotechnical optimized connection between fin and bottom plate – deliverable in widths of 200 up to 750 mm – customer specific versions and treatments

Precise milled flat surfaces – very small depth of roughness and unevenness – individually milled flat semi-conductor mounting surfaces for minimizing the heat-transmission resistances – millings on the already anodized heatsinks – protective foil avoid scratching of the high-quality mounting surface – special designs according to customer’s drawing


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Surface labelling Additional equipments Heatsinks with integrated sealing 19“ compliant CNC-treatment

Surface labelling – durable and high quality labeling by means of YAG-laser, silk screen-, pad- and digital printing – print layout preparation by means of in-house repro department – precise in contrast, precise engraved fonts and contours by means of CNC-controlled treatment systems – labeling of aluminium, Plexiglas and plastics

Additional equipments – fractional semi-conductor mounting surfaces made of copper for heat dissipation – pressed-in or screwed distance sleeves made of metal and plastics – threaded bolts with internal and external thread – support rail mountings made of metal or plastics according to DIN EN 50022

Heatsinks with integrated sealing – foamed sealing applied on the profile as a permanent element of the heatsink – also usable for front plates or milled parts – groove filled or stacked – permanently elastic and CFC-free – adaption of the sealing properties to the specific application

19“ compliant CNC-treatment – milled heatsink side or back panels for 19” cases, 19” plug in boxes, subracks and insert modules – pressing in or welding of threaded bolts – customer specified modifications, designs – surfaces and printing upon request


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Welded high perfomance heatsinks Welded heatsinks Construction- and milled parts Cases and contour milled parts

Welded high performance heatsinks – optimal fin geometry with channelled structure for free convection – production of heatsink widths outside of the press-technical production possibilities – removing of the welding line by means of precise milled flat surfaces – individual surface design

Welded heatsinks – homogeneous connection of the materials by means of special welding methods – welding on additional mounting levels which are situated diagonally to the pressing direction of the profiles – production of prototypes – application-based special designs and treatments according to your demand

Construction- and milled parts made of aluminium according to customer specifications – precise milled contours and surfaces – inserting of holes and cut-outs, cutting or milling of threads – turning in of wire thread inserts for high- and wear-resistant threads – simple data exchange by means of up to date CAD- / CAM-systems

Cases and contour milled parts made of aluminium – customer specific cases and construction parts – precise mechanical treatments for highest quality demands – all requested surface designs – modifications and versions, special requirements, treatments and designs according to your drawing specification


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Round and pin heatsinks Heatsinks for LEDs Heatsinks for all transistor types Heatsinks and coolers for processors

Round and pin heatsinks – streamlined omnidirectional fin geometrie – excellent thermal conductivity due to special aluminium alloys – suitable for free and forced convection – no direction bounded installation position – flat semiconductor mounting surfaces – contour also as milled parts according to your demands

Heatsinks for LEDs – various heatsink geometries adjusted to all current LED-types and light-engines – star shaped heatsinks for the use as a LED-lamp housing – LED mounting by means of screws, thermal conductive adhesive foil or thermal conductive glue – customer specified versions with application based „thermal management“

Heatsinks for all current PL CC, DIL-IC and SMD transistor types – effective heat dissipation at a low profile and low weight – direct mounting of the component by means of a double-sided adhesive thermal foil or glue – solderable versions of the surface – special packaging such as tape & reel, magazine or tray upon request

Heatsinks and coolers for processors – passive and active product solutions – effective heat dissipation due to optimal conception of fan and heatsink – long lifetime and high operating safety due to high quality fans – versions for screw, glue and clip mounting – customer specific solutions and fans


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for IC processor art. no.

page

Rth [K/W]

ICK PGA 6 x 6 x 14

B 11

20

dissipation loss [W] 6.4

ICK PGA 8 x 8 x 12

B 11

14.8

8.1

ICK PGA 9 x 9

B 11

14

3

ICK PGA 11 x 11 x 8

B 11

16

7.5

ICK PGA 11 x 11

B 11

10.9

4.5

ICK PGA 11 x 11 x 12

B 12

12.3

3.9

ICK PGA 14 x 14

B 12

10

4.9

ICK PGA 14 x 14 x 10

B 12

10.5

11.2

ICK PGA 14 x 14 x 14

B 12

9.6

12.5

ICK PGA 14 x 14 x 12

B 12

9.8

5.3

ICK PGA 15 x 15

B 12

9.4

5.9

ICK PGA 16 x 16 x 8

B 13

14

4.9

ICK PGA 16 x 16 x 10

B 13

10.5

12.9

ICK PGA 16 x 16 x 12

B 13

9.3

6.2

ICK PGA 17 x 17

B 13

8.6

6.9

ICK PGA 17 x 17 x 8

B 13

13.2

5.2

ICK PGA 17 x 17 x 12

B 13

9

6.5

ICK PGA 18 x 18

B 14

8.4

7.2

ICK PGA 19 x 19

B 14

8.6

7.6

ICK PGA 19 x 19 x 12

B 14

9

6.9

ICK PGA 20 x 20 x 10

B 14

8.5

15.1

ICK PGA 20 x 20

B 14

7.6

8.3

ICK PGA 20 x 20 K

B 15

7.6

8.3

ICK PGA 20 x 20 x 8

B 15

12

6.3

ICK PGA 20 x 20 x 12

B 15

8

8.1

– – – –

way of fixation

socket

suitable for processor type

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive fixing clamp

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

K

socket 7/ socket 370

L

universal

IDT W2A/ AMD® K6-III/ AMD® K6-2/ MMX/ IDT C6/ Intel® Pentium® universal

universal

universal

M

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive

very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request

B2

B

C

D

E

F

G

H

I

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for IC processor art. no.

page

Rth [K/W]

ICK PGA 21 x 21

B 15

7

dissipation loss [W] 8.6

ICK PGA 22 x 22

B 15

6.2

8.9

ICK PGA 25 x 25

B 16

5

11.1

ICK BGA 10 x 10

B 17

30

1.8

ICK BGA 10 x 10 x 10

B 17

28.5

1.9

ICK BGA 14 x 14

B 17

30

2.1

ICK BGA 14 x 14 x 10

B 17

27.4

2.3

ICK BGA 21 x 21

B 18

24.3

2.5

ICK BGA 23 x 23

B 18

22.5

2.8

ICK BGA 23 x 23 x 10

B 18

21.5

2.9

ICK BGA 27 x 27

B 18

20

3.1

ICK BGA 27 x 27 x 10

B 18

18.5

3.3

ICK BGA 27 x 27 x 14

B 18

13.5

9.5

ICK BGA 27 x 27 x 22

B 19

10.5

9.5

ICK BGA 31 x 31

B 19

18.6

3.4

ICK BGA 31 x 31 x 10

B 19

17

3.7

ICK BGA 35 x 35

B 19

16.5

3.7

ICK BGA 35 x 35 x 10

B 19

15.7

3.8

ICK BGA 37 x 37 x 6

B 19

15.7

9.5

ICK BGA 37 x 37 x 10

B 20

14

10.5

ICK BGA 40 x 40

B 20

14.6

4.3

ICK BGA 40 x 40 x 10

B 20

13.8

4.4

ICK BGA 42,5 x 45

B 20

13.6

4.2

ICK S 10 x 10 x 6,5

B 21

25

2.5

ICK S 10 x 10 x 10

B 21

23.75

2.6

ICK S 10 x 10 x 12,5

B 21

22.5

2.8

ICK S 10 x 10 x 18,5

B 22

21.75

3

B

C

D

E

F

G

H

I

K

L

M

N

B3

– – – –

way of fixation

socket

suitable for processor type

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for IC processor art. no.

page

Rth [K/W]

ICK S 14 x 14 x 6,5

B 22

9

dissipation loss [W] 5

ICK S 14 x 14 x 10

B 22

8.8

5.1

ICK S 14 x 14 x 12,5

B 22

8.1

5.4

ICK S 14 x 14 x 18,5

B 22

7.9

5.6

ICK S 17 x 17 x 15

B 22

8.36

5.95

ICK S 17 x 17 x 20

B 23

7.89

6.3

ICK S 18 x 18 x 6,5

B 23

7

7.7

ICK S 18 x 18 x 10

B 23

6.8

8

ICK S 22 x 22 x 10

B 23

5.9

8.5

ICK S 22 x 22 x 18,5

B 23

5

10

ICK S 25 x 25 x 6,5

B 23

5.8

12.9

ICK S 25 x 25 x 12,5

B 24

5.3

14.1

ICK S 25 x 25 x 18,5

B 24

5.2

14.4

ICK S 29 x 29 x 10

B 24

5.7

13.1

ICK S 29 x 29 x 20

B 24

3.7

20.2

ICK S 29 x 29 x 30

B 24

2.9

21

ICK S 32 x 32 x 10

B 24

5.4

13.8

ICK S 32 x 32 x 20

B 25

3.7

20.4

ICK S 36 x 36 x 10

B 25

4.7

16

ICK S 36 x 36 x 15

B 25

3.9

19.2

ICK S 36 x 36 x 20

B 25

3.2

22

ICK S 36 x 36 x 30

B 25

2.5

23.4

ICK S 40 x 40 x 10

B 25

4.6

16.3

ICK S 40 x 40 x 20

B 26

3.5

21.4

ICK S 40 x 40 x 25

B 26

3.1

23.7

ICK S 45 x 45 x 10

B 26

4.7

16

ICK S 45 x 45 x 20

B 26

4.4

17

– – – –

way of fixation

socket

suitable for processor type

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request

B4

B

C

D

E

F

G

H

I

K

L

M

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for IC processor art. no.

page

Rth [K/W]

ICK S 50 x 50 x 20

B 26

2.7

dissipation loss [W] 27.7

ICK S 50 x 50 x 25

B 26

2.4

31.2

ICK S 50 x 50 x 40

B 27

6.05

13.5

ICK S 50 x 50 x 50

B 27

4.05

14.32

ICK S 98 x 98 x 30

B 27

2.4

35

ICK S 98 x 98 x 45

B 27

3.5

42

ICK S D 12 x 12 x 7,5

B 28

10.85

4.6

ICK S D 18 x 12 x 7,5

B 28

9

5.4

ICK S D 24 x 18 x 7,5

B 28

8.5

5.85

ICK S D 98 x 98 x 10

B 28

4.88

10.25

ICK S R 28,5 x 6,5

B 29

5.82

15.6

ICK S R 28,5 x 10

B 29

5.65

16

ICK S R 28,5 x 12,5

B 29

5.53

16.3

ICK S R 28,5 x 18,5

B 29

4.25

20.2

ICK S R 32,5 x 10

B 29

5.54

9

ICK S R 32,5 x 20

B 29

5.6

8.9

ICK S R 32,5 x 30

B 30

4.2

11

ICK S R 32,5 x 40

B 30

3.2

15

ICK S R 32,5 x 50

B 30

2.7

18

ICK S R 36,5 x 20

B 30

6.41

18

ICK S R 40 x 10

B 30

11.04

8.4

ICK S R 40 x 20

B 30

10.32

8.8

ICK S R A 40 x 20

B 31

11.62

8.2

ICK S R 40 x 30

B 31

9.77

16

ICK S R 40 x 50

B 31

2

25

ICK S R 45 x 30

B 31

8

9.2

ICK S R 45 x 45

B 31

6

9.2

B

C

D

E

F

G

H

I

K

L

M

N

B5

– – – –

way of fixation

socket

suitable for processor type

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for IC processor art. no.

page

Rth [K/W]

ICK S R 50 x 10

B 31

5.28

dissipation loss [W] 9.5

ICK S R 50 x 20

B 32

8.55

9.8

ICK S R 50 x 30

B 32

8.26

10

ICK S R 50 x 45

B 32

6.32

12.7

ICK S R 54 x 20

B 32

8.11

10.2

ICK S R 54 x 30

B 32

6.95

11.57

ICK S R 54 x 45

B 33

5.37

15.2

ICK S R 70 x 30

B 33

1.8

27

ICK S R 70 x 50

B 33

1.5

33

ICK S R 85 x 30

B 33

2

25

ICK S R 85 x 45

B 33

1.8

27

ICK S R 98 x 30

B 34

1.65

30

ICK S R 98 x 50

B 34

1.4

35

ICK LED R 23,5 x 14

B 35

18.58

6.5

ICK LED R 23,5 x 14 G

B 35

19.16

6.3

ICK LED R 27 x 10

B 35

17.69

6.7

ICK LED R 27 x 10 G

B 35

18.24

6.6

ICK LED R 28 x 15

B 35

15.24

7.8

ICK LED R 28 x 15 G

B 36

15.72

7.6

ICK LED R 29 x 11,5

B 36

17.26

8.2

ICK LED R 29 x 11,5 G

B 36

17.8

8

ICK LED R 32 x 14

B 36

15.23

7.8

ICK LED R 32 x 14 G

B 36

15.23

7.6

ICK LED R 33 x 10

B 36

17.6

6.8

ICK LED R 33 x 10 G

B 36

18.15

6.6

ICK LED R 33 x 16,5

B 37

13.87

8.5

ICK LED R 33 x 16,5 G

B 37

14.3

8.3

– – – –

way of fixation

socket

suitable for processor type

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request

B6

B

C

D

E

F

G

H

I

K

L

M

N


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A Heatsinks for IC processor art. no.

page

Rth [K/W]

ICK LED R 35 x 10

B 37

16.9

dissipation loss [W] 9.35

ICK LED R 35 x 10 G

B 37

17.5

9.2

ICK LED R 36 x 12

B 37

12.88

10

ICK LED R 36 x 12 G

B 37

13.28

8.9

ICK LED R 40 x 10

B 37

12.28

9.45

ICK LED R 40 x 10 G

B 38

12.66

9.3

ICK LED R 40 x 27

B 38

9.41

12.1

ICK LED R 40 x 27 G

B 38

9.71

11.9

ICK LED R 45,7 x 16,5

B 38

10.46

11.05

ICK LED R 45,7 x 16,5 G

B 38

10.49

10.8

ICK LED R 50 x 10

B 38

10.57

10.5

ICK LED R 50 x 10 G

B 39

10.9

10.3

ICK LED R 50,8 x 16,5

B 39

10.17

11.1

ICK LED R 50,8 x 16,5 G

B 39

10.49

10.9

ICK LED R 54 x 20

B 39

9.48

12.1

ICK LED R 54 x 20 G

B 39

9.78

11.9

ICK LED R 66 x 40

B 39

3.2

21

ICK LED R 75 x 10

B 40

5.2

12.1

ICK LED R 84 x 40

B 40

2.5

14.5

ICK LED R 100 x 40

B 40

2

27

ICK LED R 160 x 40

B 40

1.4

42

ICK LED R 200 x 40

B 41

1

51

B

C

D

E

F

G

H

I

K

way of fixation

socket

suitable for processor type

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

universal

L

M

N

B7

– – – –

very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request


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A

Fan coolers for IC processor art. no.

page

Rth [K/W]

LA LED 40 x 30

B 49

1.4

dissipation loss [W] 35

way of fixation

socket

suitable for processor type

universal

universal

universal

universal

universal

universal

14 31.3

therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive screw fastening screw fastening

LA LED 50 x 20

B 49

1.25

40

LA LED 50 x 45

B 49

0.9

50

ICK PPC 51 ICK PEN 3 XE

B 56 B 56

8.1 2

ICK PEN 3 XE 1

B 56

1.8

33.6

screw fastening

Slot 2

ICK EM 25 ICK PEN 38 F

B 56 B 57

3.9 4

20.4 15.1

screw fastening therm. conductive foil

ICK PEN 38 W

B 57

4

15.1

therm. cond. adhesive

socket 7/ socket 370

ICK PEN 45 W

B 57

3.5

21

therm. cond. adhesive

socket 7/ socket 370

ICK PRO 40 W ICK PEN 3 FC

B 57 B 57

2.7 3.5

22 22

therm. cond. adhesive fixing clamp

socket 8 socket 7/ socket 370

B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58

2.3 2.3 1.6 1.6 1.6 1.6 1.5 1.5 1.4 1.4 1.4 1.4

22.2 22.2 35.8 35.8 35.8 35.8 41.7 41.7 46.3 46.3 46.3 46.3

therm. conductive foil therm. conductive foil therm. conductive foil therm. conductive foil therm. cond. adhesive therm. cond. adhesive therm. conductive foil therm. cond. adhesive therm. conductive foil therm. conductive foil therm. cond. adhesive therm. cond. adhesive

universal universal universal universal universal universal universal universal universal universal universal universal

LA LA LA LA LA LA LA LA LA LA LA LA

ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK

15 15 17 17 17 17 18 18 21 21 21 21

x x x x x x x x x x x x

15 15 17 17 17 17 18 18 21 21 21 21

F 05 F 12 F 12 F 12 A W 05 W 12 F 12 W 12 F 05 F 12 W 05 W 12

Slot 2

socket 7/ socket 370

Power PC Intel® Pentium® III-XeonTM Slot II Format ® Intel Pentium® III-XeonTM Slot II Format Q7 Board AMD® K6-III/ IDT W2A/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 Intel® Pentium® PRO Intel® Pentium® III FC PGA (Mendocino, Coppermine) universal universal universal universal universal universal universal universal universal universal universal universal

B

C

D

E

F

G

H

I

K

L

M – – – –

high-quality industrial design compact design with high mechanical stability fan with doubled ball bearing axis optimal thermotechnical design of fan and heatsink

B8

N


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A Fan coolers for IC processor art. no.

page

Rth [K/W]

way of fixation

socket

suitable for processor type

2.5

dissipation loss [W] 23.4

LA ICK PEN 8 F 05

B 59

therm. conductive foil

socket 7/ socket 370

B 59

2.5

23.4

therm. conductive foil

socket 7/ socket 370

LA ICK PEN 8 W 05

B 59

2.5

23.4

therm. cond. adhesive

socket 7/ socket 370

LA ICK PEN 8 W 12

B 59

2.5

23.4

therm. cond. adhesive

socket 7/ socket 370

LA ICK PEN 16 K 12

B 59

1.2

51.1

fixing clamp

socket 7/ socket 370

LA ICK PEN 16 W 12

B 59

1.2

51.1

therm. cond. adhesive

socket 7/ socket 370

LA ICK PEN 16 W 12 A

B 59

1.2

51.1

therm. cond. adhesive

socket 7/ socket 370

AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2

LA ICK PEN 8 F 12

B

C

D

E

F

G

H

I

K

L

M

N

B9

– – – –

high-quality industrial design compact design with high mechanical stability fan with doubled ball bearing axis optimal thermotechnical design of fan and heatsink


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Fan coolers for IC processor art. no.

LA ICK PEN 18 W 12

LA ICK PEN 38 W 12

page

Rth [K/W]

B 59

1.6

B 59

dissipation loss [W] 38.6

1.1

53.6

LA ICK PRO 25 F 12 LA ICK PEN 2 K 12

B 59 B 60

0.97 1.2

60 58

LA ICK PEN 3 XE

B 60

0.8

61.8

LA ICK PEN 4 1 K

B 60

0.6

85

way of fixation

socket

suitable for processor type

AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 therm. cond. adhesive socket 7/ AMD® K6-III/ socket 370 IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 therm. conductive foil socket 8 Intel® Pentium® PRO Slot A/ Intel® Pentium® II/ Slot 1 AMD® Athlon® screw fastening Slot 2 Intel® Pentium® III-XeonTM ® fixing clamp socket 463/ Intel Pentium® IV socket 423

therm. cond. adhesive

B

socket 7/ socket 370

C

D

E

F

G

H

I

K

L

M – – – –

high-quality industrial design compact design with high mechanical stability fan with doubled ball bearing axis optimal thermotechnical design of fan and heatsink

B 10

N


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A Heatsinks for PGA

B

C

D

– double-sided adhesive thermal conductive foil WLF ... ➔ E 7 – surface: black anodised

art. no. 14

Rth

14

12 8

14

2,5

E

4 0

ICK PGA 6 x 6 x 14 WLF ... 14 x 14 Rth 12,3

art. no. 23

23

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

15

[K/W] 12 9 6

2,5

F

3

ICK PGA 8 x 8 x 12 WLF ... 23 x 23

0

Rth

art. no. 12,3

G

20

[K/W] 16

24,2

10 8

3,5

24,2

14

[K/W] 12

6 4

H

2

ICK PGA 9 x 9 WLF ... 24 x 24

0

art. no. 8

Rth 24,76

27,95

12 2,5

I

20

[K/W] 16 8 4 0

ICK PGA 11 x 11 x 8 WLF ... 24 x 27 art. no.

Rth 15,24

K

27,95

10 8

3,5

24,76

14

[K/W] 12

6 4

L

2 0

ICK PGA 11 x 11 WLF ... 24 x 27

M

N

B 11

Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue

   

E 44 – 48 B 52 E 21 – 24 E 23 – 24

Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction

   

B 21 – 27 B 53 – 54 B 11 – 16 A2–8


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A

Heatsinks for PGA art. no. 12,5

Rth

27,95

B

10 8

3,5

24,76

14

[K/W] 12

6 4 2

C

0

ICK PGA 11 x 11 x 12 WLF ... 24 x 27

0

art. no.

31,34

16,51

5

Rth

1

2

3

4

5 6 v [m/s]

14

[K/W] 12

D

10 8

34,5

6 4 2 0

ICK PGA 14 x 14 WLF ... 31 x 34 art. no. 10

Rth

2

3

4

5 6 v [m/s]

E

12

[K/W] 10 8

2,5

35

35

1

0

F

6 4 2 0

ICK PGA 14 x 14 x 10 WLF ... 35 x 35

0

1

2

3

4

5 6 v [m/s]

G

art. no. 14

Rth

12

[K/W] 10 8

35

6

2,5

35

4

H

2 0

ICK PGA 14 x 14 x 14 WLF ... 35 x 35

36

36

1

2

3

4

5 6 v [m/s]

Rth 14 [K/W] 12

I

10

3,5

12,3

art. no.

0

8 6 4 2 0

ICK PGA 14 x 14 x 12 WLF ... 36 x 36 art. no. 16,51

Rth

38,1

1

2

3

4

5 6 v [m/s]

14

[K/W] 12

L

10 8

3,5

37,92

K 0

6 4 2 0

ICK PGA 15 x 15 WLF ... 37 x 37

Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue

   

E 44 – 48 B 52 E 21 – 24 E 23 – 24

Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction

1

0

   

2

B 21 – 27 B 53 – 54 B 11 – 16 A2–8

3

4

5 6 v [m/s]

B 12

M

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for PGA art. no.

Rth 8

B

40

14

[K/W] 12 10

40 3,5

8 6 4 2

C

0

ICK PGA 16 x 16 x 8 WLF ... 40 x 40 art. no. 10

Rth

D

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

12

[K/W] 10 8

40

6

2,5

40

0

4 2 0

E

ICK PGA 16 x 16 x 10 WLF ... 40 x 40 art. no.

Rth

14

[K/W] 12 10 8

40 3,5 12,3

40

F

6 4 2 0

ICK PGA 16 x 16 x 12 WLF ... 40 x 40 art. no. 16,51

G

43,1

Rth 14 [K/W] 12 10

43,1 4

8 6 4

H

2 0

ICK PGA 17 x 17 WLF ... 43 x 43 art. no.

Rth 8

I

10

43,1

8

3

43,1

14

[K/W] 12

6 4 2

K

0

ICK PGA 17 x 17 x 8 WLF ... 43 x 43 art. no.

Rth

14

[K/W] 12

L

3,5 12,3

10 43,6

43,6

8 6 4 2

M

N

0

ICK PGA 17 x 17 x 12 WLF ... 43 x 43

B 13

Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue

   

E 44 – 48 B 52 E 21 – 24 E 23 – 24

Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction

   

B 21 – 27 B 53 – 54 B 11 – 16 A2–8


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A

Heatsinks for PGA art. no. 16,51

Rth

45,7

14

[K/W] 12

B

10 8

4

45,7

6 4 2 0

ICK PGA 18 x 18 WLF ... 45 x 45

1

0

art. no. 16,51

Rth

3

4

5 6 v [m/s]

C

14

[K/W] 12 10

D

8

48,3

6

4

48,3

2

4 2 0

ICK PGA 19 x 19 WLF ... 48 x 48

0

art. no.

Rth

1

2

3

4

5 6 v [m/s]

E

14

[K/W] 12 10 8

3,5 12,3

47,3

47,3

6

F

4 2 0

ICK PGA 19 x 19 x 12 WLF ... 47 x 47

0

art. no. 10

Rth

2

3

4

5 6 v [m/s]

G

14

[K/W] 12 10

50

8

2,5

50

1

6 4

H

2 0

ICK PGA 20 x 20 x 10 WLF ... 48 x 48

0

16,51

art. no. 50,8 4

50,8

Rth

1

2

3

4

5 6 v [m/s]

14

I

[K/W] 12 10 8 6 4 2 0

ICK PGA 20 x 20 WLF ... 50 x 50

1

0

2

3

4

5 6 v [m/s]

K

L

M Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue

   

E 44 – 48 B 52 E 21 – 24 E 23 – 24

Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction

   

B 21 – 27 B 53 – 54 B 11 – 16 A2–8

B 14

N


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A Heatsinks for PGA 16,51

art. no.

B

50,8

Rth 14 [K/W] 12

4

50,8

10 8 6 4

C

2 0 0

2

3

4

5

6

v [m/s]

with fixing clamp for socket 7 and socket 370

art. no. 8

D

ICK PGA 20 x 20 K WLF ... 50 x 50

1

Rth

14

[K/W] 12

50,8 3

50,8

10 8

E

6 4 2 0

ICK PGA 20 x 20 x 8 WLF ... 50 x 50

F

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5

art. no. 14 Rth [K/W] 12

51

10

3,5 12,3

51

8

G

6 4 2 0

ICK PGA 20 x 20 x 12 WLF ... 50 x 50 art. no. 16,5

H

Rth

10

53,3 5

53,3

14

[K/W] 12 8 6

I

4 2 0

ICK PGA 21 x 21 WLF ... 53 x 53 art. no. 20

K

6

v [m/s]

14

[K/W] 12 10

54 4

54

Rth

8 6

L

4 2 0

ICK PGA 22 x 22 WLF ... 54 x 54

0

1

2

3

4

5

6

v [m/s]

M

N

B 15

Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue

   

E 44 – 48 B 52 E 21 – 24 E 23 – 24

Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction

   

B 21 – 27 B 53 – 54 B 11 – 16 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for PGA 20

art. no. Rth

B

14

[K/W] 12 62,5 3,5

62,5

10 8 6 4

C

2 0 0

ICK PGA 25 x 25 WLF ... 62 x 62

1

2

3

4

5

6

v [m/s]

D

E

F

G

H

I

K

L

M Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue

   

E 44 – 48 B 52 E 21 – 24 E 23 – 24

Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction

   

B 21 – 27 B 53 – 54 B 11 – 16 A2–8

B 16

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for BGAs

B

C

D

– – – – –

particularly suited for Ball Grid Arrays heatsink dimensions match the respective BGA-type can be glued directly on the BGA component double-sided adhesive thermal conductive foil WLF ... ➔ E 7 surface: black anodised

art. no. 6

Rth 35 [K/W] 30 25 20 10

10

15

1,8

E

10 5 0

ICK BGA 10 x 10 WLF ... 10 x 10

1

2

3

4

5

6

v [m/s]

art. no. 10

F

0 Rth 30 [K/W] 24 18 10

12

1,8

10

G

6 0

ICK BGA 10 x 10 x 10 WLF ... 10 x 10

0

1

2

3

4

5

6

v [m/s]

art. no.

Rth 35 [K/W] 30 6

H 14

20 15

1,8

14

25

10

I

5 0

ICK BGA 14 x 14 WLF ... 14 x 14

0

2

3

4

5

6

v [m/s]

art. no.

Rth 30 [K/W] 24

14

14

1,8

10

K

L

1

18 12 6 0

ICK BGA 14 x 14 x 10 WLF ... 14 x 14

0

1

2

3

4

5

6

v [m/s]

M

N

B 17

Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste

   

E 44 – 48 B 53 – 55 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Processor overview Technical introduction

   

E 23 – 24 A 21 B 2 – 10 A2–8


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A

Heatsinks for BGAs 6

art. no.

21

B

15 1,8

21

25 Rth [K/W] 20

10 5 0

ICK BGA 21 x 21 WLF ... 21 x 21

0

1

2

3

4

5

6

v [m/s]

6

art. no.

23

25 Rth [K/W] 20 15

1,8

23

C

D

10 5 0

ICK BGA 23 x 23 WLF ... 23 x 23

0

1

2

3

4

5

6

v [m/s]

10

art. no.

23

E

12

1,8

23

24 Rth [K/W] 18

F

6 0

ICK BGA 23 x 23 x 10 WLF ... 23 x 23

0

1

2

3

4

5

6

v [m/s]

6

art. no.

27

G

15 1,8

27

Rth 25 [K/W] 20

10 5 0

ICK BGA 27 x 27 WLF ... 27 x 27

0

1

2

3

4

5

6

H

v [m/s]

10

art. no.

27

I

12 1,8

27

20 Rth [K/W] 16

8 4 0 0

ICK BGA 27 x 27 x 10 WLF ... 27 x 27

1

2

3

4

5

6

v [m/s]

14

art. no.

K

Rth 14 [K/W] 12 10

27

8 2,5

27

L

6 4 2 0

ICK BGA 27 x 27 x 14 WLF ... 27 x 27

Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste

0

   

E 44 – 48 B 53 – 55 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Processor overview Technical introduction

   

1

2

E 23 – 24 A 21 B 2 – 10 A2–8

3

4

5 6 v [m/s]

B 18

M

N


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A Heatsinks for BGAs art. no. 22

B

14 Rth [K/W] 12 10 8

27

6

3,5

27

4

C

2 0

ICK BGA 27 x 27 x 22 WLF ... 27 x 27 6

art. no. 31

31

1

2

3

4

5 6 v [m/s]

0

1

2

3

4

5

20 Rth [K/W] 16 12

1,8

D

0

8 4

E

0

ICK BGA 31 x 31 WLF ... 31 x 31 10

art. no.

31

31

20 Rth [K/W] 16 12

1,8

F

6

v [m/s]

8 4 0

G

0

ICK BGA 31 x 31 x 10 WLF ... 31 x 31

1

2

3

4

5

6

v [m/s]

6

art. no.

H

12

1,8

35

35

20 Rth [K/W] 16

8 4 0

ICK BGA 35 x 35 WLF ... 35 x 35

1

2

3

4

5

6

v [m/s]

art. no. 10

I

0

35

12 1,8

35

20 Rth [K/W] 16

8

K

4 0

ICK BGA 35 x 35 x 10 WLF ... 35 x 35

0

1

2

3

4

5

6

v [m/s]

art. no. 37

37

1,8

6

L

20 Rth [K/W] 16 12 8 4

M

N

0

ICK BGA 37 x 37 x 6 WLF ... 37 x 37

B 19

Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste

0

1

2

3

4

5

6

v [m/s]

   

E 44 – 48 B 53 – 55 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Processor overview Technical introduction

   

E 23 – 24 A 21 B 2 – 10 A2–8


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A

Heatsinks for BGAs art. no. 10

Rth 14 [K/W] 12

37

B

10 8

1,8

37

6 4 2 0

ICK BGA 37 x 37 x 10 WLF ... 37 x 37

0

6

art. no. 40 1,8

40

1

2

3

4

5 6 v [m/s]

C

20 Rth [K/W] 16

D

12 8 4 0

ICK BGA 40 x 40 WLF ... 40 x 40

0

1

2

3

4

5

6

v [m/s]

10

art. no. 40

20 Rth [K/W] 16 12

1,8

40

E

F

8 4 0 0

ICK BGA 40 x 40 x 10 WLF ... 40 x 40

1

2

3

4

5

6

v [m/s]

6

art. no. 45 1,8

42,5

Rth 15 [K/W] 12

G

9 6

H

3 0 0

ICK BGA 42,5 x 45 WLF ... 42,5 x 45

1

2

3

4

5

6

v [m/s]

I

K

L

M Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste

   

E 44 – 48 B 53 – 55 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Processor overview Technical introduction

   

E 23 – 24 A 21 B 2 – 10 A2–8

B 20

N


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A Pin heatsinks

B

C

D

E

F

– – – – – – – – –

arrangement and number of pins for optimum air flow suitable for forced and free convection excellent thermal conductivity by the alloy material (Al99,5; 220 W/mK) and homogeneous arrangement of materials constant heat dissipation in the base and the pins in the direction of heat flow low weight achieved by optimised geometry components fastened using glue, adhesive foil or clamps customer-specific modifications and special designs other pin-lengths and surfaces on request surface: Al-natural

art. no.

G

6,5

2

30 Rth [K/W] 25 20 15

10

10

10

art. no.

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

2

20 15

10

10

I

10 5

ICK S 10 x 10 x 10 WLF ... 10 x 10 weight: 1g 12,5

art. no.

2

K

0

30 Rth [K/W] 25 10

H

5

ICK S 10 x 10 x 6,5 WLF ... 10 x 10 weight: 1g

10

10

30 Rth [K/W] 25 20 15 10

L

5

ICK S 10 x 10 x 12,5 WLF ... 10 x 10 weight: 1.3g

M

N

B 21

Processor overview Mounts SMD-heatsinks Thermally conductive foil

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

E 21 – 22 E 23 – 24 B 35 – 48 A2–8


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A

Pin heatsinks

18,5

art. no.

B

20 15

2 10

30 Rth [K/W] 25

10

10 5

ICK S 10 x 10 x 18,5 WLF ... 10 x 10 weight: 1.3g

0

1

2

3

4 5 v [m/s]

C

6,5

art. no.

D

8

14

6

2

14

12 Rth [K/W] 10

4 2

ICK S 14 x 14 x 6,5 WLF ... 14 x 14 weight: 1.5g

0 0

1

2

3

4 5 v [m/s]

E

10

art. no. 8

14

6

2

14

12 Rth [K/W] 10

F

4 2

ICK S 14 x 14 x 10 WLF ... 14 x 14 weight: 1.9g

0 0

1

2

3

4

5

v [m/s]

12,5

art. no. 8

14

6

2

14

G

12 Rth [K/W] 10

4

H

2

ICK S 14 x 14 x 12,5 WLF ... 14 x 14 weight: 2g

0 0

1

2

3

4

5

v [m/s]

18,5

art. no. 12 Rth [K/W] 10

I

8 6

14 2

14

4 2

ICK S 14 x 14 x 18,5 WLF ... 14 x 14 weight: 2.4g

0 0

1

2

3

4

5

K

v [m/s]

3,5 15

art. no. 12 Rth [K/W] 10

L

8 17,3

17,3

6 4 2

ICK S 17 x 17 x 15 WLF ... 17 x 17 weight: 4.7g

Processor overview Mounts SMD-heatsinks Thermally conductive foil

0 0

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

1

2

E 21 – 22 E 23 – 24 B 35 – 48 A2–8

3

4 5 v [m/s]

B 22

M

N


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A Pin heatsinks art. no. 3,5 20

B

12 Rth [K/W] 10 8 6

17,3

17,3

4 2

C

ICK S 17 x 17 x 20 WLF ... 17 x 17 weight: 5.6g

0 0

1

2

3

4

5

v [m/s]

6,5

art. no.

D

8

18

6

2

18

12 Rth [K/W] 10

4

E

2

ICK S 18 x 18 x 6,5 WLF ... 18 x 18 weight: 2.5g

0 0

1

2

3

4

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

5 v [m/s]

10

art. no.

18

8

18

6

2

F

12 Rth [K/W] 10

4 2

ICK S 18 x 18 x 10 WLF ... 18 x 18 weight: 3.1g art. no. 10

G

0

8

22

6

2

22

12 Rth [K/W] 10

H

4 2

ICK S 22 x 22 x 10 WLF ... 22 x 22 weight: 4g

0

art. no.

6 18,5

I

K

4

2 1

ICK S 22 x 22 x 18,5 WLF ... 22 x 22 weight: 5.4g

25

25

2

6,5

art. no.

L

5

3

22 2

22

Rth [K/W]

Rth [K/W]

6 5 4 3 2

M

N

1

ICK S 25 x 25 x 6,5 WLF ... 25 x 25 weight: 4g

B 23

Processor overview Mounts SMD-heatsinks Thermally conductive foil

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

E 21 – 22 E 23 – 24 B 35 – 48 A2–8


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A

Pin heatsinks 12,5

art. no.

25

6

B

5 4

2

25

Rth [K/W]

3 2 1

ICK S 25 x 25 x 12,5 WLF ... 25 x 25 weight: 6g

0

18,5

art. no.

2

3

4 5 v [m/s]

C

6 5

D

4 3

2

25

25

Rth [K/W]

1

2 1

ICK S 25 x 25 x 18,5 WLF ... 25 x 25 weight: 7g

0

10

art. no.

29

2

3

4 5 v [m/s]

E

6 5 4

3,5

29

Rth [K/W]

1

3

F

2 1

ICK S 29 x 29 x 10 WLF ... 29 x 29 weight: 11g

0

20

art. no.

Rth [K/W]

1

2

3

4 5 v [m/s]

G

6 5 4

29

3 3,5

29

2

H

1

ICK S 29 x 29 x 20 WLF ... 29 x 29 weight: 15g

0

30

art. no.

Rth [K/W]

1

2

3

4 5 v [m/s]

6

I

5 4

29

3 3,5

29

2 1

ICK S 29 x 29 x 30 WLF ... 29 x 29 weight: 15.4g

0

10

art. no.

32,7

2

3

4 5 v [m/s]

K

6 5 4

3,5

32,7

Rth [K/W]

1

L

3 2 1

ICK S 32 x 32 x 10 WLF ... 32 x 32 weight: 14g

Processor overview Mounts SMD-heatsinks Thermally conductive foil

0

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

1

2

E 21 – 22 E 23 – 24 B 35 – 48 A2–8

3

4 5 v [m/s]

B 24

M

N


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A Pin heatsinks art. no.

Rth [K/W] 20

B

C

3 3,5

2 1

ICK S 32 x 32 x 20 WLF ... 32 x 32 weight: 19g 10

art. no. 36,4

36,4

Rth [K/W]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4 5 v [m/s]

0

1

2

3

4

6 5 4

3,5

D

5 4

32,7

32,7

6

3 2

E

1

ICK S 36 x 36 x 10 WLF ... 36 x 36 weight: 17g

15

art. no.

F

5

3 2 1

ICK S 36 x 36 x 15 WLF ... 36 x 36 weight: 20g art. no. 20

G

6

4 3,5

36,4

36,4

Rth [K/W]

Rth [K/W]

6 5 4

H

36,4

3

3,5

36,4

2 1

ICK S 36 x 36 x 20 WLF ... 36 x 36 weight: 24g art. no. 30

I

Rth [K/W]

6 5 4

K

36,4

3

3,5

36,4

2 1

ICK S 36 x 36 x 30 WLF ... 36 x 36 weight: 24.4g

40

40

L

3,5

10

art. no.

Rth [K/W]

6 5 4 3 2

M

N

1

ICK S 40 x 40 x 10 WLF ... 40 x 40 weight: 21g

B 25

Processor overview Mounts SMD-heatsinks Thermally conductive foil

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

5 v [m/s]

E 21 – 22 E 23 – 24 B 35 – 48 A2–8


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A

Pin heatsinks

20

art. no.

Rth [K/W]

6

B

5 4

40

3

3,5

40

2 1

ICK S 40 x 40 x 20 WLF ... 40 x 40 weight: 29g

0

25

art. no.

Rth [K/W]

1

2

3

4 5 v [m/s]

6 5

D

4 40

3

3,5

40

C

2 1

ICK S 40 x 40 x 25 WLF ... 40 x 40 weight: 37g

0

10

art. no. 45

2

3

4 5 v [m/s]

E

6 5 4

3,5

45

Rth [K/W]

1

3

F

2 1

ICK S 45 x 45 x 10 WLF ... 45 x 45 weight: 26g

0

20

art. no.

Rth [K/W]

1

2

3

4 5 v [m/s]

G

6 5 4

45

3

3,5

45

2

H

1

ICK S 45 x 45 x 20 WLF ... 45 x 45 weight: 36g

0

20

art. no.

Rth [K/W]

1

2

3

4 5 v [m/s]

6

I

5

50

50

3,5

4 3 2 1

ICK S 50 x 50 x 20 WLF ... 50 x 50 weight: 43g

0

25

art. no.

Rth [K/W]

1

2

3

4 5 v [m/s]

6 5

L

50

3,5

4 50

K

3 2 1

ICK S 50 x 50 x 25 WLF ... 50 x 50 weight: 49g

Processor overview Mounts SMD-heatsinks Thermally conductive foil

0

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

1

2

E 21 – 22 E 23 – 24 B 35 – 48 A2–8

3

4 5 v [m/s]

B 26

M

N


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A Pin heatsinks art. no. 40

B

5

3,5

3 2 1

ICK S 50 x 50 x 40 WLF ... 50 x 50 weight: 80.05g

0

Rth [K/W]

50

D

1

2

3

4

5

v [m/s]

art. no.

E

6

4 50

50

C

Rth [K/W]

6 5 4

50

3

3,5

50

2 1

ICK S 50 x 50 x 50 WLF ... 50 x 50 weight: 95.51g

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

30

art. no. Rth [K/W]

6 5 4

F

98

3

5

98

2 1 0

G

ICK S 98 x 98 x 30 WLF ... 98 x 98 weight: nullg

5

v [m/s]

45

art. no. Rth [K/W]

6 5

98

98

5

4

H

3 2 1 0

I

0

ICK S 98 x 98 x 45 WLF ... 98 x 98 weight: 301.3g

1

2

3

4

5

v [m/s]

K

L

M

N

B 27

Processor overview Mounts SMD-heatsinks Thermally conductive foil

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

E 21 – 22 E 23 – 24 B 35 – 48 A2–8


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A

Pin heatsinks Dome

B

art. no. 7,5

12 Rth [K/W] 10 8 12

6

2,5

12

4

C

2

ICK S D 12 x 12 x 7,5 WLF ... 12 x 12 weight: 1.8g

0 0

1

2

3

4

5

v [m/s]

art. no. 7,5

12 Rth [K/W] 10 12

6

2,5

18

D

8 4 2

ICK S D 18 x 12 x 7,5 WLF ... 12 x 18 weight: 2.7g

0 0

1

2

3

4

5

E

v [m/s]

art. no. 7,5

12 Rth [K/W] 10 24

8 2,5

18

F

6 4 2 0

ICK S D 24 x 18 x 7,5 WLF ... 18 x 24 weight: 4.4g

0

art. no. 98

2

3

4 5 v [m/s]

G

12 Rth [K/W] 10 5 10

98

1

8 6

H

4 2 0 0

ICK S D 98 x 98 x 10 WLF ... 98 x 98 weight: 154g

1

2

3

4

5 v [m/s]

I

K

L

M Processor overview Mounts SMD-heatsinks Thermally conductive foil

   

B 2 – 10 E 44 – 48 B 53 – 55 E 5 – 15

Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction

   

E 21 – 22 E 23 – 24 B 35 – 48 A2–8

B 28

N


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A Pin heatsinks Round art. no.

Rth [K/W] Ø 28,5

6 5 4

2 6,5

B

3 2

C

ICK S R 28,5 x 6,5 WLF ... D 28,5 weight: 4.41g

1 0

10

art. no.

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

6 5 4

2

D

Ø 28,5

Rth [K/W]

0

3 2

E

1

ICK S R 28,5 x 10 WLF ... D 28,5 weight: 5.16g

0

art. no. Rth [K/W]

F

3 2 1

ICK S R 28,5 x 12,5 WLF ... D 28,5 weight: 5.7g

0

18,5

art. no.

Ø 28,5

Rth [K/W]

6 5 4

2

G

5 4

2 12,5

Ø 28,5

6

3 2

H

1

ICK S R 28,5 x 18,5 WLF ... D 28,5 weight: 6.98g

0

art. no. 10

I

6 5 4

3

Ø 32,5

Rth [K/W]

3 2

K

ICK S R 32,5 x 10 WLF ... D 32 weight: 9.7g

1 0

20

art. no. Rth [K/W]

6 5

Ø 32,5

3

4

L

3 2 1

M

N

ICK S R 32,5 x 20 WLF ... D 32 weight: 13.8g

B 29

Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview

0

   

E 23 – 24 E 21 – 22 B 53 – 55 B2–8

Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction

   

E 44 – 48 E 5 – 15 B 35 – 51 A2–8


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A

Pin heatsinks

30

art. no.

B

6 5 4 3 2

3,5

Ø 32,5

Rth [K/W]

1

ICK S R 32,5 x 30 WLF ... D 32 weight: 20.6g

0 0

1

2

3

4

5 v [m/s]

C

40

art. no. Rth [K/W]

6

D

5 4 3 2

3,5

Ø 32,5

1

ICK S R 32,5 x 40 WLF ... D 32 weight: 24.61g

0 0

1

2

3

4

5 v [m/s]

E

50

art. no. Rth [K/W]

6

F

5 4 3

ICK S R 32,5 x 50 WLF ... D 32 weight: 28.62g

2 1

3,5

Ø 32,5

0 0

20

art. no.

Rth [K/W]

1

2

3

4

5 v [m/s]

7 6 5

Ø 36,5

H

3,5

4 3 2

ICK S R 36,5 x 20 WLF ... D 36,5 weight: 17.59g

1 0

1

2

3

4

5 v [m/s]

I 10

art. no. 12 Rth [K/W] 10 8

3,5

Ø 40

6

K

4 2

ICK S R 40 x 10 WLF ... D 40 weight: 15.85g

0 0

20

art. no.

1

2

3

4

5 v [m/s]

12 Rth [K/W] 10

L

8 3,5

Ø 40

6 4

ICK S R 40 x 20 WLF ... D 40 weight: 21.96g

Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview

G

2 0 0

   

E 23 – 24 E 21 – 22 B 53 – 55 B2–8

Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction

1

   

2

3

E 44 – 48 E 5 – 15 B 35 – 51 A2–8

4

5 v [m/s]

B 30

M

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Pin heatsinks 20

art. no.

B

6 4

ICK S R A 40 x 20 WLF ... D 40 weight: 22.18g

2 0

art. no. 30

C

8 3,5

Ø 40

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

12 Rth [K/W] 10 8 6

3,5

Ø 40

D

12 Rth [K/W] 10

4

ICK S R 40 x 30 WLF ... D 40 weight: 29.24g

2 0

art. no. 50

E

F

8 6

3,5

Ø 40

12 Rth [K/W] 10

4

ICK S R 40 x 50 WLF ... D 40 weight: 47.96g

2 0

30

art. no.

8 6

3,5

Ø 45

G

12 Rth [K/W] 10

4

ICK S R 45 x 30 WLF ... D 45 weight: 37.78g

0 Rth [K/W]

art. no. 45

H

2

8 7 6 5

I

4 3,5

Ø 45

3 2

ICK S R 45 x 45 WLF ... D 45 weight: 50.67g

1 0

Ø 50

K

3

10

art. no.

Rth [K/W]

6 5 4 3 2

ICK S R 50 x 10 WLF ... D 50 weight: 22g

1 0

L

M

N

B 31

Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview

   

E 23 – 24 E 21 – 22 B 53 – 55 B2–8

Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction

   

E 44 – 48 E 5 – 15 B 35 – 51 A2–8


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A

Pin heatsinks Rth [K/W] 20

art. no.

9 8

B

6 5

3,5

Ø 50

4 3

ICK S R 50 x 20 WLF ... D 50 weight: 34.39g

2

C

1 0

30

art. no.

1

2

3

4

5 v [m/s]

9 8 6

D

5 3,5

Ø 50

Rth [K/W]

0

4 3 2

ICK S R 50 x 30 WLF ... D 50 weight: 45.28g

1 0

45

art. no.

Rth [K/W]

0

1

2

3

4

5 v [m/s]

E

8 7 6 5 4

3,5

Ø 50

F

3 2

ICK S R 50 x 45 WLF ... D 50 weight: 61.59g

1 0

art. no. 20

Rth [K/W]

1

2

3

4

5 v [m/s]

G

7 6 5

3,5

Ø 54

0

8

4 3

H

2

ICK S R 54 x 20 WLF ... D 54 weight: 40.94g

1 0 0 30

art. no.

Rth [K/W]

1

2

3

4

5 v [m/s]

8 7

I

6 5 3,5

Ø 54

4 3 2

ICK S R 54 x 30 WLF ... D 54 weight: 54.11g

1 0

0

1

2

3

4

5 v [m/s]

K

L

M Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview

   

E 23 – 24 E 21 – 22 B 53 – 55 B2–8

Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction

   

E 44 – 48 E 5 – 15 B 35 – 51 A2–8

B 32

N


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A Pin heatsinks art. no.

45

B Rth [K/W]

C

3 2 1

ICK S R 54 x 45 WLF ... D 54 weight: 73.86g

0 0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

0

1

2

3

4

5 v [m/s]

art. no. 30

D

5 4

3,5

Ø 54

6

5

Ø 70

Rth [K/W]

6 5 4 3

E

2

ICK S R 70 x 30 WLF ... D 70 weight: 92.8g

1 0

art. no. 50

F

Rth [K/W] 5

Ø 70

6 5 4 3

G

2

ICK S R 70 x 50 WLF ... D 70 weight: 135.56g

1 0

art. no. 30

H

Rth [K/W]

5

Ø 85

6 5 4 3

I

2

ICK S R 85 x 30 WLF ... D 85 weight: nullg

1 0

art. no. 45

K 5

Ø 85

Rth [K/W]

6 5 4

L

3 2

ICK S R 85 x 45 WLF ... D 85 weight: nullg

1 0

M

N

B 33

Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview

   

E 23 – 24 E 21 – 22 B 53 – 55 B2–8

Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction

   

E 44 – 48 E 5 – 15 B 35 – 51 A2–8


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A

Pin heatsinks art. no. 30

B Rth [K/W]

5

Ø 98

6 5 4 3

C

2

ICK S R 98 x 30 WLF ... D 98 weight: nullg

1 0 0

1

2

3

4

5 v [m/s]

art. no. 50

D

5

Ø 98

Rth [K/W]

6 5 4 3

E

2

ICK S R 98 x 50 WLF ... D 98 weight: 194.23g

1 0 0

1

2

3

4

5 v [m/s]

F

G

H

I

K

L

M Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview

   

E 23 – 24 E 21 – 22 B 53 – 55 B2–8

Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction

   

E 44 – 48 E 5 – 15 B 35 – 51 A2–8

B 34

N


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A Heatsinks for LEDs

B

C

D

– – – – – – –

suitable for free or forced convection heat sink dimensions are fitted to the respective LED typ simple mounting by using thermally conductive adhesive foil, glue or screw mounting specific versions on customer´s request double-sided adhesive thermal conductive foil WLF ... ➔ E 7 special design, surfaces and modification to customer specification on request surface: black anodised

E

14

art. no.

F

Rth = 18,58 K/W

2,5

Ø 23,5

ICK LED R 23,5 x 14 WLF ... D 23 14

art. no.

G

12 8

2,5

Ø 23,5

4

ICK LED R 23,5 x 14 G WLF ... D 23

0 0

1

2

3

4

5 6 v [m/s]

3

4

5 6 v [m/s]

art. no. 10

H

Rth = 17,69 K/W

3

Ø 27

ICK LED R 27 x 10 WLF ... D 27 20 Rth [K/W] 16

art. no. 10

I

20 Rth [K/W] 16

12

Ø 27 3

8 4

K

0

ICK LED R 27 x 10 G WLF ... D 27

0

1

2

L

Ø 27,95

3,5 15,24

art. no.

Rth = 15,24 K/W

ICK LED R 28 x 15 WLF ... D 28

M

N

B 35

Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8


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A

Heatsinks for LEDs art. no.

20 Rth [K/W] 16

B

12 3,5 15,24

Ø 27,95

ICK LED R 28 x 15 G WLF ... D 28

8 4 0 0

1

2

3

4

5 6 v [m/s]

3,5

Ø 29

11,5

art. no.

C

Rth = 17,26 K/W

ICK LED R 29 x 11,5 WLF ... D 29

D

art. no.

Rth 20 [K/W] 16

3,5

12 11,5

Ø 29

8

E

4 0

ICK LED R 29 x 11,5 G WLF ... D 29

0

1

2

3

4

5 6 v [m/s]

art. no. 14

F Rth = 15,23 K/W

2,5

Ø 32

ICK LED R 32 x 14 WLF ... D 32

G 14

art. no.

12 8

2,5

Ø 32

Rth 20 [K/W] 16

4

H

0

ICK LED R 32 x 14 G WLF ... D 32

0

1

2

3

4

5 6 v [m/s]

10

art. no. Ø 33

I

3

Rth = 17,6 K/W

ICK LED R 33 x 10 WLF ... D 33 10

art. no.

K

Rth 20 [K/W] 16 12

3

Ø 33

8 4 0

ICK LED R 33 x 10 G WLF ... D 33

0

1

2

3

4

5 6 v [m/s]

L

M Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8

B 36

N


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A Heatsinks for LEDs 16,5

art. no.

Ø 33

C

Rth = 13,87 K/W

3,5

B

ICK LED R 33 x 16,5 WLF ... D 33 16,5

art. no.

D

12 3,5

Ø 33

20 Rth [K/W] 16 8 4 0

ICK LED R 33 x 16,5 G WLF ... D 33

0

1

2

3

4

5 6 v [m/s]

3

4

5 6 v [m/s]

3

4

5 6 v [m/s]

art. no. 10

E ICK LED R 35 x 10 WLF ... D 35 art. no.

10

F

Rth = 16,9 K/W

2,5

Ø 35

12 2,5

Ø 35

20 Rth [K/W] 16 8 4

G

0

ICK LED R 35 x 10 G WLF ... D 35

0

2

12,3

art. no.

1

Ø 36

Rth = 12,88 K/W

3,5

H ICK LED R 36 x 12 WLF ... D 36 art. no.

12,3

I

12 3,5

Ø 36

Rth 20 [K/W] 16 8 4

K

0 0

ICK LED R 36 x 12 G WLF ... D 36

1

2

Ø 40

L

2,5

10

art. no.

Rth = 12,28 K/W

ICK LED R 40 x 10 WLF ... D 40

M

N

B 37

Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8


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A

Heatsinks for LEDs 10

art. no.

B

12 2,5

Ø 40

20 Rth [K/W] 16 8 4 0

ICK LED R 40 x 10 G WLF ... D 40

0

1

2

3

4

5 6 v [m/s]

C

27

art. no.

Rth = 9,41 K/W

5

Ø 40

D

ICK LED R 40 x 27 WLF ... D 40 27

art. no.

Rth 12 [K/W] 10

E

8 Ø 40 5

6 4 2 0

ICK LED R 40 x 27 G WLF ... D 40

0

1

2

3

4

5 6 v [m/s]

F

16,51

art. no.

G

Rth = 10,46 K/W

4

Ø 45,7

ICK LED R 45,7 x 16,5 WLF ... D 45

H 16,51

art. no.

8 6

4

Ø 45,7

Rth 12 [K/W] 10

4

I

2 0

ICK LED R 45,7 x 16,5 G WLF ... D 45

0

1

2

3

4

5 6 v [m/s]

art. no. 10

K

2,5

Ø 50

Rth = 10,57 K/W

L

ICK LED R 50 x 10 WLF ... D 50

M Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8

B 38

N


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A Heatsinks for LEDs art. no. 10

12 Rth [K/W] 10

B

8 2,5

Ø 50

6 4 2

C

0

ICK LED R 50 x 10 G WLF ... D 50

0

1

2

3

4

5 6 v [m/s]

3

4

5 6 v [m/s]

3

4

5 6 v [m/s]

16,51

art. no.

Ø 50,8 4

D

Rth = 10,17 K/W

ICK LED R 50,8 x 16,5 WLF ... D 50

E

16,51

art. no.

Ø 50,8

Rth 12 [K/W] 10

4

8 6 4

F

2 0

ICK LED R 50,8 x 16,5 G WLF ... D 50

0

1

2

art. no.

Ø 54

4

20

G

Rth = 9,48 K/W

H ICK LED R 54 x 20 WLF ... D 54 art. no. 4

20

I Ø 54

Rth 12 [K/W] 10 8 6 4 2

K

0

ICK LED R 54 x 20 G WLF ... D 54

0

1

2

40

art. no.

10

L Ø 66

M

N

Rth = 3,2 K/W

ICK LED R 66 x 40 WLF ... D 66

B 39

Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8


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A

Heatsinks for LEDs 10

art. no.

B

2,5

Ø 75

Rth = 5,2 K/W

C

ICK LED R 75 x 10 WLF ... D 75

40

art. no.

10

D

Ø 84

Rth = 2,5 K/W

E ICK LED R 84 x 40 WLF ... D 84 art. no.

10

40

F

Ø 100

Rth = 2 K/W

G

H

ICK LED R 100 x 40 WLF ... D 100 40

art. no.

I

10

Ø 160

Rth = 1,4 K/W

K ICK LED R 160 x 40 WLF ... D 160

L

M Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8

B 40

N


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A Heatsinks for LEDs art. no.

Ø 200

C

D

10

40

B

Rth = 1 K/W

ICK LED R 200 x 40 WLF ... D 200

E

F

G

H

I

K

L

M

N

B 41

Pin heatsinks Ø Mounts Thermally conductive foil Thermal conductive paste

   

B 29 – 33 E 44 – 48 E 5 – 15 E 21 – 22

Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction

   

E 23 – 24 A 21 A 13 – 17 A2–8


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A

Heatsinks for LEDs – special design, surfaces and modification to customer specification on request – up from a profile length of 25 mm: optional adapter plate LA LED 68 ... ➔ B 50 suitable for LED modules: Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco, Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica Lumaera, Vossloh Schwabe

art. no.

Rth [K/W] 7,5

C

6,0 Ø12

Ø 13,6

B

4,5 3,0 1,5

Ø 20

SK 585 ...

50

art. no.

100

150

200 [mm]

D

Rth [K/W] 7,5 6,0 Ø 30

Ø 18

4,5

E

3,0 1,5 50

SK 620 ... art. no.

100

150

200 [mm]

F

Rth [K/W] 5 Ø 45

Ø 25

4 3 2

G

1 6,75

50

SK 618 ... please indicate:

100

150

200 [mm]

... 10 15 20 25 37.5 50 1000 mm

surface:

H

black anodised

art. no.

Rth [K/W] 5 Ø 46

Ø 30

4

I

3 2 1 50

SK 619 ... art. no.

100

150

200 [mm]

K

Rth [K/W] 5 Ø 30

Ø 46

4 3 2

L

1 5,73

SK 598 ... please indicate:

... 10 15 20 25 37.5 50 1000 mm

surface:

Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

50

100

150

200 [mm]

... adapter (optional) AD = adapter plate

M

black anodised

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Thermal conductive glue Technical introduction

   

E 44 – 48 E 5 – 15 E 23 – 24 A2–8

B 42

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for LEDs Rth [K/W] 5

art. no.

4 Ø 30

Ø 50

B

3 2 1

C

SK 602 ...

6,5

50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

Rth [K/W] 2,5

art. no.

D

Ø 30

Ø 50

2,0 1,5 1,0 0,5

SK 577 ...

6,76

50

art. no.

Rth [K/W] 2,5

E 51

Ø 26

2,0 1,5 1,0 0,5

F

51,5

SK 46 ...

50

art. no. Rth [K/W] 2,5 Ø 30

Ø 60

G

2,0 1,5 1,0 0,5

H

50

5,73

SK 578 ... art. no.

I

Ø 40

Ø 60

Rth [K/W] 2,5 2,0 1,5 1,0 0,5

K

8,1

SK 569 ... please indicate:

50

... 10 15 20 25 37.5 50 1000 mm

surface:

... adapter (optional) AD = adapter plate

black anodised

L

M

N

B 43

Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Thermal conductive glue Technical introduction

   

E 44 – 48 E 5 – 15 E 23 – 24 A2–8


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A

Heatsinks for LEDs art. no.

B

Rth [K/W] 2,5 Ø 70

Ø 50

2,0 1,5 1,0

C

0,5 50

100

150

200 [mm]

9,1

SK 570 ... art. no.

D

Rth [K/W] 2,5

Ø 35

Ø 70

2,0 1,5 1,0

E

0,5

SK 571 ...

50

100

150

200 [mm]

art. no.

Ø 50

Ø 85

Rth 2,5

F

[K/W]

2,0 1,5 1,0

G

0,5 50

SK 572 ... please indicate:

...

150

200 [mm]

... adapter (optional) AD = adapter plate

10 15 20 25 37.5 50 1000 mm surface:

100

H

black anodised

art. no.

I

Rth [K/W] 2,5

Ø 70

Ø 105

2,0 1,5 1,0

K

0,5 50

100

150

200 [mm]

L

SK 584 ... please indicate:

... 10 15 20 25 37.5 50 1000 mm

surface:

black anodised

M Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Thermal conductive glue Technical introduction

   

E 44 – 48 E 5 – 15 E 23 – 24 A2–8

B 44

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for LEDs art. no.

B Rth [K/W] 2,5

C

1,5

Ø 60

Ø 120

2,0

1,0 0,5 50

100

150

200 [mm]

100

150

200 [mm]

100

150

200 [mm]

D SK 615 ... art. no.

E Rth [K/W] 2,5

F

1,5

Ø 65

Ø 120

2,0

1,0 0,5 50

G 10

SK 599 ... art. no.

H Rth [K/W] 2,5 Ø 85

Ø 145

I

2,0 1,5 1,0 0,5

K

50

SK 592 ... please indicate:

... 10 15 20 25 37.5 50 75 100 150 1000 mm

L surface:

black anodised

M

N

B 45

Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Thermal conductive glue Technical introduction

   

E 44 – 48 E 5 – 15 E 23 – 24 A2–8


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A

Heatsinks for LEDs art. no.

B

Ø 80

Ø 178

Rth [K/W] 2,5

C

2,0 1,5 1,0 0,5 50

100

150

200 [mm]

D

SK 590 ... please indicate:

E

... 10 15 20 25 37.5 50 75 100 150 1000 mm

surface:

black anodised

F

G

H

I

K

L

M Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Thermal conductive glue Technical introduction

   

E 44 – 48 E 5 – 15 E 23 – 24 A2–8

B 46

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A LED fin cooler KTE R customised

B

C

D

E

– – – – –

individual LED heatsinks acc. to customer’s requests adaptable to all common LED modules and sizes integration possibility of reflectors or fans by using special sheet metal design entry core for heat dissipation made of copper upon request other dimensions, sheet metal geometries, surfaces and mechanical machinings upon request G

F

H

KTE R D

ØB

G

ØC

Ø

A

H F

possible dimensions:

I

K

dim. [mm] A B + 20 to 200

B C 35 30 40 35 55 50 80 75 90 85 100 95 E max. number of grooves at D = 0.8 mm

D 0.8 1 1.5 2

E 32 36 50 72 84 92

F max. 400

G max. 800

H max. 200

E

F

G

H

please indicate with your order:

L

dim. [mm] A please indicate:

M

N

material:

B 47

B

C

D

... surface SA = black anodised ME = clear anodised aluminium

Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Processor overview Technical introduction

   

E 44 – 48 E 5 – 15 B 2 – 10 A2–8


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A

Heatsinks for LEDs – heatsink specially made for flexible and fixed LED Line Modules – insertion possibility of metal sheets and sheets of Plexiglas – customer specified designs, lengths and treatments upon request

1,2

R th [K/W ]

C

10

8,7

5 1,8

2

17

B

24,8 20,8 18,4 16

7

2,2

art. no.

8 6 4 50

18 36

SK LED 1

100

150

200 [mm]

D

art. no. 35 , 33 6 ,2 32 30 ,2 , 26 8 ,2

E

R th [K/W ] 8

,8 17

10

34,4

,6

6 4

F

2 50

30°

100

150

200 [mm]

53,9

SK LED 2

G

art. no.

57,2 42,55 41,8 39,4 37

R th [K/W ]

H

2,2 5,6

19,2

4 15,5 12,2

1,8 40

2,3

9,4

1,2

5

3 2 50

100

150

200 [mm]

I 39

SK LED 3 please indicate:

... 50 75 100 150 1000 mm

... surface SA = black anodised ME = clear anodised

K

L

M Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Processor overview Technical introduction

   

E 44 – 48 E 5 – 15 B 2 – 10 A2–8

B 48

N


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A Active heat dissipation of LEDs Ø 40

31,4 30 3,5

10

B

C Ø 40

art. no.

Rth [K/W]

LA LED 40 x 30

1.4

D 22,4 20 3,5

10

Ø 40

E

Ø 50

art. no.

1.25 Ø 40 10

F

Rth [K/W]

LA LED 50 x 20

3,5

46,4 45

G

H

Ø 50

art. no.

Rth [K/W]

LA LED 50 x 45

I

0.9

Technical data of the fans LF 40B12

K

L

M

N

circuit voltage

12 V

bearing type

two-way plain bearing

cur. consumpt.

50 mA

max. iuitial current

160 mA

max. volume flow

157 l/min - 9.4 m3/h

max. static pressure

3.4 mmH2O - 33 Pa

noise level

26 dB(A), 1 m lateral

temperature range

-20°C... +60°C

failure rate (L10)

60,000 h

MTBF

1,900,000 h (20°C)

Type rotor speed

6,600 min-1

weight

10 g

B 49

Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Processor overview Technical introduction

   

E 44 – 48 E 5 – 15 B 2 – 10 A2–8


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A

Active heat dissipation of LEDs

B

C – – – –

active heat dissipation of LED modules Zhaga compliant mounting possibility integrated low noise fan optional adapter plate suitable for LED modules: Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco, Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica Lumaera, Vossloh Schwabe M2x0,4 - 6H (3x)

art. no.

Ø 68,5

Rth [K/W] 2,5

D

E

2,0 35

1,5 1,0 0,5

LA LED 68 ... please indicate:

... 50 75 100 mm

... surface SA = black anodised ME = clear anodised

F 50

M3x0,5 - 6H (2x)

100

150

200 [mm]

... adapter (optional) AD = adapter plate

G

Technical data of the fans LF 40B12 circuit voltage

12 V

bearing type

two-way plain bearing

cur. consumpt.

50 mA

max. iuitial current

160 mA

max. volume flow

157 l/min - 9.4 m3/h

max. static pressure

3.4 mmH2O - 33 Pa

noise level

26 dB(A), 1 m lateral

temperature range

-20°C... +60°C

failure rate (L10)

60,000 h

MTBF

1,900,000 h (20°C)

Type rotor speed

6,600 min-1

weight

10 g

H

I

K

L

M Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Processor overview Technical introduction

   

E 44 – 48 E 5 – 15 B 2 – 10 A2–8

B 50

N


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A Sample box LED Heatsinks

B

– Sample box for verification of the thermal management for LEDs – Contains a choice of different extruded heatsinks, LED extruded heatsinks in round design, LED pin heatsinks and extruded profiles for LED-Line modules – for thermal contacting or mounting of LED a high-performance thermal conductive graphite foil is also enclosed (WLFG, sample strips 25x150mm), a high-performance thermal conductive (silicone-free) ceramic-filled thermal conductive paste (WLPK, syringe), a double-sided sticky thermal conductive foil (WLFT 404, sample strips 25x150mm) and a thermal conductive epoxy based two-component adhesive (WLK DK, syringe)

C

D

E

F art. no. SK LED BOX 1

G

H

I

K

L

M

N

B 51

Pin heatsinks Ø Hole pattern Special heatsink design Thermal conductive paste

   

B 29 – 33 A 21 A 137 – 138 E 21 – 22

Mounts Thermally conductive foil Processor overview Technical introduction

   

E 44 – 48 E 5 – 15 B 2 – 10 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for DIL-IC and PLCC Heatsinks for DIL-IC – other length on request

1

4,8

B 6,3

art. no.

6/8 contacts 14/16 contacts

[mm]

Rth [K/W]

8.5 19.0

art. no.

83 46

ICK 20 L

for cases

[mm]

20 contacts

25.0

Rth [K/W] 34

C

1

4,8

ICK 6 8 L ICK 14 16 L

for cases

19

art. no. ICK 14 16 B ICK 24 B ICK 28 B

for cases 14/16 contacts 24 contacts 28 contacts

[mm]

Rth [K/W]

6.3 33.0 37.0

surface:

art. no.

54.0 19.4 18.5

ICK 36 B ICK 40 B ICK 1000 B

for cases

[mm]

36 contacts 40 contacts —

47.0 51.0 1000.0

Rth [K/W] 16.5 15.8 —

black anodised

D

E

– with clip – other length on request

16

14,8

F

1

G

7,1 12

2,45

art. no. ICK 14 H ICK 16 H

for cases 14 contacts 16 contacts

[mm]

Rth [K/W]

18.0 20.5

surface:

20 18

art. no. ICK 18 H ICK 1000 H

for cases

[mm]

18 contacts —

23.0 1000.0

Rth [K/W] 16 —

black anodised

H

Ø 10

Ø 25

I

Ø 16

12

8,5

16

Heatsinks for PLCC

Ø 10

art. no.

Rth [K/W]

K

19

2,5

8

ICK R

L

11,8

art. no. ICK PLCC 28

[mm]

Rth [K/W]

11.8

25

surface:

black anodised

M Extruded heatsinks Pin heatsinks for IC Insulting clamping parts Thermal conductive glue

   

A 22 – 83 B 21 – 28 E 45 E 23 – 24

Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction

   

E 5 – 15 E 21 – 22 A 21 A2–8

B 52

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for SMD

B

C

D

E

particularly suitable for SMD components low profile reduced weight effective heat dissipation can be glued directly onto the component solderable versions customer specific versions on request special packaging like tape and real, bar magazin, tray etc. on request

4,8

1

F

– – – – – – – –

G

6,3

art. no.

[mm]

ICK SMD A 5 ... ICK SMD A 8 ... ICK SMD A 10 ...

5 8 10

Rth [K/W]

art. no.

123 87 75

ICK SMD A 13 ... ICK SMD A 17 ... ICK SMD A 22 ...

Rth [K/W] 63 51 34

4,8

1

H

[mm] 13 17 22

19

art. no.

[mm]

ICK SMD B 5 ... ICK SMD B 7 SA ICK SMD B 10 SA

5 7 10

Rth [K/W]

art. no.

56 47 35

ICK SMD B 13 SA ICK SMD B 19 ... 30

Rth [K/W] 29 22

7,5

K

[mm] 13 19

2,8

I

17

art. no.

L

[mm]

ICK SMD C 7 SA ICK SMD C 10 SA please indicate:

7 10

Rth [K/W]

art. no.

33 26

ICK SMD C 17 ...

[mm] 17

Rth [K/W] 17

... surface SA = black anodised MI = solderable surface

M

N

B 53

Extruded heatsinks ICK S 10 x 10 x 6,5 Insulting clamping parts Thermal conductive glue

   

A 22 – 83 B 21 – 28 E 45 E 23 – 24

Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction

   

E 5 – 15 E 21 – 22 A 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for SMD 8

B

art. no.

Rth [K/W]

15.3 22.3

art. no.

27 21

ICK SMD E 29 SA

B [mm] 29.0

Rth [K/W] 18

C 2

6

ICK SMD E 15 SA ICK SMD E 22 SA

[mm]

3

B

8

art. no.

Rth [K/W]

8 10 17

74 71 42

art. no. ICK SMD F 19 ... ICK SMD F 21 ... ICK SMD F 26 ...

[mm] 19 21 26

Rth [K/W]

E

Rth [K/W]

8 10 13

73 70 61

art. no. ICK SMD G 17 SA ICK SMD G 19 SA ICK SMD G 21 ...

[mm] 17 19 21

Rth [K/W] 41 36 32

F

8

ICK SMD G 8 MI ICK SMD G 10 ... ICK SMD G 13 SA

[mm]

1,8

10

art. no.

D

37 33 26

6

ICK SMD F 8 ... ICK SMD F 10 ... ICK SMD F 17 SA

[mm]

Rth [K/W]

8 10 17

33.0 29.0 24.5

art. no. ICK SMD H 19 SA ICK SMD H 25 ...

3,5

ICK SMD H 8 ... ICK SMD H 10 ... ICK SMD H 17 ...

[mm]

[mm] 19 25

Rth [K/W] 23.0 20.0

H

15,24

art. no.

G

2,5

11,8

13,5

art. no.

Rth [K/W]

8 10 13

25.6 23.4 21.5

art. no. ICK SMD K 17 ... ICK SMD K 19 ... ICK SMD K 21 ...

[mm] 17 19 21

Rth [K/W] 19.4 18.0 16.5

art. no. ICK SMD M 8 SA ICK SMD M 10 SA ICK SMD M 17 MI please indicate:

Extruded heatsinks ICK S 10 x 10 x 6,5 Insulting clamping parts Thermal conductive glue

[mm]

Rth [K/W]

8 10 17

72 66 40

1,8

14

art. no. ICK SMD M 19 SA ICK SMD M 21 SA

[mm] 19 21

Rth [K/W] 35 31

L

... surface SA = black anodised MI = solderable surface

   

A 22 – 83 B 21 – 28 E 45 E 23 – 24

I

K

6

ICK SMD K 8 ... ICK SMD K 10 SA ICK SMD K 13 ...

[mm]

Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction

M    

E 5 – 15 E 21 – 22 A 21 A2–8

B 54

N


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A heatsink for SMD 6

B art. no.

C

ICK SMD N 8 ... ICK SMD N 10 ... ICK SMD N 17 ... please indicate:

D

[mm] 8 10 17

2

8

Rth [K/W]

art. no.

74 71 42

ICK SMD N 19 ... ICK SMD N 21 ... ICK SMD N 26 ...

[mm] 19 21 26

Rth [K/W] 37 33 26

... surface SA = black anodised MI = solderable surface

Sample box SMD heatsinks – contains an assortment of SMD heatsinks with anodised and solderable surface as well as thermally conductive glue (WLK) and double-sided adhesive thermal foil (WLF)

E

F

art. no. ICK SMD BOX 1

G

H

I

K

L

M

N

B 55

Extruded heatsinks ICK S 10 x 10 x 6,5 Insulting clamping parts Thermal conductive glue

   

A 22 – 83 B 21 – 28 E 45 E 23 – 24

Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction

   

E 5 – 15 E 21 – 22 A 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Passive heatsinks for processors Ø 4,2

R 6,5

51

48

12

5

1,3

B 51

48

art. no. ICK PPC 51

Rth [K/W]

suitable for processor type

8.1

Power PC

C

Ø 4,2 Ø 8,5

Rth [K/W]

D

25

107

3,0 2,0

4,2

1,0 0 0

1

2

3

4

130

art. no.

Rth [K/W]

ICK PEN 3 XE

5 6 v [m/s]

E

suitable for processor type Intel®

2

Pentium® III-XeonTM Slot II Format

Ø 4,2

F

Ø 8,5

Rth [K/W]

25

107

3,0 2,0

G

4,2

1,0 0 0

1

2

3

4

130

art. no.

Rth [K/W]

ICK PEN 3 XE 1

5 6 v [m/s]

suitable for processor type Intel®

1.8

Pentium® III-XeonTM Slot II Format

H

3

Heatsink specially for Q7 "Embedded-Boards" 2,9

I

70 52

25

6,5

3

5

18

75

2,5

K

56,5

art. no. ICK EM 25

Rth [K/W]

suitable for processor type

3.9

Q7 Board

L

M Fan cooler for Intel PentiumIIIXeon Fan cooler, universal Attachable heatsinks Thermal conductive material

   

B 60 B 58 C 10 – 16 E 2 – 24

Heatsinks for Q7 "Embedded-Boards" Heatsinks for BGA  Heatsinks for PGA  Technical introduction 

B 56 B 17 – 20 B 11 – 16 A2–8

B 56

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Passive heatsinks for processors – customer specific versions and modifications on request

B

ICK PEN 38

Rth [K/W]

4 3 2 1

C C

B

0

0

1

3

4

ICK PEN 45

Rth [K/W]

D

2

5 6 v [m/s]

3 2

D

A

1 0

E

F

art. no.

Rth [K/W]

ICK PEN 38 F

4.0

ICK PEN 38 W

4.0

ICK PEN 45 W

3.5

suitable for processor type AMD®

K6-III/ IDT W2A/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2

0

1

2

3

4

5 6 v [m/s]

A 49.5

dim. [mm] B C 49.5 38

D 5.0

49.5

49.5

38

5.0

50.0

50.0

45

3.5

Rth [K/W]

3 2

B

C

G D

1 0

H

art. no. ICK PRO 40 W

I

Rth [K/W]

suitable for processor type Intel®

2.7

Pentium®

2

3

4

dim. [mm] B C 67.5 40

A 65

PRO

1

0

A

5 6 v [m/s]

D 4.5

F = with double-sided thermally conductive adhesive foil W = for thermally conductive adhesive (please order separately) WLK ... ➔ E 23 Rth [K/W] 4

25

K

14 63

3 2 1 4,5

0

L

art. no. ICK PEN 3 FC

70

Rth [K/W]

0

1

2

3

4

5 6 v [m/s]

suitable for processor type Intel®

3.5

Pentium® III FC PGA (Mendocino, Coppermine)

fixing method: K = with fixing clamp (incl. one-sided adherent thermal foil)

M

N

B 57

Fan cooler for Intel PentiumIIIXeon Fan cooler, universal Attachable heatsinks Thermal conductive material

   

B 60 B 58 C 10 – 16 E 2 – 24

Heatsinks for Q7 "Embedded-Boards" Heatsinks for BGA  Heatsinks for PGA  Technical introduction 

B 56 B 17 – 20 B 11 – 16 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Active heatsinks for processors A

art. no. LA LA LA LA LA LA LA LA LA LA LA LA

ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK

15 15 17 17 17 17 18 18 21 21 21 21

x x x x x x x x x x x x

15 15 17 17 17 17 18 18 21 21 21 21

F 05 F 12 F 12 F 12 A W 05 W 12 F 12 W 12 F 05 F 12 W 05 W 12

B

C

B

Rth [K/W]

suitable for processor type

2.3 2.3 1.6 1.6 1.6 1.6 1.5 1.5 1.4 1.4 1.4 1.4

universal universal universal universal universal universal universal universal universal universal universal universal

A 37.92 37.92 43.10 43.10 43.10 43.10 45.70 45.70 53.34 53.34 53.34 53.34

dim. [mm] B 38.10 38.10 43.10 43.10 43.10 43.10 45.70 45.70 53.34 53.34 53.34 53.34

C C 20 20 20 20 20 20 20 20 20 20 20 20

D

E

F

used fans: 5 Volt = Sepa MFB 25 F 05 L / MFB 40 H 05 / MFB 40 H 05 A; 12 Volt = Sepa MFB 25 F 12 / MFB 40 H 12 / MFB 40 H 12 A F = with double-sided thermally conductive adhesive foil W = for thermally conductive adhesive (please order separately) WLK ... ➔ E 23

G

A = alarm exit

H

I

K

L

M Heatsinks for BGA  Heatsinks for Q7 "Embedded-Boards" Fan cooler, universal  Heatsinks for Pentium PRO 

B B B B

17 – 20 56 58 57

Heatsinks for P II-Mobile Module Fan cooler for Pentium IV Thermal conductive material Technical introduction

   

B 56 B 60 E 2 – 24 A2–8

B 58

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Active heatsinks for processors

B

– easy assembly on ZIF socket by fixing clamp

B

C

C

D

D

A

art. no.

E

F

G

H

I

K

Rth [K/W]

suitable for processor type

LA ICK PEN 8 F 05

2.50

LA ICK PEN 8 F 12

2.50

LA ICK PEN 8 W 05

2.50

LA ICK PEN 8 W 12

2.50

LA ICK PEN 16 K 12

1.20

LA ICK PEN 16 W 12

1.20

LA ICK PEN 16 W 12 A

1.20

LA ICK PEN 18 W 12

1.60

LA ICK PEN 38 W 12

1.10

LA ICK PRO 25 F 12

0.97

AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 AMD® K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel® Pentium®/ AMD® K6-2 Intel® Pentium® PRO

A 50.8

dim. [mm] B C 50.8 8.00

D 9.00

50.8

50.8

8.00

9.00

50.8

50.8

8.00

9.00

50.8

50.8

8.00

9.00

50.8

50.8 16.51 26.51

50.8

50.8 16.51 26.51

50.8

50.8 16.51 26.51

50.8

50.8

49.5

49.5 38.00 48.00

63.5

67.5 25.00 35.00

8.00 18.00

used fans: 5 Volt = Sepa MFB 50 E 05; 12 Volt = Sepa MFB 50 E 12/ Sepa MFB 50 E 12 A; LA ICK PEN 8: 5 Volt = Sepa HFB 44 X 05 A; 12 Volt = Sepa HFB 44 B 12 A K = with fixing clamp (incl. one-sided adherent conductive foil) F = with double-sided thermally conductive adhesive foil W = for thermally conductive adhesive (please order separately) WLK ... ➔ E 23 A = alarm exit

L

M

N

B 59

Heatsinks for BGA  Heatsinks for Q7 "Embedded-Boards" Fan cooler, universal  Heatsinks for Pentium PRO 

B B B B

17 – 20 56 58 57

Heatsinks for P II-Mobile Module Fan cooler for Pentium IV Thermal conductive material Technical introduction

   

B 56 B 60 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Active heatsinks for processors – incl. one-sided adherent thermal foil

52

4 27

3,5

B

C

125

art. no.

Rth [K/W]

suitable for processor type

1.2

Intel® Pentium® II/ AMD® Athlon®

LA ICK PEN 2 K 12 ... please indicate:

... accessory (optional) SM = molex connection plug

D

utilized fans: 12 Volt = Sepa MFB 40 H 12

107

4 28,4

E

F 130

art. no.

Rth [K/W]

suitable for processor type

0.8

Intel® Pentium® III-XeonTM

LA ICK PEN 3 XE please indicate:

G

... accessory (optional) A = alarm exit SM = molex connection plug

fixing method: SB= screw fixing utilized fans: 12 Volt = Sepa MFB 50 E 12

H

– with copper base plate – customer specific designs and modifications on request

7,7 45

70

63,5

I

art. no.

Rth [K/W]

suitable for processor type

0.6

Intel® Pentium® IV

LA ICK PEN 4 1 K please indicate:

K

80

7

... accessory (optional) SM = molex connection plug

L

fixing method: K = with fixing clamp operating voltage of the fan motor: 12 Volt (Papst 612 NHH)

M Heatsinks for BGA  Heatsinks for Q7 "Embedded-Boards" Fan cooler, universal  Heatsinks for Pentium PRO 

B B B B

17 – 20 56 58 57

Heatsinks for P II-Mobile Module Fan cooler for Pentium IV Thermal conductive material Technical introduction

   

B 56 B 60 E 2 – 24 A2–8

B 60

N


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A

Technical data of the fans

B molex crimp case series: 6471; molex crimp terminals: 2759 – Sepa-fan 24 h BURN-IN tested

C

5 volt fan Sepa Sepa MFB 25 F 05 L MFB 40 H 05 circuit voltage bearing type

Sepa Sepa MFB 40 H 05 A MFB 50 E 05

Sepa ebmpapst HFB 44 X 05 A 405 F

4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC double ball bearing double ball bearing double ball bearing double ball bearing ball bearing

fan dimensions cur. consumpt. max. iuitial current max. volume flow

4.5...5.5 V DC double slide bearing 40x40x10 mm 140 mA

D

E

25x25x10 mm 90 mA 170 mA 46 l/min 2.8 m3/h max. static pressure 2.2 mmH2O 22 Pa noise level 18 dB(A), 1 m lateral

40x40x10 mm 90 mA 250 mA 184 l/min 11 m3/h 3.1mm H2O 30.5 Pa 24 dB(A), 1 m lateral

40x40x10 mm 90 mA 250 mA 184 l/min 11 m3/h 3.1mm H2O 30.5 Pa 24 dB(A), 1 m lateral

50x50x10 mm 50 mA 120 mA 169 l/min 10.1 m3/h 1.6mm H2O 15.6 Pa 17 dB(A), 1 m lateral

44x44x6.2 mm 90 mA 160 mA 50 l/min 3 m3/h 2.6mm H2O 25.5 Pa 28 dB(A), 1 m lateral

temperature range failure rate (L10) MTBF weight cases

-10°C ... +85°C 95,000 h

-40°C... +80°C 95,000 h

-40°C... +80°C 95,000 h

-10°C... +70°C 95,000 h

-40°C... +80°C 95,000 h

132 l/min 8 m3/h 3.06mm H2O 30 Pa 22.1 dB(A), 1 m lateral -20°C... +70°C 45,000 h (20°C)

280,000 h (20°C) 8g plastic PBT (UL E54695)

280,000 h (20°C) 13 g plastic PBT (UL E54695)

280,000 h (20°C) 13 g plastic PBT (UL E54695)

280,000 h (20°C) 19 g plastic PBT (UL E54695)

280,000 h (20°C) 7g plastic PBT (UL E54695)

17 g plastic PBT (UL E38324)

G

12 volt fan Sepa MFB 25 F 12 circuit voltage bearing type

F

Sepa MFB 40 H 12

Sepa Sepa MFB 40 H 12 A MFB 50 E 12

10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC double ball bearing double ball bearing double ball bearing ball bearing

fan dimensions cur. consumpt. max. iuitial current max. volume flow

Sepa ebmpapst HFB 44 B 12 A 412 F 10.2...13.8 V DC ball bearing

10-14 V DC double slide bearing 40x40x10 mm 60 mA

25x25x10 mm 70 mA 150 mA 70 l/min 4.1 m3/h max. static pressure 2.24mm H2O 41.5 Pa noise level 23 dB(A), 1 m lateral

40x40x10 mm 50 mA 130 mA 173 l/min 10.3 m3/h 2.9 mmH2O 28.5 Pa 24 dB(A), 1 m lateral

40x40x10 mm 50 mA 130 mA 173 l/min 10.3 m3/h 2.9 mmH2O 28.5 Pa 21 dB(A), 1 m lateral

50x50x10 mm 60 mA 140 mA 238 l/min 14.3 m3/h 2.7mm H2O 26.9 Pa 22 dB(A), 1 m lateral

44x44x6.2 mm 40 mA 70 mA 50 l/min 3 m3/h 2.6mm H2O 25.5 Pa 28 dB(A), 1 m lateral

temperature range failure rate (L10) MTBF weight cases

-40°C... +80°C 95,000 h

-40°C... +80°C 95,000 h

-40°C... +80°C 95,000 h

-10°C... +70°C 95,000 h

-40°C... +80°C 95,000 h

280,000 h (20°C) 8g plastic PBT (UL E54695)

280,000 h (20°C) 13 g plastic PBT (UL E54695)

280,000 h (20°C) 13 g plastic PBT (UL E54695)

280,000 h (20°C) 19 g plastic PBT (UL E54695)

280,000 h (20°C) 20 g 17 g steel/aluminium (UL plastic PBT E54695) (UL E38324)

132 l/min 8 m3/h 3.06mm H2O 30 Pa 22.1 dB(A), 1 m lateral -20°C... +70°C 45,000 h (20°C)

H

I

K

Fans with pulse output - Technical data of fans with pulse output: – – – – –

L

pulse output for activation of the alarm control pulse similar to a square pulse with three times the frequency of the rotor speed when the rotor is blocked, the output signal may be L (≤0.8 V) or H (Vcc-1 V) the pulse output must not be connected to GND or Vcc withoutb protective resistor (>10 K) in order to avoid short circuits, the pulse output not being used must be insulated

M

B 62

N


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Finger shaped heatsinks for power semiconductors Attachable heatsinks Finger shaped heatsinks for transistors Miniature heatsinks

Finger shaped heatsinks for power semiconductors – specially compatible for power semiconductors in a TO-case – made as a bent sheet metal part or die cast heatsink made of aluminium – aligned heatsink contours for the best heat dissipation – direct screwing of the component to the heatsink on the PCB

Attachable heatsinks – made of aluminium or copper material – solderable surface coating – integrated spring clip for easy and fast mounting of the transistor – secure hold of the component due to optimized spring force and geometry – customer specific version upon request

Finger shaped heatsinks for transistors – effective heat dissipation of transistors – efficient radiation of heat at a horizontal or vertical mounting position – component fastening by means of screws or special transistor retaining springs – solder mounting by means of integrated solder pins and solderable surfaces

Miniature heatsinks – for TO 5, SOT 82, D PAK and similar semiconductors – made of aluminium, phosphorus bronze or copper – simple mounting by direct plugging or soldering of the heatsink – special types of packaging such as tape & reel, magazine or tray upon request – versions and designs for your application


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Finger shaped heatsinks for power semiconductors

B

,9 10

4,5

46 38,1

4,

2

,2

,2

30

13

3,7

C

38,1 46

[mm]

FK 254 SA 3 FK 318 SA FK 318 SA 3

Rth [K/W]

25.4 31.8 31.8

5.8 4.8 4.8

material:

die-casting aluminium

surface:

black lacquered

TO 3 without TO 3

CB

TO 3

3

D

45

40

,9

45 35

2,5

6 3,

4,

2

2

,2 30

, 13

E

,2 30 ,1 15 ,2 13

Ø 4, Ø 2

art. no.

4 5, , 2 6

10

F

FK FK FK FK FK FK

201 201 201 202 202 202

SA SA SA SA SA SA

[mm]

Rth [K/W]

25.4 25.4 25.4 12.7 12.7 12.7

3 CB 3 CB

10 ,9

,1 13 4,9 5 1 9, 0 1

art. no.

6 6 6 8 8 8 L (TO 3 – SOT 9 + TO 66 – SOT 32 – TO220)

H

30,1 23,1 16,9 13

I 33

10,9

4,2

5,4 4,2

1,5

2,5

G

without TO 3 CB without TO 3 CB

3,6

K

41,6

art. no. FK FK FK FK

205 206 207 208

SA SA SA SA

[mm]

L L L L

Rth [K/W]

31.8 25.4 19.1 12.7

9.0 10.5 12.0 14.0

material:

aluminium

surface:

black anodised

L L L L

L

M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 – 117 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 – 48 E 51 E 2 – 24 A2–8

C2

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Finger shaped heatsinks for power semiconductors

FK 223 SA CB ,2 30 ,2 13

4,

4 5, ,2 6

Ø 2 4,

10

,9

42 32

8

3

6

3, 5

9,

C

1,

Ø

2

10

,2 30 ,2 13

B

,9

FK 223 SA 3

13

1,5

10 ,1

art. no.

D

[mm]

FK 223 SA FK 223 SA 3 FK 223 SA CB

Rth [K/W]

17 17 17

6.8 6.8 6.8

without TO 3 CB M 2,5

1,5

8,5

E

F

art. no.

10 14,75 35,5

[mm]

FK 217 SA CB 2

M3

28,3

4

Rth [K/W]

13

16

material:

aluminium

surface:

black anodised

CB 2 (SOT 32; TO 220)

G

H

I

K

L

M

N

C3

Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 – 117 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 – 48 E 51 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for transistors in plastic case – for semiconductor screw-assembly, horizontal

FK 234 SA L 1

28 3

3

Ø 3,2 8

8

Ø 3,8 18,5±0,5 11,5±0,5

C 1,5

14,75 20

10 20

FK 234 SA L 3

FK 234 SA L 4 10 Ø 3,8

Ø 3,2

Ø 3,8

Ø 3,8

234 234 234 234

SA SA SA SA

L L L L

[mm]

1 2 3 4

E

20

12,5

FK FK FK FK

D

28

28 8

art. no.

B

FK 234 SA L 2

28

Rth [K/W]

15 15 15 15

17 17 17 17

material:

aluminium

surface:

black anodised

TO 220 SOT 32 CB CB

F

G

– for semiconductor screw-assembly, vertical

FK 235 ... L 1

FK 235 ... L 2

28

28 18,3 2

13,5

1,5

10,16

Ø 3,2

10,16

Ø 3,8

4

4

art. no. FK FK FK FK

235 235 235 235

[mm]

MI L 1 MI L 2 SA L 1 SA L 2

15 15 15 15

H

2

18,5±0,5 11,5±0,5

I

Rth [K/W] 16 16 16 16

material:

aluminium

surface:

solderable surface/ black anodised

TO 220 SOT 32 TO 220 SOT 32

K

L

M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 E 51 E 2 – 24 A2–8

C4

N


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A Heatsinks for transistors in plastic case 38

26 18

B

1,5

4

9,9 K/W

22

art. no.

TO 220

art. no.

24,5 8

38

10

26 18 9,9 K/W

D

22

FK 225 SA L 1 3,6

TO 220 6,9 16,5 31,2

FK 225 SA L 2 art. no.

24,5

2,5

21 13

19

E

30 K/W 4

11,5

C

13 19

TO 220

F

art. no.

1,5

18,5

6,5

FK 228 SA L 1

21 13

19

4

13,5

27 K/W TO 220 18,5

6,5

1,5

G

FK 229 SA L 1 art. no. 21 13

19

4

19,5

21 K/W

H

18,5

FK 230 SA L 1

I

material:

aluminium

surface:

black anodised

art. no.

12,5

5,1

30,4

4

31,2

3,8

5

7

15,2

K

17 K/W TO 220

15 3

FK 249 SA 220

L

1,5

TO 220 6,5

0,8

24,2

1,2 11,1

material:

aluminium

surface:

black passivated, solder pins tin plated

1,9

M

N

C5

Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 – 48 E 51 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for transistors in plastic case art. no. 3,8

12,2

25,4

8

B

1

25 K/W SOT 32 18

FK 209 SA 32

C

available without hole pattern as well 22,4 12,2

25,4

8

3,8

art. no.

1

18 K/W CB (SOT 32 + TO 220)

FK 210 SA CB

D

30

available without hole pattern as well 12,2

E 25,4

13

Ø

3,8

art. no.

1

21 K/W SOT 32 18

FK 213 SA 32

F

available without hole pattern as well 22,4 12,2

25,4

13

Ø

3,8

art. no.

15 K/W 1

G

CB (SOT 32 + TO 220) 30

FK 214 SA CB

available without hole pattern as well

art. no.

1

11,5

3,8

24 K/W

13,5

9,5

13,5

H

TO 220 19

FK 231 SA 220 art. no.

I

1,3

16,45

24 K/W

19,05 3,8

9,5

13,34

SOT 32

K

19,5

FK 239 SA 32 material:

aluminium

surface:

black anodised

L

M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 – 48 E 51 E 2 – 24 A2–8

C6

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for transistors in plastic case

12,2 1 25,4

8

B

3,8

1,2

art. no.

1

25 K/W SOT 32

18

3

available without hole pattern as well

art. no.

22,4 12,2

8

25,4

1

3,8

1,2 1

18 K/W

D

CB (SOT 32 + TO 220)

18,2 30

3

available without hole pattern as well 12,2

13

E

25,4

1,2

Ø 3,8

art. no.

1

1

21 K/W SOT 32 18

FK 215 32 ... art. no.

22,4 12, 2

1

15 K/W

G

CB (SOT 32 + TO 220)

3

available without hole pattern as well

art. no.

3,8

5,2

5,5

25,4

20 K/W 30

14,4

3,8

2,5 12,7

H FK 222 ...

18, 2 30

1

FK 216 CB

TO 220

available without hole pattern as well

art. no.

5,2

14,4 8

12

3,8

2,5

3,8

12,7

I

25,4

13

1

3,8

1,2

F

3

available without hole pattern as well

2,2

FK 212 CB ...

25,4

C

FK 211 32 ...

FK 247 220 ... please indicate:

material:

19,1

1,5 16,8

3,8

1,5 1,95

L

TO 220 4

art. no. 7,9

K

5,5

30

FK 222 THF ...

22 K/W TO 220

1,6

1

20 K/W

23,5

4,5

... surface SA = black anodised MI = solderable surface aluminium

M

N

C7

Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 E 51 E 2 – 24 A2–8


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A

Heatsinks for transistors in plastic case 17,8 Ø 3,6

art. no.

B

22 K/W

1

20

45

7

9,8 9

18

TO 220

FK 227 SA L 1

4,3 36,6

C

1

Ø 3,7

art. no.

9,5

45

18

12 K/W 20

D

TO 220

FK 238 SA L 1

10,2

12,2

material:

aluminium

surface:

black anodised

art. no.

E

35,6 4

3,5

FK 218 32 ...

1,6

Ø 3,2

12,3

19,4

SOT 32 TO 220

19,3

F

1,2

22

6,7

21 K/W

24,5 20,5

3,2

7

TO 220

G

24

13

1,2

21 K/W

Ø 3,6

art. no.

4 17

FK 232 220 ... 33 29

3,2

7

TO 220

H

27

1,2

16

20,2 K/W

Ø 3,6

art. no.

4

I

20

FK 233 220 ... please indicate:

... surface SA = black anodised MI = solderable surface

material:

K

aluminium

L

M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers

   

C 10 – 14 C 17 – 19 C 21 E 17 – 18

Mounts Insulating caps Thermal conductive material Technical introduction

   

E 44 E 51 E 2 – 24 A2–8

C8

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for transistors in plastic case

2,5 3,2 10,8 9,7 14,8

7,1 18,3 25,4

FK 219 CB 1 ... FK 219 CB 2 ...

[mm]

21

4,8

Rth [K/W]

12.6 12.6

14 14

CB 1 (TO 220) CB 2 (TO 220) 2,5

art. no.

4,8

50,8

6

1,8

1,2

35,1 16,6

E

11,5 22,9

3,2

1,5

C

D

50,8

1,2

22,9

35,1 16,6

50,8

35,1 16,6

B

FK 219 CB 2 ...

3,2 2,5

FK 219 CB 1 ...

3,9

7,1 18,3 25,4

F FK 219 CB 3 ...

[mm]

Rth [K/W]

12.6

14

CB 3 (TO 220)

FK 236 CB ... 32

3,8

22 18 12

3,8

32

1,9

G

FK 236 220 ... 1,9

art. no.

4,8

3,3

16 23,4

22,8 12

16 23,4

3,3

22,8 12 3,3

1

22

H 28,5 30,8

art. no.

I

FK 236 220 ... FK 236 CB ... please indicate:

K

material:

[mm]

5

28,5 30,8

5

Rth [K/W]

5 5

18 18

TO 220 CB

... surface SA = black anodised MI = solderable surface aluminium

L

M

N

C9

Retaining springs for transistors  Lock-in retaining spring for transistors Profiles for lock-in fixing spring  Profiles for PCB mounting 

A A A A

115 – 117 119 84 89 – 112

Heatsinks for TO 5 and TO 18  Attachable heatsinks  Mounting material for semiconductors Technical introduction 

C 17 – 19 C 10 – 14 E 46 A2–8


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A

Attachable heatsinks 25

B

20,5

7

C

0,6

art. no.

Rth [K/W]

FK 220 SA 220

25

TO 220

material:

aluminium

surface:

black anodised

D

– for transistiors with thin bottom thickness (0.5 mm) 25

7

20,5

E

0,6

art. no.

F

Rth [K/W]

FK 258 SA 220

25

TO 220

material:

aluminium

surface:

black anodised

G

25 18

4

25,4

8,3

1,2

art. no.

1,2 1,3

22,5

Rth [K/W]

FK 224 ... P SIP please indicate:

H

18

I

P SIP

... surface SA = black anodised MI = solderable surface

material:

K

aluminium

L

M Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

   

C 21 C4–9 E 16 E 41

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

   

E 41 A 123 – 124 E 17 – 18 A2–8

C 10

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Attachable heatsinks

FK 224 ... 218 2

FK 224 ... 218 1

B

25 18

25 18 4

8,3

14,5

25,4

25,4

8,3

15,5

4

15,5

4

C 1,3

1,2

1,3

1,2

FK 224 ... 220 1

D

25 18

FK 224 ... 220 2 25 18 4

8,3

14,5

25,4

25,4

8,3

E 1,2

art. no.

F

FK 224 ... 218 1 FK 224 ... 218 2

1,2

art. no.

18 18

TO 218 TO 218

10,5 15,5

4

4

1,3

Rth [K/W]

please indicate:

G

10,5 15,5

1,3

Rth [K/W]

FK 224 ... 220 1 FK 224 ... 220 2

18 18

TO 220 TO 220

... surface SA = black anodised MI = solderable surface

material:

aluminium

12,7

25,4

22,86 0,81 7,6

H

3,81 5,3

31

1,27

FK 241 SA 218 V

I

2 3,4

art. no.

with tin-plated soldering lug for direct soldering onto circuit board, for vertical installation

art. no. 20

20

28

9,8 K/W TO 220

17,2

1,4

8

K

Ø 1,2 20,1

FK 248 SA 220 material:

aluminium

surface:

black anodised, solder pins tin plated

L

M

N

C 11

Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

   

C 21 C4–9 E 16 E 41

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

   

E 41 A 123 – 124 E 17 – 18 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Attachable heatsinks universal clip on heatsinks for type TO 218, TO 229, TO 247, TO 248, SIP-Muliwatt and similar easy assembly by pushing the heatsink onto the component for vertical and horizontal fastening by soldering fin height variations on request special design accord. to customized specification

art. no.

B

27

9 20

1,2

without soldering lug

art. no.

16

3,2

0,6 10

0,6 20

1,2

4,85 1,1

4

1

27

9

8,5

16

0,6

0,6 10

with soldering lug for vertical mounting

G 13

0,6 10 8,5

16

18,4 K/W

20

1,2

without soldering lug

art. no.

H

19 K/W 13

8,5

16

3,2

0,6 10

0,6 27

20

1,2

I

1

with soldering lug for horizontal mounting

art. no. 4,85

18,4 K/W

4

1

8,5

16

27

13

0,6 10 0,6

1,1

FK 243 MI 247 V

F

20

1,2

27

FK 243 MI 247 H

E

19,7 K/W

art. no.

FK 243 MI 247 O

1

with soldering lug for horizontal mounting

art. no.

FK 245 MI 247 V

D

20,5 K/W

27

FK 245 MI 247 H

C

9

FK 245 MI 247 O

0,6 10 8,5

16

20,2 K/W

8,5

– – – – –

1,2

20

with soldering lug for vertical mounting

material:

copper (Cu)

surface:

solderable surface

material thickness:

0.6 mm

K

L

M Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

   

C 21 C4–9 E 16 E 41

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

   

E 41 A 123 – 124 E 17 – 18 A2–8

C 12

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Attachable heatsinks 2

*

B

1

TO 220

C 3

D

E

– – – – – – – – –

narrow version with better thermal resistance max. 14.5 mm wide 3 different lengths for varied dissipation power takes less space than any other attachable heatsink simple assembly by pushing the heatsink onto the TO 220 housing the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3) optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases effective heat emmision with horizontal and vertical mounting * = touch in edge of transistor

art. no. max. 14,5

* 12,7

26 K/W 0,81

ca. 8,5

F

15,24

G FK 242 SA 220 O

without soldering lug

art. no. *

max. 14,5

12,7

21 K/W

ca. 8,5

H

19,05 0,81

FK 237 SA 220 O

without soldering lug

art. no.

16 K/W max. 14,5

12,7

*

K 38,1

0,81

FK 240 SA 220 O

L

ca. 8,5

I

without soldering lug

material:

aluminium

surface:

black anodised, solder pins tin plated

M

N

C 13

Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

   

C 21 C4–9 E 16 E 41

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

   

E 41 A 123 – 124 E 17 – 18 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Attachable heatsinks art. no.

*

4,05

ca. 8,5

26 K/W 0,81

0,81

1,27

11,8

15,24

6,4

*

21 K/W

0,81

ca. 8,5

4,05

max. 14,5

0,81

1,27

19,05

with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

art. no.

16 K/W

max. 14,5

E ca. 8,5

0,81

0,81 1,27

12, 7

4,05

*

0,81 4,6

6,4

FK 240 SA 220 H

38,1

F

with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

material:

aluminium

surface:

black anodised, solder pins tin plated

– with tinned soldering lug for direct soldering onto circuit board, for vertical installation

0,81

A [mm]

Rth [K/W]

6.35

26

FK 242 SA 220 VL

A [mm]

Rth [K/W]

6.35

21

26

ca. 8,5

19,05

FK 237 SA 220 VL

A [mm]

Rth [K/W]

9.53

21

*

Rth [K/W]

6.35

16

ca. 8,5

L

38,1

art. no. FK 240 SA 220 VL

material:

aluminium

surface:

black anodised, solder pins tin plated

C 21 C4–9 E 16 E 41

K

12,7

0,81 1,62

31,8 A

A [mm]

   

9.53

H

I

art. no.

0,81

Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

Rth [K/W]

12,7

0,81 1,62 A

6,4

FK 240 SA 220 V

A [mm]

12,8

0,81

max. 14,5

art. no.

ca. 8,5

art. no. *

6,4

FK 237 SA 220 V

9 15,24

A

max. 14,5

art. no.

12,7

0,81 1,62 6,4

FK 242 SA 220 V

G

*

max. 14,5

art. no.

D

4,6

6,4

FK 237 SA 220 H

C

with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

art. no.

0,81 12,7

FK 242 SA 220 H

B

0,81 12,7

max. 14,5

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

A [mm]

Rth [K/W]

9.53

16

M    

E 41 A 123 – 124 E 17 – 18 A2–8

C 14

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Attachable heatsinks for TO 220 with a bottom plate thickness of 0.5 mm

B

C

D

E

– – – – – – – –

narrow version with better thermal resistance max. 14.5 mm wide takes less space than any other attachable heatsink simple assembly by pushing the heatsink onto the TO 220 housing the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3) optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases effective heat emmision with horizontal and vertical mounting * = touch in edge of transistor

art. no. max 14,5

*

without soldering lug max 14,5

art. no.

*

4,1

H

12,7

21 K/W 0,81 1,27

0,81 19,05

6,35 12,7

FK 252 SA 220 H

I

ca. 8,4

FK 252 SA 220 O

19,05

0,81

12,7

G

12,7

21 K/W

ca. 8,4

F

with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

material:

aluminium

surface:

black anodised

– with tinned soldering lug for direct soldering onto circuit board, for vertical installation max. 14,5

1,27 0,81

12,7

L

art. no. FK 252 SA 220 V

ca. 8,4

0,81

K

A [mm]

Rth [K/W]

6.35

21

12,7

*

19,05

A

art. no. FK 252 SA 220 VL

material:

aluminium

surface:

black anodised

A [mm]

Rth [K/W]

9.53

21

M

N

C 15

Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

   

C 21 C4–9 E 16 E 41

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

   

E 41 A 123 – 124 E 17 – 18 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Attachable heatsinks

19

11,1

B 19

10,7 22

art. no.

C

Rth [K/W] 23.7

TO 220

D

11,7

19,05

11,1

FK 253

19,05

24,8

art. no.

E

Rth [K/W] 16.8

TO 220

F 19,05

10,2

4,19 ±0,13

FK 255

0,6

12,2

19,05

21,84

art. no.

G

Rth [K/W]

FK 257

21.2

TO 220

material:

aluminium

surface:

black anodised

H

I

K

L

M Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers

   

C 21 C4–9 E 16 E 41

Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction

   

E 41 A 123 – 124 E 17 – 18 A2–8

C 16

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Small heatsinks art. no.

B 10,1

40 K/W TO 5

Ø8 0,6

C

3,96

6,35

6,35

6,35

21,4

KK 1 3,96 art. no.

10,1

38 K/W

D

TO 5

Ø8 0,6 21,4

E

KK 1 6,35 art. no.

35 K/W

10,1

TO 5

F

Ø8 0,6

12,7

6,35

21,4

KK 1 12,7 art. no.

31 K/W

G 10,1

TO 5

H

Ø8 0,6

19,05

6,35

21,4

KK 1 19,05 material:

aluminium

surface:

black anodised

I

K

L

M

N

C 17

Finger-shaped heatsinks Heatsinks for transistors Attachable heatsinks Heatsinks for D PAK

   

C C C C

2–3 4–9 10 – 16 21 – 22

Thermal conductive material  Mounting material for semiconductors Extruded heatsinks  Technical introduction 

E 2 – 24 E 46 – 48 A 22 – 83 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Small heatsinks art. no.

B

25 5

7,9

57 K/W TO 5 KF 5/5

C

art. no. 25 10

7,9

46 K/W TO 5

D

KF 5/10 art. no. 25 15

7,9

40 K/W TO 5

E

KF 5/15 material:

brass

surface:

blackened

F

art. no. 7,8

KK 562 GS

8

T

19

F

60 K/W TO 5

G

T = gap; F = spring loaded

material:

special bronze CuZn 15

material thickness:

0.3 mm

surface:

blackened

H

I

K

L

M Finger-shaped heatsinks Heatsinks for transistors Attachable heatsinks Heatsinks for D PAK

   

C C C C

2–3 4–9 10 – 16 21 – 22

Thermal conductive material  Mounting material for semiconductors Extruded heatsinks  Technical introduction 

E 2 – 24 E 46 – 48 A 22 – 83 A2–8

C 18

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Small heatsinks art. no.

max. 12,7 1+0,5 -0,2

B 6

63 K/W TO 5 8,1±0,1

SKK 56

C

art. no.

max. 12,7 1+0,5 -0,2 8

55 K/W

D

TO 5 8,1±0,1

SKK 58 art. no.

10

max. 12,7 1+0,5 -0,2

E

44 K/W TO 5 8,1±0,1

SKK 510

F

material:

aluminium

surface:

etched (other surfaces on request)

3,5

art. no.

G

80 K/W

9,5

15

TO 126 SOT 32 SOT 82

KK 92 art. no. 2,4

3,3

13

H

60 K/W

I

30 10

11

0,5

Ø 2,2

TO 126 SOT 32 SOT 82

4 8,8

KK 32 material:

special bronze CuZn 6

surface:

blackened

K

L

M

N

C 19

Finger-shaped heatsinks Heatsinks for transistors Attachable heatsinks Heatsinks for D PAK

   

C C C C

2–3 4–9 10 – 16 21 – 22

Thermal conductive material  Mounting material for semiconductors Extruded heatsinks  Technical introduction 

E 2 – 24 E 46 – 48 A 22 – 83 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Heatsinks for D PAK and others

B

C

D

– copper heatsinks with excellent heat conductivity – direct mounting on printed circuit through solderable surface – especially suitable for SMD components of type D PAK (TO 252), D² PAK (TO 263), D³ PAK (TO 268), SOT 669 LF PAK, SO IC-8 FL MP, Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223 etc – available standard packing: bulk parts or reel – special packing like magazine, tray etc. on request; - special versions according to customers specifications – tape width: 44 mm, reel diameter: 330 mm, quantity: FK 244 08 = 450, FK 244 13 = 200

E

23

10

FK 244 08 D PAK ... weight: 2g

8

8

10

art. no.

31,5 K/W

14,8

F FK 244 13 D PAK ... weight: 3.3g

13

8

10

art. no.

10

25 K/W

14,8

23

G 13

FK 244 08 D2 PAK ... weight: 2.2g

8

8

10

art. no.

26

29,3 K/W

17,8

13

8

H

10

art. no.

13

FK 244 13 D2 PAK ... weight: 3.6g

M

N

8 31

18

26 K/W

22,8

please indicate:

13

18 22,8

19,5 K/W

31

... packing (optional) TR = tape and reel

surface:

solderable surface

material:

copper (Cu)

material thickness:

0.6 mm

C 21

10

8

art. no.

FK 244 13 D3 PAK ... weight: 3.9g

L

10

art. no.

FK 244 08 D3 PAK ... weight: 2.5g

K

22,8 K/W

8

I

26 17,8

Heatsink profile-overview Assignment table Finger-shaped heatsinks Heatsinks for transistors

   

A 13 – 17 A 18 – 20 C2–3 C4–9

Attachable heatsinks Heatsinks for TO 5 and TO 18 Thermal conductive material Technical introduction

   

C 10 – 16 C 17 – 19 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heatsinks for D PAK and others – tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350 – tape width: 24 mm, reel diameter: 330 mm, quantity: FK 251 06 = 450, FK 251 08 = 350, FK 251 10 = 250

B

FK 250 06 LF PAK ... weight: 1g

7 11,4

8

4,5 6,5

art. no.

15

37 K/W

C

6 8

8

art. no.

FK 250 08 LF PAK ... weight: 1.1g

7 11,4

15

34,8 K/W

D 15

7 11,4

FK 250 10 LF PAK ... weight: 1.2g

8

8 10

art. no.

28,8 K/W

E

4,5 6,5

13

art. no. 7 11,4

FK 251 06 LF PAK ... weight: 1.3g

15

32 K/W

F

6 8

13

art. no. FK 251 08 LF PAK ... weight: 1.4g

7 11,4

29,8 K/W

15

G

FK 251 10 LF PAK ... weight: 1.5g please indicate:

7 11,4

13

8 10

art. no.

15

24 K/W

H

... packing (optional) TR = tape and reel

surface:

solderable surface

material:

copper (Cu)

material thickness:

0.6 mm

I

art. no.

15,24

0,6

19,38

11,43

11 K/W

19,38

25,4

FK 256 surface:

solderable surface

material:

aluminium

material thickness:

0.6 mm

K

11,43

L

M Heatsink profile-overview Assignment table Finger-shaped heatsinks Heatsinks for transistors

   

A 13 – 17 A 18 – 20 C2–3 C4–9

Attachable heatsinks Heatsinks for TO 5 and TO 18 Thermal conductive material Technical introduction

   

C 10 – 16 C 17 – 19 E 2 – 24 A2–8

C 22

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Segment cooling aggregates Miniature cooling aggregates Hollow fin cooling aggregates High performance heatsinks

Segment cooling aggregates – modular assembly consisting of different circle- and length segments – electrical and thermal insulation of the single cooling segment sections – standard drilling patterns TO 3 and pressfit – segment profile also sold by the meter – other fan types and fan voltages upon request

Miniature cooling aggregates – compact construction for dissipating high power losses on smallest installation space – heatsink geometries and fixed length optimal adjusted to the fan being used – homogeneous heat dissipation – mounting of the semi-conductor by means of sliding nut chanels or specific snap-to-retaining springs for transistors

Hollow fin cooling aggregates – flow-optimized hollow fin geometry – precise milled flat semiconductor mounting surface, single- and double-sided – laminar airflow and noise reduction by means of harmonized chamber systems – additional treatments, modifications and designs according to customers specifications

High performance heatsinks – exclusive for forced convection – for radial- and tangential fans – flow-optimized design, best heat dissipation by means of especially thick bottom plates – precise milled flat semiconductor mounting surfaces – mechanical treatments, special designs and surface coating for your application


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Order example (see drawing on the right) Semiconductor cooling package, consisting of 4 heatsinks LA 1 -2 A (segment C), 1 heatsink LA 1 - 8 A (segment D), 8 heatsinks LA 1 - 1 A (segment E) and 2 heatsinks LA 1- 4 A (segment F). Total dissipation 1280 W.

A

B

How to tick off? C F 1. Tick on the left hand side the circles corresponding to an eight element long package, D E and also at the end of each row of the segments C, D, E and F to define the length. 2. For segment C: 4 marks for four double length elements, insulated from each other. This indicates 4 units LA 1 - 2. 3. For segment D: 1 mark for one single length of heatsink, 290.5 mm long. This indicates 1 unit LA 1 - 8. 4. For segment E: 8 marks for 8 elements of the standard length (35 mm) each insulated from the other. This indicates 8 units LA 1 - 1. 5. For segment F: 2 marks for each two heatsinks of 144.5 mm length, each insulated from the other. This indicates 2 units LA 1 - 4. 6. For each segment the profile types, either A or B, must be indicated for aggregate LA 1. 7. In the rectangle corresponding to the heatsink elements, the pin layouts for the transistor should also be indicated. 8. In the order form please indicate whether the cooling-aggregate is to be supplied with a fan and whether this is equipped with a protection-grid, or if it is to be supplied without a fan.

C

D

Upon request, it is possible to supply fans for special voltages and higher temperatures.

LA 1

LA 2

E

le

date: pieces p. order:

r rde

company:

p m a x

e

O

name/dept.: town:

F

street: signature: with fan

length units: mm

35.0

71.5

108.0

144.5

181.0

217.5

254.0

290.5

327.0

1

2

3

4

5

6

7

8

9

363.5 10

segment:

...... Volt

230 Volt

protection grid without fan

voltage: ~ =

segment:

segment:

segment:

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 Fassung TO-3 Lochung Preßfit-Bohrg.

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

C

F

D

E

G

cable connection

C

D

E

H

I

The segment-line C-D-E-F is shown against air-escape orifice, thus on the other side of the axial fan. From this view also tick off cable terminal with axial fan.

K

L

M

F

Please check off here total length of the cooling aggregate.

POB 1590 Nottebohmstraße 28 Tel.: +49 (0) 23 51 / 4 35-0

D - 58465 Lüdenscheid D - 58511 Lüdenscheid Fax: +49 (0) 23 51 / 4 57 54

info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik

D2

N


A

B

tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Order / inquiry LA 1

LA 2

date: pieces p. order: company:

C

name/dept.: town: street: signature:

D

E

with fan

length units: mm

35.0

F

71.5

108.0

1

2

3

G 144.5

H

181.0

217.5

4

5

6

I 254.0

K

290.5

327.0

L

7

8

9

363.5 10

segment:

N

voltage: ~ =

segment:

segment:

segment:

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 Fassung TO-3 Lochung Preßfit-Bohrg.

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

C

F

D

E cable connection

C M

...... Volt

230 Volt

protection grid without fan

D

E

The segment-line C-D-E-F is shown against air-escape orifice, thus on the other side of the axial fan. From this view also tick off cable terminal with axial fan.

F

Please check off here total length of the cooling aggregate.

D3

POB 1590 Nottebohmstraße 28 Tel.: +49 (0) 23 51 / 4 35-0

D - 58465 Lüdenscheid D - 58511 Lüdenscheid Fax: +49 (0) 23 51 / 4 57 54

info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Order / inquiry LA 1

LA 2

A

B

date: pieces p. order: company: name/dept.:

C

town: street: signature: with fan

length units: mm

35.0

71.5

108.0

144.5

181.0

217.5

254.0

290.5

327.0

1

2

3

4

5

6

7

8

9

363.5 10

segment:

D

...... Volt

230 Volt

protection grid without fan

voltage: ~ =

segment:

segment:

segment:

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 Fassung TO-3 Lochung Preßfit-Bohrg.

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

Typ. A B TO-3 holder TO-3 hole pressfit hole

C

F

D

E

E

cable connection

C

D

E

F

G The segment-line C-D-E-F is shown against air-escape orifice, thus on the other side of the axial fan. From this view also tick off cable terminal with axial fan.

I

K

L

F M

Please check off here total length of the cooling aggregate.

POB 1590 Nottebohmstraße 28 Tel.: +49 (0) 23 51 / 4 35-0

D - 58465 Lüdenscheid D - 58511 Lüdenscheid Fax: +49 (0) 23 51 / 4 57 54

H

info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik

D4

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Segment cooling aggregates A-Type

B-Type

84

42 58,5

6,5

48

,7 62

B

35

C

58,5 170 129 105

[mm WS ] 9

p

Y 38

119

86

8

80

7

70

6

60

5

50

4

40

3

30

2

20

1

10

35

[INCHES H2 O]

30

D 129 105

[PA] 90

60 Hz 50 Hz 25

20

15

10

E

05

20

40

60

80

100

[CFM]

0

1,5

0

F

G

H

I

LA LA LA LA LA

1 1 1 1 1

01 02 03 04 05

0

100

art. no.

L [mm]

... ... ... ... ...

35.0 71.5 108.0 144.5 181.0

dim. [mm] X Y 26.0 88.6 62.5 125.1 99.0 161.6 135.5 198.1 172.0 234.6

art. no. LA LA LA LA LA

40

60

80 100 120 140 160 180 200 . [m33/h] /h] VV[m

7,5

X 6,2

20

1 1 1 1 1

06 07 08 09 10

... ... ... ... ...

0,5

1

L [mm] 217.5 254.0 290.5 327.0 363.5

1,5

2

2,5

3 . 3 3 /min] V [m V [m /min]

dim. [mm] X Y 208.5 271.1 245.0 307.6 281.5 344.1 318.0 380.6 354.5 417.1

... for A-types: please add an "A", for B-types: please add a "B". L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan 24 V DC fan on request In case of order please use order form. segments also available in meter length: art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 1 1000 B Other fan types and fan voltages on request. Technical data of the fans ... 230

K

L

type

ebmpapst, ball bearing

dimensions

119x119x38 mm

tension

230 V AC

power inout

19 W

max. air volume

160 m3/h

temperature range

-40°C... +85°C

noise level

47 dB(A)

speed

2,650 min-1

weight

550 g

failure rate (L10)

L10 < 37,500 h (40°C)

M

N

D5

Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile

   

D 9 – 11 D 36 E 2 – 29 D 30

Order example Order form Mounting parts for heatsinks Technical introduction

   

D2 D3–4 E 49 – 50 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Thermal resistance LA 1 The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the „A“-type. When using „B“-types this value increases by 3 %.

B

K/W

1. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A. Total dissipation 160 W.

C

K/W

2. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A and 2 x 1 heatsink LA 1 - 2 A. Total dissipation 320 W.

D

E K/W

3. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A, 2 heatsinks LA 1 - 2 A and 2 x 1 heatsink LA 1 - 4 A. Total dissipation 640 W.

F

G

K/W

4. Cooling aggregate consisting of 6 heatsinks LA 1 - 1 A, 3 heatsinks LA 1 - 2 A and 2 x 1 heatsink LA 1 - 6 A. Total dissipation 960 W.

H K/W

5. Cooling aggregate consisting of 8 heatsinks LA 1 - 1 A, 4 heatsinks LA 1 - 2 A, 2 heatsinks LA 1 - 4 A and 1 heatsink LA 1 - 8 A. Total dissipation 1280 W.

I

K K/W

6. Cooling aggregate consisting of 10 heatsinks LA 1 – 1 A, 2 heatsinks LA 1 – 5 A, and 2 x 1 heatsink LA 1 – 10 A. Total dissipation 1600 W.

L

M Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile

   

D 9 – 11 D 36 E 2 – 29 D 30

Order example Order form Mounting parts for heatsinks Technical introduction

   

D2 D3–4 E 49 – 50 A2–8

D6

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Segment cooling aggregates 72,5 22

B

45,5

33,8

30

C 148 100

38

Y

92

100 72

D

E 75

. V [m3/h]

5

X

M4 . V [m3/min]

art. no.

F

G

LA LA LA LA LA

2 2 2 2 2

01 02 03 04 05

L [mm]

... ... ... ... ...

35.0 71.5 108.0 144.5 181.0

dim. [mm] X 54.2 90.7 127.2 163.7 200.2

art. no.

Y 92.0 128.5 165.0 201.5 238.0

LA LA LA LA LA

2 2 2 2 2

06 07 08 09 10

... ... ... ... ...

L [mm] 217.5 254.0 290.5 327.0 363.5

dim. [mm] X 236.7 273.2 309.7 346.2 382.7

Y 274.5 311.0 347.5 384.0 420.5

L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan

H

24 V DC fan on request In case of order please use order form. segments also available in meter length: art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 2 1000 B Other fan types and fan voltages on request. Technical data of the fans

I

K

L

... 230 type

ebmpapst, ball bearing

dimensions

92x92x38 mm

tension

230 V AC

power inout

12 W

max. air volume

75 m3/h

temperature range

-40°C... +75°C

noise level

37 dB(A)

speed

2,700 min-1

weight

420 g

failure rate (L10)

L10 < 52,500 h (40°C)

M

N

D7

Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile

   

D 9 – 11 D 36 E 2 – 29 D 30

Order example Order form Mounting parts for heatsinks Technical introduction

   

D2 D3–4 E 49 – 50 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Thermal resistance LA 2 The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the „A“-type. K/W

B

1. Cooling aggregate consisting of 4 heatsinks LA 2 - 1. Total dissipation 160 W maximal.

C

K/W

2. Cooling aggregate consisting of 4 heatsinks LA 2 - 1 and 2 x 1 heatsink LA 2 - 2. Total dissipation 320 W.

D

E K/W

3. Cooling aggregate consisting of 4 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 2 and 2 x 1 heatsink LA 2 - 4. Total dissipation 640 W.

F

G

K/W

4. Cooling aggregate consisting of 6 heatsinks LA 2 - 1, 3 heatsinks LA 2 - 2 and 2 x 1 heatsink LA 2 - 6. Total dissipation 960 W.

H K/W

5. Cooling aggregate consisting of 8 heatsinks LA 2 - 1, 4 heatsinks LA 2 - 2, 2 heatsinks LA 2 - 4 and 1 heatsink LA 2 - 8. Total dissipation 1280 W.

I

K K/W

6. Cooling aggregate consisting of 10 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 5, and 2 x 1 heatsink LA 2 - 10. Total dissipation 1600 W.

L

M Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile

   

D 9 – 11 D 36 E 2 – 29 D 30

Order example Order form Mounting parts for heatsinks Technical introduction

   

D2 D3–4 E 49 – 50 A2–8

D8

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Miniature cooling aggregates made for dissipation of high power within a very small space approximate length is optimised to the fan motor slide-nut channels for M3 nuts for mounting the transistors and circuit boards other fan types and fan voltages on request

art. no.

C

1

50 25

4

75 3,5

B

– – – –

3,1 5,5

50

15

D

75

140 mm 0,3 K/W

LAM 1 art. no.

11

100 mm

32

F

50

13

1

32

4

50 3,5

E

3,1 5,5

0,73 K/W

LAM 2

G

surface:

natural colour anodised

Technical data of the fans

H

I

LAM 1

LAM 2

type

ebmpapst 612 NHH-118

ebmpapst 412 F

dimensions

60x60x25 mm

40x40x10 mm

tension

12 V DC

12 V DC

power inout

2.9 W

0.7 W

max. air volume

56

temperature range

-20°C... +70°C

-20°C... +70°C

m3/h

8 m3/h

noise level

41 dB(A)

22.1 dB(A)

speed

6,800 min-1

5,400 min-1

weight

66 g

17 g

failure rate (L10)

L10 < 60,000 h (40°C)

L10 < 45,000 h (20°C)

K

L

M

N

D9

Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat.

   

A 115 – 117 A 137 – 138 D 15 – 25 D 26 – 35

Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction

   

A 131 – 133 D 36 E 5 – 15 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Miniature cooling aggregates compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customer´s requirements other surfaces treatment, fan types and fan voltages on request 0,15 4 x

art. no.

3

3

24 30

LAM 3 ... please indicate:

surface:

Rth [K/W] 1,6 1,4 1,2 1,0 0,8 10

...

25 50

C 5 V DC 12 V DC 75 100 125 150 [mm]

... fan type 5 = 5 V DC 12 = 12 V DC

50 75 100 125 150 mm

with grooves for lock-in retaining spring for transistors THFU ➔ A 119 compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customers requirements other surfaces treatment, fan types and fan voltages on request

art. no.

F Rth [K/W] 1,6 1,4 1,2 1,0 0,8

20 24 30

0,1 2 x

24 30

... 50 75 100 125 150 mm

surface:

E

0,15 2 x

3

LAM 3 K ... please indicate:

D

natural colour anodised

3

– – – – – – –

B

24 30

– – – – – –

10

25 50

5 V DC 12 V DC

G

75 100 125 150 [mm]

... fan type 5 = 5 V DC 12 = 12 V DC

H

natural colour anodised

Technical data of the fans ... 5

... 12

type

Sepa, ball bearing

Sepa, ball bearing

dimensions

30x30x10 mm

30x30x10 mm

tension

5 V DC

12 V DC

max. air volume

6.8

cur. consumpt.

130 mA

70 mA

temperature range

-10°C... +70°C

-10°C... +70°C

noise level

21 dB(A)

23 dB(A)

speed

8,500 min-1

9,100 min-1

weight

8g

8g

failure rate (L10)

L10 < 95,000 h (20°C) MTBF < 280,000 h (20°C)

L10 < 95,000 h (20°C) MTBF < 280,000 h (20°C)

m3/h

I

7.7 m3/h

K

L

M Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat.

   

A 115 – 117 A 137 – 138 D 15 – 25 D 26 – 35

Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction

   

A 131 – 133 D 36 E 5 – 15 A2–8

D 10

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Miniature cooling aggregates

B

– – – – – –

compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customer´s requirements other surfaces treatment, fan types and fan voltages on request

art. no.

0,15 4 x 3

3

40

32 40

C

D

32 40

LAM 4 ...

20 (25)

...

please indicate:

... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC

50 75 100 125 150 mm

E

F

surface: – – – – – – –

natural colour anodised

with grooves for lock-in retaining spring for transistors THFU ➔ A 119 compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customer's requirements other surfaces treatment, fan types and fan voltages on request

art. no.

0,15 2 x

32 40

LAM 4 K ...

20 (25)

...

please indicate:

surface:

Rth [K/W] 1,6 1,4 1,2 5 V DC 1,0 0,8 12 V DC 24 V DC 0,6 0,4 25 50 75 100 125 150 [mm]

... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC

50 75 100 125 150 mm

I

40

G

3 26,5 32 40

0,1 2 x

3

H

Rth [K/W] 1,6 1,4 1,2 5 V DC 1,0 0,8 12 V DC 24 V DC 0,6 0,4 25 50 75 100 125 150 [mm]

natural colour anodised

Technical data of the fans ... 5

K

L

... 24

type

ebmpapst 405

ebmpapst 412 JHH

ebmpapst 414 JHH

dimensions

40x40x20 mm

40x40x25 mm

40x40x25 mm

tension

5 V DC

12 V DC

24 V DC

power inout

0.9 W

3.3 W

3.6 W

max. air volume

10 m3/h

24 m3/h

24 m3/h

temperature range

-20°C... +70°C

-20°C... +60°C

-20°C... +60°C

noise level

18 dB(A)

46 dB(A)

46 dB(A)

speed

6,000 min-1

13,000 min-1

13,000 min-1

weight

27 g

50 g

50 g

failure rate (L10)

L10 < 50,000 h (40°C) L10 < 20,000 h (tmax)

L10 < 57,500 h (40°C) L10 < 35,000 h (tmax)

L10 < 57,500 h (40°C) L10 < 35,000 h (tmax)

M

N

... 12

D 11

Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat.

   

A 115 – 117 A 137 – 138 D 15 – 25 D 26 – 35

Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction

   

A 131 – 133 D 36 E 5 – 15 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Miniature cooling aggregates compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customer´s requirements other surfaces treatment, fan types and fan voltages on request 4,5

4,5

please indicate:

0,15 4 x

42 50

LAM 5 ...

25 50

C 5 V DC 12 V DC 24 V DC 75 100 125 150 [mm]

E

natural colour anodised

with grooves for lock-in retaining spring for transistors THFU ➔ A 119 compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customer´s requirements other surfaces treatment, fan types and fan voltages on request 0,2 4 x

42 50

LAM 5 K ... please indicate:

10 (15)

...

25 50

5 V DC

G

12 V DC 24 V DC 75 100 125 150 [mm]

... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC

50 75 100 125 150 mm

surface:

Rth [K/W] 1,4 1,2 1,0 0,8 0,6 0,4 0,2

27,1

4,5

42 50

4,5

F

50

art. no.

D

... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC

50 75 100 125 150 mm

– – – – – – –

Rth [K/W] 1,4 1,2 1,0 0,8 0,6 0,4 0,2

10 (15)

...

surface:

B

50

art. no.

42 50

– – – – – –

H

natural colour anodised

I

Technical data of the fans ... 5

... 12

... 24

type

Sepa, ball bearing

Sepa, ball bearing

ebmpapst

dimensions

50x50x10 mm

50x50x10 mm

50x50x15 mm

tension

5 V DC

12 V DC

24 V DC

max. air volume

10 m3/h

14.3 m3/h

20 m3/h

temperature range

-10°C... +70°C

-10°C... +70°C

-20°C... +70°C

speed

3,400 min-1

4,800 min-1

5,000 min-1

noise level

17 dB(A)

22 dB(A)

30 dB(A)

weight

19 g

19 g

27 g

failure rate (L10)

L10 < 95,000 h (20°C) MTBF < 280,000 h (20°C)

L10 < 95,000 h (20°C) MTBF < 280,000 h (20°C)

L10 50,000 h (20°C)

alarm output

with

with

K

L

M Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat.

   

A 115 – 117 A 137 – 138 D 15 – 25 D 26 – 35

Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction

   

A 131 – 133 D 36 E 5 – 15 A2–8

D 12

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Heatsink-cooling aggregates

B

– – – –

with grooves for lock-in retaining springs THFU ➔ A 119 screw-in solder pin M 3 (art. no.: ELS 3) different lengths, special designs and machinings according to customer specifications different surfaces, fan types and fan voltages upon request 75,5 50

art. no.

12 V DC 24 V DC

Rth [K/W]

C

2,0

50

1,2 0,8

29,5

65,8

1,6

D

50 57,5

LA 27 K ... please indicate:

... 50 75 84 94 100 125 150 mm

E

F

G

0,4 50

100

150

200 [mm]

... fan type 12 = 12 V DC 24 = 24 V DC

Technical data of the fans ... 12

... 24

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

60x60x25 mm

60x60x25 mm

tension

12 V DC

24 V DC

power inout

2.9 W

2.9 W

max. air volume

56

temperature range

-20°C... +70°C

-20°C... +70°C

noise level

41 dB(A)

41 dB(A)

m3/h

56 m3/h

speed

6,800

weight

66 g

66 g

failure rate (L10)

L10 < 60,000 h (40°C)

L10 < 60,000 h (40°C)

min-1

6,850 min-1

H

I

K

L

M

N

D 13

Cooling aggreg. in segment mount. Miniature cooling aggregates Protection grid for axial fans Thermal conductive material

   

D5–7 D 9 – 11 D 36 E 2 – 29

Extruded heatsinks Cooling aggregates with radial fan Heatsinks with hollow fin profile Technical introduction

   

A 22 – 83 D 33 – 35 D 30 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan Heatsink-cooling aggregates – – – – – –

especially suitable for IGBT, SSR, semiconductor modules, high performance transistors etc. effective construction with axial fans good thermal performance additional machining according to customer's instructions cooling aggregates also available without fans other fan types and fan voltages on request

B

C

art. no. 55 8

Rth [K/W]

119 105

1,0 0,8

D

0,6 0,4

230 V AC 24 V DC

0,2

105 119

LA 4 ...

50

100

150 [mm]

art. no.

E

Rth [K/W]

2

1,0

116

0,8

57

10,5

0,6 0,4 230 V AC 24 V DC

0,2 50

112

LA 5 ...

100

F

150 [mm]

* for one segment

please indicate:

...

... fan type 24 = 24 V DC 230 = 230 V AC

75 100 150 mm

G

Technical data of the fans ... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

119x119x38 mm

119x119x38 mm

tension

24 V DC

230 V AC

power inout

11 W

19 W

max. air volume

237 m3/h

160 m3/h

temperature range

-30°C ... +70°C

-40°C... +85°C

noise level

57 dB(A)

47 dB(A)

speed

4,400 min-1

2,650 min-1

weight

390 g

550 g

failure rate (L10)

L10 < 70,000 h (40°C)

L10 < 37,500 h (40°C)

H

I

K

L

M Cooling aggreg. in segment mount. Miniature cooling aggregates Protection grid for axial fans Thermal conductive material

   

D5–7 D 9 – 11 D 36 E 2 – 29

Extruded heatsinks Cooling aggregates with radial fan Heatsinks with hollow fin profile Technical introduction

   

A 22 – 83 D 33 – 35 D 30 A2–8

D 14

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Hollow-fin cooling aggregates

B

– – – – –

geometry of hollow fin opimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request

art. no.

≤ 0,1 100

≤ Rz10

C

12 V DC 24 V DC

Rth [K/W]

11,5 ±0,5

1,2 1,2

50

74 ±0,5

0,30 0,25 0,20 0,15

D

0,10

50 62 ±0,5

LA 6 ...

100

200

300 [mm]

without air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

12 V DC 24 V DC

Rth [K/W] 0,25

E 74 ±0,5

0,20 0,15 0,10

F

1,2 1,4

0,05

125 ±0,5

LA 7 ...

100

200

300 [mm]

without air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

12 V DC 24 V DC

Rth [K/W] 0,25

G

74 ±0,5

0,20 0,15 0,10 0,05

H

188 ±0,5

LA 8 ... please indicate:

...

K

L

200

300 [mm]

   

A 137 – 138 D 30 E 2 – 24 A2–8

... fan type 12 = 12 V DC 24 = 24 V DC

100 150 200 250 300 mm

I

100

without air flow chamber

Technical data of the fans ... 12

... 24

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

60x60x25 mm

60x60x25 mm

tension

12 V DC

24 V DC

power inout

2.9 W

2.9 W

max. air volume

56

temperature range

-20°C... +70°C

-20°C... +70°C

m3/h

56 m3/h

noise level

41 dB(A)

41 dB(A)

speed

6,800 min-1

6,850 min-1

weight

66 g

66 g

failure rate (L10)

L10 < 60,000 h (40°C)

L10 < 60,000 h (40°C)

M

N

D 15

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan Hollow-fin cooling aggregates – – – – –

geometry of hollow fin optimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request

B

art. no.

≤ 0,1 100

≤ Rz10

12 V DC 24 V DC

Rth [K/W] 0,30

C

74 ±0,5

60

74 ±0,5

50 11,5 ±0,5

0,25 0,20 0,15 0,10

50 62 ±0,5

LA V 6 ...

100

25

200

300 [mm]

D

30

with air flow chamber

art. no.

≤ Rz10

12 V DC 24 V DC

Rth [K/W] 0,20

≤ 0,1 100

E

0,16

74 ±0,5

0,12 0,08 0,04 100

125 ±0,5

LA V 7 ...

200

300 [mm]

with air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

F

12 V DC 24 V DC

Rth [K/W] 0,12 0,10

G

74 ±0,5

0,08 0,06 0,04

188 ±0,5

LA V 8 ...

100

200

300 [mm]

with air flow chamber

please indicate:

... 100 150 200 250 300 mm

H

... fan type 12 = 12 V DC 24 = 24 V DC

Technical data of the fans

I ... 12

... 24

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

60x60x25 mm

60x60x25 mm

tension

12 V DC

24 V DC

power inout

2.9 W

2.9 W

K

max. air volume

56

temperature range

-20°C... +70°C

-20°C... +70°C

m3/h

56

m3/h

noise level

41 dB(A)

41 dB(A)

speed

6,800 min-1

6,850 min-1

weight

66 g

66 g

failure rate (L10)

L10 < 60,000 h (40°C)

L10 < 60,000 h (40°C)

L

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 16

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Hollow-fin cooling aggregates

B

– – – – –

geometry of hollow fin opimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request

art. no. ±0,5

C

≤ Rz10

Rth [K/W]

≤ 0,1 100

0,30

±0,5

11,5

0,25 0,20

230 V AC

83

0,15 24V DC

0,10 0,05

D

+1

80 –0,5

LA 9 ...

100

200

300 [mm]

without air flow chamber

art. no.

≤ 0,1 100

±0,5

≤ Rz10

Rth [K/W]

11

0,20 ±0,5

0,18 0,14

83

E

0,10

230 V AC 24 V DC

0,06 0,02 +1,5

160 –1

100

300 [mm]

200

±0,5

without air flow chamber

art. no.

10

F

LA 10 ...

Rth [K/W]

≤ 0,1 100

≤ Rz10

0,12

±0,5

G

0,08

83

0,10

0,06

24V DC

0,04 +2

100

240 –0,5

LA 11 ...

H

230V AC

300 [mm]

200

without air flow chamber

please indicate:

...

... fan type 24 = 24 V DC 230 = 230 V AC

100 150 200 250 300 mm

Technical data of the fans

I

K

L

... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

80x80x32 mm

80x80x38 mm

tension

24 V DC

230 V AC

power inout

6W

12 W

max. air volume

80 m3/h

50 m3/h

temperature range

-20°C... 75°C

-40°C... +90°C

noise level

48 dB(A)

31 dB(A)

speed

5,000 min-1

2,800 min-1

weight

170 g

490 g

failure rate (L10)

L10 < 55,000 h (40°C)

L10 < 52,500 h (40°C)

M

N

D 17

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan Hollow-fin cooling aggregates geometry of hollow fin optimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request

B ≤ 0,1 100

≤ Rz10

83 ±0,5

11,5 ±0,5

Rth [K/W] 0,30

83 ±0,5

art. no.

80

– – – – –

C

0,25 0,20 0,15

230 V AC

0,10

24 V DC

+1

80 –0,5

LA V 9 ...

38

100

30

200

300 [mm]

with air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W] 0,25

83 ±0,5

11 ±0,5

0,20

E

0,15 0,10

230 V AC 24 V DC

0,05 +1,5

LA V 10 ...

D

100

160 –1

200

300 [mm]

with air flow chamber

art. no.

F

Rth [K/W]

≤ 0,1 100

≤ Rz10

0,12

83 ±0,5

10 ±0,5

0,10 0,08 0,06

230 V AC 24 V DC

0,04 +2

LA V 11 ...

100

240 –0,5

200

G

300 [mm]

with air flow chamber

please indicate:

... 100 150 200 250 300 mm

... fan type 24 = 24 V DC 230 = 230 V AC

H

Technical data of the fans

type

... 24

... 230

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

80x80x32 mm

80x80x38 mm

tension

24 V DC

230 V AC

power inout

6W

12 W

max. air volume

80

temperature range

-20°C... 75°C

m3/h

I

50 m3/h

K

-40°C... +90°C

noise level

48 dB(A)

31 dB(A)

speed

5,000 min-1

2,800 min-1

weight

170 g

490 g

failure rate (L10)

L10 < 55,000 h (40°C)

L10 < 52,500 h (40°C)

L

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 18

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Hollow-fin cooling aggregates

B

C

– – – – – –

extremly low losses due to optimised hollow fin geometry particularly effective heat dissipation compact design with axial fan milled flat semiconductor mounting surface addtional design to customer's intructions other fan types and fan voltages on request

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W] 0,25

±0,5

±0,5

15

D

120

0,20

0,10

230V AC 24V DC

0,05

120

LA 14 ...

E

0,15

100

±0,8

200

300 [mm]

without air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W] 0,10

±0,5

±0,5

0,06

120

15

0,08

0,04

F

230V AC 24V DC

0,02 +1,4

100

240 -1,2

LA 15 ...

200

300 [mm]

without air flow chamber

please indicate:

... 100 150 200 250 300 400 mm

G

... fan type 24 = 24 V DC 230 = 230 V AC

Technical data of the fans

H

I

K

... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

119x119x38 mm

119x119x38 mm

tension

24 V DC

230 V AC

power inout

11 W

19 W

max. air volume

237

temperature range

-30°C ... +70°C

-40°C... +85°C

noise level

57 dB(A)

47 dB(A)

speed

4,400 min-1

2,650 min-1

weight

390 g

550 g

failure rate (L10)

L10 < 70,000 h (40°C)

L10 < 37,500 h (40°C)

m3/h

160 m3/h

L

M

N

D 19

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan Hollow-fin cooling aggregates – – – – – –

extremly low losses due to optimised hollow fin geometry particularly effective heat dissipation compact design with axial fan milled flat semiconductor mounting surface addtional design to customer's intructions on request other fan types and fan voltages on request 15 ±0,5

art. no.

B

≤ Rz10

C

≤ 0,1 100 Rth [K/W]

0,20

120 ±0,5

119

120 ±0,5

0,25

0,15 0,10 230 V AC 24 V DC

0,05

120 ±0,8

LA V 14 ...

100

38 30

200

300 [mm]

with air flow chamber 15 ±0,5

art. no.

E

≤ 0,1 100

≤ Rz10

D

Rth [K/W] 0,10

120 ±0,5

0,08 0,06 230 V AC 24 V DC

0,04

F

0,02 100

+1,4

200

300 [mm]

240 –1,2

LA V 15 ...

G

with air flow chamber

please indicate:

... 100 150 200 250 300 400 mm

... fan type 24 = 24 V DC 230 = 230 V AC

H

Technical data of the fans ... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

119x119x38 mm

119x119x38 mm

tension

24 V DC

230 V AC

power inout

11 W

19 W

max. air volume

237 m3/h

160 m3/h

temperature range

-30°C ... +70°C

-40°C... +85°C

noise level

57 dB(A)

47 dB(A)

speed

4,400 min-1

2,650 min-1

weight

390 g

550 g

failure rate (L10)

L10 < 70,000 h (40°C)

L10 < 37,500 h (40°C)

I

K

L

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 20

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Hollow-fin cooling aggregates

B

C

– – – – – –

extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W] 0,15

0,09

10

±0,5

±0,5

0,12

120

230 V AC

D

0,06

±0,5

122

LA 17 ...

100

10

≤ Rz10

E

24 V DC

0,03 200

300 [mm]

≤0,1 100 ±0,8

without air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W]

±0,5

10 ±0,5

0,07

120

F

0,06 0,05 230 V AC

0,04 0,03 24 V DC

≤ Rz10

G

≤0,1 100

243

LA 18 ...

... 100 150 200 250 300 400 mm

I

K

100

200

300 [mm]

without air flow chamber

please indicate:

H

±1,5

10 ±0,5

0,02

... fan type 24 = 24 V DC 230 = 230 V AC

Technical data of the fans ... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

119x119x38 mm

119x119x38 mm

tension

24 V DC

230 V AC

power inout

11 W

19 W

max. air volume

237

temperature range

-30°C ... +70°C

-40°C... +85°C

noise level

57 dB(A)

47 dB(A)

speed

4,400 min-1

2,650 min-1

weight

390 g

550 g

failure rate (L10)

L10 < 70,000 h (40°C)

L10 < 37,500 h (40°C)

m3/h

160 m3/h

L

M

N

D 21

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan Hollow-fin cooling aggregates – – – – – –

extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request

art. no.

B

≤ Rz10

C

≤ 0,1 100 Rth [K/W]

≤ Rz10

120 ±0,5

119

0,09 230 V AC 24 V DC

0,06

10 ± 0,5

120 ±0,5

10 ±0,5

0,15 0,12

D

0,03

≤0,1 100

100

38 30

200

300 [mm]

122 ±0,8

LA V 17 ...

with air flow chamber

E 119

art. no.

F 38

30 ≤ 0,1 100

≤ Rz10

Rth [K/W] 0,06

±0,5

10 ±0,5

0,05 230 V AC

0,04

G

120

0,03 24 V DC

0,02

≤0,1 100

243

LA V 18 ...

±1,5

10 ±0,5

0,01

≤ Rz10

100

200

300 [mm]

H

with air flow chamber

please indicate:

... 100 150 200 250 300 400 mm

... fan type 24 = 24 V DC 230 = 230 V AC

I

Technical data of the fans ... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

119x119x38 mm

119x119x38 mm

tension

24 V DC

230 V AC

power inout

11 W

19 W

max. air volume

237

temperature range

-30°C ... +70°C

-40°C... +85°C

noise level

57 dB(A)

47 dB(A)

speed

4,400 min-1

2,650 min-1

weight

390 g

550 g

failure rate (L10)

L10 < 70,000 h (40°C)

L10 < 37,500 h (40°C)

m3/h

K

160 m3/h

L

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 22

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Hollow-fin cooling aggregates

C

– – – – – –

extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request

art. no.

9,5 ±0,5

B

≤ 0,1 100

≤ Rz10

Rth [K/W] 0,20

93 ±0,5

0,16

9,5 ±0,5

D

0,12 230 V AC 24 V DC

0,08

≤ Rz10

100

200

300 [mm]

≤0,1 100

92 ±0,8

E

LA 21 ...

without air flow chamber

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W]

±0,5

0,12

9

0,09

93

±0,5

0,15

F

230 V AC

0,06

24 V DC

≤0,1 100

184

G

LA 22 ...

I

K

100

200

300 [mm]

without air flow chamber ...

please indicate:

100 150 200 250 300 400 mm

H

±1,25

9

≤ Rz10

±0,5

0,03

... fan type 24 = 24 V DC 230 = 230 V AC

Technical data of the fans ... 24

... 230

type

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

92x92x32 mm

92x92x38 mm

tension

24 V DC

230 V AC

power inout

5W

12 W

max. air volume

107 m3/h

75 m3/h

temperature range

-20°C... 75°C

-40°C... +75°C

noise level

47 dB(A)

37 dB(A)

speed

4,000 min-1

2,700 min-1

weight

190 g

420 g

failure rate (L10)

L10 < 57,500 h (40°C)

L10 < 52,500 h (40°C)

L

M

N

D 23

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan Hollow-fin cooling aggregates extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request

art. no.

B

≤ 0,1 100

≤ Rz10

C

Rth [K/W] 0,20

9,5

±0,5

– – – – – –

92

±0,5

0,16

±0,5

93

0,12 230 V AC 24 V DC

9,5

0,08

≤ Rz10

92

LA V 21 ...

100

32 30 (38)

≤0,1 100

±0,8

200

D

300 [mm]

with air flow chamber

art. no. 92

E

32 (38)

30

F

≤ 0,1 100

≤ Rz10

Rth [K/W] 0,15

0,09

9

93

±0,5

±0,5

0,12

230 V AC

0,06

24 V DC

G

LA V 22 ...

±1,25

100

9

≤0,1 100

184

±0,5

0,03

≤ Rz10

200

300 [mm]

with air flow chamber

please indicate:

... 100 150 200 250 300 400 mm

H

... fan type 24 = 24 V DC 230 = 230 V AC

Technical data of the fans

type

I

... 24

... 230

ebmpapst, ball bearing

ebmpapst, ball bearing

dimensions

92x92x32 mm

92x92x38 mm

tension

24 V DC

230 V AC

power inout

5W

12 W

max. air volume

107 m3/h

75 m3/h

K

temperature range

-20°C... 75°C

-40°C... +75°C

noise level

47 dB(A)

37 dB(A)

speed

4,000 min-1

2,700 min-1

weight

190 g

420 g

failure rate (L10)

L10 < 57,500 h (40°C)

L10 < 52,500 h (40°C)

L

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 24

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with axial fan Hollow-fin cooling aggregates

C

– – – – – –

extremly low losses due optimised hollow fin geometry especially effective heat dissipation compact construction with axial fans two oposite mounting surfaces are miled flat additional treatment upon customer's request other fan types and fan voltages on request

art. no.

≤ 0,1 100

≤ Rz10

Rth [K/W]

12 ±0,5

B

0,08 0,07

D

0,05

Ø 150

158 ±0,5

12 ±0,5

0,06 0,04

230 V AC

0,03

24 V DC

0,02 0,01 200

≤ Rz10

E

155

LA V 24 ...

H

500 [mm]

38 30 (55)

±1

...

... fan type 24 = 24 V DC 230 = 230 V AC

200 300 400 mm

G

400

with air flow chamber

please indicate:

F

300

≤0,1 100

Technical data of the fans ... 24

... 230

type

ebmpapst, ball bearing, with grid

ebmpapst, ball bearing, with grid

dimensions

Ø150x38 mm

Ø150x55 mm

tension

24 V DC

230 V AC

power inout

19 W

47 W

max. air volume

420 m3/h

380 m3/h

temperature range

-25°C... +72°C

-30°C... +60°C

noise level

59 dB(A)

60 dB(A)

speed

3,350 min-1

2,700 min-1

weight

620 g

1,100 g

failure rate (L10)

L10 < 75,000 h (40°C)

L10 < 40,000 h (40°C)

I

K

L

M

N

D 25

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan High performance cooling aggregate

B

C

D extremely low losses of air flow as compared to cooling aggregates with extruded aluminium – compact dimensions, that means high performance density due to large heat-conducting surfaces – maximum heat flow due to brazing or thermal adhesion – high performance cooling aggregates are only effective with forced ventilation by means of the fan, but not with free convection – other fan types and fan voltages on request

E

material: solder-plated aluminium sheet, thus minimal weight due to the thickness of the material An optimised unit for any application can be produced from the wide range of existing components upon request. The specific capacity will be determined by a test run upon customer´s request.

F

Technical data of the fans ... 230 type

ebmpapst, ball bearing

dimensions

119x119x38 mm

tension

230 V AC

power inout

19 W

max. air volume

160 m3/h

temperature range

-40°C... +85°C

noise level

47 dB(A)

speed

2,650 min-1

weight

550 g

failure rate (L10)

L10 < 37,500 h (40°C)

G

H

I

K

L

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 26

N


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A Cooling aggregates with axial fan High performance cooling aggregate

B

150 mm

LA HL 1 ... 3

v = 6 m/s

v = 6 m/s

Rth [K/W]

Rth [K/W] 0,18

0,075

0,14

+ 0,061

115

C

+ 0,096

119

0,100

0,10

0,050 0,025

1 2

0,06

+ 0, 28

0,02 1

D

2

3

38

1050 max.

129 ± 1 104,8 Rz16 0,2 100

art. no.

3 50 100 150 200 250 [mm]

150 mm Rth [K/W] 0,18

0,10

ca. 6

115 ± 1

104,8

0,14

E

0,06 0,02 1

F

Rz16

ca. 2

LA HL 1 ...

2

3

4

6 v [m/s]

5

0,2 100

without air flow chamber

art. no.

33,2 104,8

258 ± 1 104,8 0,2 100

Rz16

ca. 6

104,8

115 ± 1

G

H Rz16

ca. 2

LA HL 2 ...

0,2 100

without air flow chamber

art. no. 104,8

0,3 100

ca. 6

Rz16

104,8

115 ± 1

I

387 ± 1,5 29,2

K Rz16

ca. 2

LA HL 3 ...

L

please indicate:

0,3 100

without air flow chamber ... 100 150 200 250 300 400 mm

M

N

D 27

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with axial fan High performance cooling aggregate 150 mm

LA HL V 1 ... 3

v = 6 m/s

Rth [K/W]

Rth [K/W] 0,18

+ 0,09

0,075 + 0,059

0,050

0,14

115

119

0,100

0,10 1 2

0,06

+ 0,027

0,025

B

v = 6 m/s

30

0,02 1

2

3

3 50 100 150 200 250 [mm]

1050 max.

38

art. no.

129 ± 1 104,8 Rz16

C

D

150 mm

0,2 100

Rth [K/W] 0,18

115 ± 1 104,8

0,14

E

ca. 6

0,10 0,06 0,02 1

Rz16

ca. 2

LA HLV 1 ...

2

3

4

0,2 100

5 6 v [m/s]

F

with air flow chamber

art. no. 104,8

33,2

258 ± 1 104,8 0,2 100

Rz16

ca. 6

115 ± 1 104,8

G

H ca. 2

LA HLV 2 ...

Rz16

0,2 100

with air flow chamber

art. no. 104,8

387 ± 1,5 29,2

115 ± 1 104,8

K ca. 2

LA HLV 3 ... please indicate:

I

0,3 100

ca. 6

Rz16

Rz16

0,3 100

with air flow chamber

L

... 100 150 200 250 300 400 mm

M Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8

D 28

N


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A Cooling aggregates with axial fan High performance cooling aggregate

B

C

– – – – – – –

innovative, efficient heatsink design thick multiwall sheets for maximum heat dissipation specially formed laminated structures ensure optimum heat exchange with the air flow powerful mixed axial fan for highly effcient heat dissipation reduced noise output achieved by an optimised adaption of fan and heatsink additional treatment and modifications upon customer's request double and triple versions upon request

art. no.

Rth [K/W] 0,10 0,08 0,06 0,04 0,02 0

D

12 V DC 24 V DC 100

200

300 [mm]

129 ± 1 104,8 Rz16 0,2 100

F

LAHL D 1 ...

I

115

119 38

...

... fan type 12 = 12 V DC 24 = 24 V DC

100 150 200 250 300 400 mm

H

1050 max.

0,2 100

ca. 2

please indicate:

G

115 ± 1

104,8 Rz16

ca. 6

E

30

Technical data of the fans ... 12

... 24

type

ebmpapst, ball bearing, with grid

ebmpapst, ball bearing, with grid

dimensions

119x119x38 mm

119x119x38 mm

tension

12 V DC

24 V DC

power inout

21 W

19.5 W

max. air volume

310

temperature range

-20°C... +65°C

-20°C... +65°C

m3/h

310 m3/h

noise level

65 dB(A)

65 dB(A)

speed

6,000 min-1

6,000 min-1

weight

390 g

390 g

failure rate (L10)

L10 > 60,000 h (40°C) L10 > 37,500 h (tmax)

L10 > 65,000 h (40°C) L10 > 37,500 h (tmax)

K

L

M

N

D 29

Miniature cooling aggregates  Protection grid for axial fans  Drilling pattern for Solid State Relais  High capacity heatsinks 

D 9 – 11 D 36 A 12 A 57 – 58

Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction

   

A 137 – 138 D 30 E 2 – 24 A2–8


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A

High-performance heatsinks High performance heatsinks with hollow-fin profile – – – – – –

high performance heatsinks for fan operation exclusively for forced convection preferably for radial or tangential fans hollow fin geometry optimises the air flow particularly effective heat dissipation milled flat base (except length 1000 mm)

B

art. no.

17

64

84 ± 0,5

8

≤ Rz10

0,08 0,07 0,06 0,05 0,04 0,03 0,02 0,01

D

≤0,1 100

SK 497 ...

100

5,2

165 ± 1

art. no.

200

300

400 [mm]

E

Rth [K/W] v = 5 m/s

15

60

75 76 ± 0,5

6,5

≤ Rz10

≤0,1 100

SK 498 ... please indicate:

C

Rth [K/W] v = 5 m/s

0,08 0,07 0,06 0,05 0,04 0,03 0,02 0,01

5

F 100

200

300

215 ± 1,2

400 [mm]

...

... surface SA = black anodised AL = raw degreased aluminium

150 200 250 300 1000 mm

8,5

G

v = 5 m/s Rth [K/W]

H

0,08 0,07

0,05 71

A

0,06

0,04

SK 440 SK 458 SK 441 SK 461

0,03 C

0,02

I

0,01 6

B

100

art. no. SK SK SK SK

440 458 441 461

number of fins

... ... ... ...

please indicate:

A 84 ±1 84 ±1 84 ±1 88 ±1

15 19 23 31 ...

150 200 300 1000 mm

200

300

[mm]

K

dim. [mm] B 200 ±1.2 250 ±1.4 300 ±1.6 400 ±2

C 16 16 16 20

L

... surface SA = black anodised AL = raw degreased aluminium

M High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates

   

D D D D

26 33 30 15

– – – –

29 35 31 25

Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction

   

D 14 D5 D 9 – 11 A2–8

D 30

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A High performance heatsinks with hollow-fin profile

B

– – – – –

high capacity heatsinks for fan operation preferably for radial- or tangential fan motors universal modular design exclusively for forced convection flow-optimized hollow fin geometry minimum order quantity: 1000 kg, samples on request

5

5

70

62

52

43

D

F

SK SK SK SK SK SK

603 604 605 606 607 608

5

5

5

G

23

5

number of fins

... ... ... ... ... ...

please indicate:

20 A

art. no.

E

81,5

112

C

dim. [mm] A 200 250 300 350 400 500

25 32 39 45 52 65 ... fin height 430 = 43 mm 520 = 52 mm 620 = 62 mm 700 = 70 mm 815 = 81.5 mm 1120 = 112 mm

...

... surface SA = black anodised ME = clear anodised

200 300 400 500 mm

SK 603

H

Rth [K/W]

v = 11 m/s

0,06 0,05 0,04

I

SK 603 430 SK 603 520 SK 603 620 SK 603 700 SK 603 815 SK 603 1120

0,03 0,02 0,01 100

K

150

200

250

300

350

400

450

500 [mm]

SK 604 Rth [K/W]

v = 11 m/s

0,05

L

0,04 SK 604 430 SK 604 520 SK 604 620 SK 604 700 SK 604 1120

0,03 0,02 0,01

M

100

150

200

250

300

350

SK 604 815

400

500 [mm]

N

D 31

High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates

   

D D D D

26 33 30 15

– – – –

29 35 31 25

Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction

   

D 14 D5 D 9 – 11 A2–8


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A

High performance heatsinks with hollow-fin profile SK 605 Rth [K/W]

B

v = 11 m/s

0,040 0,035 0,030

C

0,025 0,020

SK 605 430 SK 605 520 SK 605 620 SK 605 700 SK 605 815 SK 605 1120

0,015 0,010 100

150

200

250

300

350

400

450

D

500 [mm]

SK 606 Rth [K/W]

v = 11 m/s

E

0,035 0,030 0,025 0,020 SK 606 430 SK 606 520 SK 606 620

0,015 0,01 100

150

200

250

300

350

SK 606 1120 450 400

F

SK 606 700 SK 606 815 500

[mm]

SK 607 Rth [K/W]

G

v = 11 m/s

0,020

SK 607 430 SK 607 520 SK 607 620 SK 607 815 SK 607 1120

0,015 0,010 0,005 200

250

300

350

400

450

500

550

H

SK 607 700

600

[mm]

SK 608 Rth [K/W]

I

v = 11 m/s

0,016 0,014

K

0,012 SK 608 430

0,010 0,008 0,006 200

250

300

350

400

450

SK 608 520 SK 608 620 SK 608 700 SK 608 815 SK 608 1120 500 550

L

600 [mm]

M High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates

   

D D D D

26 33 30 15

– – – –

29 35 31 25

Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction

   

D 14 D5 D 9 – 11 A2–8

D 32

N


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A Cooling aggregates with radial fan High performance cooling aggregate

B

C

– – – – – – –

optimised air flow due to hollow fin geometrie very good thermal performance optimized high performance construction with radial fan milled flat mounting surface for semiconductor cover plate for fin side upon request additional customized treatment upon request fan condenser: art. no. LAHLR K 2

art. no.

Rth [K/W] 0,10 0,08 0,06 0,04 0,02

D 11 ±0,5

100 200 300 400 500 600 [mm]

1000 max.

162

160 +1,5 –1

LA 25 ...

F

165 83 ±0,5

E

≤ 0,1 100

≤ Rz10

art. no.

Rth [K/W] 0,08 0,06 0,04 0,02

G

≤ 0,1 100

≤ Rz10

84 ±0,5

165

17 ±0,5

100 200 300 400 500 600 [mm]

H 165 ±0,5

LA 26 ... please indicate:

162

1000 max.

...

I

200 300 400 500 600 mm Technical data of the fans ... 230

K

L

M

N

type

ebmpapst, radial blower with grid, double sided absorbtion

bearing type

ball bearing

discharge air flow

435 m3/h

rotation speed

1,950 min-1

power inout

87 W

current consumption

0.39 A

temperature range

-25°C... +40°C

circuit voltage

230 V AC

motor condenser

2 µF/400 V

noise level

58 dB(A)

weight

1,500 g

D 33

Drilling pattern for Solid State Relais  Mounting for TO 3 angle  High capacity heatsinks  Cooling aggreg. in segment mount. 

A 12 A 125 – 128 A 57 – 58 D5–7

Miniature cooling aggregates heatsinks for Solid State Relais Hole pattern Technical introduction

   

D 9 – 12 135 – 136 A 21 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Cooling aggregates with radial fan High performance cooling aggregate – – – – – – –

optimised air flow due to hollow fin geometrie very good thermal performance optimized high performance construction with radial fan milled flat mounting surface for semiconductor cover plate for fin side upon request additional customized treatment upon request fan condenser: art. no. LA 20 K 6

B

art. no.

C

Rth [K/W] 0,035 0,025

D

0,015 0,005 100

200

300

400

600 [mm]

500

276

LA 20 ... please indicate:

300

≤ Rz10

241

126 ±1,6

27 ±1

E

±1,6

225

≤ 0,1 100

F

(1000 max.)

... 200 300 400 500 600 mm

G

Technical data of the fans ... 230 bearing type

ball bearing

type

ebmpapst, radial blower with grid, double sided absorbtion

discharge air flow

1,310 m3/h

rotation speed

1,350 min-1

power inout

185 W

current consumption

0.81 A

circuit voltage

230 V AC

temperature range

-25°C... +70°C

motor condenser

6 µF

noise level

64 dB(A)

weight

5,900 g

H

I

K

L

M Drilling pattern for Solid State Relais  Mounting for TO 3 angle  High capacity heatsinks  Cooling aggreg. in segment mount. 

A 12 A 125 – 128 A 57 – 58 D5–7

Miniature cooling aggregates heatsinks for Solid State Relais Hole pattern Technical introduction

   

D 9 – 12 135 – 136 A 21 A2–8

D 34

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Cooling aggregates with radial fan High performance cooling aggregate

B

– other lengths upon request – fan condenser: art. no. LAHLR K 2

art. no.

Rth [K/W] 0,09

0,07

C

0,05 100 200 300

500

600 [mm]

≤ Rz16

0,5

70 ±1

165

D

400

E

F

170 ±1

LAHLR 1 500

162

500 ±2 max.

construction:

solid frame construction with inner animation and carrier plates, thermally connected by soldering

weight:

6,300 g

material:

aluminium alloy

surface:

blanc, milled flat

Technical data of the fans ... 230

G

H

I

type

ebmpapst, radial blower with grid, double sided absorbtion

bearing type

ball bearing

discharge air flow

435 m3/h

rotation speed

1,950 min-1

power inout

87 W

current consumption

0.39 A

temperature range

-25°C... +40°C

circuit voltage

230 V AC

motor condenser

2 µF/400 V

noise level

58 dB(A)

weight

1,500 g

K

L

M

N

D 35

Drilling pattern for Solid State Relais  Mounting for TO 3 angle  High capacity heatsinks  Cooling aggreg. in segment mount. 

A 12 A 125 – 128 A 57 – 58 D5–7

Miniature cooling aggregates heatsinks for Solid State Relais Hole pattern Technical introduction

   

D 9 – 12 135 – 136 A 21 A2–8


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A

Protection grid for fans – – – –

protection against contact as per EN 294 aerodynamic contruction minimized noise modification only low modification of the air flow

B 32 ±0,4 Ø 29

1,5 +0,3

±0,8

art. no. LAGI 40

C

4,7 +1

Ø 4 +0,3

suitable for cooling aggregate LAM 2/ LAM 4/ LAM 4 K 1,5 +0,3

50 ±0,6 Ø 53

±1

D 4,7 +1

Ø 4 +0,3

art. no. LAGI 60

suitable for cooling aggregate LAM 1/ LA (V) 6/ LA (V) 7/ LA (V) 8/ LA 27 K 71,5

±0,6

E

1,5 +0,3

Ø 75

±1,2

F Ø 4 + 0,3

art. no. LAGI 80

4,7 +1

suitable for cooling aggregate LA (V) 9/ LA (V) 10/ LA (V) 11 82,5 ±0,6

1,5

Ø 89

G

+0,3

±1,5

H Ø 4 +0,3

art. no. LAGI 92

4,7 +1

suitable for cooling aggregate LA 2/ LA (V) 21/ LA (V) 22 104,8 ±0,8

1,5 +0,3

5,4 Ø 11

Ø 4 +0,3

art. no. LAGI 119

I

±1,5

K

L

4,7 +1

suitable for cooling aggregate LA 1/ LA 4/ LA 5/ LA (V) 14/ LA (V) 15/ LA (V) 17/ LA (V) 18/ LA HL (V) 1/ LA HL (V) 2/ LA HL (V) 3 / LA HL D1

material:

High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates

steel wire, nickel-plated

   

D D D D

26 – 29 33 – 35 30 15 – 25

Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction

   

D 14 D5 D 9 – 11 A2–8

D 36

M

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

Thermal conductive material Guide rails for PCBs Mounting material for semiconductorsMounting material for mechanical components

Thermal conductive material – large standard programme for thermal conductive pastes and glues, silicone-, GEL-, and foam foils (Gap Filler), cuts, tapes, tubes and caps – thermal conductive electrically insulating foils – customer specific productions made in our in-house punching shop

Guide rails for PCBs – for horizontal and vertical assembly – suitable for sheet thicknesses of 0.5 - 1.85 mm – with and without lock mechanism – slim an wide designs – screwable and snapable versions, extractors with locking pin fixing – special designs upon request

Mounting material for semiconductors – mounting disc for discrete devices such as transistors, capacitors and LEDs – electrically insulating mounting of the transistors – simple and fast assembly – insulating clamping pins for various semiconductors for increasing the dielectric strength – cover and insulating cap for transistors

Mounting material for mechanical components – distance bolts made of metal and plastics with inner or outer thread – clamp mounting made of aluminium and plastics for mounting the heatsinks and cases on the mounting rail acc. to DIN EN 50022 – anti-vibration device for minimizing the noise and resonance


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Silicon-rubber insulating material for semiconductors

B

C

D

E

F

A: washer B: insulating cap C: insulating tube D: cuts

G

Our thermal conduction wafers effect following advantages: – good surface contact as material is flexible – reduced production costs as a matter of mounting without thermal conducting paste (clean and fast) – spring-back of the elastic material protects the transistor against damage – free of any toxic substances

H

Customer specific versions: – punching and cuts of our thermal conductive foil according to drawing – sold per sheet or by the meter – other foils, plastics, papers, etc. upon request

I The thermal details refer to an area of 1 inch2 (6.45 cm2).

K

L

M Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

7 – 10 12 – 15 21 – 22 23 – 24

Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction

   

A 89 – 112 B 17 – 20 A 22 – 83 A2–8

E2

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Silicone rubber insulating material for semiconductors – other cuttings on request

B

30 50

10,9

28,2

42

5,5

15 20,5

22

17,1

11

16,5

17,5

7,5

Ø 3,1

4

17,5

30

Ø 3,9

Ø 3,1

15 20,5

16,9

24

Ø 3,1

F

Ø 4,2

R 18

2xØ2

42

11 36

5,5

29

11 30

D

E

R 10

2 x Ø 1,5

R 14,5 R6

2 x Ø2

2 x Ø 4,2

5,5

C

2

2

2 x Ø 3,1

16 17,4 20

10 20

21

Ø 3,1 6 18

17

13,5

18

15

24

Ø3

G

H 13

21

Ø 3,2

I 15

15

15

7,5

Ø 3,1

Ø 2,5

Ø 3,2

K

18

9

8

4

7,5

5,5 11

60

7,3 11

L

M

N

E3

Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

7 – 10 12 – 15 21 – 22 23 – 24

Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction

   

A 89 – 112 B 17 – 20 A 22 – 83 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Thermally conductive foil made of siliconelastomer foil type material

foil WS silicone foil, standard

foil WG silicone foil, GF reinforced

foil WK silicone foil, GF reinforced, one-sided selfadhesive

foil WB silicone foil, GF reinforced

B

Washer TO-3 TO-3 M TO-3/4 TO-3 PF 3158 TOP 3 TOP 3/1 TO 218 (Multiwatt) TO 247 TO 220 4 X TO 220 3159 TO 126 SOT 32 TO 247/1

WS WS WS WS WS WS WS

3 3M 3/4 3P 3158 TOP 3 TOP 3/1

WG 3

WK 3

WB 3

WG 3 P

WK 3/4 WK 3 P WK 3158

C WB 3 P WB 3158

D

WK TOP 3/1 WG 218

WS WS WS WS

247 220 4 220 3159

WK 247 WK 220

WG 220

WB 220

WK 3159 WK 126 WK 32

E

WB 3159

WS 247/1

Insulating tube

F

TO-220 Ø 11 mm, WSC-220 length 25 mm TO-3 PF Ø 13.5 mm, WSC-3 P length 25 mm TO-247 Ø 14.5 mm, WSC-247 length 30 mm

G

Insulating tube as meterpiece TO-220 Ø 11 mm TO-3 PF Ø 13.5 mm

WSM-220 WSM-3 P

Tape material (width) 24 mm 30 mm 36 mm 85 mm 300 mm

H

WKT 24 WST 30 WST 36 WST 85

WBT 30

WGT 300 Foil WS

WKT 300

I

WBT 300

Foil WG

Foil WK

Foil WB

material thickness

0.3 mm

0.2 mm

0.15 mm

material hardness

75 Shore A

87 Shore A

90 Shore A

dielectric strength

10 kV

6.5 kV

3 kV

thermal resistance

0.4 K/W

0.42 K/W

0.45 K/W

0.34 K/W

1.22 W/m·K

1.13 W/m·K

0.92 W/m·K

1.43 W/m·K

thermal conductivity insulation resistance

2.9·1015

extensibility

Ω·cm

100 %

5.7·1015

K

1.6·1015 Ω·cm

Ω·cm

2%

4%

temperature range

-60°C... +180°C

class of flammibility

UL 94 V-0

L

M Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

7 – 10 12 – 15 21 – 22 23 – 24

Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction

   

A 89 – 112 B 17 – 20 A 22 – 83 A2–8

E4

N


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A Insulating cap

B

D

B

C

D

E

WSI WSI WSI WSI WSI

art. no.

type

220 210 220 225 TOP 3 235 TOP 3 280 TO 3 PL

TO 220 TO 220 TOP 3 TO 3 PL/TO 247 TO 3 PL/TO 247

dim. [mm] A 11 11 18 16 22

B 21.0 22.5 23.5 28.0 34.0

Foil WSI material thickness

C 5.0 5.0 5.0 5.0 5.5

D 0.9 0.3 0.9 0.3 0.9 Foil WSI

0.9 mm

material hardness

F

C

A

0.3 mm 75 Shore A

dielectric strength

15 kV

10 kV

thermal resistance

0.96 K/W

0.4 K/W

thermal conductivity

1.22 W/m·K

insulation resistance

2.9·1015 Ω·cm

extensibility

100 %

temperature range

-60°C... +180°C

class of flammibility

UL 94 V-0

G

H

I

K

L

M

N

E5

Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

7 – 10 12 – 15 21 – 22 23 – 24

Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction

   

A 89 – 112 B 17 – 20 A 22 – 83 A2–8


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A

Thermal conductive foil one-sided adhesive

B

C

– – – – –

one-sided acrylate adhesive coating, silicone-free carrier material good thermal characteristics with high operating temperature thin material thickness for optimal thermal resistance high dielectric strength, electrically insulating cuttings and customised cut-outs acc. to customer specific requirements

art. no. WLFT 8943

D

type of delivery plates, usable area 300x200mm

E

WLFT 8943 description

one-sided adhesive, filled Copolymer

overall thickness

0.17 mm

filling material

ceramic

specific thermal resistance

F

4.7°C cm2/W

thermal conductivity

0.4 W/m·K

temperature range

-40°C... +150°C

volume resistance

2.5·1013 Ω/cm

dielectric strength

62,7 kV/mm

peel strength at ambient temperature and 24 h

G

6 N/cm

class of flammibility

UL 94 V-0

H

I

K

L

M Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors

   

E2–5 A 89 – 93 A 89 – 112 C4–9

GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction

   

E 12 – 15 E 40 E 32 – 33 A2–8

E6

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Thermally conductive foil both sides adhesive

B

C

D

– – – –

good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request

art. no.

E

WLFT WLFT WLFT WLFT WLFT WLFT

404 404 404 404 414 414

F

R25 R50 R100 R200 R25 R50

art. no.

G

WLFT WLFT WLFT WLFT WLFT

404 404 404 414 414

H

description

width [mm] 25 50 100 200 25 50

100x100 100x200 200x200 100x100 100x200

type of delivery

art. no.

sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter

dimensions [mm] type of delivery 100x100 plate 100x200 plate 200x200 plate 100x100 plate 100x200 plate

WLFT WLFT WLFT WLFT WLFT WLFT

414 414 405 405 405 405

R100 R200 R25 R50 R100 R200

art. no. WLFT WLFT WLFT WLFT

414 405 405 405

200x200 100x100 100x200 200x200

WLFT 404

WLFT 414

WLFT 405

0.15 mm ±0.03

polyimide (Kapton MT) 0.025mm

aluminium foil 0.05mm

acrylate (pressure sensitive) double-sided

thermal conductivity

0.4 W/m·K

0.5 W/m·K

3.7°C cm2/W

3.4°C cm2/W

temperature range

-30°C... +125°C

holding force (overlapping)

L

dimensions [mm] type of delivery 200x200 plate 100x100 plate 100x200 plate 200x200 plate

0.127 mm ±0.03

specific thermal resistance

K

sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter

non insulating, double-sided adhesive

glue layer

I

type of delivery

insulating, double sided adhesive

overall thickness truss material

width [mm] 100 200 25 50 100 200

holding force (shear rate)

0.86 MPa Al 25°C 0.897 [MPa]/ Al 150°C 0.345 [MPa]/ Cu 25°C 0.828 [MPa]/ Cu 150°C 0.31 [MPa]/ Al2O3 25°C 1.17 [MPa]/ Al2O3 150°C 0.34 [MPa]

dielectric strength

0.93 MPa

Al 25°C 0.897 [MPa]/ Al 150°C 0.345 [MPa]

Al 25°C 0.86 [MPa]/ Al 150°C 0.38 [MPa]/ Cu 25°C 1.1 [MPa]/ Cu 150°C 0.48 [MPa]/ Al2O3 25°C 1.0 [MPa]/ Al2O3 150°C 0.41 [MPa]

5 kV (AC)

class of flammibility

UL 94 V-0

M

N

E7

Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors

   

E2–5 A 89 – 93 A 89 – 112 C4–9

GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction

   

E 12 – 15 E 40 E 32 – 33 A2–8


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A

Thermally conductive foil both sides adhesive

B

C

D

– – – – – –

double sided adhesive layer optimal adhesion of different substrates very good thermal conductivity, electrical insulating easy handling due to double sided protection foil optimized surface moistening and excellent impact strength cutouts and different punchings according to customer drawing

art. no. WLFT 8805 WLFT 8810 WLFT 8815 WLFT 8820 WLFT 8940

E

type of delivery plates, usable area 300x200mm plates, usable area 300x200mm plates, usable area 300x200mm plates, usable area 300x200mm plates, usable area 300x200mm WLFT 8805

description

WLFT 8810

F

G

WLFT 8815

WLFT 8820

WLFT 8940

double sided adhesive, filled acrylic polymer

overall thickness

0.13 mm

0.25 mm

0.38 mm

0.5 mm

filling material

ceramic

protection cover

silicone treated polyester, 37.5 - 50 µm

thermal conductivity

0.6 W/m·K

specific thermal resistance

3.1°C

cm2/W

temperature range

5.7°C

cm2/W

7.6°C

5.2·1011 Ω/cm

3.9·1011 Ω/cm

5.8 N/cm

8.3 N/cm

dielectric strength

9.7°C

cm2/W permanent up to 150°C

3.8·1011 Ω/cm

37 kV/mm

peel strength at ambient temperature and 72 h class of flammibility

H 0.9 W/m·K

cm2/W

permanent up to 100°C

volume resistance

0.19 mm

I

2.5·1013 Ω/cm 55 kV/mm

9.8 N/cm

11.9 N/cm

UL 746 C

6 N/cm UL 94 V-0

K

L

M Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors

   

E2–5 A 89 – 93 A 89 – 112 C4–9

GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction

   

E 12 – 15 E 40 E 32 – 33 A2–8

E8

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A High thermoconducting graphite foils

B

C

D

E

F

G

– – – – – –

high-compressed anisotropic natural graphite very good thermal characteristics optimal for heat spreading high operating temperature range different material thicknesses and coatings upon request customer specified cuttings and stampings acc. to drawing

art. no. WLFG WLFG WLFG WLFG WLFG WLFG

9010 9010 9010 9015 9015 9015

R R R R R R

25 50 100 25 50 100

width [mm] 25 50 100 25 50 100

type of delivery

art. no.

sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter WLFG 9010

description

WLFG WLFG WLFG WLFG WLFG WLFG

9020 R 25 9020 R 50 9020 R 100 S 900 K R 25 S 900 K R 50 S 900 K R 100

WLFG 9015

base film made of graphite, electrically conductive

sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter

WLFG 9020

WLFG S 900 K

adherent layer on one side

overall thickness

0.15 mm

0.2 mm

0.25 mm

0.175 mm

thermal resistance

0,09 K/W

0,07 K/W

0,23 K/W

0,08 K/W

thermal conductivity z (x/y)

5.5 (55) W/m·K

6 (55) W/m·K

4 (55) W/m·K

7.5 (<450) W/m·K

specific thermal resistance

36°C mm2/W

28.8°C mm2/W

72°C mm2/W

34°C mm2/W

temperature range

I

type of delivery

graphite foil, electrically conductive

version

H

width [mm] 25 50 100 25 50 100

-40°C... +500°C

hardness range

30 Shore D

tensile strength

5.5

N/mm2

6

N/mm2

elongation at break

10 %

tightness

g/cm3

1

class of flammibility

5.5 N/mm2

10 N/mm2 5% <1.6 g/cm3

UL 94 V-0

K

L

M

N

E9

Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors

   

E2–5 A 89 – 93 A 89 – 112 C4–9

GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction

   

E 12 – 15 E 40 E 32 – 33 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Heat conductive silicon foam foil

B

C – – – – –

elastomer foam with closed cell structure good heat conductor e.g. between components, heatsinks and casing parts electrical insulating can be compressed even with a low contact pressure absorbs shocks and vibrations

art. no. WSF 16 WSF 32 WSF 635 WSFS 635

D

material thickness [mm] 1.60 ±0.4 3.20 ±0.8 6.35 ±1.2 6.35 ±1.2

E

Thermal resistance at 3.2 mm material thickness: compression % contact 10 25 50 contact pressure PSI Rth K/W (1

in2

>1

x 3.2 mm) 6

heat conductivity W/mK 0.3

5

12

34

F

4.5 2.5 1 0.4 0.45 0.65

– WSFS 635 double sided adhesive and WSF adhesive upon request – according to NASA gas emission requirements WSF version

no adhesive

thermal conductivity

G

WSFS 635 one-sided self-adhesive 0.108 W/m·K (substrate)

hardness range

13 Shore D

H

compression, 25%

18 PSI

temperature range

-62°C... +205°C

extensibility

150 %

tensile strength

120 PSI

dielectric strength

4 kV/mm

tightness

I

1.118 g/cm3

class of flammibility

UL 94 V-1 (at thickness ≥3.2mm)

type of delivery

plates 914x914mm/ cuttings on customer's requirements

K

L

M Thermal conductive material GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

2–5 12 – 15 21 – 22 23 – 24

Kapton insulator washers Heatsinks for PGA Heatsinks for BGA Technical introduction

   

E 16 B 11 – 16 B 17 – 20 A2–8

E 10

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Silicone free thermal adhesive foils

B

C

D

E

– – – –

silicone free gap-filler with good thermal characteristics smooth, compressible and elastic cut outs, punchings and modifications according to customer specification other material thicknesses upon request

art. no.

material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] ness [mm] [°C in2/W] [°C cm2/W] [°C in2/W] [°C cm2/W] ±0.2 ±0.2 GEL F 15 10 1.06 6.56 GEL F 15 G 10 1.16 7.55 1.0 1.0 GEL F 15 15 1.44 8.01 GEL F 15 G 15 1.52 9.22 1.5 ±0.2 1.5 ±0.2 ±0.3 ±0.3 GEL F 15 20 1.83 11.26 GEL F 15 G 20 1.93 10.89 2.0 2.0 version

GEL F 15

GEL F 15 G

standard

polyamide film mash reinforced

thermal conductivity

F

1.5 W/m·K

volume resistance

2 ·103 MΩ/m

hardness range

53 Shore 00

temperature range

-40°C... +105°C

extensibility

150 %

dielectric constant

G

H

9,12 [50 Hz] / 8,55 [1 kHz] / 5,83 [1 MHz]

dielectric loss factor

0,152 [50 Hz] / 0,135 [1 kHz] / 0,034 [1 MHz]

dielectric strength

11 kV/mm

tightness

2.1 g/cm3

class of flammibility

UL 94 V-0

type of delivery

on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on customer's requirements

I

K

L

M

N

E 11

Thermal Thermal Thermal Thermal

conductive conductive conductive conductive

material foil paste glue

   

E E E E

2–5 7 – 15 21 – 22 23 – 24

Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction

   

A 22 – 83 B 35 – 48 A 13 – 17 A2–8


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A

Gel thermal conducting foils

B

C – highly heat-conductive silocon foil – smooth, elastic and compressible – equals uneven surfaces very well (Gap-Filler)

art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL

05 10 15 20 25 30 35 40 45 50

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] 0.69 4.45 0.5 ±0.1 ±0.2 1.03 6.64 1.0 1.39 8.96 1.5 ±0.2 1.52 9.78 2.0 ±0.3 2.10 13.58 2.5 ±0.3 2.35 15.15 3.0 ±0.3 2.56 16.51 3.5 ±0.3 3.25 20.95 4.0 ±0.4 3.38 21.82 4.5 ±0.4 3.52 22.70 5.0 ±0.5

art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL

GEL version

G G G G G G G G G G

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] 0.63 4.04 0.5 ±0.1 ±0.2 1.17 7.56 1.0 1.59 10.27 1.5 ±0.2 2.07 13.33 2.0 ±0.3 2.61 16.81 2.5 ±0.3 2.89 18.66 3.0 ±0.3 3.35 21.63 3.5 ±0.3 3.56 22.96 4.0 ±0.4 3.89 25.10 4.5 ±0.4 4.22 27.23 5.0 ±0.5

05 1 15 2 25 3 35 4 45 5

GEL G 05 - 25

standard

1.5 W/m·K

volume resistance

E

F

GEL G 3 - 5

polyamide film mash reinforced, adherent layer on one side

thermal conductivity

D

G

1·106 MΩ/m

hardness range

49 Shore 00

temperature range

-60°C ... +200°C

extensibility

100 %

60 %

dielectric constant

H

5.8 [50 Hz]/ 5.6 [1 KHz]/ 5.5 [1 MHz]

dielectric loss factor

0.048 [50 Hz]/ 0.015 [1 KHz]/ 0.003 [1 MHz]

dielectric strength

14 kV/mm (AC)

tightness

8 kV/mm (AC) 2.6

class of flammibility

UL 94 V-0

type of delivery

g/cm3

UL 94 V-1

UL 94 V-0

on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on customer's requirements

I

K

L

M Thermal Thermal Thermal Thermal

conductive conductive conductive conductive

material foil paste glue

   

E E E E

2–5 7 – 15 21 – 22 23 – 24

Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction

   

A 22 – 83 B 35 – 48 A 13 – 17 A2–8

E 12

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Gel thermal conducting foils

B

C – – – –

D

E

F

GEL thermal conductive foils with very good thermical characteristics for balancing non-planarities and differences in components (Gap Filler) soft, elastic and compressible customer specific cuts and punchings according to drawing

art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL

28 28 28 28 28 28 28 28 28

05 10 15 20 25 30 35 40 50

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] ±0.15 0.23 1.48 0.5 ±0.2 0.44 2.76 1.0 0.61 3.82 1.5 ±0.2 ±0.3 0.80 5.00 2.0 0.90 5.65 2.5 ±0.3 ±0.3 1.10 6.90 3.0 1.27 7.97 3.5 ±0.3 ±0.3 1.39 8.69 4.0 1.67 10.47 5.0 ±0.3

art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL

28 28 28 28 28 28 28 28 28

G G G G G G G G G

05 10 15 20 25 30 35 40 50

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] ±0.15 0.29 1.85 0.5 ±0.2 0.47 2.99 1.0 0.72 4.53 1.5 ±0.2 ±0.3 0.97 6.07 2.0 1.15 7.23 2.5 ±0.3 ±0.3 1.23 7.69 3.0 1.35 8.46 3.5 ±0.3 ±0.3 1.67 10.47 4.0 1.92 12.02 5.0 ±0.3

GEL 28 version

G

standard

thermal conductivity volume resistance

3.6·104 MΩ/m 50 Shore 00

temperature range

55 Shore 00 -60°C ... +200°C

extensibility

64 %

dielectric constant

32 %

8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz]

dielectric loss factor

I

polyamide film mash reinforced 2.5 W/m·K

hardness range

H

GEL 28 G

0.0826 [50 Hz]/0.0300 [1 kHz]/0.0052 [1 MHz]

dielectric strength

15 kV/mm

tightness

2.7 g/cm3

class of flammibility

UL 94 V-0

type of delivery

on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions upon request

K

L

M

N

E 13

Thermal Thermal Thermal Thermal

conductive conductive conductive conductive

material foil paste glue

   

E E E E

2–5 7 – 15 21 – 22 23 – 24

Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction

   

A 22 – 83 B 35 – 48 A 13 – 17 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Thermal adhesive foils

B

– – – –

C

gap filler with exceptionally good thermal conductivity and low outgassing especially smooth, compressible and elastic cut outs, punchings and modifications according to customer specification other material thicknesses upon request

art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL

45 45 45 45 45 45 45 45 45 45

05 10 15 20 25 30 35 40 45 50

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] 0.61 3.94 0.5 ±0.15 ±0.2 0.96 6.27 1.0 1.30 8.42 1.5 ±0.2 1.52 9.85 2.0 ±0.3 1.71 11.08 2.5 ±0.3 1.94 12.52 3.0 ±0.3 ±0.35 2.20 14.20 3.5 2.46 15.88 4.0 ±0.4 ±0.45 2.68 17.34 4.5 2.84 17.34 5.0 ±0.5

art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL

45 45 45 45 45 45 45 45 45 45

G G G G G G G G G G

05 10 15 20 25 30 35 40 45 50

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] 0.64 4.17 0.5 ±0.15 ±0.2 0.97 6.28 1.0 1.71 11.06 1.5 ±0.2 1.71 11.06 2.0 ±0.3 2.03 13.11 2.5 ±0.3 ±0.3 2.28 14.76 3.0 ±0.35 2.54 16.40 3.5 2.80 18.12 4.0 ±0.4 ±0.45 3.03 19.56 4.5 3.22 20.82 5.0 ±0.5

GEL 45 version

polyamide film mash reinforced 4.5 W/m·K

volume resistance

1.4·105

hardness range

E

F

GEL 45 G

standard

thermal conductivity

D

G

Ω/cm

45 Shore 00

temperature range

-60°C ... +200°C

extensibility

50 %

dielectric constant

H

8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz]

dielectric loss factor

0,0249 [50 Hz] / 0,0219 [1 kHz] / 0,00675 [1 MHz]

dielectric strength

11 kV/mm

tightness

3.2 g/cm3

class of flammibility

UL 94 V-0

type of delivery

on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on customer's requirements

I

K

L

M Thermal Thermal Thermal Thermal

conductive conductive conductive conductive

material foil paste glue

   

E E E E

2–5 7 – 15 21 – 22 23 – 24

Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction

   

A 22 – 83 B 35 – 48 A 13 – 17 A2–8

E 14

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Gel thermal conducting foils

B

– – – –

GEL silicone foils with especially high thermal conductivity balances non-planarities and differences in components (Gap Filler) soft, elastic and compressible cuts, punchings and special designs according to customer specifications

art. no.

C

GEL GEL GEL GEL GEL

60 60 60 60 60

05 10 15 20 25

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] ±0.1 0.20 1.30 0.5 0.33 2.11 1.0 ±0.2 ±0.2 0.53 3.45 1.5 0.61 3.91 2.0 ±0.3 ±0.3 0.72 4.67 2.5

D

art. no. GEL GEL GEL GEL GEL

05 10 15 20 25

GEL 60 G

standard

thermal conductivity

polyamide film mash reinforced 6 W/m·K

volume resistance

1·106 MΩ/m

hardness range

52 Shore 00

temperature range

-60°C ... +200°C

extensibility

80 %

dielectric constant

6.4 [50 Hz]/6.4 [1 kHz]/6.4 [1 MHz]

dielectric loss factor

F

G G G G G

GEL 60 version

E

60 60 60 60 60

material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [°C in2/W] [°C cm2/W] ±0.1 0.21 1.37 0.5 0.31 1.99 1.0 ±0.2 ±0.2 0.48 3.08 1.5 0.62 4.00 2.0 ±0.3 ±0.3 0.77 4.96 2.5

0.035 [50 Hz]/0.005 [1 kHz]/0.001 [1 MHz]

dielectric strength

13 kV/mm

tightness

3.2 g/cm3

class of flammibility

UL 94 V-0

type of delivery

on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions upon request

G

H

– especially soft design – levels smallest air gaps and unevennesses – cuts and contours with cutouts according to customer specifaction

art. no.

I

K

L

material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa) 2 2 ness [mm] ness [mm] [°C in /W] [°C cm /W] [°C in2/W] [°C cm2/W] GEL 27 S 25 2.5 0.94 6.05 GEL 27 S 50 5.0 1.69 10.91 version:

standard

thermal conductivity:

2.7 W/m·K

volume resistance:

2·107 MΩ/m

hardness range:

53 Shore 00

temperature range:

-60°C ... +200°C

extensibility:

45 %

dielectric strength:

15 kV/mm

tightness:

3 g/cm3

class of flammibility:

UL 94 V-0

type of delivery:

on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions upon request

M

N

E 15

Thermal Thermal Thermal Thermal

conductive conductive conductive conductive

material foil paste glue

   

E E E E

2–5 7 – 15 21 – 22 23 – 24

Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction

   

A 22 – 83 B 35 – 48 A 13 – 17 A2–8


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A

Kapton insulator washers – – – – – – – – – – –

very low thermal resistance optimised heat conductivity best mechanical charactaristics polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides clean processing, no abrasion of the coating stacked foils do not stick together good resistance against cleening agents no cold flow low pressure force necessary, thus particularly applicable for spring-fixing of semiconductors cuttings and special versions according to customer's requirements the thermal details refer to an area of 1 inch2 (6.45 cm2)

B

C Ø 3,1

18

23

24

21

13

18

21

1000±0,5

D

6

18 24

E

305±0,5

art. no. KAP 247 O

suitable for pre-cut parts (plate)

TO 248/ TO 218/ TO 247

art. no. KAP 218 O TO 218 Ø 4,2

Ø 4,2

16 23

TO 248/ TO 218/ TO 247

F

Ø 4,2

34

5,5 5,5

13 4,5

TO 220

Ø 4,2

Ø 3,1

18 7

art. no. KAP 218

Ø 1,5

Ø 1,5 Ø 3,1

art. no. KAP 220 O

11 29

art. no. KAP 1 P

13,5 18

G

17 17

13

30

8,5

47

42

art. no. KAP 220 G

art. no. KAP 220 K

art. no. KAP 3 G

art. no. KAP 3 K

TO 220

TO 220

TO 3

TO 3

H

KAP material

polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides

material thickness

I

0.077mm (substrate 0.05mm)

thermal conductivity

0.45 W/m·K (substrate)

insulation resistance

1014 Ω

thermal resistance

0.15 K/W [at 1

temperature range

inch2;

K

= 6.45 cm2; = TO 3 (KAP 3)]

-40°C... +150°C

phase change temperature

52 °C

extensibility

30 %

dielectric strength

7.8 kV

class of flammibility

L

UL 94 V-0

M Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors

   

A 91 A 89 – 93 A 89 – 112 C4–9

Finger-shaped heatsinks  C2–3 Distance sleeves for PCB´s in HP grid  E 39 Spacers  E 40 Technical introduction  A2–8

E 16

N


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A Aluminium oxide wafers

0.02 mm

0.15 mm

Ø 3,7

0.11 mm

4.5 mm

0.054 mm

1.5 mm

4 25

art. no. AOS 3 P

0.076 mm

Ø 4,9

1.5 mm 4,9

17,5 0.15 mm

Ø 3,1

Ø 3,1

4

art. no. AOS 220 1.5 mm

0.054 mm

7,3 11

3,7

art. no. AOS 32 1.5 mm

0.033 mm

8 2,5

9,5 Ø 3,2

art. no. AOS 5

0.061 mm

1.5 mm

art. no. AOS 93

0.032 mm

2.3 mm

0.03 mm

art. no. AOS 18 1.5 mm

0.023 mm

Ø 4,3

40,5

2.9 mm

14,7

9,7

16,9

13,2

5,1 19,2

11

26,2

4,2

Ø 4,3

33,3

art. no. AOS 3

art. no. AOS 66

0.123 mm

2.5 mm

0.10 mm

K

AOS material

AL2O3 - ceramics

thermal resistance

0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]

specific electrical resistance

L

1.5 mm

15 20,5

18

3 mm

0.15 mm

14 18

0.054 mm

10,9 5,1

art. no. AOS 3 P SL

17,5

21

R 7,5

20

4

art. no. AOS 220 4

Ø 3,1

art. no. AOS 127

I

14 18

art. no. AOS 220 SL

1 mm

Ø4

Ø4

G

H

0.02 mm

14

14

art. no. AOS 220 3

F

1.5 mm

4

14 18

19,3

1.6 mm

art. no. AOS 3 P 2

Ø 3,2

14,5

E

art. no. AOS 218 247 1

15 20,5

12

D

3 mm

23

8

art. no. AOS 218 247

18 25

Ø O,9

art. no. AOS 247

7

18 25

Ø 3,1

12

7

21

21

23

1 mm

16

Ø4

20

C

Ø 3,6

Ø4

Ø 1,1

B

– other thicknesses and versions on request = thickness; = flatness

>1014 Ω/cm

thermal conductivity

25 W/m·K

dielectric constant

9

linear expansion coefficient

~8·10-6/K

snap through stability

10 kV/mm

M

N

E 17

Thermal conductive material GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

2–5 12 – 15 21 – 22 23 – 24

Thermal conductive foil Kapton insulator washers Mica wafers Technical introduction

   

E 7 – 10 E 16 E 19 A2–8


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A

Aluminium oxide wafers according to customer's instructions – laser-cut versions with outer dimensions and cutouts according to customer's requirements – other plate dimensions upon request – max. plate dimension 180 x 180 mm

B

C

D

E

F

G material thickness [mm] 2.000 2.540 1.500 1.270 1.000 0.800 0.635 0.500 0.400 0.300 0.250

outer dimensions [mm] 114x114 114x114 114x114 114x114 114x114/ 165x115/ 160x113 114x114/ 165x115/ 160x113 106.5x106.5/ 114x114/ 165x115/ 160x113 106.5x106.5/ 114x114 106.5x106.5/ 114x114 106.5x106.5/ 114x114 106.5x106.5/ 114x114

H

I

K

L

M Thermal conductive material GEL thermal conductive foils Thermal conductive paste Thermal conductive glue

   

E E E E

2–5 12 – 15 21 – 22 23 – 24

Thermal conductive foil Kapton insulator washers Mica wafers Technical introduction

   

E 7 – 10 E 16 E 19 A2–8

E 18

N


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A Mica wafers Ø 4,1 Ø 3,1

13,5

17,5

21

11 20

C

D

24

art. no. GS 220 C TO 220

art. no. GS 218 TO 218

18

18

art. no. GS 3 P SL TOP 3

art. no. GS 66 P TO 66 Ø 4,2

Ø 3,1

4

5,3

15 20,5

18

Ø4

Ø 3,7

12

B

art. no. GS 220 4 TO 220

Ø2

Ø 3,1

3,7 11

4

10,9 30

4

17,5

E

8

12

Ø 3,1

15 20,5

18

17

13,2 43

F

art. no. GS 220 P TO 220

art. no. GS 32 P SOT 32

art. no. GS 3 P TOP 3

art. no. GS 3 TO 3 GS

G

material

muskovit

material thickness

0.05 mm

thermal resistance (GS 3)

0.4 K/W

insulation resistance

3·1017 Ω·cm

snap through stability

5 kV

H

I

K

L

M

N

E 19

Thermal conductive material Thermal conductive foil GEL thermal conductive foils Thermal conductive paste

   

E E E E

2–5 7 – 10 12 – 15 21 – 22

Thermal conductive glue Kapton insulator washers Aluminium oxide wafers Technical introduction

   

E 23 – 24 E 16 E 17 – 18 A2–8


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A

Free standing film

B

C – – – – – – – – – – –

self-supporting differential phase changing thermal interface material, contains no substrate (Free Standing Film) materials with phase change temperature at 52 °C; best thermal conductivity, exceeding phase change temperature point, material flows into all gaps between components and heatsink thixotropic, does not migrate from the interface area no lowering of thermal conductivity though thermal cycling application with very low contact pressure, due to non elastomeric material, particularly suitable for clamp mounting of components electrically non-conductive, but not an insulator self adhering characteristics, also suitable for large areas no toxic ingredients custom required shapes on request all with protection foil on both sides

art. no. FSF 52 P

basin plate, protection foil on both sides

E

dimensions [mm] 330x343x0.127 ±0.025

F

FSF 52 P phase change temperature

D

52 °C

colour

white

tightness

2 g/cm3

thermal conductivity

0.9 W/m·K

G

0.03 K/W 0.031 N/mm2

thermal resistance (1 in2, TO 3) at contact pressure of temperature range

≤+200°C

adhesive holding force

0.35 N/mm2

class of flammibility

UL 94 V-0

dielectric constant

H

3.8 [1 kHz] 3.4 [1 MHz]

I

K

L

M Mica wafers Thermal conductive foil Thermal conductive paste Thermal conductive glue

   

E E E E

19 7 – 10 21 – 22 23 – 24

Thermal conductive material Insulating caps Aluminium oxide wafers Technical introduction

   

E2–5 E 51 E 17 – 18 A2–8

E 20

N


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A Thermal transfer compounds Silicon thermal transfer compound

B

– thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink

C

D

E

WLP WLP WLP WLP WLP

art. no. 004 035 500 300 S 500 S

basin box box box cartridge (310 ml) cartridge (310 ml)

delivery quantity [g] 4 35 500 300 500

Silicone-free thermal transfer compound – thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink

F

G

H

WLPF WLPF WLPF WLPF WLPF

art. no. 05 10 20 50 300 S

basin syringe syringe syringe syringe cartridge (310 ml)

composition

I

delivery quantity [ml] 2 5 10 20 — WLP

WLPF

silicone oil, inorganic filling material

silicone free synthetic liquid. Metal oxide filling.

consistance

pastey

colour tightness thermal conductivity

K

white

white-grey

1.1 g/cm3

approx. 2 g/cm3

0.61 W/m·K

>0.7 W/m·K

specific electrical resistance flashpoint

>1012

Ω/cm

none (DIN 53213)

drop point

of the basic oil >280°C (ISO 2592)

>260°C

thermal resistance

L

delivery quantity [g] — — — — 300

no bleeding at (4 h/200°C)

<1% (96 h/200°C)

temperature range

-40°C ... +250°C

-40°C... +150°C

acid number

< 0.01 mg KOH/g

solubility in water

insoluble

M

N

E 21

Mica wafers Thermal conductive foil Thermal conductive paste Thermal conductive glue

   

E E E E

19 7 – 10 21 – 22 23 – 24

Thermal conductive material Insulating caps Aluminium oxide wafers Technical introduction

   

E2–5 E 51 E 17 – 18 A2–8


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A

Thermal transfer compounds Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity – – – –

suitable especially for silicone-sensitive applications no drying out, hardening or melting of the thermal conductive paste high long-term stability further package sizes, container types such as cans, cartridge, etc. upon request

B

C

D art. no. WLPK 3 WLPK 5 WLPK 10

basin syringe syringe syringe

delivery quantity [ml] 3 5 10

E

WLPK composition

silicone-free, synthetic fluid ceramic filled

consistance

pastey

colour

F

silver

tightness

1.4 g/cm3

thermal conductivity

10 W/m·K

dielectric strength

not applicable, because conducting

temperature range

G

-60°C ... +150°C

solubility in water

insoluble

H

I

K

L

M Mica wafers Thermal conductive foil Thermal conductive paste Thermal conductive glue

   

E E E E

19 7 – 10 21 – 22 23 – 24

Thermal conductive material Insulating caps Aluminium oxide wafers Technical introduction

   

E2–5 E 51 E 17 – 18 A2–8

E 22

N


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A Thermally conductive adhesive

B

– – – – –

thermally conductive, electrically non-conductive adhesive two part epoxy resin adhesive, metaloxide filled fully replaces mechanical fastenings excellent function and application characteristics to be stored at a cool and dark place

C

D

art. no. WLK 5

composition 5 g resin/0.5 g hardener

art. no. WLK 10

composition 10 g resin/1 g hardener

art. no. WLK 30

composition 30 g resin/3 g hardener

art. no. WLK 120

composition 120 g resin/12 g hardener

E

F

G

WLK thermal conductivity

H

0.836 W/m·K

specific thermal resistance

1.2 m·K/W

volume resistance

1016 Ω/cm

temperature range

-56°C... +149°C

hardening time

20°C approx. 16-24h / 25°C approx. 8 h / 120°C approx. 20 min

glue layer

Epoxid

mixture proportion

10:1

I

K

L

M

N

E 23

Thermal conductive material Thermal conductive foil GEL thermal conductive foils Thermal conductive paste

   

E E E E

2–5 7 – 10 12 – 15 21 – 22

Thermal conductive glue fan cooler for Pentium and MMX heatsinks for Pentium III FC PGA Technical introduction

   

E 23 – 24 B 59 B 57 A2–8


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A

Thermally conductive adhesive – – – – –

solvent-free and thermal conductive two part adhesive epoxy based filled with aluminium oxide composition of hardener and resin (1:1) with statical mixing tube lockability of the container via Luer-Lock System good usage and working properties

B

C

D

art. no. WLK DK 4 WLK DK 10 WLK DK 50

basin syringe syringe cartridge

contents of delivery 1x 4 ml syringe / 3x mixer WLK M4 1x 10 ml syringe / 3x mixer WLK M4 1x 50 ml cartridge / 3x mixer WLK M50 WLK DK

thermal conductivity

F

1 W/m·K

specific thermal resistance

118°C cm/W

volume resistance

8·1011 Ω/cm

temperature range

-50°C... +145°C

working life at room temperature

approx. 30 min

hardening time

25°C approx. 4 h/50°C approx. 1 h/85°C approx. 10 min/125°C approx. 2 min

glue layer

E

G

Epoxid

mixture proportion

1:1

Accessories

H

– more package sizes and container types upon request – store cool and dry

art. no. WLK M 4 WLK M 50 WLK P

contents of delivery 10x mixer für 4 & 10 ml syringe (packing unit 10 pieces) 10x mixer für 50 ml cartridge (packing unit 10 pieces) 1x applicator gun for 50 ml cartridge

I

K

L

M Thermal conductive material Thermal conductive foil GEL thermal conductive foils Thermal conductive paste

   

E E E E

2–5 7 – 10 12 – 15 21 – 22

Thermal conductive glue fan cooler for Pentium and MMX heatsinks for Pentium III FC PGA Technical introduction

   

E 23 – 24 B 59 B 57 A2–8

E 24

N


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A Fastening for mounting rail

B

C

– – – –

universal, solid plastic clip fastening for all 35 mm mounting rails suitable for rail material thicknesses from 1 to 2.3 mm according to DIN EN 60 715 (formerly DIN EN 50 022) registrated design DE 200 07 435.0 fast and easy mounting of heatsinks, casings etc. due to direct snap up on the mounting rail

– – – –

safe hold due to a stable extruded plastic profile with integrated spring back electroconductive material or surface on request special lengths and treatments on customer's request * = examples of mounting rail versions suitable for KL 35 K

D

13,5

F

7,5

art. no.

H

35

1,5

2,3

2,7 12,9

G

35

1 2,7

5,6

9

43,7

* 35

E

dim. [mm]

15

art. no.

KL 35 K 40 KL 35 K 50

40 50

material:

rigid PVC

heat distortion:

-30°C ... +80°C

colour:

anthracite grey

class of flammibility:

UL 94 V-0

15

dim. [mm]

KL 35 K 75 KL 35 K 100

75 100

– safe hold due to a stable extuded profile with integrated stainless steel spring – special lengths (≥40mm), treatments and surfaces on request – * = examples of mounting rail versions suitable for KL 35

I

1,5

37,5

35

1

35

35

K

*

17

50

12,1

7,4

2,3

3,5

5

7,5

15

15

8,5

L

art. no. KL 35 50

M

N

dim. [mm] 50

art. no. KL 35 75

material:

aluminium

surface:

clear anodised

E 25

Distance sleeves for PCB´s in HP grid  E 39 Extractors for guide rails  E 30 Insulting clamping parts  E 45 Vibration dampers  E 41

dim. [mm] 75

art. no.

dim. [mm]

KL 35 100

Mounting pads for transistors Mounting parts for heatsinks Vibration dampers Technical introduction

100

   

E 47 E 49 E 41 A2–8


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A

Guide rails Screw-on type for eurocards connectors according to DIN 41612 or VG 95324 mountable high stability through inner reinforcements stable foot mounting trough inserted brass- thread inserts groove depth: 2.2 mm, groove width 1.9 mm suitable for PCB thicknesses from 0.5 to 1.85 mm * = printed circuit board

B

C

116,5 108 90 M4 x 7,5

7,8

Ø 2,8

5

– – – – – – –

D

100

12

*

A

E 10,2

10,2 10

Ø 4,05

119,5

F

G

1,5

11

37,5

2,75

90

15 B

16,4

art. no.

H

dim. [mm] A 151

FS 151 P

B 2.5

art. no.

8

CLIP 151

2,5

Ø1,2

10 15

9,5

10,35

20 24,25 27,5

2,6

7,5

I

K

only for FS 151 P

material:

polycarbonate, GF reinforced

temperature range:

-40°C... +125°C

class of flammibility:

UL 94 V-0

L

M Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts

   

E E E E

43 29 – 30 30 45

Distance sleeves for PCB´s in HP grid  E 39 Mounting pads for transistors  E 47 Vibration dampers  E 41 Technical introduction  A2–8

E 26

N


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A Guide rails Screw-on type

B

6

6

1,8

M3

A

2,4 8

3

art. no.

C

FS FS FS FS FS FS FS FS

D

E

A 65 70 80 90 100 110 120 130

065 070 080 090 100 110 120 130

C

dim. [mm] B 50 50 67 67 84 84 84 84

material:

polycarbonate, GF reinforced

temperature range:

-20°C... +130°C

thread nut:

brass nickel-plated

class of flammibility:

UL 94 V-0

C 7 12 5 15 8 18 28 38

art. no.

109 18 2

G

4

2

8,5

3

F

6 6 6 6 6 6 6 6

B

14

5

art. no.

12,5

2,5

FS 109 100 93

2

8

7 8,5

7

3

9

M3

2

H

22

9

92

FS 100

2,2

5

8,5

1

100 92

8

∅7 5,5

85

K

12,5

2

*

M3

art. no.

2,2

I

∅ 1,8

L

MSVL 100

* = position of snap-in slot

material:

polyamide, GF reinforced

temperature range:

-40°C... +205°C

class of flammibility:

UL 94 V-0

M

N

E 27

Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts

   

E E E E

43 29 – 30 30 45

Distance sleeves for PCB´s in HP grid  E 39 Mounting pads for transistors  E 47 Vibration dampers  E 41 Technical introduction  A2–8


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A

Guide rails Lockable mounting rails – – – – –

lockable by pushing the plastic pin or the metal button no conductive connection to the PCB the PCB requires a snap-in slot in accordance to the drawing other position with locking device on request * = position of snap-in slot

B

2

C

Ø 3,1

6

A

L

3

6

9,5

12,7

D

18,8

art. no. FS 85 50 FS 85 60

version without bolting device without bolting device

dim. [mm] L A 50 42

FS 85 70

60

FS 85

52

art. no.

version without bolting device without bolting device 8,5

*

2,2

dim. [mm] L A 70 62 85

E

76

5 5,5

1

F

2

Ø 7

2,2 L

6

G

6

A

A

Ø 1,8

3

Ø 3,1

9,5

12,7 18,8

3

art. no. MSVL 50 MSVL 60

version

dim. [mm] L 50 60

with bolting device with bolting device

art. no.

A 42 52

MSVL 70 MSVL 85

material:

polyamide, GF reinforced

temperature range:

-40°C... +205°C

class of flammibility:

UL 94 V-0

version with bolting device with bolting device

dim. [mm] L 70 85

H

A 62 76

I

– the guide bars have got mounting holes for vertical and horizontal assembly of printed circuits – they can also be stacked together horizontally or vertically using pins and treatments 90 65

9

7

13,9

22

3,5

4

K

7

10

Ø8

3

4,5

Ø 2,5

2

80

Ø3 2,5

10

Ø 2,8

4

art. no. MSHV 90 material:

polyamide, GF reinforced

class of flammibility:

UL 94 V-0

L

M Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts

   

E E E E

43 29 – 30 30 45

Distance sleeves for PCB´s in HP grid  E 39 Mounting pads for transistors  E 47 Vibration dampers  E 41 Technical introduction  A2–8

E 28

N


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A Guide rails Snap-in – narrow version

E

F

art. no. FS FS FS FS FS FS FS

S S S S S S S

06 07 08 10 11 12 13

2

B

6,4

A Ø 3,2

5,5

dim. [mm]

art. no.

L 63.5 76.2 88.9 101.6 114.3 127.0 139.7

2 2 2 2 2 2 2

R 1,5 3

3,4

D

L 4,4

1,2 ... 2,2

1,2

3,2

C

3,2

6,2

B

A 50.8 63.5 76.2 88.9 101.6 114.3 127.0

FS FS FS FS FS FS

material:

nylon, natural coloured

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-2

S S S S S S

15 16 19 20 21 21

dim. [mm] A 139.7 152.4 177.8 190.5 203.2 203.2

L 152.4 165.1 190.5 203.2 215.9 215.9

2 2 3 3 2 3

B — — 88.9 95.2 — 101.6

– wide version

I

K

L

art. no. FS FS FS FS FS FS FS FS FS

BT BT BT BT BT BT BT BT BT

06 08 10 11 13 15 16 19 20

7,9 1,9

dim. [mm] L 63.5 88.9 101.6 114.3 139.7 152.4 165.1 190.5 203.2

5,7

art. no.

A 38.1 63.5 76.2 88.9 114.3 127.0 139.7 165.1 177.8

FS FS FS FS FS FS FS FS

material:

nylon, natural coloured

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-2

4,3

Ø 4,6

3,2 1,9

1,2 ... 2,3

4,5 R 2,2

version deep groove deep groove deep groove deep groove deep groove deep groove deep groove deep groove deep groove

L

FS BF ...

A

12,7

4,3

3,2

4,4

H

L

FS BT ... 1,2 ... 2,3

7,9 1,9

G

BF BF BF BF BF BF BF BF

06 07 10 11 13 15 19 20

version shallow groove shallow groove shallow groove shallow groove shallow groove shallow groove shallow groove shallow groove

dim. [mm] L A 63.5 38.1 76.2 50.8 101.6 76.2 114.3 88.9 139.7 114.3 152.4 127.0 190.5 165.1 203.2 177.8

M

N

E 29

Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts

   

E E E E

43 29 – 30 30 45

Distance sleeves for PCB´s in HP grid  E 39 Mounting pads for transistors  E 47 Vibration dampers  E 41 Technical introduction  A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Guide rails Ejectors – low profile – suitable for ejectors art. no. AHG V 14 und AHG V 17

B 7,9

2

L

12,7

2,6

05 07 08 10 11 13

L 50.8 76.2 88.9 101.6 114.3 139.7

4,4

C

LP LP LP LP LP LP

dim. [mm] A C 25.8 2.0 38.5 2.0 38.5 2.0 76.6 2.0 76.6 2.0 76.6 2.0

D A

Ø 4,4

art. no. FS FS FS FS FS FS

B

2,6

3

art. no. D 3.2 3.2 3.2 3.2 3.2 3.2

FS FS FS FS FS

material:

polyamide, GF reinforced

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-0

LP LP LP LP LP

dim. [mm] A B 127.4 — 127.4 — 153.2 — 191.3 95.7 267.9 134.0

L 152.4 165.1 177.8 228.6 304.8

15 16 17 22 30

D

3,4

4,4

4

1,2 ... 2,3

C

C 2.0 2.0 2.0 2.0 2.4

D 3.2 3.2 3.2 3.6 4.0

E

F

– deep guideway – bevelled entrance zone

G

H

3,3

11,3

L

6,35

2

6,35

6,35

1,27

A 6,35

4,8 6,4

R 2,3

12,7

art. no. FS U 06 FS U 11 FS U 20 material:

polyamide, GF reinforced

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-0

I

B

dim. [mm] A 38.1 88.9 177.8

L 63.5 114.3 203.2

4,62

1,3

1,2 ... 2,3

Ø 4,75

K B — — 88.9

L

M Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts

   

E E E E

43 29 – 30 30 45

Distance sleeves for PCB´s in HP grid  E 39 Mounting pads for transistors  E 47 Vibration dampers  E 41 Technical introduction  A2–8

E 30

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Ejectors art. no.

B

Ø 2,2

0,76

Ø2

* = mounting dimensions; locking in FS LP

art. no.

Ø 2,2 3,2 Ø 2,8

Ø2

7,6

FS LP

1,6

3,2

6,4

19,8 6,9

14,3

14,3

PCB

28,4

7,9 6,4 10,8

6,4 3,2

*

0,76

Ø 2,4

14,3

* = mounting dimensions; locking in FS LP 3,2

art. no.

27,9

6,4

6,4

AHG V 17

14,3

Ø 2,4

6,4

Ø 2,8

6,4

AHG V 14

E

F

10,8

1,6 6,4

D

FS LP

3,2

C

6,4 14,3

14,3

*

28,7 6,9

7,9

PCB

7,6

6,4 3,2

R 3,2

Ø 2,4 R 3,6

art. no.

6,4

G

1,6

9,5

9,5 28,6 6,4

6,4

AHG K 27

12,7 R 3,2 R 3,6

AHG K 28 6,4 Ø 2,8

A

1,9

art. no.

L

11 Ø 2,3

7,6

K

12,4

4

1,2

6,1

I

50,8 37,5 6,6

15 16,6

6,4

45°

Ø 2,3

11,1

1,6

4,7

H

dim. [mm] A 7.4

AHG L 7 material:

nylon

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-2

type of delivery:

all ejectors with matching spring pin

M

N

E 31

Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts

   

E E E E

43 29 – 30 30 45

Distance sleeves for PCB´s in HP grid  E 39 Mounting pads for transistors  E 47 Vibration dampers  E 41 Technical introduction  A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Insulating spacers with internal and external thread

B

C

D

E

field of applications: – insulated assembly of stacked PCB – insulated assembly of stacked heatsinks with varying capacities – insulated assembly of chassis plates in cases – insulated supports in the wiring – mechanicaly very stable as threads are made of brass – other lengths on request – dimensions = nominal size: deviation ±0.5 mm – ... please indicate length "L" L

D

art. no. ISAB ISAB ISAB ISAB

25 A ... 3 A ... 4 A ... 6 A ...

A 8.0 8.0 8.0 12.7

P’

G A D'

P

F

H

dim. [mm] L 10/ 15/ 20/ 25 10/ 20 15/ 20 25

D/D' M2.5/M2.5 M3/M3 M4/M4 M6/M6

dielectric strength:

27 kV/mm

creeping current resistance:

CTI 600

thread inserts:

brass

temperature range:

-30°C... +85°C (short term +200°C)

surface:

raw

plastic body:

polyamide 66

colour:

natural (opaque)

P/P' 6.0 6.0 6.0 12.7

I

K

L

M Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8

E 32

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Insulating spacers with internal and external thread P'

L

B D

A D'

P

C

D

art. no. ISAB ISAB ISAB ISAB ISAB

25 B ... 3 B ... 4 B ... 5 B ... 6 B ...

A 8.0 8.0 8.0 9.5 12.7

dim. [mm] L 10/ 13/ 15/ 18/ 20/ 25/ 30 10/ 13/ 15/ 18/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 40 20/ 30/ 40 25/ 30/ 35/ 40/ 50

D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6

P/P' 6.0 6.0 6.0 10.0 12.7

– dimensions = nominal size: deviation ±0.5 mm; at ISAB 3 C ... L=10 => P/P'=3.5

E

L P D

A D'

P'

F

G

H

I

art. no. ISAB ISAB ISAB ISAB ISAB ISAB

25 C ... 3 C ... 4 C ... 5 C ... 6 C ... 6 C ...

A 8.0 8.0 8.0 9.5 12.7 12.7

dim. [mm] L 10/ 13/ 15/ 18/ 20/ 25/ 30 10/ 13/ 15/ 18/ 20 15/ 35 20 25 30

D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6 M6/M6

dielectric strength:

27 kV/mm

creeping current resistance:

CTI 600

thread inserts:

brass

temperature range:

-30°C... +85°C (short term +200°C)

surface:

raw

plastic body:

polyamide 66

colour:

natural (opaque)

P/P' 6.0 6.0 6.0 10.0 12.0 12.7

K

L

M

N

E 33

Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Miniature spacers with threads

B

C

– – – – – –

D

allows compact, insulated constructions reduced volume in case of stack assembly insulated mounting of heatsinks, PCB, housingparts etc. very good mechanical stability due to brass inserts dimensions = nominal size: deviation ±0.5 mm ... please indicate length "L" +0,5

+0,5

6

L

E

S

G

Ø

6

art. no.

ISAM 2 A ... ISAM 3 A ...

F

dim. [mm] S

type of thread

L

6 7

M2.5 M3

4/ 5/ 7/ 9/ 11/ 12 4/ 5/ 7/ 8/ 9/ 10

6

+0,5

L

S

-0,3

art. no.

dim. [mm] S

type of thread

L

6 7

M2.5 M3

8/ 9/ 10/ 11 7/ 8/ 9/ 10/ 11/ 12 L

I

dim. [mm] S

type of thread

L

6 7

M2.5 M3

9 9/ 10/ 12

28 kV/mm

creeping current resistance:

CTI 600

thread inserts:

brass

temperature range:

-30°C... +85°C (short term +200°C)

surface:

raw

plastic body:

polyamide 6

colour:

natural (opaque)    

E E E E

40 26 – 30 31 41

max. diameter of the bushing 6 7

K

L

dielectric strength:

Spacers Screw mounted guide rails Ejectors Vibration dampers

H

G

art. no.

ISAM 2 C ... ISAM 3 C ...

max. diameter of the bushing 6 7

S

-0,3

4

-0,3

Ø

4

G

G

Ø

4

ISAM 2 B ... ISAM 3 B ...

max. diameter of the bushing 6 7

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

M    

E 44 – 48 E 49 – 50 E 2 – 24 A2–8

E 34

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Distance hexagonal bolts insulating

B

C

D

F

field of applications: – insulated assembly of stacked PCBs – insulated assembly of stacked heatsinks with varying capacities – insulated assembly of chassis plates in cases – insulated supports in the wiring – mechanicaly very stable, as threads are made of brass – other lengths on request – dimensions = nominal size: deviation ±0.5 mm – ... please indicate length "L" P

A

P’

D

G

L

D’

E

H

I

K

art. no. ISAS ISAS ISAS ISAS ISAS

25 30 40 50 60

A A A A A

... ... ... ... ...

A 6.35 6.35 8.00 9.50 12.70

dim. [mm] L 15/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 20/ 25/ 30/ 35/ 40/ 45/ 50 25/ 30/ 35/ 40/ 45/ 50/ 60

D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6

dielectric strength:

27 kV/mm

creeping current resistance:

CTI 600

thread inserts:

brass

temperature range:

-30°C... +85°C (short term +200°C)

surface:

raw

plastic body:

polyamide 66

colour:

natural (opaque)

P/P' 6.0 6.0 6.0 10.0 12.7

L

M

N

E 35

Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Distance hexagonal bolts insulating P

A

L

B

D

D’

P’

art. no. ISAS ISAS ISAS ISAS ISAS

25 30 40 50 60

B B B B B

... ... ... ... ...

A 6.35 6.35 8.00 9.50 12.70

C

dim. [mm] L 15/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 20/ 25/ 30/ 35/ 40/ 45/ 50 25/ 30/ 35/ 40/ 45/ 50/ 60

D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6

P/P' 6.0 6.0 6.0 10.0 12.7

D

L P

A

P’ D’

D

art. no. ISAS ISAS ISAS ISAS ISAS

25 30 40 50 60

C C C C C

... ... ... ... ...

A 6.35 6.35 8.00 9.50 12.70

E

dim. [mm] L 15/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 20/ 25/ 30/ 35/ 40/ 45/ 50 25/ 30/ 35/ 40/ 45/ 50/ 60

D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6

dielectric strength:

27 kV/mm

creeping current resistance:

CTI 600

thread inserts:

brass

temperature range:

-30°C... +85°C (short term +200°C)

surface:

raw

plastic body:

polyamide 66

colour:

natural (opaque)

P/P' 6.0 6.0 6.0 10.0 12.7

F

G

H

I

K

L

M Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8

E 36

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Spacers with internal and external thread

B

– other lengths and threads on request – ... please indicate length "L" L ±0,1 P D

D’

P’

C

H

art. no.

D

E

F

G

H

GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM

2550 2550 2550 2550 3050 3050 3050 3050 4070 4070 4070 4070 4070 5080 5080 5080

H 5 5 5 5 5 5 5 5 7 7 7 7 7 8 8 8

... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ...

dim. [mm] L 5 10 15/ 20 25/ 30/ 35 5 10/ 12/ 14 15/ 18/ 20 25/ 30/ 35/ 40/ 45/ 50 5 10 15 20 25/ 30/ 35/ 40/ 45/ 50 10 15/ 20 25/ 30/ 35/ 40/ 45/ 50

D/D' M2.5 M2.5 M2.5 M2.5 M3 M3 M3 M3 M4 M4 M4 M4 M4 M5 M5 M5

material:

brass

surface:

6 µm nickel-plated, solderable

P 6 6 6 8 8 8 8 10 8 8 8 8 10 8 8 10

P' 2.5 5.0 8.0 10.0 2.5 5.0 10.0 10.0 2.5 5.0 8.0 10.0 10.0 5.0 6.0 10.0

P 8 8 8 8 8 8

P' 7 8 10 7 9 10

– other lengths and threads on request – ... please indicate length "L" L ±0,1 P D

D’

P’

I H

art. no.

K

L

GBP GBP GBP GBP GBP GBP

3060 3060 3060 4080 4080 4080

H 6 6 6 8 8 8

... ... ... ... ... ...

dim. [mm] L 10 12 15/ 18/ 20/ 25/ 30 10 12 15/ 18/ 20/ 25/ 30/ 35/ 40/ 45

D/D' M3 M3 M3 M4 M4 M4

material:

polyamide, GF reinforced

temperature range:

-30°C... +110°C

colour:

black

M

N

E 37

Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Distance sleeves with internal thread – other lengths and threads on request – ... please indicate length "L"

B

L ±0,1 P

D

D’

P’

C

H

art. no. ABM ABM ABM ABM ABM ABM ABM ABM ABM ABM ABM

2550 2550 2550 3050 3050 3050 4070 4070 4070 5080 5080

... ... ... ... ... ... ... ... ... ... ...

H 5 5 5 5 5 5 7 7 7 8 8

dim. [mm] L 5/ 8/ 10/ 12/ 15 18 20/ 25/ 30/ 35/ 40/ 45/ 50 5/ 8/ 9/ 10/ 12/ 13/ 15 16/ 18/ 19 20/ 25/ 29/ 30/ 35/ 40/ 45/ 50 5/ 8/ 10/ 12/ 15 18 20/ 25/ 30/ 35/ 40/ 45/ 50 5/ 12/ 15 20/ 30/ 40/ 50

D/D' M2.5 M2.5 M2.5 M3 M3 M3 M4 M4 M4 M5 M5

material:

brass

surface:

6 µm nickel-plated, solderable

P =L 8 10 =L 8 10 =L 9 10 =L 10

P' — 8 10 — 8 10 — 9 10 — 10

– other lengths and threads on request – ... please indicate length "L"

D

D’

H

art. no. ABP ABP ABP ABP ABP ABP ABP

2550 2550 3060 3060 3060 4080 4080

... ... ... ... ... ... ...

F

P’

H

H 5 5 6 6 6 8 8

E

G

L ±0,1 P

D

dim. [mm] L 10 15/ 20/ 25/ 30 10/ 12/ 15 20 25/ 30 10/ 15/ 20 30/ 40

D/D' M2.5 M2.5 M3 M3 M3 M4 M4

material:

polyamide, GF reinforced

temperature range:

-30°C... +110°C

colour:

black

P =L 6 =L 8 10 =L 10

P' — 6 — 8 10 — 10

I

K

L

M Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8

E 38

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A Distance sleeves for PCB in HP grid

B

C

D

– these internally threaded distance sleeves mount PCBs to the correct pitch for insertion into subracks – ABM TE: spacer between two PC boards – ABM TE ... DIN:spacer between two PC boards, one of them equipped with DIN-connector resp. A front panal/PCB Interconnection deviece VS 1 – spacers with internal and external thread to HP grid on request

E

F

art. no.

suitable for TE

ABM TE 04 ABM TE 06 ABM TE 08

4 6 8

dim. [mm] L 18.72 28.88 39.04

P/P' 8 8 8

dim. [mm] L 12.72 22.88 33.04

P =L 8 8

G

H art. no.

4 6 8

material:

brass

surface:

8 µm nickel-plated, solderable

– ... please indicate length "L" L ±0,1 ØD

K

ABM TE 04 DIN ABM TE 06 DIN ABM TE 08 DIN

L

art. no. AHM 3260... AHM 4380...

M

N

dim. [mm] A 6 8

D 3.2 4.3

L 1/ 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 25/ 30 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 20

material:

brass

surface:

8 µm nickel-plated, solderable

E 39

ØA

I

suitable for TE

Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Distance spacers – special lengths on request

B

DR DR DR DR DR DR DR DR

art. no. 071 V0 072 V0 073 V0 074 V0 075 V0 076 V0 077 V0 078 V0

C [mm] 1 2 3 4 5 6 7 8

DR DR DR DR DR DR DR DR

art. no. 079 V0 710 V0 711 V0 712 V0 713 V0 714 V0 715 V0 720 V0

C [mm] 9 10 11 12 13 14 15 20

DR DR DR DR DR DR DR

art. no. 725 V0 730 V0 735 V0 740 V0 745 V0 750 V0 760 V0

C [mm] 25 30 35 40 45 50 60

C

D

E DR DR DR DR DR DR DR DR

art. no. 081 V0 082 V0 083 V0 084 V0 085 V0 086 V0 087 V0 088 V0

C [mm] 1 2 3 4 5 6 7 8

DR DR DR DR DR DR DR DR

art. no. 089 V0 810 V0 811 V0 812 V0 813 V0 814 V0 815 V0 820 V0

C [mm] 9 10 11 12 13 14 15 20

DR DR DR DR DR DR DR

art. no. 825 V0 830 V0 835 V0 840 V0 845 V0 850 V0 860 V0

C [mm] 25 30 35 40 45 50 60

F

G

H DR DR DR DR

art. no. 105 V0 110 V0 115 V0 120 V0

C [mm] 5 10 15 20

art. no. DR 125 V0 DR 130 V0 DR 135 V0

material:

polyamide

heat distortion:

180°C

temperature range:

+180°C

colour:

black

class of flammibility:

UL 94 V-0

C [mm] 25 30 35

art. no. DR 140 V0 DR 145 V0 DR 150 V0

C [mm] 40 45 50

I

K

L

M Spacers Screw mounted guide rails Ejectors Vibration dampers

   

E E E E

40 26 – 30 31 41

Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction

   

E 44 – 48 E 49 – 50 E 2 – 24 A2–8

E 40

N


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Contructional elements to vibration damping and insulation

B

C

– universal applicable round metal, antivibration buffers for solving vibration problems – other lengths and hardness range on request – ... please indicate height "H"

Field of applications: – reduction of dynamic component stress – vibration insulation for disc drives and motors – impact reducing on sensitive instruments – reduction of the noise level – prevention of vibration resonance phenomena (amplified effect) – compensation of mechanical inbalances L

G

L

H

D ØD

art. no. SMP 410 A … SMP 415 A … SMP 515 A …

type of thread M4 M4 M5

ØD 10 15 15

L 10 10 12

L’

E

dim. [mm] H 10 15 15

H

G

L

F ØD

art. no. SMP 410 B … SMP 415 B … SMP 515 B …

type of thread M4 M4 M5

L' 4 4 5

L 10 10 12

L’

G

H 10 15 15

dim. [mm] ØD 10 15 15 H

G

H

I

K

ØD

art. no.

dim. [mm] H 15/ 20 15/ 20 20

SMP 410 C … SMP 415 C … SMP 515 C …

type of thread M4 M4 M5

ØD 10 15 15

material:

rubber-metal connection

rubber:

natural rubber (NR according to ISO)

hardness range:

~ 50 Shore A

extensibility and tebsile strength:

very good

colour:

black

metall parts:

steel tin-plated

temperature range:

-40°C... +80°C (short term +90°C)

L' 4 4 5

L

M

N

E 41

Screw mounted guide rails Ejectors Insulating distance sleeves Spacers

   

E E E E

26 – 28 31 32 – 39 40

Insulting clamping parts Mounting parts for heatsinks Mounting material for semiconduct. Technical introduction

   

E 45 E 49 – 50 E 44 A2–8


tel. 02.33.61.16.26 www.elitaliaweb.it fax 02.26.26.10.09 info@elitaliaweb.it

A

Solder terminals art. no.

Ø 2,4

B

3,5 1, 5

1

7,5 1,2

1,2

Ø 3,8 Ø 4,4

LSD 07520 art. no.

C

2,5

Ø2

D 1

3,5

8,9

1,5

Ø1

Ø 3,8 Ø 4,4

LSD 08910 art. no. 2,5

Ø2

E

3,5 1,5

1

8,9

Ø1

Ø 3,8 Ø 4,4

LSD 08920 art. no.

F Ø2

1,5

3,5 1

G

Ø 3,8 Ø 1,5

4,7

13,5

2,5

Ø1

LSD 13510

Ø 4,4

art. no.

Ø2 2,5

1,5

3,5 1

13,5 4,7

LSD 13520

H

Ø1

Ø 3,8 Ø 1,5

I

Ø 4,4

material:

insulating body: PTFE (teflon)

contact pin:

brass, 2 µm Ni, 4 µm Ag

temperature range:

-200°C ... +260°C

K

L

M Screw mounted guide rails Ejectors Insulating distance sleeves Spacers

   

E E E E

26 – 28 31 32 – 39 40

Insulting clamping parts Mounting parts for heatsinks Mounting material for semiconduct. Technical introduction

   

E 45 E 49 – 50 E 44 A2–8

E 42

N


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A Solder pins 3,5

3

B

2,8

2,8

3

1,2 13

0,95 6,6

11,3

Ø 1,3

7

4

8,5 2,9

Ø 1,4

10

1,2 5

11,3

2,2

1,4

1,2

C

1,4

1,4

1,1

art. no. LS 101

art. no. LS 102

art. no. LS 103

art. no. LS 104

art. no. LS 105

0.6 mm

0.6 mm

0.6 mm

0.6 mm

0.5 mm

3,8

D

2,8

2,8

16 7

3,5

10,5

Ø 1,4 Ø 1,4

E

F

1,2

1,4

art. no. LS 106

art. no. LS 107

0.8 mm

0.5 mm

= thickness LS material

brass, 6 µm Sn

G

H

I

K

L

M

N

E 43

Solder terminals  E Distance sleeves for PCB´s in HP grid  E Spacers  E Insulting clamping parts  E

42 39 39 – 40 45

Miniature distance sleeves Mounting material for semiconduct. Mounting parts for heatsinks Technical introduction

   

E 34 E 44 – 48 E 49 – 50 A2–8


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A

Mounting kits for insulation of power transistors

B

C

art. no. MST 3

for transistor TO 3

MSTS 3

TO 3

MST 220

TO 220

MSTS 220

TO 220

version contents of delivery with mica wafer GS 1 mica wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2 cheese 3 head screws, nickel-plated, 2 screw nuts M3 nickel-plated with silicone wafer 1 silicone wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2 WS 3 cheese head screws, nickel-plated, 2 screw nuts M3 nickel-plated with mica wafer GS 1 mica wafer, 1 tin-plated solder lug, 1 cheese head screw, nickel220 plated, 1 screw nut M3 nickel-plated with silicone wafer 1 silicone wafer, 1 insulator sleeve, 1 tin-plated solder lug, 1 WS 220 cheese head screw, nickel-plated, 1 screw nut M3 nickel-plated

Snap rivet for quick fastening of TO 220 – detachable plastic snap rivet for quick fastening of transistors onto heatsinks and cooling plates (e.g. FK 212-CB, FK 216-CB, FK 222-220. FK 232. FK 233. FK 235-L 1) – suitable for material thickness: 1 – 1.5 mm – suitable for hole diameter: 3.5 – 4 mm – * = bottom view, pin not inserted

D

E

F

Ø 6,4 1,6

Ø 4,6

0,85

G

4,5

*

6,1

H

Ø 3,5

art. no. EPN 1

for transistor TO 220

material:

polysulphone, GF reinforced

temperature range:

-70°C... +180°C (5s+260°C)

class of flammibility:

UL 94 V-0

I

K

L

M Mounting parts for heatsinks Spacers Guide rails for PCBs Finger-shaped heatsinks

   

E 49 – 50 E 40 E 26 – 30 C2–3

Vibration dampers Thermal conductive material Retaining springs for transistors Technical introduction

   

E 41 E 2 – 24 A 115 – 117 A2–8

E 44

N


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A Insulating clamping parts for power transistors

B

art. no. 15,2

3 3,4

3,7

C

Plastic insulating clamping parts for mounting transistors in cases TO 220, TO 218 and TO 247 for enhanced dielectric stengths – electrically insulating assembly of the transistor by means of a plastic clamping part – pin reaching into the hole of the transistor plate – fastening of clamping part onto the mounting plate by screws, no electroinsulating connection to the transistor – dielectric strength only determined by the insulating washer between transistor and mounting surface – no insulating bush necessary, thus no dielectric breakdown

Ø 3,4

10,1

Ø 3,7

D

8,5

4

6,5

ISP 220 art. no. 17,7

Ø 3,4 Ø 3,7

12,1

5,6

E

10 4,6

F

6,4

ISP 220 V art. no. 5,8

18,5

0,9

15,2

G

Ø 3,5 Ø 3,7

12,1 7

3,8

H

ISP 218 art. no. Ø 3,7

20

2

24

7

I

3,8

13,1

ISP 247

K

L

material:

polyamide 6, GF reinforced

dielectric strength:

<27 kV/mm

heat distortion:

205°C (1.8 MPa); 135°C (8 MPa)

dielectric constant:

8 [100 Hz]/4.5 [1 MHz]

dielectric loss factor:

1300 [100 Hz] 450 [1 MHz]

specific volume resistance:

>1013 Ω·cm

colour:

black

class of flammibility:

UL 94 V-0

M

N

E 45

Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting Thermal conductive material

   

A 91 A 89 A 89 – 112 E 2 – 23

Insulating distance sleeves Vibration dampers Aluminium oxide wafers Technical introduction

   

E 32 – 34 E 41 E 17 – 18 A2–8


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A

Mounts Ø 9,4

Ø 9,2

3

Ø 9,2 Ø5,08

Ø9 Ø5,08

2,5

1

5

5 3

B

1

0,8

0,8

0,8

0, 8

Ø 0,8

5,08

Ø 9,2 Ø5,08

2,5

7

5,08

art. no. MS 53 3

art. no. MS 53 7

art. no. MS 53 25

art. no. MS 54 25

art. no. MS 58 5

TO 5

TO 5

TO 5

TO 5

TO 5-8 p.

1,5

9,5

Ø 9,2 Ø5,08

1

Ø 5,08 Ø 2,54

1

Ø 0,8

Ø9 0,8

8

TO 5-8 p. Ø 0,8

Ø 9,0 Ø 5,08

art. no. MS 56 15

art. no. MS 58 15

TO 5-6 p.

TO 5-8 p.

9,2 5,08

3,5 2,5

D

0,8

0,

art. no. MS 58 7

2,5 1,5

5,08

5,08

1,5

9,5 5,08

1,5

9,5

1

7 5

C

2,5

1

5,4

TO 5/ TO 18 5,5 2,54

2,5

2,5

3,5

E

2,5

1

Ø 2,54

art. no. MS 3518 35 TO 5/ TO 18

5,5

art. no. MS 34 518

art. no. MS 183 25

art. no. MS 184 25

art. no. MS 183 35

TO 5/TO 18

TO 18

TO 18

TO 18

5,4 0,8

3,5

7

2,54

2,5 1,75

5,1

7,1

5

4

F

G

0,8

5

0,

0,8

1

0,8

2,5

10

5,4

7 5

2,54

2,5

2,54

5 0,

0,7

1

1

1

0,8

2,5

art. no. MS 3518 25

TO 5-10 p. 2,5

5,4

3,5

art. no. MS 510 15

art. no. MS 184 35

art. no. MS 183 7

art. no. MS 184 7

art. no. MS 84 4

art. no. MS 923 25

TO 18

TO 18

TO 18

TO 8

TO 92

4

9,9 7,62

2,5

2,54

Ø 0,9

2,54

3,6

4

3,2 1,5

5,08

9,9 5,08

Ø 1,3

H

I

art. no. MS 4016

art. no. US 58 4

art. no. US 512 4

max. 16 contacts

TO 5

TO 5

K

* = transfer washer: the US-pads convent the TO 5 pin circle to a pitch of 2.54 mm material:

polyamide 6, GF reinforced

temperature range:

-40°C... +205°C

class of flammibility:

UL 94 V-0 (at thickness ≥3mm), UL 94 V-1

L

M Mounting parts for heatsinks Heatsinks for PCB Profiles for PCB mounting Thermal conductive material

   

E 49 – 50 A 89 – 93 A 89 – 112 E 2 – 24

Insulating distance sleeves Finger-shaped heatsinks Retaining springs for transistors Technical introduction

   

E 32 – 34 C2–3 A 115 – 117 A2–8

E 46

N


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A Mounts Mounts for power transistors – for TO 220, TO 219, TO 202 and similar – for vertical and horizontal mounting – also suitable as mounting bracket for angled connections 10,8

1

5,6

3,2

1

B

A

C

Ø 1,5

art. no.

D

E

1,3

B

C

colour

MLW 32 MLW 44 MLW 51

dim. [mm] B — 1.3 1.9

A 3.2 4.4 5.1

white white white

material:

polyamide 6 (nylon)

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-2

C 7.1 7.1 7.1

Mounts for rectangular LEDs

Ø 0,813

F

– for LED 2x4 mm oder 2x5 mm – symmetric version for easy assembly – self-adhesive 5,2 2,5

4,2

1,25

C

A

G

2,3 max.

B

1,3

Ø 0,64 Ø 1,1 Ø 0,51

H

art. no.

colour

MRL 20

I

A 2

white

material:

polyamide 6 (nylon)

temperature range:

-40°C... +120°C

class of flammibility:

UL 94 V-2

dim. [mm] B 0.5

C 1

K

L

M

N

E 47

Mounting parts for heatsinks Heatsinks for PCB Profiles for PCB mounting Thermal conductive material

   

E 49 – 50 A 89 – 93 A 89 – 112 E 2 – 24

Insulating distance sleeves Finger-shaped heatsinks Retaining springs for transistors Technical introduction

   

E 32 – 34 C2–3 A 115 – 117 A2–8


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A

Mounts for discrete components – suitable for various components e.g. resistors, capacitors etc.

B

D A

F

C

B

Ø 1,1

E

B 1.1 1.1 1.1

dim. [mm] C D 0.55 1.3 0.55 2.3 0.55 2.3

art. no. E 4.6 6.9 7.4

F 2.3 3.2 2.3

MD A 09 MD A 12

A 7.6 10.2

0,81

0,64

MD A 04 MD A 06 MD A 07

A 2.5 3.8 5.1

0,76

2,5

Ø 0,89

dim. [mm] C D 0.66 3.6 0.76 4.8

B 1.1 1.1

C E 9.9 12.4

F 2.3 2.3

D

B 1,3 2,5

art. no.

Ø 1,7

E

A

art. no. A 7.6 10.2 11.4

art. no. B 5.1 7.6 8.9

dim. [mm]

MD B 12 MD B 15

A 12.7 15.2

Ø 2,3

B 10.2 12.7

F

5,1 B

30

°

MD B 07 MD B 10 MD B 11

dim. [mm]

2,3

A

Ø 1,1

G

7,4

art. no. MD C 13

dim. [mm] A 1.3

art. no. MD C 22

material:

polyamide 6 (nylon)

temperature range:

-30°C... +110°C

class of flammibility:

UL 94 V-2

dim. [mm] A 2.2

B 0.89

H

I

K

L

M Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting Thermal conductive material

   

A 91 A 89 A 89 – 112 E 2 – 23

Insulating distance sleeves Finger-shaped heatsinks Retaining springs for transistors Technical introduction

   

E 32 – 34 C2–3 A 115 – 117 A2–8

E 48

N


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A Mounting parts for heatsinks 7 4

10 Ø 7,3

10

4,2

4

9 4

2

20 26

7,3

B

4,2

art. no.

C

5

for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 50 mm

art. no.

7 4

10

20 26

4,2 2

4

9 4 7

2

D

10

7,3

Ø 7,3 Ø 4,2

4,2

IS 1

Ø4

Ø 4,2 25,7 35,7

5

Ø4 5

E

IS 2

19,5 29,5

5

for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 37.5 75 100 mm

art. no.

10

222

F

6,9

10 9,3 4,2

5,5

for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69 16 12,5

1,8

34,5

G

14,6

14

ø 4,2 ø 7,3

H

11,6

IS 3 art. no.

2,7 8,6

IS 4

for SK 06

art. no. 3

7 10

5

7

for SK 20

art. no.

12 6,2

13

2,5

2,5

L

M5 15

IS 6

M

N

4

14,5

3

25

IS 5

K

2

M2,5

I

for SK 67

material:

polyamide 6, GF reinforced

class of flammibility:

UL 94 V-0

E 49

5

Heatsink profile-overview Profiles for PCB mounting Heatsinks for PCB Insulating distance sleeves

   

A 13 – 17 A 89 – 112 A 89 – 93 E 32 – 34

Insulting clamping parts  Mounting pads for transistors  Mounting pads for single components Technical introduction 

E 45 E 47 E 48 A2–8


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A

Mounting parts for heatsinks art. no.

13

6,2

3

6 3,5 M5

5

10,5

IS 7 art. no.

24,5

13,5

B

C

6,8 3

3

D

9,5

19,5

2 10

4,2

13

5

M3

IS 8

for SK 20

material:

polyamide 6, GF reinforced

class of flammibility:

UL 94 V-0

E

Sockets for power transistors TO 3 17 11,4

F

Ø 3,3

4 5,9 14,6

10,9

0,8

1,5

Ø 5,5 17,5

Ø 6,4

30,2 Ø 5,5

39,8

art. no. TF 3 2

G

no. of contacts 3

insulating body material:

stanyl PA 4.6

contact:

CuSn-alloy, CuSn 6; Ni 1-2µm, Au 0.2µm

current rating:

15 A max.

contact resistance:

<10 mΩ

temperature range:

-65°C ... +290°C

capacity:

1 pF

test voltage:

1650 V

class of flammibility:

UL 94 V-0

H

I

K

L

M Heatsink profile-overview Profiles for PCB mounting Heatsinks for PCB Insulating distance sleeves

   

A 13 – 17 A 89 – 112 A 89 – 93 E 32 – 34

Insulting clamping parts  Mounting pads for transistors  Mounting pads for single components Technical introduction 

E 45 E 47 E 48 A2–8

E 50

N


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A Insulating caps – different transistor flange levels will be by the sleeves

art. no.

C

11

29

B

Ø 3,2

30,2 43,6

IK 341 3 art. no.

26,5

D

E

F

41,3

12,3

11,6

IK 3 material:

polyamide, GF reinforced

pressed-in sleeves:

brass, nickel-plated

class of flammibility:

UL 94 V-0

G

H

I

K

L

M

N

E 51

Mica wafers Thermal conductive material Mounting for TO 3 angle Die-cast heatsinks

   

E 19 E2–5 A 125 A 125 – 128

Aluminium oxide wafers Thermal conductive paste Thermal conductive glue Technical introduction

   

E 17 – 18 E 21 – 22 E 23 – 24 A2–8


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A

Insulating bush Ø 7,1

2,6 4,2

1,8

2,2

1,2

1,9

2,5

4,7

1,05

1,5

1,4

Ø 3,2

Ø 3,1 Ø4 Ø 6,2

Ø 2,6 Ø3

Ø 4,4

Ø 6,3

Ø 3,9

Ø 4,2

Ø 6,3

Ø4

Ø 3,1

B

Ø 9,2

Ø 9,3

C art. no. IB 1 / IBT 1

art. no. IB 2 / IBT 2

art. no. IB 3 / IBT 3

art. no. IB 4 / IBT 4

Ø6

Ø6

art. no. IB 5

Ø 3,1 Ø 3,5

Ø 3,3 Ø 4,3

art. no. IB 6 / IBT 6

2,3

1,2

4

3,5

1 7,5

2,2

1 Ø 3,1 Ø 3,5

D

Ø 6,4

1

1,6

Ø8 Ø6

Ø 3,1 Ø 3,8

Ø 3,05 Ø 3,55

E

art. no. IB 7 / IBT 7

art. no. IB 8 / IBT 8

art. no. IB 9 / IBT 9

art. no. IB 10 / IBT 10

Ø 2,6 Ø3

art. no. IB 11 / IBT 11

1,5

1

Ø 3,1 Ø 3,1 Ø 3,85 Ø 4,15

art. no. IB 12 / IBT 12

Ø3

Ø 3,9

art. no. IB 13

6

4,5

4,4

2,1

3,5

1

Ø 3,1 Ø 3,8

F

Ø7

Ø 7,5

6,2

Ø8

7,7

Ø 7,1

1,7

Ø 6,5

Ø4

art. no. IB 14 / IBT 14

G

art. no. IB 15 / IBT 15

5,8

10

1,4

1

3,5

Ø 3,1 Ø 3,5

4

1,4

Ø 3,1

H

Ø6

1

Ø7

Ø 3,5

I

Ø 3,1 Ø 3,5

art. no. IB 16

art. no. IB 17

art. no. IB 18 / IBT 18 IB 1 - IB 7 / 18

material form stability

IBT 1 - IBT 15 / 18

IB 8 - IB 17

polyamide 4.6, GF reinforced

PTFE (teflon)

thermoplastic resin

-40°C ... +250°C (1.8 MPa)

-260°C ... +250°C

-40°C ... +200°C

30 kV/mm

40 kV/mm

38 kV/mm

dielectric strength class of flammibility

UL 94 V-0

K

L

M Mica wafers Thermal conductive material Mounting for TO 3 angle Insulating distance sleeves

   

E 19 E2–5 A 125 E 32 – 128

Aluminium oxide wafers Thermal conductive paste Thermal conductive glue Technical introduction

   

E 17 – 18 E 21 – 22 E 23 – 24 A2–8

E 52

N


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HEATSINKS & CASES SURFACES HEATSINKS & CASES SURFACES

art. no.

The information given in this catalogue were established and examined carefully. Nevertheless, mistakes or printing errors, and especially The information given in and this catalogue wereimprovement established and examined technical modifications updating and of our products, carefully. or are printing errors,even andif especially cannot beNevertheless, excluded. All mistakes trade marks recognised they are not technical modifications and updating No andidentification improvementdoes of our specifically identified or mentioned. notproducts, imply that cannot be excluded. All trade marks are recognised even if they are not a product or trademark is not registered. No part of this catalogue may specifically identified or mentioned. No identification not imply that be reproduced or distributed without prior writtendoes consent of Fischer a Elektronik. product or All trademark is not registered. No part of in thistexts, catalogue may data contained in this catalogue, illustrations, bedocuments reproduced or distributed without prior written consent of Fischer and descriptions are subject to copyright and the provisions Elektronik. All16016. data contained in this catalogue, in texts, illustrations, of DIN ISO All rights reserved. documents and descriptions are subject to copyright and the provisions of©DIN ISO 16016. AllElektronik rights reserved. Copyright Fischer 1969 ... 2014

art. no.

AL

© Copyright Fischer Elektronik 1969 ... 2014

raw degreased aluminium

AL BZ

raw degreased aluminium raw pickled aluminium

BZ LP

raw pickled aluminium outside black lacquered RAL 9005/transparent passivated

LP ME

outside black lacquered RAL 9005/transparent passivated

ME MI

clear anodised

MI SA

solderable surface

SA TP

black anodised chrome-free transparent passivated

TP

chrome-free transparent passivated

clear anodised solderable surface black anodised

CONNECTOR CONTACT SURFACE FINISH CONNECTOR CONTACT SURFACE FINISH

art. no. art. no.

G

Fischer Elektronik GmbH & Co. KG

Postfach 1590 • D-58465 Lüdenscheid Fischer Elektronik GmbH & Co. KG

G S

gold-plated

S Z

selective gold-plated

Z

tin-plated

selective gold-plated tin-plated

art. no.

RAL RAL

COLOURS COLOURS

GO

6026

opal green

GO K

6026 7032

opal green gravel grey

system cases RackCase/shell cases bench cases

K LG

7032 7035

gravel grey

bench cases

light grey

shell cases

LG NB

7035 5022

light grey night blue

shell cases system cases RackCase/shell cases

NB S

5022 9005

night blue

system cases RackCase/shell cases

S TB

9005 5018

deep black

TB UL

5018 5002

turquoise blue

UL

5002

ultramarine blue

art. no.

f.cool.e 08-2014 f.cool.e 08-2014

Hausadresse/House Address/Adresse Postfach 1590 • D-58465 Lüdenscheidde domicile Nottebohmstr. 28 • D-58511 Lüdenscheid Hausadresse/House Address/Adresse de domicile Telefon: 0 23 51 / 4 35 - 0 Nottebohmstr. 28 • D-58511 Lüdenscheid Telefax: Telefon: 0 23 51 / 4 35 - 0 Verkauf / sales / ventes Telefax: 0 23 51 / 4 57 54 Verkauf / sales / ventes Einkauf / purchasing / achats 0 23 51 / 4 57 54 0 23 51 / Elektronik 45 94 33 Fischer GmbH & Co. KG Einkauf / purchasing / achats Export / exports / exports P.O. Box 1590 0 23 51 / Elektronik 45 94 33 Fischer GmbH & Co. KG 0 23 51 /Lüdenscheid 43 51 85 D-58465 Export / exports P.O. Box 1590 / exports info@fischerelektronik.de 0 23 51 /Lüdenscheid 43 51 85 D-58465 House Address www.fischerelektronik.de info@fischerelektronik.de Nottebohmstr. 28 House Address www.fischerelektronik.de Fischer Elektronik D-58511 Lüdenscheid Nottebohmstr. 28 Österreich Fon: +49Ges. (0) 23m.b.H. 51 4 35 - 0 Fischer Elektronik D-58511 Lüdenscheid Firmiangasse 49 51 • A -1130 Wien Fax: sales +49 (0) 23 51 4 57 54 Österreich Fon: +49Ges. (0) 23m.b.H. 51 4 35 - 0 Telefon: 01 +49 / 8 76 purchasing (0) 62 23 27 51 45 94 33 Firmiangasse 49 (0) - 5123• 51 A -1130 Wien Fax: sales +49 4 57 54 exports 01 +49 (0) 62 23 27-11 51 43 51 85 Telefax: / 8 76 Telefon: 01 +49 / 8 76 purchasing (0) 62 23 27 51 45 94 33 info@fischerelektronik.de online@fischerelektronik.co.at exports 01 +49 (0) 62 23 27-11 51 43 51 85 Telefax: / 8 76 www.fischerelektronik.de www.fischerelektronik.at info@fischerelektronik.de online@fischerelektronik.co.at www.fischerelektronik.de www.fischerelektronik.at

gold-plated

deep black turquoise blue ultramarine blue

ARTICLES ARTICLES system cases RackCase/shell cases

bench cases/shell cases/system cases RackCase bench cases/shell cases/system cases RackCase system cases RackCase/shell cases system cases RackCase/shell cases Plusline/shell cases Plusline/shell cases

fischer elektronik catalogo cool 15/16  
fischer elektronik catalogo cool 15/16  
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